CN101384135A - Sheet peeling device and sheet printing system using same device - Google Patents
Sheet peeling device and sheet printing system using same device Download PDFInfo
- Publication number
- CN101384135A CN101384135A CNA2008102110373A CN200810211037A CN101384135A CN 101384135 A CN101384135 A CN 101384135A CN A2008102110373 A CNA2008102110373 A CN A2008102110373A CN 200810211037 A CN200810211037 A CN 200810211037A CN 101384135 A CN101384135 A CN 101384135A
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- CN
- China
- Prior art keywords
- film
- mentioned
- substrate
- solder paste
- sheet
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Abstract
The invention claims a sheet printing system, in which undesirable printing caused by dislocation of a sheet component will not be brought when arranging an opening on the sheet component and printing by supplying soldering paste to the opening, comprising a paste portion, a pattern making portion, a printing portion, a backflow furnace and a stripping portion, characterized in that the paste portion pastes the sheet component onto a base plate for coating soldering paste; the pattern making portion forms an opening pattern for coating soldering paste on the sheet component; the printing portion prints soldering paste on the base plate mounting with the sheet component that forms the opening pattern; the backflow furnace heats the base plate printing with soldering paste to fix the soldering paste onto surface of the base plate; and the stripping portion removes the sheet component from the surface of the base plate fixing with soldering paste.
Description
Technical field
The present invention relates on real estate, form the printing equipment of soldering projection, particularly the print system that prints as mask with sheet component.
Background technology
In Japanese kokai publication hei 9-116257 communique, disclosed the technology that on real estate, forms the soldering projection of required pattern.In this technology, form pattern on sheet component, mounting and the mask sheet that is formed on the pattern identical patterns on the sheet material are used sheet top from mask, solder paste is filled on the sheet component, removed mask with behind the sheet, with filling the sheet component of solder paste, be positioned on the substrate align substrates face, then, after reflowing, remove sheet material, on real estate, formed the soldering projection of required pattern.
In above-mentioned technology, need the mask sheet of use and sheet component identical patterns shape.In addition, solder paste is filled to the peristome that is formed on the sheet component after, remove the mask sheet, sheet component is positioned on the substrate, for this reason, solder paste must be filled to the peristome of sheet component fully, can not flow out.In addition, after the reflowing, peel off the removal sheet material,, must not stay residue ground that sheet material is removed so the residue of sheet material may be stayed on the substrate, causes loose contact etc. from circuit substrate.
Summary of the invention
The objective of the invention is, when replacing metal mask to form the soldering projection with sheet component, can form the soldering projection with few material and operation, and, after reflowing, do not stay residue ground to remove sheet component from substrate.
Sheet printing system of the present invention comprises paste section, design producing portion, Printing Department, reflow ovens and sheet peeling device.Above-mentioned paste section pastes sheet component on the substrate of coating solder paste.Above-mentioned design producing portion forms the patterns of openings that the coating solder paste is used on sheet component.Solder paste prints in above-mentioned Printing Department on the substrate that is provided with the sheet component that has formed patterns of openings.Above-mentioned reflow ovens will have been printed the substrate heating of solder paste, and solder paste is cemented on the real estate.Above-mentioned sheet peeling device in order to remove sheet component from the real estate of fixed solder paste, uses the stripper of predetermined temperature.
Sheet peeling device is provided with the injection equipment of peeling off liquid bath and removing to the injection predetermined temperature stripper of impregnated substrate in peeling off liquid bath and with sheet component that stripper is kept uniform temperature and stored.
Sheet component is pasted as after on the real estate of printing object, opening is set, then on sheet component, solder paste is supplied on the patterns of openings of sheet component in Printing Department by mask, so available pasting print process is implemented high-precision printing to little, intensive patterns of openings.
In addition, after backflow, the sheet material (film) of printing usefulness must be peeled off, in this is peeled off, substrate is impregnated in the stripper that remains on predetermined temperature range, then, spray the stripper that remains on same temperature ranges stated with injection equipment with predetermined expulsion pressure, like this, can not stay residue ground to remove sheet material, so, can prevent the defective insulation of sheet material etc., can form good soldering projection.
