CN101452102B - 组件减少的数字图像拍摄设备及其装配方法 - Google Patents
组件减少的数字图像拍摄设备及其装配方法 Download PDFInfo
- Publication number
- CN101452102B CN101452102B CN2008101794775A CN200810179477A CN101452102B CN 101452102 B CN101452102 B CN 101452102B CN 2008101794775 A CN2008101794775 A CN 2008101794775A CN 200810179477 A CN200810179477 A CN 200810179477A CN 101452102 B CN101452102 B CN 101452102B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- digital image
- image capture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 10
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 230000005611 electricity Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- VLLVVZDKBSYMCG-UHFFFAOYSA-N 1,3,5-trichloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC=C1Cl VLLVVZDKBSYMCG-UHFFFAOYSA-N 0.000 description 31
- 238000003860 storage Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2217/00—Details of cameras or camera bodies; Accessories therefor
- G03B2217/002—Details of arrangement of components in or on camera body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N2101/00—Still video cameras
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0125184 | 2007-12-04 | ||
KR1020070125184 | 2007-12-04 | ||
KR1020070125184A KR101475683B1 (ko) | 2007-12-04 | 2007-12-04 | 디지털 촬영장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101452102A CN101452102A (zh) | 2009-06-10 |
CN101452102B true CN101452102B (zh) | 2013-04-10 |
Family
ID=40675311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101794775A Expired - Fee Related CN101452102B (zh) | 2007-12-04 | 2008-11-28 | 组件减少的数字图像拍摄设备及其装配方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8223246B2 (zh) |
KR (1) | KR101475683B1 (zh) |
CN (1) | CN101452102B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090058419A (ko) * | 2007-12-04 | 2009-06-09 | 삼성디지털이미징 주식회사 | 디지털 촬영장치 |
JP6459961B2 (ja) * | 2013-03-15 | 2019-01-30 | 株式会社ニコン | 受光装置 |
US9769361B2 (en) * | 2015-08-31 | 2017-09-19 | Adlink Technology Inc. | Assembly structure for industrial cameras |
USD914071S1 (en) | 2018-11-02 | 2021-03-23 | Esab Ab | Welding device enclosure |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2645238Y (zh) * | 2003-09-05 | 2004-09-29 | 英新达股份有限公司 | 数字图像拍摄模块的封装结构及制程 |
CN1983536A (zh) * | 2005-12-12 | 2007-06-20 | 嘉田科技股份有限公司 | 改善影像感测晶片组构于电路板的封装方法 |
CN1984245A (zh) * | 2005-12-15 | 2007-06-20 | 普立尔科技股份有限公司 | 数码相机 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960002205B1 (ko) * | 1992-08-18 | 1996-02-13 | 현대전자산업주식회사 | 자동카메라용 릴리즈 버튼 작동구조 |
KR960028534A (ko) | 1994-12-28 | 1996-07-22 | 김금천 | 자동차 후방투시용 c.c.d 카메라 설치구조 |
JPH1169208A (ja) * | 1997-08-21 | 1999-03-09 | Kanagawa Chikudenchi Kk | ピンホールビデオカメラ |
KR20010036029A (ko) * | 1999-10-05 | 2001-05-07 | 윤종용 | 씨씨티브이 카메라의 초점거리 조절장치 |
KR20020032027A (ko) | 2000-10-25 | 2002-05-03 | 듀흐 마리 에스. | Ccd 이미징 칩용 패키징 구조 |
JP2003270705A (ja) * | 2002-03-14 | 2003-09-25 | Olympus Optical Co Ltd | カメラ |
-
2007
- 2007-12-04 KR KR1020070125184A patent/KR101475683B1/ko active IP Right Grant
-
2008
- 2008-10-28 US US12/290,183 patent/US8223246B2/en active Active
- 2008-11-28 CN CN2008101794775A patent/CN101452102B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2645238Y (zh) * | 2003-09-05 | 2004-09-29 | 英新达股份有限公司 | 数字图像拍摄模块的封装结构及制程 |
CN1983536A (zh) * | 2005-12-12 | 2007-06-20 | 嘉田科技股份有限公司 | 改善影像感测晶片组构于电路板的封装方法 |
CN1984245A (zh) * | 2005-12-15 | 2007-06-20 | 普立尔科技股份有限公司 | 数码相机 |
Also Published As
Publication number | Publication date |
---|---|
US8223246B2 (en) | 2012-07-17 |
KR101475683B1 (ko) | 2014-12-23 |
KR20090058418A (ko) | 2009-06-09 |
US20090141158A1 (en) | 2009-06-04 |
CN101452102A (zh) | 2009-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DIGITALAL IMAGE CO., LTD. Free format text: FORMER OWNER: SAMSUNG TECHWIN CO., LTD. Effective date: 20090821 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090821 Address after: Gyeonggi Do Korea Suwon Applicant after: Samsung Electronics Co., Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: Samsung Techwin Co., Ltd. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG ELECTRONICS CO., LTD. Free format text: FORMER OWNER: SAMSUNG TECHWIN CO., LTD. Effective date: 20110104 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: HAN GUO GYEONGGI SUWON CITY TO: SUWON CITY, GYEONGGI, SOUTH KOREA |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20110104 Address after: Gyeonggi Do Korea Suwon Applicant after: Samsung Electronics Co.,Ltd. Address before: Suwon, Gyeonggi-do, South Korea Applicant before: Samsung Electronics Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130410 Termination date: 20201128 |
|
CF01 | Termination of patent right due to non-payment of annual fee |