CN101404260B - 一种led显示器的封装方法 - Google Patents

一种led显示器的封装方法 Download PDF

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CN101404260B
CN101404260B CN2008101559578A CN200810155957A CN101404260B CN 101404260 B CN101404260 B CN 101404260B CN 2008101559578 A CN2008101559578 A CN 2008101559578A CN 200810155957 A CN200810155957 A CN 200810155957A CN 101404260 B CN101404260 B CN 101404260B
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包书林
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Jiangsu Wenrun Optoelectronic Co Ltd
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Abstract

本发明公开了一种LED显示器的封装方法,包括a、提供封装支架或基板;b、固晶;c、焊线;d、封胶的步骤,所述封胶包括如下步骤:d1、选用与封装支架或基板相匹配的成型模腔;d2,在成型模腔内灌注液态环氧树脂;d3、将封装支架或基板放入工业丙酮中过滤;d4、取出晾干;d5、将封装支架或基板倾斜放入成型模腔内并压紧;d6、烘烤固化,进行烘烤使环氧树脂固化,本发明能有效控制气泡的产生,且作业效率高、操作简单,采用该方法封装的LED显示器出光均匀。

Description

一种LED显示器的封装方法
技术领域
本发明涉及一种封装方法,特别涉及一种LED显示器的封装方法。
背景技术
LED显示器集微电子技术、计算机技术、信息处理于一体,以其色彩鲜艳、动态范围广、亮度高、寿命长、工作稳定可靠等优点,成为最具优势的新一代显示媒体。随着大规模集成电路和计算机技术的不断进步,LED显示器正在迅速崛起,目前,LED显示器已广泛应用于大型广场、商业广告、体育场馆、信息传播、新闻发布、证券交易等,可以满足不同环境的需要。
现有的LED显示器的常规封装方法:
a、选用适合的封装支架或基板,在封装支架或基板周边穿上插针,后用模具压紧或用锡丝进行焊接,形成相邻的第一电极和第二电极;
b、固晶,在封装支架或基板上制作规定的位置安放LED芯片、将LED芯片固定于封装支架或基板上;
c、焊线,用金丝将晶片与封装支架或基板进行内连接导通,将LED芯片的正、负极分别与封装支架或基板上的第一、第二电极相连;
d、封胶,其中,所述封胶包括如下步骤:
d1、选用与封装支架或基板相匹配的成型模腔;
d2,在成型模腔内灌注液态环氧树脂;
d3、将封装支架或基板以0-90度的角度放入成型模腔内并压紧;
d4、烘烤固化,进行烘烤使环氧树脂固化,烘烤时间为1小时,烘烤温度为135℃。
该方法的缺点是:由于环氧树脂具有一定的粘度(混合粘度500~700CPS/30℃),浸透性较差;且成型模腔内部的形状不规则,将封装支架或基板放入成型模腔内时,封装支架或基板与环氧树脂接触,由于表面张力的存在,使得封装支架或基板不容易被环氧树脂浸润,极容易在封装支架或基板的表面产生气泡,从而导致LED显示器出光不均匀,影响LED显示器的发光效果。
发明内容
本发明所要解决的技术问题是针对上述缺点,提供一种LED显示器的封装方法,该方法能有效控制气泡的产生,且作业效率高、操作简单,采用该方法封装的LED显示器出光均匀。
为了解决上述技术问题,本发明一种LED显示器的封装方法,包括以下步骤:
a、提供封装支架或基板,该封装支架或基板包括相邻的第一电极和第二电极;
b、固晶,将LED芯片固定于封装支架或基板上;
c、焊线,将LED芯片的正、负极分别与封装支架或基板上的第一、第二电极相连;
d、封胶,其中,所述封胶包括如下步骤:
d1、选用与封装支架或基板相匹配的成型模腔;
d2,在成型模腔内灌注液态环氧树脂;
d3、将封装支架或基板放入工业丙酮中过滤,过滤时间为1~2秒,工业丙酮的浓度≥99.2%;
d4、取出晾干,晾干时间为1-60秒;
d5、将封装支架或基板以0-90度的角度放入成型模腔内并压紧;
d6、烘烤固化,进行烘烤使环氧树脂固化,烘烤时间为1小时,烘烤温度为135℃。
上述一种LED显示器的封装方法,其中,优选所述晾干时间为5~10秒。
上述一种LED显示器的封装方法,其中,优选液态环氧树脂的灌注量为成型模腔体积的80%。
与现有LED封装方法相比,本发明采用的LED显示器封装方法,由于工业丙酮具有良好的降低粘度的特性,且与环氧树脂有很好的相容性,可在封装支架或基板放入成型模腔内前,将封装支架或基板放入工业丙酮中过滤,使封装支架或基板被浸润,降低了封装支架或基板与环氧树脂接触时,封装支架或基板表面的张力,又可去除封装支架或基板表面的杂物,从而将封装支架或基板放入成型模腔内时,可减少气泡的产生,清洗以前每只产品气泡残存大于70%,处理后气泡的残存小于3%,提高了LED显示器出光的均匀性及作业效率,且该方法只是在封装支架或基板放入成型模腔内前,将封装支架或基板过滤了一次,因此,操作方便;且由于晾干时间一般为5~10秒,这样工业丙酮不会因时间长挥发了,而影响过滤的效果;也不会因时间短,工业丙酮在封装支架或基板上残存过多,影响环氧树脂固化后的性能,从而更加减少了气泡的残存量;另外,液态环氧树脂的灌注量为成型模腔体积的80%,这样当封装支架或基板放入后,环氧树脂不会溢出且可将封装支架或基板完全覆盖封装支架或基板,从而减少了环氧树脂的浪费,节约了成本。