Description of drawings
Fig. 1 is the figure of the unitary construction of expression sheet printing system.
Fig. 2 is the figure of the structure of expression sheet attaching mechanism.
Fig. 3 is the general structural map of exposure mechanism.
Fig. 4 is the general structural map of printing equipment.
Fig. 5 is the general structural map of film peeling apparatus.
Embodiment
Fig. 1 roughly represents the unitary construction of sheet printing system.
As shown in the figure, native system comprises apparatus for film adhesion 200, design producing apparatus 300, cleaning device 400, printing equipment 500, reflux (reflow ovens) 600 and film peeling apparatus 700.Above-mentioned apparatus for film adhesion 200 pastes sheet component 20 (perhaps being sometimes referred to as film) on the printing surface as the substrate 14 of printing object thing.Above-mentioned design producing apparatus 300 is implemented to adopt the perforate processing of the pattern that laser or exposure method print to the sheet face of pasting.Above-mentioned cleaning device 400 is got rid of the residue on the sheet face of having implemented perforate processing.Above-mentioned printing equipment 500 has mask, be provided with the opening roughly the same or slightly little on this mask with real estate, scraper plate is moved on mask, solder paste is supplied on the real estate by the pattern openings portion that is located on the sheet face (pellicular front) from mask open portion.Above-mentioned reflux (reflow ovens) 600 is transported into the substrate that has printed solder paste, with the solder paste fusion, it is cemented on the real estate.Above-mentioned film peeling apparatus 700 strips down the real estate of sheet member 20 from fixed solder paste.Connect by the substrate conveyer belt between each device.In addition, though not shown, the controlling organization that also is provided with the main control unit of the action of controlling whole system and is located at the interior action of each device of control on each device.Certainly, main control unit be located at each the device on controlling organization be connected by holding wire.
Fig. 2 represents film (sheet component) is pasted an example of the apparatus for film adhesion on the substrate.Among Fig. 2, film rolling 1 is formed by coverlay 2, diaphragm, 3 layers such film 20 of basement membrane, from the inboard, and reeling successively coverlay 2, diaphragm, basement membrane.In addition, the photosensitive film that film 20 is resolution height and thermal endurance, fissility is good.In addition, the thickness of film 20 changes according to the height of the soldering projection that will form, and is the film of 20～100 μ m but adopt thickness usually.
For film 20 is delivered on the face of transporting from film rolling 1, be provided with deflector roll 3 at the downside of film rolling 1.Peel off coverlay 2 at these deflector roll 3 places.The coverlay 2 that strips down be winding to the film rolling 1 adjacent take up roll that is being provided with 4 on.
At the drive division of film rolling 1 and take up roll 4, be provided with the function (figure does not show) of regulating torque according to the surplus of film 20.Like this, the tension force of film 20 can be remained definitely and transport.
At the downside of deflector roll 3, be provided with the leading section presumptive area or rearward end presumptive area, the front end holding member 5 that transports and the rear end holding member 6 that attract adsorbent thin film 20.Inside at front end holding member 5 is provided with vacuum chamber, is provided with adsorption hole in the above.Vacuum chamber is connected with the vacuum pump that figure does not show.Drive vacuum pump, with the film front end be adsorbed on front end holding member 5 above.That is, by keeping with vacuum suction mechanism and with servo motor 9 direct-connected ball-screws 10 be bearing on the movable part 11 front end holding member 5 to left and right direction (film carriage direction) move.In addition, by the cylinder 7 that is being connected with movable part 11, the front end of film 20 can be transported in a pair of crimping roller (overlapping rollers 13) that constitutes pressure contact portion, with side's crimping roller position adjacent.
