KR20090024069A - Sheet peeling device and sheet printing system using the same - Google Patents

Abstract

A sheet peeling device and a sheet printing system using the same are provided to prevent defect due to residue by removing a sheet member without the residue from the substrate after reflow. A sheet printing system includes a film attachment device(200), a pattern forming device(300), a printing device(500), a reflow device(600) and a film peeling device(700). The film attachment device attaches the sheet film on a substrate(14) coated with a solder paste. The pattern forming device forms an aperture pattern for coating the solder paste in the sheet film. The printing device prints the solder paste on the substrate. The reflow device heats the substrate and fixes the solder paste on the substrate. The film peeling device removes the sheet film from the substrate.

Description

Sheet peeling apparatus and sheet printing system using the same {SHEET PEELING DEVICE AND SHEET PRINTING SYSTEM USING THE SAME}

TECHNICAL FIELD The present invention relates to a printing apparatus for forming solder bumps on a substrate surface, and more particularly, to a printing system for printing using a sheet-like member as a mask.

Conventionally, Japanese Unexamined Patent Application Publication No. 9-116257 forms a pattern on a sheet-like member, mounts a mask sheet with the same pattern as the pattern formed on the sheet, and solder paste is sheeted from the mask sheet top. After filling the shape member and removing the mask sheet, the sheet-shaped member filled with the solder paste is mounted on the substrate surface by positioning, and after removing the sheet after reflow, solder bumps of a desired pattern are removed on the substrate surface. Formation is disclosed.

In the above prior art, a mask sheet for the same pattern as the sheet member is required. In addition, after the solder paste is filled in the opening formed in the sheet-like member, in order to remove the mask sheet and mount it on the substrate, it is necessary to sufficiently fill the solder paste in the opening of the sheet-like member and prevent it from flowing out. have. In addition, since the sheet is peeled off and removed from the circuit board after reflow, there is a possibility that the residue of the sheet may remain on the substrate side, resulting in poor contact or the like, and research for removing the sheet is required to prevent the residue.

It is an object of the present invention to form solder bumps with fewer materials and processes when forming a solder bump using a sheet-like member instead of a metal mask, and at the same time, the sheet-shaped member is removed from the substrate after reflow. It is to remove without generating residue of.

An attachment portion for attaching the sheet-shaped member on the substrate surface to which the solder paste is applied, a pattern creation portion for forming an opening pattern for applying the solder paste to the sheet-shaped member, and a sheet-shaped member for forming the opening pattern are provided. Removes the sheet-like member from the printing portion for printing the solder paste on the substrate, the reflow furnace for fixing the solder paste to the substrate surface by heating the substrate on which the solder paste is printed, and the substrate surface to which the solder paste is fixed. In order to configure the sheet peeling apparatus using a peeling liquid of a predetermined temperature.

In particular, the sheet peeling apparatus maintains the peeling liquid at a predetermined temperature, and installs a peeling liquid tank and a spray mechanism for ejecting and removing the peeling liquid at a predetermined temperature on a substrate immersed in the peeling liquid tank. It is one configuration.

Since the sheet-like member is attached to the substrate surface to be printed, the opening is provided in the sheet-like member, and then the solder paste is supplied to the sheet-opening pattern through a mask in the printing portion. The squeegee printing method enabled high precision printing.

In addition, it is necessary to peel off the sheet (film) used for printing after the reflow, but after immersing the substrate in the stripping solution kept at the temperature range preset for the stripping, the stripping solution kept at the same temperature range is blown out. Since the sheet can be removed without a residue by providing the spray mechanism sprayed by pressure, generation | occurrence | production of insulation defect by a sheet | seat can be prevented, and a favorable solder bump can be formed.

The outline of the whole structure of a sheet printing system is shown in FIG.

