CN101459149A - 半导体封装 - Google Patents

半导体封装 Download PDF

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Publication number
CN101459149A
CN101459149A CNA2008101866078A CN200810186607A CN101459149A CN 101459149 A CN101459149 A CN 101459149A CN A2008101866078 A CNA2008101866078 A CN A2008101866078A CN 200810186607 A CN200810186607 A CN 200810186607A CN 101459149 A CN101459149 A CN 101459149A
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China
Prior art keywords
connection pads
special
shaped connection
encapsulation
semiconductor packages
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Pending
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CNA2008101866078A
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English (en)
Inventor
井上英俊
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Shinko Electric Industries Co Ltd
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication of CN101459149A publication Critical patent/CN101459149A/zh
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Abstract

本发明公开了一种半导体封装。在这种半导体封装中，使连接焊盘中的至少两个连接焊盘形成平面形状与其他连接焊盘不同的异形连接焊盘，并且以如下方式布置一个异形连接焊盘和另一个异形连接焊盘，即：当所述一个异形连接焊盘的位置围绕所述半导体封装的中心点旋转180度时，所述一个异形连接焊盘所处的位置与所述另一个异形连接焊盘的布置位置不重合。

Description

半导体封装
技术领域
本发明涉及半导体封装(封装件)。
背景技术
作为用于堆叠半导体封装的结构，已知一种所谓的POP(层叠封装)结构。最近，随着半导体封装小型化的进步以及形成在半导体封装中的配线图案和连接焊盘的小型化，使得在配线图案之间或者在连接焊盘之间很难布置用于对下部半导体封装或安装半导体封装和上部安装半导体封或被安装半导体封装进行定位的对准标记。
为了知道IC芯片等的引线接合中的接合位置，专利参考文献JP-UM-A-6-79147提出了将特定的第二连接焊盘形成为具有与其他第二连接焊盘的形状不同的形状，从而提供具有对准标记功能的特定第二连接焊盘。
因为可以通过保证标记的轴对轴距离来提高位置精度，所以通常把布置在半导体封装中的对准标记布置在半导体封装的平面对角线上。在如此把对准标记布置在对角线上的情况下，出现了多种问题，例如，当把其中形成有对准标记的半导体封装旋转180度时，对准标记相互重叠并且无法被识别。因此，不能通过对准标记进行位置偏差的识别，从而使具有堆叠结构或POP结构半导体封装有缺陷。