Rear end holding member 6 also with front end holding member 5 similarly, be provided with vacuum chamber in inside, be provided with adsorption hole in the above.In addition, be provided with groove at Width, this groove is also as using with cutting knife supporting stations when Width cuts off film 20 such as cutting knifes.In addition, available movable part 11 transports film 20 exactly.Driving is located at the rotary actuator on the movable part 11, makes link 12 rotations, can make rear end holding member 6 transport face from film and keep out of the way downside.
Cutter mechanism 8 is located at the upside of rear end holding member 6, can move at Width by piston-rodless cylinder etc.Like this, can cut off film 20 at Width.
Overlapping rollers 13 is made of the metallic roller, and is covered with the rubber (silicon rubber etc.) of the good heat resistance about thickness 1.2mm at this metallic roll outer circumferential side.In addition, in the central shaft side of metallic roller, have the heater of tubular, in the periphery of this heater, the cover of having enclosed water or wet goods liquid is formed on the concentric circles.With heater energising heating, make the cover heating of outer circumferential side, whole roller evenly can be heated.In addition, overlapping rollers 13 utilizes Electrostatic Absorption to keep film 20, adopts silicon rubber if cover the rubber of periphery, though then resistance increases, because thin thickness has only 1.2mm, so Electrostatic Absorption is no problem.In addition, preferably adopt the conducting rubber of good heat resistance, can strengthen the Electrostatic Absorption effect.
A pair of overlapping rollers 13 clips by transporting the substrate 14 that roller 15 is brought from above-below direction.In addition, the connection cylinder that driving figure does not show, can make each overlapping rollers 13 towards upper and lower to moving.The metal partial earthing of overlapping rollers 13.
Below, the film applying action in the present embodiment is described.
At first,, manually film 20 is moved on the deflector roll 3 from film rolling 1, coverlay 2 is peeled off as the preparation that is used to carry out the film applying action.Coverlay 2 under peeling off is winding on the take up roll 4.Remaining film 20 is pulled to the front end of rear end holding member 6, by the top attraction absorption of front end holding member 5 and rear end holding member 6.
At this moment, making the driving mechanism that is located on film rolling 1 and the take up roll 4 is motor action, forms certain force of strain and acts on state on the film 20.Under this state, the cutting knife of cutter mechanism 8 makes cutter mechanism 8 move at Width, film 20 is cut off by the slot part of rear end holding member 6.After cutting off the end of job, the attraction absorption of adsorbing the rear end holding member 6 of film 20 is stopped.The cut-out end of film 20 is discarded.At this moment, stretch out from the leading section of front end holding member 5 at the leading section of film 20 under the state of length of 10mm, film 20 is adsorbed on the front end holding member 5.So far, the preparation of film applying action is finished.
Under the state that preparation is finished, be positioned at substrate and transport face overlapping rollers 13 up and down and rises together, in the heater heats that is arranged on inside state, rotate towards the substrate carriage direction.In addition, above the overlapping rollers 13 of downside, be positioned at substrate and transport face, can transport substrate 14.
At first, make servo motor 9 action, movable part 11 is moved to position near overlapping rollers 13, drive the rotary actuator that is located on the rear end holding member 6, make link 12 rotations, make rear end holding member 6 transport face and keep out of the way downside from film.Then, make cylinder 7 action, front end holding member 5 is moved, until till the front end of film 20 is positioned near the upper central of overlapping rollers 13.When film 20 is come above-mentioned position, take place to apply high voltage to electrode 16 with power supply 17 from static.At this moment, the leading section of film 20 is between electrode 16 and overlapping rollers 13.Therefore, charged from the film fore-end that front end maintaining part 5 is stretched out, be adsorbed on the overlapping rollers 13 of ground connection.Overlapping rollers 13 is delivered to downside (substrate-side) to the film 20 that is adsorbing towards the rotation of substrate carriage direction.At this moment, remove the attraction absorption of front end holding member 5, film 20 is transported to substrate-side when rotating with overlapping rollers 13.Make 11 actions of cylinder 7 and movable part, film 20 is sent to the lower position that front end holding member 5 on the overlapping rollers 13 turns back to deflector roll 3.Then, drive rotary actuator, make link 12 rotations, like this, the rear end holding member of keeping out of the way 6 also turns back to the position that film transports face.
