CN101426336B - 内置了电阻元件的印刷布线板的制造方法 - Google Patents

内置了电阻元件的印刷布线板的制造方法 Download PDF

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Publication number
CN101426336B
CN101426336B CN2008101778984A CN200810177898A CN101426336B CN 101426336 B CN101426336 B CN 101426336B CN 2008101778984 A CN2008101778984 A CN 2008101778984A CN 200810177898 A CN200810177898 A CN 200810177898A CN 101426336 B CN101426336 B CN 101426336B
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China
Prior art keywords
resistive element
metallic film
wiring board
layer
printed wiring
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Expired - Fee Related
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CN2008101778984A
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English (en)
Chinese (zh)
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CN101426336A (zh
Inventor
松田文彦
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Nippon Mektron KK
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Nippon Mektron KK
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  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN2008101778984A 2007-10-25 2008-10-27 内置了电阻元件的印刷布线板的制造方法 Expired - Fee Related CN101426336B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-277795 2007-10-25
JP2007277795 2007-10-25
JP2007277795A JP4943293B2 (ja) 2007-10-25 2007-10-25 抵抗素子を内蔵したプリント配線板の製造方法

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CN101426336A CN101426336A (zh) 2009-05-06
CN101426336B true CN101426336B (zh) 2011-07-27

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CN2008101778984A Expired - Fee Related CN101426336B (zh) 2007-10-25 2008-10-27 内置了电阻元件的印刷布线板的制造方法

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JP (1) JP4943293B2 (ja)
CN (1) CN101426336B (ja)
TW (1) TWI429349B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102573301B (zh) * 2010-12-23 2014-08-27 北大方正集团有限公司 在电路板上制作刻槽的方法及电路板
CN107466157A (zh) * 2017-06-20 2017-12-12 深圳崇达多层线路板有限公司 一种埋阻板及使用该埋阻板制作印制线路板的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1536952A (zh) * 2003-04-04 2004-10-13 株式会社电装 多层印制电路板及其制造方法
CN101048036A (zh) * 2006-03-30 2007-10-03 财团法人工业技术研究院 嵌入式薄膜电阻及其制造方法、多层基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079798A (ja) * 1983-10-06 1985-05-07 三洋電機株式会社 樹脂製回路基板
JPS61185995A (ja) * 1985-02-13 1986-08-19 三菱電機株式会社 抵抗体付き回路基板の製法
JPH0680880B2 (ja) * 1988-03-15 1994-10-12 松下電工株式会社 抵抗体付セラミック回路板の製法
JPH0682909B2 (ja) * 1988-06-27 1994-10-19 松下電工株式会社 抵抗体付セラミック回路板の製造方法
JPH0682908B2 (ja) * 1988-06-27 1994-10-19 松下電工株式会社 抵抗体付セラミック回路板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1536952A (zh) * 2003-04-04 2004-10-13 株式会社电装 多层印制电路板及其制造方法
CN101048036A (zh) * 2006-03-30 2007-10-03 财团法人工业技术研究院 嵌入式薄膜电阻及其制造方法、多层基板

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Publication number Publication date
TW200938019A (en) 2009-09-01
TWI429349B (zh) 2014-03-01
JP4943293B2 (ja) 2012-05-30
CN101426336A (zh) 2009-05-06
JP2009105323A (ja) 2009-05-14

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