CN101426336B - 内置了电阻元件的印刷布线板的制造方法 - Google Patents
内置了电阻元件的印刷布线板的制造方法 Download PDFInfo
- Publication number
- CN101426336B CN101426336B CN2008101778984A CN200810177898A CN101426336B CN 101426336 B CN101426336 B CN 101426336B CN 2008101778984 A CN2008101778984 A CN 2008101778984A CN 200810177898 A CN200810177898 A CN 200810177898A CN 101426336 B CN101426336 B CN 101426336B
- Authority
- CN
- China
- Prior art keywords
- resistive element
- metallic film
- wiring board
- layer
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-277795 | 2007-10-25 | ||
JP2007277795 | 2007-10-25 | ||
JP2007277795A JP4943293B2 (ja) | 2007-10-25 | 2007-10-25 | 抵抗素子を内蔵したプリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101426336A CN101426336A (zh) | 2009-05-06 |
CN101426336B true CN101426336B (zh) | 2011-07-27 |
Family
ID=40616603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101778984A Expired - Fee Related CN101426336B (zh) | 2007-10-25 | 2008-10-27 | 内置了电阻元件的印刷布线板的制造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4943293B2 (ja) |
CN (1) | CN101426336B (ja) |
TW (1) | TWI429349B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102573301B (zh) * | 2010-12-23 | 2014-08-27 | 北大方正集团有限公司 | 在电路板上制作刻槽的方法及电路板 |
CN107466157A (zh) * | 2017-06-20 | 2017-12-12 | 深圳崇达多层线路板有限公司 | 一种埋阻板及使用该埋阻板制作印制线路板的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1536952A (zh) * | 2003-04-04 | 2004-10-13 | 株式会社电装 | 多层印制电路板及其制造方法 |
CN101048036A (zh) * | 2006-03-30 | 2007-10-03 | 财团法人工业技术研究院 | 嵌入式薄膜电阻及其制造方法、多层基板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6079798A (ja) * | 1983-10-06 | 1985-05-07 | 三洋電機株式会社 | 樹脂製回路基板 |
JPS61185995A (ja) * | 1985-02-13 | 1986-08-19 | 三菱電機株式会社 | 抵抗体付き回路基板の製法 |
JPH0680880B2 (ja) * | 1988-03-15 | 1994-10-12 | 松下電工株式会社 | 抵抗体付セラミック回路板の製法 |
JPH0682909B2 (ja) * | 1988-06-27 | 1994-10-19 | 松下電工株式会社 | 抵抗体付セラミック回路板の製造方法 |
JPH0682908B2 (ja) * | 1988-06-27 | 1994-10-19 | 松下電工株式会社 | 抵抗体付セラミック回路板の製造方法 |
-
2007
- 2007-10-25 JP JP2007277795A patent/JP4943293B2/ja active Active
-
2008
- 2008-10-08 TW TW97138728A patent/TWI429349B/zh active
- 2008-10-27 CN CN2008101778984A patent/CN101426336B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1536952A (zh) * | 2003-04-04 | 2004-10-13 | 株式会社电装 | 多层印制电路板及其制造方法 |
CN101048036A (zh) * | 2006-03-30 | 2007-10-03 | 财团法人工业技术研究院 | 嵌入式薄膜电阻及其制造方法、多层基板 |
Also Published As
Publication number | Publication date |
---|---|
TW200938019A (en) | 2009-09-01 |
TWI429349B (zh) | 2014-03-01 |
JP4943293B2 (ja) | 2012-05-30 |
CN101426336A (zh) | 2009-05-06 |
JP2009105323A (ja) | 2009-05-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110727 Termination date: 20191027 |
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CF01 | Termination of patent right due to non-payment of annual fee |