When film 20 is transported to following (with the face position contacting of the substrate of bringing 14) of overlapping rollers 13, stop the rotation of overlapping rollers 13.Then, be adsorbed onto the film 20 that is positioned at front end holding member 5 and rear end holding member 6 upsides on each holding member and maintain, drive cutter mechanism 8, cut off film 20 at Width.At this moment, regulate the position of cutter mechanism 8 and the position of rear end holding member 6, make the length of the film 20 that cut off become the length that pastes on the substrate 14.In addition, also can not stop the rotation of overlapping rollers 13, make cutter mechanism 8, front end holding member 5 and rear end holding member 6 synchronous with transporting of film 20, absorption is keeping film 20 ground to cut off.
Rotation along with overlapping rollers 13, carry out the thermo-compressed of film 20 on the substrate 14, when the rear end holding member 6 that is adsorbing film 20 has arrived near the overlapping rollers 13, for the film front end is sent on the overlapping rollers 13 from front end holding member 5, apply high voltage from 17 pairs of electrodes 16 of electrostatic generator, like this, make the film rear end that is positioned at electrode 16 bottoms charged, by Electrostatic Absorption on overlapping rollers 13.
After the rear end of film 20 is all sent on the overlapping rollers 13, remove the attraction absorption affinity of rear end holding member 6, make link 12 rotations, keep out of the way downside.Then, front end holding member 5 attracts the front end of the next film of absorption and is kept the residence to move near the overlapping rollers 13.
Because the rear end Electrostatic Absorption of film 20 is on overlapping rollers 13, so, can not fall to that underground heat is crimped on the substrate 14 on the substrate 14, wrinkle, bubble etc. are not sneaked into adhesive portion.
In addition, when pasting, film 20 is 2 layers of structure of basement membrane and diaphragm.The face of diaphragm and substrate 14 in opposite directions, the face of this diaphragm is transported on the substrate.That is, the basement membrane side is by overlapping rollers 13 Electrostatic Absorption and reeled.When coiled film 20, overlapping rollers 13 has been heated, and this heat is also with film 20 heating.Therefore, epilamellar diaphragm fusion becomes the state with appropriate viscosity.By with overlapping rollers 13 with film 20 thermo-compressed on substrate 14, film 20 connects airtight with substrate 14.At this moment, film 20 and substrate 14 to connect airtight the Electrostatic Absorption power that force rate acts between film 20 and the overlapping rollers 13 big, so film 20 can strip down from overlapping rollers 13 simply.
Whole thermo-compressed of film 20 after on the substrate 14, the overlapping rollers 13 of upside rises, and accepts next film from front end holding member 5.
After sending to the film front end on the overlapping rollers 13, front end holding member 5 moves to the downside of deflector roll 3.Then, the rear end holding member of keeping out of the way 6 also returns the position that film transports face, and so far, a series of sticking placement is finished.
In addition,, also can not adopt the leading section of Electrostatic Absorption film 20 and the mode of rearward end, and make film wholely wear static, it is adsorbed on the overlapping rollers 13 for film 20 is sent on the overlapping rollers 13.
In addition, with make film 20 be adsorbed on the overlapping rollers 13 mechanism similarly, the film maintaining body of front end holding member 5 and rear end holding member 6 also can not adopt vacuum suction mechanism, and adopts the Electrostatic Absorption maintaining body to keep film 20.
Pasted the substrate 14 of film 20,, be sent to design producing apparatus 300 moving by transporting transporting on the road that roller or conveyer belt constitute.Fig. 3 represents the general structure of pattern formation portion.Form in the device 300 at pattern, substrate 14 is positioned on the substrate platform 31, with 32 photographies of 34 pairs of alignment marks of position cameras, positions.Among this figure, alignment mark is located at tetragonal four angles.The formation position of this alignment mark can be the outer optional position of printing zone.After finish the location, aim at predefined patterns of openings, pattern is formed with 33 action, irradiating laser forms required pattern (patterns of openings) on film 20.In addition, the laser of patterns of openings is set on sheet component, is to adopt a laser in the drawings, but also can adopts some directional lights.In addition, pattern forms with 34 and is installed on the movable door shape support unit (figure does not show), this shape support unit can with the real estate devices spaced apart move in real estate upper edge XY direction.