具体实施方式
下面结合附图对本发明作进一步说明。
如图所示,为了解决上述技术问题,本发明一种LED显示器的封装方法,包括如下步骤:a、提供封装支架或基板,在封装支架或基板周边穿上插针,后用模具压紧或用锡丝进行焊接,形成相邻的第一电极和第二电极,以满足安装后形成外连接;b、固晶,在LED芯片底部电极备上绝缘胶或银胶后进行扩张,将扩张后的芯片安置在刺晶台上,在显微镜下用刺晶笔将管芯一个一个安装在封装支架或基板上相应的焊盘上,随后进行烧结使银胶固化,银胶烧结的温度一般控制在150℃,烧结时间2小时;绝缘胶一般150℃,1小时,银胶烧结烘箱的必须按工艺要求隔2小时(或1小时)打开更换烧结的产品,中间不得随意打开。烧结烘箱不得再其他用途,防止污染。烧结时间可根据实际情况,调整到170℃,1小时,从而将LED芯片固定于封装支架或基板上;c、焊线,用铝丝或金丝焊机将电极连接到LED芯片上,将LED芯片的正、负极分别与封装支架或基板1上的第一、第二电极相连,以作电流注入的引线,LED芯片安装在封装支架或基板上的,一般采用铝丝焊机,压焊的目的是将电极引到LED芯片上,完成产品内外引线的连接工作,LED的压焊工艺有金丝球焊和铝丝压焊两种:铝丝压焊的过程,先在LED芯片电极上压上第一点,再将铝丝拉到相应的支架上方,压上第二点后扯断铝丝。金丝球焊过程,则在压第一点前先烧个球,后在LED芯片电极上压上第一点,再将铝丝拉到相应的支架上方,压上第二点后扯断铝丝;d、封胶,前三个步骤与现有封装方法的步骤相同,而最后一个步骤即封胶则是本发明区别于现有封装方法的主要步骤,以下就步骤d即封胶进行详细说明。
本发明中,步骤d封胶包括如下步骤:
d1、选用与封装支架或基板相匹配的成型模腔,所述封装支架或基板的形状不受限制,所述成型模腔的形状与所述封装支架相适应,为了加工方便,使用安全,还可在成型模腔的外表面压贴上一层高温胶带;
d2,在成型模腔内灌注液态环氧树脂,成型模腔类似一个方形且内部不规则的水槽,环氧树脂的灌注量不受限制,本发明中,液态环氧树脂的灌注量一般约为成型模腔体积的80%,这样当封装支架或基板放入后,环氧树脂不会溢出且可将封装支架或基板完全覆盖封装支架或基板,从而减少了环氧树脂的浪费,节约了成本,一般灌封后半小时内需要压封装支架或基板。
d3、用手持封装支架或基板的电极,将封装支架或基板放入工业丙酮中过滤,过滤时间为1~2秒,工业丙酮的浓度≥99.2%,采用上述浓度的工业丙酮,可使环氧树脂固化后的粘接强度更加好,不会因浓度偏低,水分含量大,造成环氧树脂固化后的粘接强度下降。
d4、取出晾干,晾干时间一般为1-60秒,将封装支架或基板上残存流动的工业丙酮去掉。本实施例中,封装支架或基板在工业丙酮中过滤后,晾干时间一般为5~10秒,然后压于环氧树脂中,这样工业丙酮不会因时间长挥发了,而影响过滤的效果;也不会因时间短,工业丙酮在封装支架或基板上残存过多,影响环氧树脂固化后的性能。
d5、将封装支架或基板倾斜放入成型模腔内并压紧,封装支架或基板浸润的过程是:首先把封装支架或基板一边置入环氧树脂中,然后用手扶着其对边,缓慢的倾斜倒入,其角度是封装支架或基板与环氧树脂液面的夹角,其角度是从90度到0度。
d6、烘烤固化,进行烘烤使环氧树脂固化,烘烤时间一般为1小时,烘烤温度为135℃。
其中,所述步骤d2与步骤d3的顺序不受限制,可进行互换。
为了避免由于封装支架或基板的第一电极与第二电极完全接触,使LED芯片被短路而不能工作,可在进行所述步骤a提供封装支架或基板之前,对连接LED芯片的封装支架或基板进行预处理,该预处理步骤如下:首先将封装支架或基板1浸泡于环氧树脂溶液中一段时间,然后放入烘箱中进行烘干,使环氧树脂在封装支架或基板的第一电极与第二电极顶端之间形成绝缘层,上述浸泡过程所需时间为1-2秒,而烘干温度为130℃时,烘干时间为40-60分钟;烘干温度为150℃时,所需的烘干时间为30分钟,烘干温度适当增高会使烘干所需的时间相应减少,但也会对形成的绝缘层结构产生不良影响,因此,烘烤温度不可过高。
上述封装方法中封装支架或基板上的第一电极和第二电极分别由两排插针构成,先将插针插入封装支架或基板两端,然后再通过压力装置将插针压接在所述封装支架或基板上,该两排插针是用来传递信号的。
为了让环氧树脂充分固化,同时对LED进行热老化,提高环氧树脂与封装支架或基板的粘接强度,可在封胶后,再进行一次后固化,后固化是再次烘烤,一般条件为温度是120℃,时间为4小时。
综上所述,本发明一种LED显示器的封装方法,由于工业丙酮与环氧树脂有很好的相容性,在封装支架或基板放入成型模腔内前,将封装支架或基板放入工业丙酮中过滤,使封装支架或基板被浸润,减小封装支架或基板表面的张力,又可去除封装支架或基板表面的杂物,从而将封装支架或基板放入成型模腔内时,可减少气泡的产生,清洗以前每只产品气泡残存大于70%,处理后气泡的残存不大于3%,提高了LED显示器出光的均匀性且作业效率高。
这里本发明的描述和应用是说明性的,并非想将本发明的范围限制在上述实施例中,因此,本发明不受本实施例的限制,任何采用等效替换取得的技术方案均在本发明保护的范围内。

