CN101403785B - 探测装置以及探测方法 - Google Patents

探测装置以及探测方法 Download PDF

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Publication number
CN101403785B
CN101403785B CN2008101695407A CN200810169540A CN101403785B CN 101403785 B CN101403785 B CN 101403785B CN 2008101695407 A CN2008101695407 A CN 2008101695407A CN 200810169540 A CN200810169540 A CN 200810169540A CN 101403785 B CN101403785 B CN 101403785B
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CN
China
Prior art keywords
wafer
image unit
platform
video recording
putting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101695407A
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English (en)
Chinese (zh)
Other versions
CN101403785A (zh
Inventor
山本保人
小泽和博
加贺美史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101403785A publication Critical patent/CN101403785A/zh
Application granted granted Critical
Publication of CN101403785B publication Critical patent/CN101403785B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
CN2008101695407A 2007-09-28 2008-09-28 探测装置以及探测方法 Expired - Fee Related CN101403785B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007256804 2007-09-28
JP2007256804 2007-09-28
JP2007-256804 2007-09-28
JP2008092934 2008-03-31
JP2008092934A JP5120027B2 (ja) 2007-09-28 2008-03-31 プローブ装置及びプロービング方法
JP2008-092934 2008-03-31

Publications (2)

Publication Number Publication Date
CN101403785A CN101403785A (zh) 2009-04-08
CN101403785B true CN101403785B (zh) 2012-01-11

Family

ID=40537857

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101695407A Expired - Fee Related CN101403785B (zh) 2007-09-28 2008-09-28 探测装置以及探测方法

Country Status (4)

Country Link
JP (1) JP5120027B2 (https=)
KR (1) KR101020396B1 (https=)
CN (1) CN101403785B (https=)
TW (1) TWI442494B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI861896B (zh) * 2023-05-24 2024-11-11 旺矽科技股份有限公司 探針座位置調整方法及使用該方法之可換探針座之測試機

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4949454B2 (ja) * 2009-11-17 2012-06-06 東京エレクトロン株式会社 プローブ装置
JP2013024829A (ja) * 2011-07-26 2013-02-04 Seiko Epson Corp 電子部品搬送装置及び電子部品搬送方法
JP2014135363A (ja) * 2013-01-09 2014-07-24 Tokyo Electron Ltd プローブ装置及びウエハ搬送ユニット
JP6220596B2 (ja) * 2013-08-01 2017-10-25 東京エレクトロン株式会社 プローバ
JP6084140B2 (ja) * 2013-09-06 2017-02-22 ヤマハファインテック株式会社 電気検査装置
US11159784B2 (en) * 2014-10-23 2021-10-26 Cognex Corporation System and method for calibrating a vision system with respect to a touch probe
JP6999321B2 (ja) * 2017-07-31 2022-01-18 東京エレクトロン株式会社 検査装置、検査方法及び記憶媒体
TWI794324B (zh) * 2017-11-24 2023-03-01 日商日本電產理德股份有限公司 基板檢查裝置、檢查位置補正方法、位置補正資訊產生方法、以及位置補正資訊產生系統
CN112798933B (zh) * 2021-01-28 2025-01-17 长春光华微电子设备工程中心有限公司 一种晶圆自动对针装置及方法
JP7638723B2 (ja) * 2021-02-18 2025-03-04 東京エレクトロン株式会社 検査装置のセットアップ方法及び検査装置
CN114308709A (zh) * 2021-12-28 2022-04-12 傲普(上海)新能源有限公司 一种电芯极片叠片对位检测方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3306972B2 (ja) * 1993-02-26 2002-07-24 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
JPH0915302A (ja) * 1995-06-30 1997-01-17 Olympus Optical Co Ltd 回路基板検査機の位置決め装置および位置決め方法
JP3303968B2 (ja) * 1998-02-19 2002-07-22 東京エレクトロン株式会社 ウエハと接触子の位置合わせ装置
JP4740405B2 (ja) 2000-11-09 2011-08-03 東京エレクトロン株式会社 位置合わせ方法及びプログラム記録媒体
JP2003152037A (ja) * 2001-11-12 2003-05-23 Moritex Corp ウェハ検査方法、検査装置及び検査用赤外線撮像装置
JP2004063877A (ja) 2002-07-30 2004-02-26 Tokyo Seimitsu Co Ltd ウェハの位置決め修正方法
JP2004140084A (ja) * 2002-10-16 2004-05-13 Sharp Corp 半導体チップのピックアップ方法およびそのピックアップ装置
KR20050024922A (ko) * 2003-09-05 2005-03-11 김광렬 웨이퍼의 결함 검사장치 및 그 방법
JP2005223251A (ja) * 2004-02-09 2005-08-18 Seiko Epson Corp 半導体装置の検査方法及びその検査装置、並びにその検査装置の制御プログラム
JP4799880B2 (ja) 2005-02-23 2011-10-26 オー・エイチ・ティー株式会社 検査装置及び検査方法並びに位置決め方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI861896B (zh) * 2023-05-24 2024-11-11 旺矽科技股份有限公司 探針座位置調整方法及使用該方法之可換探針座之測試機

Also Published As

Publication number Publication date
KR20090033036A (ko) 2009-04-01
TW200931556A (en) 2009-07-16
KR101020396B1 (ko) 2011-03-08
JP5120027B2 (ja) 2013-01-16
CN101403785A (zh) 2009-04-08
TWI442494B (zh) 2014-06-21
JP2009099937A (ja) 2009-05-07

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Granted publication date: 20120111

Termination date: 20160928