On film 20, form the substrate 14 of pattern, on roller or conveyer belt, moved, be sent to cleaning device 400.In cleaning device 400, when the detector that is transported into that detects substrate (figure does not show) detects being transported into of substrate,, to the jet surface cleaning fluid of film 20 remaining sheet component (with the residue of the peristome of laser processing opening) is rinsed out from cleaning fluid injection portion 35 from oblique upper.After rinsing out residue etc., the drier drying of not showing with figure.In addition, in the bottom of cleaning device 400, be provided with and collect cleaning fluid, with its liquid drain tank of discharging (figure does not show) as waste liquid.
Then, substrate is transported to printing equipment 500.Fig. 4 represents the general structural map of printing equipment.The substrate 14 that has formed patterns of openings 23 on film 20 is transported into and is transported to the substrate with the platform 50 that is located in the printing equipment 500 with conveyer belt 25 and accepts on the conveyer belt 26.When substrate arrival substrate was accepted platform 50 tops of conveyer belt 26, substrate was accepted conveyer belt 26 and is stopped, and 57 actions of platform rising mechanism, platform 50 are risen, and like this, substrate 14 is positioned on the platform 50.Then, after driving XY θ platform 56 and positioning, make the adsorbing mechanism action of vacuum suction mechanism that figure do not show etc., substrate is fixed on the table top.
Be provided with mask 51 on the top of platform 50, being provided with at an upper portion thereof can be towards reaching the mobile scraper plate 52 of directions X (or Y direction) up and down.Here used mask 51 is provided with the four-sided openings of coincideing with the shape of substrate 14, and is provided with the opening of coating solder paste the mask that adopts in common silk screen printing.Why adopting such mask, is in order unnecessary solder paste not to be remained on the sheet face, no solder paste to be placed on the mask face, being used for the solder paste coating of next substrate.Among this figure, only represented a scraper plate 52, in fact, made the structure of Double-scraper in order to move back and forth.
By scraper plate is moved towards directions X,, solder paste 40 is coated on the face of substrate 14 via the patterns of openings that is located on the film 20.In the present embodiment, solder paste is to adopt water miscible solder paste.It is rosin that solder paste before contains a kind of of flux composition.This rosin carries out film when peeling off (dissolving) with film peeling apparatus after backflow, become residue, hinders to form good projection.Then, make scraper plate mechanism's 53 actions up and down, scraper plate 52 is risen, and the platform 50 that makes mounting substrate 14 descends, makes the mask face leave real estate.Then, platform 50 is further descended, substrate is sent to substrate accept on the conveyer belt 26.Then, make substrate accept conveyer belt 26 and 27 actions of substrate discharge conveyer belt, substrate is delivered to reflux 600.
In reflux 600, make heating arrangements 60 actions that are located in the stove, real estate is heated to about 250 ℃, solder paste 40 fusions are cemented on 14 of the substrates.Film 20 is formed by the material of not fusion under this temperature.