As shown in the drawing, the present system includes a film applying apparatus 200 for attaching a sheet-shaped member 20 (or sometimes referred to as a film) to a printing surface of a substrate 14 that is a printed object, and an attached sheet. A pattern producing apparatus 300 for performing a perforation processing of a pattern printed using a laser light or an exposure method on the surface, a cleaning apparatus 400 for removing residue on the sheet surface subjected to the perforation processing, a substrate surface and A printing apparatus 500 having a mask having substantially identical or somewhat smaller openings and moving the squeegee from the mask upper surface to supply the solder paste to the substrate surface via a pattern opening provided on the sheet surface (film surface) from the mask opening. ), A reflow apparatus (600) for importing a substrate printed with the solder paste, melting the solder paste, and fixing the solder paste to the substrate surface, and a solder paste. The film is made from a separation apparatus 700 for separating the sheet-like member 20, the substrate surface. In addition, between each apparatus is connected by the board | substrate conveyance belt. In addition, although not shown in figure, the main control unit for controlling the operation | movement of the whole system, and each apparatus are provided with the control mechanism which controls the operation | movement in each apparatus. In addition, the main control unit and the control mechanism provided in each apparatus are combined by the signal line.

In FIG. 2, an example of the film sticking apparatus which attaches a film (sheet-shaped member) on a board | substrate is shown. In FIG. 2, the film roll 1 is formed of the cover film 2, the resist, and the base film of three layers 20, The thing formed in the order of the cover film 2, a resist, and a base film is wound from the inside. have. Moreover, the film 20 is a photosensitive film with high resolution and high heat resistance and peelability. Moreover, although the thickness of the film 20 changes with the height of the solder bump to form, the film of 20-100 micrometers in thickness is used.

In order to convey the film 20 from the film roll 1 to a conveyance surface, the guide roll 31 is provided below the film roll 1. The cover film 2 is peeled off by this guide roll 3. The peeled cover film 2 is a structure wound around the winding roll 4 provided adjacent to the film roll 1.

The drive part of the film roll 1 and the reel roll 4 is provided with the function (not shown) which adjusts a torque according to the film 20 remainder, and this makes the tension of the film 20 constant, You can return it.

Below the guide roll 3, the front end holding member 5 and the rear end holding member 6 which suction-suck and convey the predetermined area | region of the film 20 front end part, or the predetermined area | region of the rear end part are provided. Inside the tip holding member 5, a vacuum chamber and an upper surface are provided with suction holes. The vacuum chamber is connected to a vacuum pump, not shown. By driving the vacuum pump, the tip of the film is sucked and attracted to the upper surface of the tip holding member 5. That is, the tip holding member 5 held by the vacuum suction mechanism and supported by the movable portion 11 by the ball screw 10 directly connected to the servo motor 9 is in the left-right direction (film conveyance direction). It is possible to move. Moreover, the film 20 is carried out by the air cylinder 7 connected to the movable part 11 to the position adjacent to one crimping roller among the pair of crimping rollers (lamination roll 13) which comprise the crimping | compression-bonding part. It is possible to convey the tip of.

Like the front end holding member 5, the rear end holding member 6 is provided with a vacuum chamber inside and a suction hole in the upper surface. Moreover, the groove | channel is provided in the width direction, and it is used also as a cutter base when cutting the film 20 in a width direction with a cutter etc. Moreover, the film 20 can be conveyed correctly by the movable part 11. Moreover, the rear end holding member 6 can be retracted downward from the film conveyance surface by driving the rotary actuator provided in the movable part 11, and rotating the connection material 12. As shown in FIG.

The cutter mechanism 8 is provided above the rear end holding member 6, and has the structure which can move to the width direction by a rodless cylinder. Thereby, the film 20 can be cut | disconnected in the width direction.

The lamination roll 13 has a structure in which a metal roll and its outer peripheral side are coated with a thickness of about 1.2 mm with rubber (silicon rubber or the like) having excellent heat resistance. Further, a cylindrical heater is provided on the central axis side of the metal roll, and a jacket in which liquid such as water and oil is enclosed is formed on the concentric circle on the outer circumference of the heater. By energizing and heating a heater, the jacket on the outer periphery side becomes hot and the whole roll can be heated uniformly. In addition, the lamination roll 13 is configured to hold the film 20 by electrostatic adsorption. However, when silicone rubber is used for the rubber covering the outer circumference, the electrical resistance increases, but since the thickness is about 1.2 mm, the electrostatic adsorption is performed. It doesn't matter. Moreover, of course, when electroconductive rubber with heat resistance is used, it goes without saying that an electrostatic adsorption effect will increase.