此外，可以设想把在半导体封装中布置多个对准标记，并且进行正确的对准工序。然而，存在以下问题：检查对准标记的工作所需要的时间延长，因此基本上不使用这种构造。
发明内容
本发明示例性实施例提供了一种半导体封装，在这种半导体封装中，布置在半导体封装中的对准标记的轴对轴距离可以保持在与现有技术相似的程度，并且在将对准标记的数量限制在最小值的同时，可以可靠地探测在其中形成有对准标记的半导体封装的水平面内是否发生180度旋转。
本发明的半导体封装为以下这种半导体封装，该半导体封装包括三个或更多个连接焊盘，所述连接焊盘中的至少两个连接焊盘形成为平面形状与其他连接焊盘不同的异形连接焊盘，并且以如下方式布置所述异形连接焊盘中的一个异形连接焊盘和所述异形连接焊盘中的另一个异形连接焊盘，即：在平面排布的相互位置关系中，当所述一个异形连接焊盘的位置围绕所述半导体封装的中心点旋转180度时，所述一个异形连接焊盘所处的位置与所述另一个异形连接焊盘的初始位置不完全重合。
此外，可以以如下方式布置所述一个异形连接焊盘和所述另一个异形连接焊盘，即：当所述一个异形连接焊盘的位置围绕所述半导体封装的中心点旋转180度时，所述一个异形连接焊盘的中心点位置偏离所述另一个异形连接焊盘的中心点位置。同样，对于该位置关系，可以知道半导体封装的旋转状态，并且因为异形连接焊盘彼此部分重叠，所以有利于视觉检查，从而这是有利的。
此外，可以以如下方式布置所述一个异形连接焊盘和所述另一个异形连接焊盘，即：当所述一个异形连接焊盘的位置围绕所述半导体封装的中心点旋转180度时，所述一个异形连接焊盘的中心点位置与所述另一个异形连接焊盘的中心点位置重合，并且所述一个异形连接焊盘的外轮廓与所述另一个异形连接焊盘的外轮廓不同。同样，对于该位置关系，可以知道半导体封装的旋转状态，并且由于异形连接焊盘彼此部分重叠，所以有利于视觉检查，从而这是有利的。
此外，半导体封装还可以包括第二异形连接焊盘，所述第二异形连接焊盘用作检查所述半导体封装的位置的视觉标记，并且形成为具有与所述连接焊盘的平面形状不同的形状。根据这种构造，操作者可以直接视觉检查标记，因而能够实现双重检查。
根据本发明的半导体封装，可以提供以下这种半导体封装，其中，在将布置在半导体封装中的对准标记的数量限制在最小值的同时，可以探测在其中形成有对准标记的半导体封装的水平面内发生的180度旋转。也就是说，可以提供以下这种半导体封装，即：该半导体封装具有很高的生产率，并且可以提高POP结构半导体封装的成品率。
从下面的详细描述、附图和权利要求书中可以清楚地看出其他特征和优点。
附图说明
图1A是根据第一实施例的POP结构半导体封装中的安装半导体封装的正面剖面图。
图1B是根据第一实施例的POP结构半导体封装中的安装半导体封装的平面图。
图2A是根据第一实施例的POP结构半导体封装中的被安装半导体封装的正面剖面图。
图2B是根据第一实施例的POP结构半导体封装中的被安装半导体封装的底面图。
图3是根据第一实施例的POP结构半导体封装的正面剖面图。
图4是示出根据第二实施例的下部封装的平面图。
图5A和图5B是示出通过对根据第二实施例的异形连接焊盘的多个部分进行成像所获得的图像的平面图。
图6是示出根据第三实施例的半导体封装的平面图。
图7A和图7B是示出通过对布置在连接焊盘的布置范围内的两个异形连接焊盘进行成像所获得的图像的平面图。
图8是示出另一个实施例的实例的下部封装的平面图。
图9是示出另一个实施例的实例的下部封装的平面图。
具体实施方式
(第一实施例)
下面，将参考附图描述本发明的半导体封装和使用了这种半导体封装的POP结构半导体封装的实施例。图1A和图1B分别示出了根据第一实施例的POP结构半导体封装中的安装半导体封装的正面剖面图和平面图。图2A和图2B分别示出了根据第一实施例的POP结构半导体封装中的被安装半导体封装的正面剖面图和底面图。