Reflux after the end, substrate 14 is sent to film stripping portion 700, in this film stripping portion 700, peels off the film 20 that is provided with opening from the face of substrate 14.Fig. 5 represents the structure of stripping portion.In the stripping portion 7 of present embodiment, earlier the substrate immersion has been full of in the stripper dipping portion (peeling off liquid bath) 70 of stripper.Stripper uses the solution that contains 2～8% NaOH.To peel off effect in order bringing into play to greatest extent, stripper to be remained on predetermined temperature range (40～70 ℃), for this reason, peel off liquid bath and have heater 65 and thermometer 72.In addition, in order to flood substrate, be provided with substrate 14 that acceptance sent here by conveyer belt 76 and it is moved to knee-action platform 77 in the stripper.Drive the driving mechanism of knee-action platform, be configured in the outside of peeling off liquid bath.Be impregnated into this and peel off in the liquid bath 70, film 20 is dissolved and become the state that separates with substrate easily.Then, with injection equipment 75 from top to whole of substrate 14 spray stripper (with peel off liquid bath the solution that uses identical), with the residue dissolving and get rid of.It is 0.1～0.3MPa that the injection of this injection stripper is pressed, for the temperature with this stripper remains and the above-mentioned roughly the same temperature range of peeling off in the liquid bath 70 (40～70 ℃) of stripper, supply groove one side supply with from stripper to injection equipment 75 has heater and thermometer (not detailed icon).
In addition, also be provided with in this film stripping portion 700 cleaning part (not showing among Fig. 1) of having peeled off behind the film, stripper being rinsed out.
In the superincumbent explanation, the dissolving of sheet material is to adopt solvent, but also can not use solvent, and the method for dissolving with irradiates light, blowing hot-air etc.
As mentioned above, in sheet printing system of the present invention, sheet component is sticked on the real estate of coating solder paste, then, by exposure etc. sheet component is implemented to be used to apply the perforate processing of solder paste, from sheet material top coating solder paste, so, even variations such as the cream of substrate coating position just can be corresponding as long as change exposure position.Therefore, saved the trouble of changing mask before like that, can be corresponding neatly.In addition,, just can change the solder paste amount of coating simply, can apply solder paste according to purposes as long as change the thickness of sheet component.
Claims (7)
1. sheet peeling device, sheet film is pasted on the substrate, after forming opening on the above-mentioned film, from above-mentioned peristome printing solder paste, after backflow, above-mentioned film is peeled off, it is characterized in that, be provided with storage with stripper remain uniform temperature and is stored peel off liquid bath and at the above-mentioned injection equipment of peeling off impregnated substrate injection predetermined temperature stripper in the liquid bath and removing.
2. sheet peeling device as claimed in claim 1 is characterized in that, above-mentioned stripper uses the aqueous solution that contains 2～8% NaOH.
3. sheet peeling device as claimed in claim 2 is characterized in that, above-mentioned injection equipment remains 40～70 ℃ with the temperature of stripper, with the expulsion pressure injection stripper of 0.1～0.3MPa.
4. as each described sheet peeling device in the claim 1 to 3, it is characterized in that above-mentioned solder paste is to use water miscible solder paste.
5. a sheet printing system is characterized in that, this system comprises sticker, design producing apparatus, printing equipment, reflux and stripping off device; Above-mentioned sticker, film applying to the real estate that is used to apply solder paste; Above-mentioned design producing apparatus is formed for applying the patterns of openings of solder paste on above-mentioned film; Above-mentioned printing equipment prints solder paste on the substrate that is provided with the film that has formed above-mentioned patterns of openings; Above-mentioned reflux with having printed the substrate heating of solder paste, is cemented on the real estate solder paste; Above-mentioned stripping off device is removed film from the real estate of fixed solder paste.
6. sheet printing system as claimed in claim 5, it is characterized in that, above-mentioned printing equipment has mask, this mask have with as the identical or slightly little opening of the substrate shape of printing object, solder paste supply to move to the scraper plate leading section of pellicular front from the aforementioned mask face after, effect on one side Yi Bian scraper plate is moved, supplies to solder paste the patterns of openings that is located on the film with the power of scraper plate toward above-mentioned mask face and pellicular front pushing.