Moreover, the pair of lamination rolls 13 is arrange | positioned so that the board | substrate 14 conveyed by the conveyance roller 15 may be pinched | interposed from the up-down direction. Moreover, each lamination roll 13 is moved to an up-down direction by driving the connected air cylinder not shown. The metal part of the lamination roll 13 is grounded.

Next, the film sticking operation of the present embodiment will be described.

First, as a preparation for performing a film sticking operation, the film 20 is taken out from the film roll 1 manually, handed to the guide roll 3, and the cover film 2 is peeled off. The peeled cover film 2 is wound up by the reel roll 4. The remaining film 20 is drawn out to the front end of the rear end holding member 6 and sucked by the upper surfaces of the front end holding member 5 and the rear end holding member 6.

At this time, the motor of the drive means provided in the film roll 1 and the reel roll 4 is operated, and it is set as the state which fixed tension acts on the film 20. In the above state, the groove portion of the rear end holding member 6 is disposed so that the cutter blade of the cutter mechanism 8 passes, and the cutter mechanism 8 is started in the width direction to cut the film 20. When the cutting operation is finished, the suction adsorption of the rear end holding member 6 that has been adsorbing the film 20 is stopped, and the waste of the film 20 is discarded. At this time, the tip portion of the film 20 is suction-adsorbed to the tip holding member 5 while the tip portion of the film 20 is pushed out by about 10 mm from the tip portion of the tip holding member 5. This completes the preparation of the film attaching operation.

In the state where preparation is completed, all the lamination rolls 13 located above and below the board | substrate conveyance surface are raised, and are rotating in the board | substrate conveyance direction in the state heated by the heater installed in the inside. Moreover, the upper surface of the lower lamination roll 13 is located in the board | substrate conveyance surface, and it is possible to convey the board | substrate 14. As shown in FIG.

First, the servo motor 9 is operated to move the movable portion 11 to the lamination roll 13, and to drive the rotary actuator provided in the rear end holding member 6 to rotate the connecting member 12, thereby holding the rear end holding member. (6) is retracted below the film conveyance surface. Then, the air cylinder 7 is operated to move the tip holding member 5 until the tip of the film 20 is positioned near the center of the upper surface of the lamination roll 13. When the film 20 is in the position described above, a high voltage is applied to the electrode 16 from the power supply 17 for generating static electricity. At this time, the front end of the film 20 is between the electrode 16 and the lamination roll 13. Therefore, the film tip portion pushed out from the tip holding member 5 is charged and adsorbed by the lamination roll 13 which is grounded. The lamination roll 13 is rotating in the substrate conveyance direction, and conveys the adsorbed film 20 to the lower side (substrate side). At this time, the film 20 is conveyed to the substrate side with the rotation of the lamination roll 13 by releasing the suction adsorption of the tip holding member 5. The tip holding member 5 which has given the film 20 to the lamination roll 13 operates the air cylinder 7 and the movable part 11, and returns to the lower position of the guide roll 3. And the back end holding | maintenance member 6 which was retracted also returns to the position of the film conveyance surface by rotating a connection material 12 by driving a rotary actuator.

When the film 20 is conveyed to the bottom of the lamination roll 13 (position to contact the conveyed substrate 14 surface), the rotation of the lamination roll 13 is stopped. Then, the film 20 on the upper end of the front end holding member 5 and the rear end holding member 6 is sucked and held by the respective holding members, and the film 20 is driven in the width direction by driving the cutter mechanism 8. Cut with At this time, the position of the cutter mechanism 8 and the position of the rear end holding member 6 are adjusted so that the length of the cut film 20 becomes a length attached to the substrate 14. Moreover, without stopping the rotation of the lamination roll 13, the cutter mechanism 8, the front end holding member 5, and the rear end holding member 6 are synchronized with conveyance of the film 20, and the film 20 is adsorb | sucked. You may hold | maintain and cut | disconnect.