在本说明书中，POP结构半导体封装10(图3)中的安装半导体封装称为下部封装20，被安装半导体封装称为上部封装30。
如图1A所示，在下部封装20中，半导体器件24的电极24Z(金凸点、焊料凸点等)通过倒装芯片接合法与形成在电路板22的上表面上的连接焊盘23连接。电路板22的上表面与半导体器件24的下表面之间的缝隙(接合部)填充有底部填充树脂25。倒装芯片接合法为已知方法，因此不再对其进行详细描述。
在电路板22的上表面(将要安装上部封装30的表面)上形成有用于连接下部封装20与上部封装30的连接焊盘26。连接焊盘26以围绕半导体器件24的外周边缘的排列方式排列成两行。在连接焊盘26中，至少两个连接焊盘27形成为具有与其他连接焊盘26的平面形状不同的平面形状。在本说明书中，具有与其他连接焊盘26的平面形状不同的平面形状的连接焊盘称为异形连接焊盘27。
在本实施例中，如图1B所示，连接焊盘26的平面形状呈圆形，异形连接焊盘27的平面形状呈矩形。按照以下方式布置一个异形连接焊盘27和另一个异形连接焊盘27，即：当一个异形连接焊盘27的位置围绕下部封装20的中心点旋转180度时，该位置与另一个异形连接焊盘27的初始位置不完全重合。
实际上，要求以如下方式设置一个异形连接焊盘27与另一个异形连接焊盘27的平面排列的位置关系，即：连接一个异形连接焊盘27的中心点与另一个异形连接焊盘27的中心点的直线不经过下部封装20的中心点。也就是说，以如下方式形成一个异形连接焊盘27与另一个异形连接焊盘27的布置位置的位置关系，即：当一个异形连接焊盘27围绕下部封装20的中心点旋转180度时，即使一个异形连接焊盘27与另一个异形连接焊盘27部分重叠，异形连接焊盘27、27的中心点也是彼此偏离的。
可以按照下面的方式同时形成连接焊盘26和异形连接焊盘27。进行以下步骤：在电路板22的上表面上形成由铜等制成的配线图案；将阻焊层施加在配线图案的整个表面上；将光致抗蚀剂施加在阻焊层的表面上；通过图案掩模进行曝光；使光致抗蚀剂显影。此后，从光致抗蚀剂的开口部分蚀刻掉阻焊层。
因此，一旦形成图案掩模，就可以应用现有的技术，所以即使存在混合的连接焊盘26和异形连接焊盘27，也不会增加生产成本。虽然没有示出，但是优选的是，对连接焊盘26和异形连接焊盘27的暴露表面施加例如镀金等表面处理。
在电路板22的下表面上形成有由焊球等构成的外部连接端子28。外部连接端子28按照能够与安装基板(未示出)等BGA(球栅阵列)连接的排列方式布置。
如图2A所示，按照以下方式构造上部封装30：通过倒装芯片接合法使第一半导体器件34A的电极34Z(金凸点、焊料凸点等)与形成在电路板32的上表面上的连接焊盘33连接；用底部填充树脂35填充电路板32的上表面与第一半导体器件34A之间的缝隙；然后通过粘合剂将第二半导体器件34B结合到第一半导体器件34A上；通过例如金线等接合线40使形成在第二半导体器件34B的上表面上的电极37与形成在电路板32的上表面上的接合焊盘31连接；然后进行树脂模制来密封半导体器件34A、34B和接合线40。附图标记41表示模制树脂。
通过已知方法进行倒装芯片接合、引线接合和树脂模制，因而将省略对这些步骤的详细描述。
如图2A所示，在电路板32的下表面(将要被安装在下部封装20上的表面)上形成有外部连接端子38，该外部连接端子用于使下部封装20与上部封装30连接，并且每个外部连接端子38都由焊球等构成。外部连接端子38布置成分别与布置在下部封装20上的连接焊盘26和异形连接焊盘27相对。
图2A所示的上部封装30采用同时使用倒装芯片接合法和引线接合法的结构作为堆叠半导体器件的结构。当然，当要把第二半导体器件34B堆叠在第一半导体器件34A上时，可以采用以下这种堆叠形式，即：半导体器件34A和34B都通过引线接合法连接，或者半导体器件34A和34B都通过倒装芯片接合法连接。
接下来，将描述以堆叠方式将上部封装30连接在下部封装20上的封装连接法。