Claims (3)

1.一种LED显示器的封装方法,包括以下步骤:
a、提供封装支架或基板,该封装支架或基板包括相邻的第一电极和第二电极;
b、固晶,将LED芯片固定于封装支架或基板上;
c、焊线,将LED芯片的正、负极分别与封装支架或基板上的第一、第二电极相连;
d、封胶,其特征在于,所述封胶包括如下步骤:
d1、选用与封装支架或基板相匹配的成型模腔;
d2,在成型模腔内灌注液态环氧树脂;
d3、将封装支架或基板放入工业丙酮中过滤,过滤时间为1~2秒,工业丙酮的浓度≥99.2%;
d4、取出晾干,晾干时间为1-60秒;
d5、将封装支架或基板以0-90度的角度放入成型模腔内并压紧;
d6、烘烤固化,进行烘烤使环氧树脂固化,烘烤时间为1小时,烘烤温度为135℃。
2.如权利要求1所述一种LED显示器的封装方法,其特征在于,所述晾干时间优选为5~10秒。
3.如权利要求1所述一种LED显示器的封装方法,其特征在于,所述液态环氧树脂的灌注量优选为成型模腔体积的80%。
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6241858B1 (en) * 1999-09-03 2001-06-05 Flex Products, Inc. Methods and apparatus for producing enhanced interference pigments
CN1474749A (zh) * 2000-09-18 2004-02-11 �����ι�˾ 一种压电致动器和使用压电致动器的泵
CN1741210A (zh) * 2005-09-05 2006-03-01 韶关市韶特电气有限公司 干式电力变压器浇注式环氧树脂线圈免切割技术

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6241858B1 (en) * 1999-09-03 2001-06-05 Flex Products, Inc. Methods and apparatus for producing enhanced interference pigments
CN1474749A (zh) * 2000-09-18 2004-02-11 �����ι�˾ 一种压电致动器和使用压电致动器的泵
CN1741210A (zh) * 2005-09-05 2006-03-01 韶关市韶特电气有限公司 干式电力变压器浇注式环氧树脂线圈免切割技术

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