The board | substrate 14 is conveyed by the conveyance roller 15 to a film adhesion position. When the substrate 14 reaches the film attachment position, the lower lamination roll 13 lowers the upper lamination roll 13 as it is (close to the lower lamination roll 13), thereby allowing the film 20 to be attached to the substrate ( Start thermocompression at 14). At this time, the film 20 is conveyed to the lamination roll 13 together with the substrate 14, but since the rear end holding member 6 is moved to the lamination roll 13 in synchronism with the conveyance of the film 20, the tension is increased. It is possible to make constant.

When the lamination roll 13 rotates, when the film 20 is thermocompression-bonded to the board | substrate 14 and the rear end holding member 6 which adsorb | sucks the film 20 reaches | attains the lamination roll 13 vicinity. As the film tip is sent from the tip holding member 5 to the lamination roll 13, a high voltage is applied from the static electricity generating device 17 to the electrode 16, thereby lowering the film rear end under the electrode 16. It is charged and electrostatically adsorbed to the lamination roll 13.

After all of the rear end of the film 20 is given to and received by the lamination roll 13, the suction adsorption force of the rear end holding member 6 is released, and the connecting member 12 is rotated to evacuate to the lower side. And the front end holding member 5 moves to the lamination roll 13 vicinity, holding the front end of the next film by suction adsorption.

Since the rear end of the film 20 is electrostatically adsorbed to the lamination roll 13, it is possible to thermocompress the substrate 14 without sagging to the substrate 14, whereby wrinkles, bubbles, and the like are mixed in the attachment portion. There is no work.

In addition, at the time of attachment, the film 20 has a two-layer structure of a base film and a resist, and the conveyance system is comprised so that a resist surface may come as the surface which opposes the board | substrate 14. That is, the base film side is electrostatically attracted and wound by the lamination roll 13. When the film 20 is wound, the lamination roll 13 is heated, and the film 20 is also heated by this heat. For this reason, the resist on a base film melts and it will be in the state which has moderate viscosity. The film 20 is in close contact with the substrate 14 by thermocompression bonding the film 20 to the substrate 14 with the lamination roll 13. At this time, since the adhesive force of the film 20 and the board | substrate 14 is larger than the electrostatic attraction force which acts between the film 20 and the lamination roll 13, the film 20 is easy from the lamination roll 13 Peeled off.

After the entire surface of the film is thermocompression-bonded to the substrate 14, the upper lamination roll 13 is raised, and the next film is exchanged from the front end suction member 5.

After passing the film tip to the lamination roll 13, the tip holding member 5 moves to the lower side of the guide roll 3. And the back end holding member 6 which was retracted also returns to the position of a film conveyance surface, and a series of attachment operation | movement is completed.

In addition, in order to transfer the film 20 to the lamination roll 13, the front end and the rear end of the film 20 may not be electrostatically adsorbed, but the entire surface of the film may be electrostatically charged and adsorbed onto the lamination roll 13. .

In addition, similar to the means for adsorbing the film 20 to the lamination roll 13, the film holding mechanisms of the front end holding member 5 and the rear end holding member 6 are used instead of the vacuum suction mechanism. The film 20 may be retained.

The board | substrate 14 with a film 20 moves on the conveyance path which consists of a conveyance roller or a conveyance belt, and is sent to the pattern preparation apparatus 300. FIG. The schematic structure of a pattern formation part is shown in FIG. In the pattern forming apparatus 300, the board | substrate 14 is mounted on the board | substrate table 31, the alignment mark 32 is imaged with the alignment camera 34, and alignment is performed. In this figure, the case where the alignment mark is installed in four corners of a square shape is illustrated. The position where the alignment mark is formed may be anywhere outside the printing area. After completion of the alignment, the pattern forming head 33 is operated in accordance with a predetermined opening pattern, and laser beam is irradiated to form a desired pattern (opening pattern) on the film 20. In addition, although the laser beam which provides an opening pattern to a sheet-shaped member is used as one laser beam in drawing, you may make it the structure which uses a some parallel light. Moreover, although the pattern forming head 34 is not shown in figure, It is provided in the movable door-type support member so that it may move to an XY direction at intervals on a board | substrate surface.