首先，传送设备的夹具部分从下部封装容纳部分取出下部封装20。用照相机对取出的下部封装20的底面(下表面)的外观状态进行成像，控制部分对获得的图像进行图像数据处理，以检查例如下部封装20的外部连接端子28的排列状态等外观状态。参考预先储存的无缺陷封装的图像数据和容差，控制部分确定用于获得图像数据的下部封装20是有缺陷的还是无缺陷的。控制部分确定为有缺陷的下部封装20被传送到有缺陷封装容纳部分(在本实施例中为下部封装容纳部分中的原始容纳部分)。控制部分确定为无缺陷的下部封装20被设置在载体上并处于朝着正确方向的状态。
接下来，传送设备的夹具部分从上部封装容纳部分取出上部封装30。类似地，用照相机对取出的上部封装30的底面(下表面)的外观状态进行成像，控制部分对获得的图像进行图像数据处理，以检查例如上部封装30的外部连接端子38的排列状态等外观状态。参考预先储存的无缺陷封装的图像数据和容差，控制部分确定用于获得图像数据的上部封装30是有缺陷的还是无缺陷的。控制部分确定为有缺陷的上部封装30被传送到缺陷封装容纳部分(在本实施例中为上部封装容纳部分中的原始容纳部分)。控制部分确定为无缺陷的上部封装30经历将焊剂(未示出)传送到外部连接端子38上的步骤，然后在等待位置处待用。
然后，用布置在固定位置处的照相机对设置在载体上的下部封装20的表面(上表面)进行成像，控制部分对获得的图像进行图像数据处理，以根据异形连接焊盘27的位置计算出设置在载体上的下部封装20的位置数据。控制部分预先存储了在异形连接焊盘27设置为基准位置的状态下获得的基准图像数据。根据所成像的下部封装20的图像数据与基准图像数据之间的差异，可以计算出设置在载体上的下部封装20相对于基准位置的水平面内的偏移量和旋转角度。基于由以这种方式计算出的水平面内的偏移量和旋转角度所构成的位置偏移量数据(位置数据)，控制部分控制传送设备的夹具部分的操作，使得由夹具部分自身固定的上部封装30从等待位置接近设置在载体上的下部封装20，然后在上部封装30的外部连接端子38分别与连接焊盘26和异形连接焊盘27对准的状态下，将上部封装放置在下部封装上。
在对通过将下部封装20的表面进行成像所获得的图像的图像数据进行数据处理的过程中，如果探测到连接焊盘26位于异形连接焊盘27应处的位置，则意味着设置在载体上的下部封装20的方向旋转了180度。在这种情况下，控制部分停止传送设备的夹具部分的操作，从而上部封装30不会安装在下部封装20上。如果需要，控制部分发出错误信息。
当上部封装30在与下部封装20对准的状态下被放置在设置于载体上的下部封装20上时，传送装置将该载体传送到回流炉。在回流炉中，构成外部连接端子38的焊球流动，并且下部封装20与上部封装30在设置有连接焊盘26和异形连接焊盘27的部分中相互结合，从而获得图3所示的POP结构半导体封装10。
在本实施例中，使布置在下部封装20中的两个连接焊盘26改变形状以形成异形连接焊盘27、27，并且异形连接焊盘27、27布置在相对于下部封装20的中心点不对称的位置。因此，当使用异形连接焊盘27作为对准标记时，仅通过检查两个异形连接焊盘27的位置就能够准确地确定下部封装20是否在封装平面内旋转了180度。因此，可以缩短用于检查载体上的下部封装20的安装状态所需的时间，因而可以可靠近且高效地制造POP结构半导体封装10。
(第二实施例)
下面描述以下实施例，即：即使异形连接焊盘27A和27B布置在封装的平面对角线上，也就是布置在对准标记的常规位置上，该实施例也可以实现与上述实施例的效果相似的效果。
图4是示出根据第二实施例的下部封装的平面图。
本实施例的特征在于，使布置在下部封装20内的两个异形连接焊盘27A和27B形成不同的形状。在本实施例中，一个异形连接焊盘27A呈矩形，另一个异形连接焊盘27B呈六边形。在异形连接焊盘27A和27B本身具有如上所述的彼此不同形状的构造中，即使异形连接焊盘27A和27B分别布置在相对于下部封装20的平面中心点的点对称位置，仅通过检查两个异形连接焊盘27A和27B，就可以确定下部封装20是否在封装平面内旋转了180度。
