201132255 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種使油墨（ink)附著以施行印刷之印 刷機及其印刷方法。 【先前技術】 上述印刷機（喷墨印刷機（inkjet printer))係以藉由 將例如使印刷媒體與列印頭（pr inter head)相對移動的動 作、及從列印頭喷出油墨之動作進行組合，而可將所希望 的圖像印刷於膜片（sheet)狀或平板狀印刷媒體之方式構 成。此種印刷機係高精確度地進行印刷媒體與列印頭之相 對移動控制、及列印頭之油墨喷出控制，藉此使為微小的 油墨滴附著於印刷媒體上原定控制位置而可進行高品質的 印刷。近年來已開發一種活用此印刷機特徵，例如從列印 頭將具備導電性之導電油墨喷出且使之附著，而將露出形 成於電路基板之電路配線之斷線部分修補連接，藉此以修 復電路配線之技術（參照例如專利文獻1)。 上述電路基板，首先於載設有電子零件的狀態下，在 回焊（reflow)爐内加熱，藉此連接形成於電路基板之電路 配線與電子零件進行表面安裝。表面安裝後，使用檢查裝 置檢查是否有斷線的電路配線等，並將檢查合格的電路基 板作為良品出貨，另一方面，判斷為有斷線之電路配線的 電路基板則予以廢棄處分。此時，例如即使經表面安裝之 電子零件正常卻於一部分電路配線有缺陷時，正常的電子 零件亦一起予以廢棄處分，而造成極大浪費，且對環境帶 4 322173 201132255 來重大負擔。針對此點，使用印刷機修復已斷線的電路配 線時，可將先前經廢棄為不良品之電路基板再生成良品， 因此具有可消除浪費，亦可降低對於環境造成負擔之優點。 i [先前技術文獻] * [專利文獻] [專利文獻1]日本特開2006-261228號公報 【發明内容】 [發明所欲解決之課題] 最近*隨著載設有電路基板之電氣·機器之局功能化及 小型化，已要求在電路基板中亦要將電子零件予以高密度 地表面安裝。此種電路基板係由例如線寬為10 // m左右之 電路配線彼此隔開數// m左右間隔密集地露出形成之方式 所構成。然而，從列印頭喷出導電油墨而附著於電路基板 時，即使在不使之霧（mist)化之範圍内儘量使油墨液滴直 徑以較小之方式進行喷出控制，油墨液滴亦會附著於電路 基板而擴散成例如約50# m左右大小。因此，若使導電油 墨朝向斷線部分噴出附著，則導電性油墨將會擴散附著至 鄰接的電路配線。結果，本來不應連接之相鄰電路配線卻 彼此連接而成為短路的原因，而無法確保電路基板的功 能。如此，即有難以使用印刷機對於密集露出形成於電路 基板上之電路配線以修補之方式形成電路配線之問題。 本發明係有鑑於上述問題而研創者，其目的在提供一 種可對於密集露出形成於電路基板上之電路配線以修補之 方式形成電路配線之印刷機、及其印刷方法。 5 322173 201132255 [解決課題之手段] 為了達成上述目的’本發明之印刷機係具有：基板支 樓手段（例如實_態之平臺（table)12)，心支撐電路基 板；及列印頭，在與前述基板支樓手段所支樓之電路基板 相對向之狀態下以可沿著前述電路基板自由移動之方式設 置，用以朝向前述電路基板噴出油墨；前述列印頭之構成 具備：絕緣列印頭’用以喷出具備絕緣性之絕緣油墨；及 導電列印頭’用以喷出具備導電性之導電油墨；且具備： 絕緣頭控制部（例如實施形態之控㈣43)，_㈣前述 絕緣列印頭之移動及油墨喷出’且對於前述基板支撑手段 所支撐之電路基板，將絕緣油墨噴出於包圍前述電路基板 表面之預定電路形成區域之外部區域，以形成使前述電路 形成區域露出於表面側並料包圍之電路形成用絕緣圖案 (例如實施形態之絕緣圖案45a);及導電頭控制部（例如實 施形態之控制ϋ 43)，肖以控制前述導電列印頭之移動及 油墨喷出，且使導電油墨附著於藉由前述絕緣頭控制部控 制而形成之前述電路形成用絕緣圖案之前述電路形成區 域，以形成電路配線。 在上述印刷機中，較佳為：前述絕緣頭控制部可以進 行前述絕緣列印頭之移動控制及油墨喷出控制，俾形成電 路形成用絕緣圖案作為前述電路形成用絕緣圖案，而該電 路形成用絕緣圖案係露出形成有其寬度較從前述導電列印 頭所喷出之導電油墨之液滴直徑為小之狹縫（sl it)狀電路 形成區域。 6 322173 201132255 此外，在前述基板支撐手段所支撐之電路基板中，較 佳為具備缺陷位置檢測手段（例如實施形態之攝像裝置 47)，用以檢測露出形成於前述電路基板之電路配線之缺陷 部之位置；且以修補由前述缺陷位置檢測手段所檢測之缺 陷部而連接電路配線之方式形成設有電路形成區域之電路 形成用絕緣圖案以作為前述電路形成用絕緣圖案。 本發明之印刷方法’係為一種印刷機之印刷方法，該 印刷機係對於基板支撐手段所支撐之電路基板，在相對向 之狀態下使列印頭一面沿著前述電路基板移動一面喷出油 墨以施行印刷；前述列印頭之構成具備：絕緣列印頭，用 以喷出具備絕緣性之絕緣油墨；及導電列印頭，用以喷出 具備導電性之導電油墨；而該印刷方法係具備以下步驟： 第I 對於前述基板支樓手段所切之電路基板，將 包圍前述電路基板表面之預定電路形成區 並予以二形成區域嶽㈣ ，由黑附菩財: 及第2步驟，使導電 圖Ϊ之第1步驟所形成之前述電路形成用絕緣 圖案之則述電路形成區域以形成電 此外，在前述第i步驟中，較佳為線。 絕緣圖案以料前述電路形成用絕緣㈣形成電路形成用 用圖案係露出有其寬度較從前述導電歹圖案’而該電路形成 油墨之液滴聽為小之狹縫 卩碩所噴出之導電 [發明之功效] t成區域。 本毛明之印刷機係以藉由絕緣列印頭形成電路形成區 322173 7 201132255 域露出於表面側並予以包圍之電路形成用絕緣圖案，且藉 由導電列印頭以使導電油墨附著於電路形成區域而形成電 路配線之方式構成。因此，藉由使需形成電路配線之部分 露出，並且以覆蓋不應形成電路配線之部分之方式形成電 路形成用絕緣圖案’無論導電油墨之液滴直徑如何，均可 對雄集露出形成於電路基板上之電路配線以修補之方式形 成電路.配線。 另外，絕緣頭控制部係以形成具有其寬度較導電油墨 之液滴直徑為小之狹縫狀電路形成區域之電路形成用絕緣 圖案之方式來進行絕緣列印頭之移動控制及油墨喷出控制 為佳。依此方式構成時，即使露出形成之相鄰電路配線彼 此間較導電油墨之液滴直徑更為接近時，仍不會使電路配 線彼此短路而可形成電路配線。 