The board | substrate 14 with a pattern formed in the film 20 moves on a roller or a conveyance belt, and is sent to the washing | cleaning apparatus 400. FIG. In the cleaning apparatus 400, when the detector which detects carrying in of the board | substrate 9 which is not shown in figure detects carrying in of a board | substrate, the washing | cleaning liquid is sprayed obliquely from the washing | cleaning liquid injection part 35 on the surface of the film 20 from upper direction. By doing so, the excess sheet member (residue of the opening opened by laser processing) is washed away. After wash | cleaning a residue etc., it is dried by the dryer not shown in figure. Although not shown, a liquid discharge mechanism for collecting the cleaning liquid and discharging it as waste liquid is provided below the cleaning device 400.

The substrate is then conveyed to the printing apparatus 500. 4, the schematic block diagram of a printing apparatus is shown. The board | substrate 14 which provided the opening pattern 23 in the film 20 is the board | substrate receiving conveyor 26 with the table 50 installed in the printing apparatus 500 by the belt conveyor 25 for carrying in. Is returned to the award. When the substrate reaches the table 50 of the substrate receiving conveyor 26, the substrate receiving conveyor 26 stops, and the table 50 moves on the table 50 mechanism 57 to raise the table 50 onto the table 50. Is mounted on. Thereafter, the XYθ table 56 is driven and aligned, and then, the suction means such as a vacuum suction mechanism (not shown) is operated to fix the substrate to the table surface.

The mask 51 is provided in the upper part of the table 50, and the squeegee 52 is provided in the upper part so that it can move to an up-down direction and an X direction (or Y direction). The mask 51 to be used is provided with four openings in accordance with the shape of the substrate 14, and does not provide an opening for applying solder paste like a mask provided for normal screen printing. The reason for providing the mask in this way is that an excess solder paste is not left on the sheet surface, and a solder paste which is not used on the mask surface is mounted and used for solder paste coating of the next substrate. For this reason, in this figure, only one squeegee 52 is shown, but it is a double squeegee structure so that it can reciprocate.

When the board | substrate 14 is mounted and fixed on the table 50 surface, the table 50 is raised and set so that the mask 51 surface and the film 20 surface of the board | substrate 14 may become substantially the same horizontal position. In the mask 51 of the present embodiment, as described above, the quadrilateral opening corresponding to the substrate size is approximately equal to the substrate size or slightly smaller than the substrate size. The opening pattern provided in the film 20 enters in this opening part. Then, the squeegee upper and lower opening 53 is operated to lower the squeegee 52, and the squeegee moving mechanism is operated to move in the X direction while filling the opening of the film 20 with the solder paste supplied to the lower end of the squeegee 52. .

By moving the squeegee in the X direction, the solder paste 40 is applied to the substrate 14 surface via an opening pattern provided in the film 20. In this embodiment, a water-soluble solder was used for the solder paste. The conventional solder contains rosin which is one of the flux components. This is because the rosin becomes a residue when the film is peeled off (dissolved) in the film peeling apparatus after reflow, thereby inhibiting good bump formation. Thereafter, the squeegee upper and lower mouth 53 is operated to raise the squeegee 52, and the table 50 on which the substrate 14 is mounted is lowered to separate the mask surface from the substrate surface. Next, the table 50 is further lowered, and the substrate is transferred onto the substrate receiving conveyor 26. And the board | substrate receiving conveyor 26 and the board | substrate discharge conveyor 27 are operated, and a board | substrate is conveyed to the reflow apparatus 600. As shown in FIG.

In the reflow apparatus 600, the heating mechanism 60 installed in the furnace is operated to heat the substrate surface to about 250 ° C. to melt the solder paste 40 and adhere it to the substrate 14 surface. In addition, the film 20 is formed of the material which does not melt at this temperature.