具体地说，按照与上述实施例的方式相类似的方式，用照相机对下部封装20和上部封装30的外观状态进行成像，并且检查封装的外观状态。然后，用照相机对安装在载体上的下部封装20的表面(上表面)进行成像。利用所获得图像的图像数据，以及预先存储在控制部分中并且是从在正常状态下安装在载体上的下部封装20的表面获得的图像数据，观测异形连接焊盘27A和27B的多个部分的图像数据的可能差异。
当安装在载体上的下部封装20的方向正确时，布置有异形连接焊盘27A的部分(图4中的部分Z)的图像数据如图5A所示。相反，当安装在载体上的下部封装20的方向在封装平面内旋转了180度时，图像数据如图5B所示。这样，异形连接焊盘27A的布置位置的图像数据的轮廓图案明显不同。因此，易于确定安装在载体上的下部封装20的方向错误。即使在异形连接焊盘27A和27B的布置位置围绕下部封装20的中心点旋转180度，异形连接焊盘27A和27B的中心点位置相互重合的情况下，也能够通过区分异形连接焊盘27A的轮廓与异形连接焊盘27B的轮廓来进行判断。
此外，在使用异形连接焊盘27B作为基准的情况下，采用类似的判断方法，可以确定下部封装20是否在水平面内发生了180度旋转。
在确定下部封装20在水平面内是否发生180度旋转之后，使用异形连接焊盘27A和27B作为对准标记，并且采用与第一实施例类似的方法，从而可以计算出由下部封装20的水平面内的偏移量和旋转角度构成的位置偏移量数据(位置数据)。随后的步骤与第一实施例的步骤相同，因而在本实施例的描述中省略对其的详细描述。
此外，在本实施例中，仅通过对下部封装20表面上的两个异形连接焊盘27A和27B进行观测，就可以确定安装在载体上的下部封装20的方向是否正确，并且可以计算出由下部封装20的水平面内的偏移量和旋转角度构成的相对于基准位置的位置偏移量数据(位置数据)，从而可以获得与第一实施例的效果类似的效果。
(第三实施例)
图6是示出第三实施例的半导体封装的平面图。第三实施例为第二实施例的修改形式。
本实施例与第二实施例的相同之处在于两个异形连接焊盘27C和27D布置在下部封装20的平面对角线上，而不同之处在于异形连接焊盘27C和27D的形状彼此相同。也就是说，相对于一个异形连接焊盘27C的布置状态，另一个异形连接焊盘27D布置成在下部封装20的平面内旋转预定角度(处于异形连接焊盘27C和27D的定位方向彼此不同的状态)。在本实施例中，相对于一个异形连接焊盘27C的布置状态，另一个异形连接焊盘27D布置成围绕异形连接焊盘27C的中心点旋转45度的状态。
图7A和图7B是图6中的部位Z的放大平面图，图7A示出了在下部封装正常安装在载体上的状态下取得的图像，图7B示出了在下部封装在水平面内旋转180度的状态下取得的图像。
对于布置在下部封装20内的每一个异形连接焊盘27C和27D而言，控制部分都预先存储了基准图像数据，该基准图像数据是通过在下部封装20正常放置在载体上的状态下进行成像而获得的。因此，当把用照相机实际成像而获得的异形连接焊盘27C或27D的图像数据与基准图像数据比较时，可以容易地确定位于载体上的下部封装20的布置状态(在水平面是否发生180度旋转和在水平面内沿着X-Y方向的位置偏移量)是否正确。
除了异形连接焊盘的外轮廓被限定为距异形连接焊盘中心点等距的形状(圆形形状)以外，本方法可以应用于任何形状的异形连接焊盘。
随后的步骤与第一和第二实施例的步骤相同，因而省略对其的详细描述。
虽然参考这些实施例描述了本发明，但是本发明不限于上述实施例，其他实施例也当然属于本发明的技术范围。
