CN101403785B - 探测装置以及探测方法 - Google Patents
探测装置以及探测方法 Download PDFInfo
- Publication number
- CN101403785B CN101403785B CN2008101695407A CN200810169540A CN101403785B CN 101403785 B CN101403785 B CN 101403785B CN 2008101695407 A CN2008101695407 A CN 2008101695407A CN 200810169540 A CN200810169540 A CN 200810169540A CN 101403785 B CN101403785 B CN 101403785B
- Authority
- CN
- China
- Prior art keywords
- wafer
- image unit
- platform
- video recording
- putting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007256804 | 2007-09-28 | ||
JP2007-256804 | 2007-09-28 | ||
JP2007256804 | 2007-09-28 | ||
JP2008092934A JP5120027B2 (ja) | 2007-09-28 | 2008-03-31 | プローブ装置及びプロービング方法 |
JP2008092934 | 2008-03-31 | ||
JP2008-092934 | 2008-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101403785A CN101403785A (zh) | 2009-04-08 |
CN101403785B true CN101403785B (zh) | 2012-01-11 |
Family
ID=40537857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101695407A Expired - Fee Related CN101403785B (zh) | 2007-09-28 | 2008-09-28 | 探测装置以及探测方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5120027B2 (ja) |
KR (1) | KR101020396B1 (ja) |
CN (1) | CN101403785B (ja) |
TW (1) | TWI442494B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4949454B2 (ja) * | 2009-11-17 | 2012-06-06 | 東京エレクトロン株式会社 | プローブ装置 |
JP2013024829A (ja) * | 2011-07-26 | 2013-02-04 | Seiko Epson Corp | 電子部品搬送装置及び電子部品搬送方法 |
JP2014135363A (ja) * | 2013-01-09 | 2014-07-24 | Tokyo Electron Ltd | プローブ装置及びウエハ搬送ユニット |
JP6220596B2 (ja) * | 2013-08-01 | 2017-10-25 | 東京エレクトロン株式会社 | プローバ |
JP6084140B2 (ja) * | 2013-09-06 | 2017-02-22 | ヤマハファインテック株式会社 | 電気検査装置 |
US11159784B2 (en) * | 2014-10-23 | 2021-10-26 | Cognex Corporation | System and method for calibrating a vision system with respect to a touch probe |
JP6999321B2 (ja) * | 2017-07-31 | 2022-01-18 | 東京エレクトロン株式会社 | 検査装置、検査方法及び記憶媒体 |
TWI794324B (zh) * | 2017-11-24 | 2023-03-01 | 日商日本電產理德股份有限公司 | 基板檢查裝置、檢查位置補正方法、位置補正資訊產生方法、以及位置補正資訊產生系統 |
CN114308709A (zh) * | 2021-12-28 | 2022-04-12 | 傲普(上海)新能源有限公司 | 一种电芯极片叠片对位检测方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3306972B2 (ja) * | 1993-02-26 | 2002-07-24 | キヤノン株式会社 | 位置検出装置及びそれを用いた半導体素子の製造方法 |
JPH0915302A (ja) * | 1995-06-30 | 1997-01-17 | Olympus Optical Co Ltd | 回路基板検査機の位置決め装置および位置決め方法 |
JP3303968B2 (ja) * | 1998-02-19 | 2002-07-22 | 東京エレクトロン株式会社 | ウエハと接触子の位置合わせ装置 |
JP4740405B2 (ja) | 2000-11-09 | 2011-08-03 | 東京エレクトロン株式会社 | 位置合わせ方法及びプログラム記録媒体 |
JP2003152037A (ja) * | 2001-11-12 | 2003-05-23 | Moritex Corp | ウェハ検査方法、検査装置及び検査用赤外線撮像装置 |
JP2004063877A (ja) | 2002-07-30 | 2004-02-26 | Tokyo Seimitsu Co Ltd | ウェハの位置決め修正方法 |
JP2004140084A (ja) * | 2002-10-16 | 2004-05-13 | Sharp Corp | 半導体チップのピックアップ方法およびそのピックアップ装置 |
KR20050024922A (ko) * | 2003-09-05 | 2005-03-11 | 김광렬 | 웨이퍼의 결함 검사장치 및 그 방법 |
JP2005223251A (ja) * | 2004-02-09 | 2005-08-18 | Seiko Epson Corp | 半導体装置の検査方法及びその検査装置、並びにその検査装置の制御プログラム |
JP4799880B2 (ja) | 2005-02-23 | 2011-10-26 | オー・エイチ・ティー株式会社 | 検査装置及び検査方法並びに位置決め方法 |
-
2008
- 2008-03-31 JP JP2008092934A patent/JP5120027B2/ja active Active
- 2008-09-25 KR KR1020080094007A patent/KR101020396B1/ko active IP Right Grant
- 2008-09-26 TW TW097137038A patent/TWI442494B/zh not_active IP Right Cessation
- 2008-09-28 CN CN2008101695407A patent/CN101403785B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101403785A (zh) | 2009-04-08 |
TWI442494B (zh) | 2014-06-21 |
JP2009099937A (ja) | 2009-05-07 |
JP5120027B2 (ja) | 2013-01-16 |
KR101020396B1 (ko) | 2011-03-08 |
TW200931556A (en) | 2009-07-16 |
KR20090033036A (ko) | 2009-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120111 Termination date: 20160928 |