When reflow is complete | finished, the board | substrate 14 is conveyed to the film peeling part 700, and the film 20 provided with the opening there is peeled from the board | substrate 14 surface. The structure of a peeling part is shown in FIG. In the peeling part 7 of a present Example, the board | substrate is first immersed in the peeling liquid immersion part (peeling liquid tank) 70 which filled the peeling liquid. A solution containing 2 to 8% sodium hydroxide is used as the stripping solution. This peeling liquid tank is provided with the heater 65 and the thermometer 72 in order to maintain peeling liquid in predetermined temperature range (40-70 degreeC) so that the peeling effect can be exhibited as much as possible. Moreover, in order to immerse a board | substrate, the up-and-down table 77 for receiving the board | substrate 14 conveyed by the belt conveyor 76, and moving it to the peeling liquid is provided. The drive mechanism which drives a vertical motion table is arrange | positioned outside the peeling liquid tank. By immersing in this stripping liquid tank 70, the film 20 melts easily so that it may isolate from a board | substrate. Next, a spray mechanism 75 is provided on the surface of the substrate 14 to eject the peeling liquid (the same one used in the peeling tank) to the entire surface of the surface to dissolve and remove the residue. have. The spray pressure of the ejected stripping liquid is 0.1 to 0.3 MPa, and the temperature of the stripping liquid is not shown in detail. The heater and the thermometer are provided in the supply tank side which supplies a peeling liquid to the spray mechanism 75 so that it may hold | maintain.

In addition, although not shown in FIG. 1, after peeling a film from this film peeling part 700, the washing | cleaning part for washing off a peeling liquid is provided.

In the above description, the solvent was used to dissolve the sheet. However, instead of using the solvent, a method of irradiating with light or dissolving hot air may be used. Of course.

As described above, in the sheet printing system of the present invention, the sheet-like member is attached to the substrate surface on which the solder paste is applied, and then the sheet-shaped member is subjected to the perforation process of applying the solder paste by exposure or the like, and the sheet Since the solder paste is applied from the top, even if the paste application position of the substrate is changed, it is possible to cope only by changing the exposure position, which saves the trouble of the conventional mask replacement and can flexibly cope. Moreover, only by changing the thickness of the sheet member, it is possible to easily change the amount of the solder paste to be applied, and to apply the solder paste according to the application.

1 is a diagram showing the overall configuration of a sheet printing system;

2 is a diagram showing the configuration of a sheet attaching mechanism;

3 is a schematic configuration diagram of an exposure mechanism;

4 is a schematic configuration diagram of a printing apparatus;

It is a schematic block diagram of a film peeling apparatus.

Claims (7)

In the sheet peeling apparatus which adhere | attaches a sheet-like film to a board | substrate, forms an opening in the said film, prints a solder paste from the said opening, and peels off the said film after reflow, It is set as the structure which maintained the peeling liquid at predetermined temperature, and installed the storage liquid peeling tank and the spray mechanism which sprays and removes the peeling liquid of predetermined temperature on the board | substrate immersed in the said peeling liquid tank. Sheet peeling apparatus. The method of claim 1, The sheet peeling apparatus characterized by using the aqueous solution containing 2-8% of sodium hydroxide for the said peeling liquid. The method of claim 2, The spray mechanism is configured to maintain the temperature of the peeling liquid at 40 to 70 ° C and to eject the peeling liquid at a spray pressure of 0.1 to 0.3 MPa. The method according to any one of claims 1 to 3, Water-soluble solder was used for the said solder paste, The sheet peeling apparatus characterized by the above-mentioned. A solder paste on a substrate on which a film is formed on the substrate surface on which the solder paste is applied, a pattern forming apparatus for forming an opening pattern for applying the solder paste to the film, and a substrate on which the film on which the opening pattern is formed is provided. A printing apparatus for printing a substrate, a reflow apparatus for heating the substrate on which the solder paste is printed to fix the solder paste to the substrate surface, and a peeling apparatus for removing the film from the substrate surface on which the solder paste is fixed. Sheet printing system. The method of claim 5, The printing apparatus includes a mask having an opening that is the same as or slightly smaller than the shape of the substrate to be printed, and after supplying a solder paste to the squeegee leading end that moves the film surface from the mask surface, the squeegee is provided with the mask surface and the film surface. A sheet printing system, wherein the solder paste is supplied to an opening pattern provided in the film by moving while applying a pressing force. The method of claim 5, The peeling apparatus is preset to a peeling liquid tank in which the entire substrate is immersed in a peeling liquid maintained at a predetermined temperature to dissolve the film, and to a film in which separation of the substrate from the peeling liquid tank is easy. A sheet printing system, characterized by having a spray mechanism which ejects and peels the peeling liquid of temperature by predetermined pressure.

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