在上述这些实施例中，使下部封装20的连接焊盘26中的两个连接焊盘形成为异形连接焊盘27，用照相机对分别包含异形连接焊盘27的周边部分成像，然后控制部分将该图像数据与基准图像数据比较，从而能够确定上部封装30在下部封装20上的安装状态，并且能够计算出在通过传送设备的夹具部分将上部封装30堆叠在下部封装20上的情况下的位置偏移量数据(位置数据)。如图8所示，下面这种构造当然也是可以的，即：将用于视觉检查的第二异形连接焊盘27Z布置在下部封装20内并位于照相机的成像范围之外。当采用这种构造时，可由控制部分和操作者双重检查下部封装20相对于载体的布置状态，因而这种构造是有利的。
在上文中，已经描述了以下这些实施例：其中，通过对异形连接焊盘27成像来获得图像数据，从该图像数据与基准图像数据之间的差异获得在封装水平面内的位置偏移量数据(位置数据)，控制部分基于该位置偏移量数据(位置数据)控制传送设备的夹具部分的操作，使得上部封装30通过传送设备的夹具部分接近下部封装20。以下这种构造当然也是可以的，即：控制部分基于位置偏移量数据进行控制，使得上面设置有下部封装20的载体移动，再将设置在载体上的下部封装20定位于正确的位置，然后通过传送设备的夹具部分使上部封装30仅仅下降，从而将上部封装堆叠在下部封装20上。在采用这种构造的情况下，优选的是，载体包括抽吸保持机构，从而不会干扰下部封装20的设置状态。
在上述实施例中，已经描述了制造将本发明的半导体封装用作下部封装20的POP结构半导体封装10的方法。当然，这些实例也同样适用于制造将本发明的半导体封装用作上部封装30的POP结构半导体封装10的方法。
在第一实施例中，描述了以下这种构造，即：异形连接焊盘27、27布置成使得连接异形连接焊盘27、27的直线不经过下部封装20的上表面的中心点。如图9所示，即使在连接一个异形连接焊盘27E与另一个异形连接焊盘27F的直线经过下部封装20的上表面的中心点O的构造中，在满足一个异形连接焊盘27E与下部封装20的上表面的中心点O之间的距离L1不等于另一个异形连接焊盘27F与下部封装20的上表面的中心点O之间的距离L2的条件的情况下，也可以确定在下部封装20的水平面内是否发生180度旋转。当采用这种构造时，延长了异形连接焊盘27E和27F的轴对轴距离，因而可以提高位置偏移量数据的计算精度。因此，这种构造是有利的。

Claims (4)

1.一种半导体封装，包括：
三个或更多个连接焊盘，所述连接焊盘中的至少两个连接焊盘形成为平面形状与其他连接焊盘不同的异形连接焊盘，
其中，以如下方式布置所述异形连接焊盘中的一个异形连接焊盘和另一个异形连接焊盘，即：在平面排布的相互位置关系中，当所述一个异形连接焊盘的位置围绕所述半导体封装的中心点旋转180度时，所述一个异形连接焊盘所处的位置与所述另一个异形连接焊盘的初始位置不完全重合。
2.根据权利要求1所述的半导体封装，
其中，以如下方式布置所述一个异形连接焊盘和所述另一个异形连接焊盘，即：当所述一个异形连接焊盘的位置围绕所述半导体封装的中心点旋转180度时，所述一个异形连接焊盘的中心点位置偏离所述另一个异形连接焊盘的中心点位置。
3.根据权利要求1所述的半导体封装，
其中，以如下方式布置所述一个异形连接焊盘和所述另一个异形连接焊盘，即：当所述一个异形连接焊盘的位置围绕所述半导体封装的中心点旋转180度时，所述一个异形连接焊盘的中心点位置与所述另一个异形连接焊盘的中心点位置重合，并且所述一个异形连接焊盘的外轮廓与所述另一个异形连接焊盘的外轮廓不同。
4.根据权利要求1所述的半导体封装，还包括：
第二异形连接焊盘，其用作检查所述半导体封装的位置的视觉标记，并且形成为具有与所述连接焊盘的平面形状不同的形状。
CNA2008101866078A 2007-12-12 2008-12-11 半导体封装 Pending CN101459149A (zh)

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