7. sheet printing system as claimed in claim 5 is characterized in that, above-mentioned stripping off device has peels off liquid bath and injection equipment; The above-mentioned liquid bath of peeling off is impregnated into whole base plate in the stripper that remains predetermined temperature, with Film Fractionation; Above-mentioned injection equipment, to having passed through the above-mentioned film of peeling off liquid bath and separating easily with substrate, with predetermined pressure spray predetermined temperature stripper, peel off.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007227842 | 2007-09-03 | ||
| JP2007227842A JP5076749B2 (en) | 2007-09-03 | 2007-09-03 | Sheet printing system |
| JP2007-227842 | 2007-09-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101384135A true CN101384135A (en) | 2009-03-11 |
| CN101384135B CN101384135B (en) | 2011-01-12 |
Family
ID=40463685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102110373A Expired - Fee Related CN101384135B (en) | 2007-09-03 | 2008-08-20 | Sheet peeling device and sheet printing system using same device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5076749B2 (en) |
| KR (1) | KR100998689B1 (en) |
| CN (1) | CN101384135B (en) |
| TW (1) | TW200930192A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104023981A (en) * | 2011-08-30 | 2014-09-03 | 克里斯提安-可安恩-高科技模具有限公司 | Method for producing a printing stencil for technical printing, and printing stencil for technical printing |
| CN112317902A (en) * | 2020-10-15 | 2021-02-05 | 南京朝至海商贸有限公司 | Intelligent manufacturing is with automatic soldering tin phone accessory device who avoids damage |
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|---|---|---|---|---|
| JP4022004B2 (en) * | 1998-10-12 | 2007-12-12 | 互応化学工業株式会社 | Photosensitive resin composition and photoresist ink for production of printed wiring board |
| JP2001160684A (en) * | 1999-12-01 | 2001-06-12 | Matsushita Electric Ind Co Ltd | Apparatus and method for manufacturing multilayer wiring board |
| JP4707273B2 (en) * | 2000-12-26 | 2011-06-22 | イビデン株式会社 | Manufacturing method of multilayer printed wiring board |
| US20040173463A1 (en) | 2001-07-13 | 2004-09-09 | Itoh Jin-Ichi | Method for production of printed wiring board |
| JP4398262B2 (en) * | 2004-01-08 | 2010-01-13 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP4855667B2 (en) * | 2004-10-15 | 2012-01-18 | ハリマ化成株式会社 | Method for removing resin mask layer and method for producing substrate with solder bumps |
| JP2006317542A (en) * | 2005-05-10 | 2006-11-24 | Hitachi Chem Co Ltd | Photosensitive film, resist pattern forming method using the same and method for manufacturing printed wiring board |
| JP4453919B2 (en) * | 2005-11-02 | 2010-04-21 | 富士通株式会社 | Manufacturing method of electronic component with bump electrode |
| US7870663B2 (en) * | 2006-02-09 | 2011-01-18 | Hitachi Chemical Company, Ltd. | Method for manufacturing multilayer wiring board |
-
2007
- 2007-09-03 JP JP2007227842A patent/JP5076749B2/en not_active Expired - Fee Related
-
2008
- 2008-08-20 CN CN2008102110373A patent/CN101384135B/en not_active Expired - Fee Related
- 2008-08-21 KR KR1020080081829A patent/KR100998689B1/en not_active IP Right Cessation
- 2008-08-26 TW TW097132547A patent/TW200930192A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104023981A (en) * | 2011-08-30 | 2014-09-03 | 克里斯提安-可安恩-高科技模具有限公司 | Method for producing a printing stencil for technical printing, and printing stencil for technical printing |
| CN104023981B (en) * | 2011-08-30 | 2016-08-17 | 克里斯提安-可安恩-高科技模具有限公司 | The manufacture method for the printing stencil of technical printing and the printing stencil about technical printing |
| CN112317902A (en) * | 2020-10-15 | 2021-02-05 | 南京朝至海商贸有限公司 | Intelligent manufacturing is with automatic soldering tin phone accessory device who avoids damage |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101384135B (en) | 2011-01-12 |
| JP2009060023A (en) | 2009-03-19 |
| TW200930192A (en) | 2009-07-01 |
| KR100998689B1 (en) | 2010-12-07 |
| JP5076749B2 (en) | 2012-11-21 |
| KR20090024069A (en) | 2009-03-06 |
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