CN101409980A - 软硬复合电路板 - Google Patents
软硬复合电路板 Download PDFInfo
- Publication number
- CN101409980A CN101409980A CNA2007101629754A CN200710162975A CN101409980A CN 101409980 A CN101409980 A CN 101409980A CN A2007101629754 A CNA2007101629754 A CN A2007101629754A CN 200710162975 A CN200710162975 A CN 200710162975A CN 101409980 A CN101409980 A CN 101409980A
- Authority
- CN
- China
- Prior art keywords
- soft
- conductive pattern
- circuit board
- rigid
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007101629754A CN101409980B (zh) | 2007-10-09 | 2007-10-09 | 软硬复合电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007101629754A CN101409980B (zh) | 2007-10-09 | 2007-10-09 | 软硬复合电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101409980A true CN101409980A (zh) | 2009-04-15 |
CN101409980B CN101409980B (zh) | 2011-04-13 |
Family
ID=40572695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101629754A Expired - Fee Related CN101409980B (zh) | 2007-10-09 | 2007-10-09 | 软硬复合电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101409980B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102946687A (zh) * | 2012-10-31 | 2013-02-27 | 深圳崇达多层线路板有限公司 | 一种局部贴合避孔刚挠结合板及制作方法 |
CN103442525A (zh) * | 2013-08-01 | 2013-12-11 | 北大方正集团有限公司 | 一种刚挠结合印制电路板及其制作方法 |
CN103458605A (zh) * | 2012-05-30 | 2013-12-18 | 欣兴电子股份有限公司 | 软硬复合电路板及其制作方法 |
CN107949187A (zh) * | 2017-12-19 | 2018-04-20 | 维沃移动通信有限公司 | 一种软硬结合板的制作方法、软硬结合板及移动终端 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100435606C (zh) * | 2005-02-06 | 2008-11-19 | 华通电脑股份有限公司 | 制造软硬复合电路板的方法 |
CN1988761B (zh) * | 2005-12-20 | 2010-08-04 | 耀华电子股份有限公司 | 一种软硬合成印刷电路板导通孔信赖度提升的结合方法 |
-
2007
- 2007-10-09 CN CN2007101629754A patent/CN101409980B/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103458605A (zh) * | 2012-05-30 | 2013-12-18 | 欣兴电子股份有限公司 | 软硬复合电路板及其制作方法 |
CN103458605B (zh) * | 2012-05-30 | 2016-12-14 | 欣兴电子股份有限公司 | 软硬复合电路板及其制作方法 |
CN102946687A (zh) * | 2012-10-31 | 2013-02-27 | 深圳崇达多层线路板有限公司 | 一种局部贴合避孔刚挠结合板及制作方法 |
CN102946687B (zh) * | 2012-10-31 | 2015-04-22 | 深圳崇达多层线路板有限公司 | 一种局部贴合避孔刚挠结合板及制作方法 |
CN103442525A (zh) * | 2013-08-01 | 2013-12-11 | 北大方正集团有限公司 | 一种刚挠结合印制电路板及其制作方法 |
CN107949187A (zh) * | 2017-12-19 | 2018-04-20 | 维沃移动通信有限公司 | 一种软硬结合板的制作方法、软硬结合板及移动终端 |
Also Published As
Publication number | Publication date |
---|---|
CN101409980B (zh) | 2011-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9674969B2 (en) | Flexible printed circuit board and manufacturing method thereof | |
EP2911484B1 (en) | Printed circuit board and method of fabricating the same | |
CN106165554A (zh) | 印刷电路板、封装基板及其制造方法 | |
CN103456643A (zh) | Ic载板及其制作方法 | |
US11723153B2 (en) | Printed circuit board and method of fabricating the same | |
CN105491819A (zh) | 具有不同柔性外形的刚挠板及其制备方法 | |
CN101409980B (zh) | 软硬复合电路板 | |
US20150156877A1 (en) | Strip level substrate including warpage preventing member and method of manufacturing the same | |
CN102573278A (zh) | 多层布线基板 | |
CN110636690B (zh) | 一种散热基板结构及其制作方法 | |
CN102487578A (zh) | 线路板及其制作方法 | |
CN102131337B (zh) | 线路板及其制程 | |
JP5165723B2 (ja) | 回路基板およびその製造方法 | |
CN101777548B (zh) | 内埋芯片基板及其制作方法 | |
CN116614964B (zh) | 一种ic载板及其制作方法 | |
KR102534940B1 (ko) | 인쇄회로기판 | |
CN104349610A (zh) | 印制电路板子板及印制电路板的制造方法和印制电路板 | |
CN107017211B (zh) | 电子部件和方法 | |
KR101368043B1 (ko) | 양면연성회로기판의 구조 | |
US20150101846A1 (en) | Printed circuit board and method of manufacturing the same | |
CN101361414A (zh) | 多层印刷线路基板及其制造方法 | |
US20150014026A1 (en) | Printed circuit board and manufacturing method thereof | |
CN103582287A (zh) | 内建式印刷电路板的绝缘体及用其制造印刷电路板的方法 | |
JP2007311723A (ja) | 多層回路基板 | |
CN102484952A (zh) | 部分多层配线基板及其制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: UNIFLEX TECHNOLOGY (KUNSHAN) INC. Free format text: FORMER OWNER: XINXING ELECTRONICS CO., LTD. Effective date: 20120216 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 215316 SUZHOU, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20120216 Address after: Kunshan City, Jiangsu province Hanpu road 215316 No. 999 Patentee after: UNIMICRON-FPC TECHNOLOGY (KUNSHAN) CORP. Address before: China Taiwan Taoyuan County Patentee before: Xinxing Electronics Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110413 Termination date: 20201009 |