此外，具備用以檢測電路配線之缺陷部之位置之缺陷 位置檢測手段，且以修補缺陷部而將電路配線連接之方式 形成設有電路形成區域之電路形成用絕緣圖案之構成為 佳。在此構成之情形中，係藉由缺陷位置檢測手段來特別 界定需形成電路配線之部分之後，再形成使該部分露出之 電路形成用絕緣圖案，藉此即可確實修復具有缺陷部之電 路配線。 本發月之印刷方法係具有··使預定電路形成區域露出 於表面側並予以包圍之電路形成用絕緣圖案之第丨 及使導電油墨附著於該電路形成用絕緣圖案中之電路形成 區域以形成電路配線之第2步驟H可在使需形成電 322173 8 201132255 路配線之部分露出，而且以覆蓋不應形成電路配線之部刀 之方式形成電路形成用絕緣圖案之後附著導電油墨。因 此，無論導電油墨之液滴直狡為何，均可對密集且露出形 ~ 成於電路基板上之電路配線以修補之方式形成電路配線: • 此外，在前述第1步驟中，係以形成具有其寬度軚導 電油墨之液滴直徑為小之狹縫狀電路形成區域的電路形成 用絕緣圖案為佳。在此構成之情形中，即使露出形成之相 鄰電路配線彼此間較導電油墨之液滴直徑更接近時’亦不 會使電路配線彼此短路而可形成電路配線。 【實施方式】 以下參照圖式說明本發明之實施形態。首先’參照第 1圖及第2圖說明應用本發明印刷機1之構成。為了便於 說明’在各圖式中以箭頭方向顯示印刷機1之前後、左右 及上下方向，以下使用此方向進行說明。 在以下中，如第1圖所示，將說明應用本發明於印刷 機1之構成例，該印刷機1係對於可前後移動之導軌（guide rail)42，以可左右移動之方式載設絕緣列印頭及導電 列印頭46所構成。另外，除將絕緣列印頭45及導電列印 頭46載設於導轨42之構成以外，亦可為載設於例如多關 節型機械臂（SCARA robot)使之移動之構成。 如第1圖所示，印刷機1係具備：支撐部2，具有設 於下部作為基座（base)之功能；及本體部3 ,以可前後移 動之方式女裝於該支撐部2之上。支撐部2係由以下構件 所構成：複數個支撐腳U ;平臺12，藉由該支撐腳u支 9 322173 201132255 撐成水平且於上表面具有平面狀支撑面；及 20、30，朝广.......- ' ^ ^ ’及前後移動機構BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printer for attaching ink to perform printing and a printing method therefor. [Prior Art] The above-described printing machine (inkjet printer) is an operation of ejecting ink from a printing head by, for example, an operation of relatively moving a printing medium and a pr inter head. The combination is performed, and the desired image can be printed on a sheet-like or flat-shaped printing medium. The printing machine performs high-accuracy relative movement control of the printing medium and the printing head, and ink ejection control of the printing head, thereby allowing tiny ink droplets to adhere to the original control position on the printing medium. High quality printing. In recent years, in order to utilize the characteristics of the printing machine, for example, a conductive ink having conductivity is ejected from a printing head and attached thereto, and the disconnected portion of the circuit wiring formed on the circuit substrate is exposed and repaired. A technique for repairing circuit wiring (see, for example, Patent Document 1). The circuit board is first heated in a reflow furnace while the electronic component is mounted, thereby connecting the circuit wiring formed on the circuit board and the electronic component to surface mounting. After the surface is mounted, the inspection device is used to check whether there is a broken circuit wiring, etc., and the circuit board that has passed the inspection is shipped as a good product. On the other hand, the circuit board that is judged to have a broken circuit wiring is discarded. At this time, for example, even if the surface-mounted electronic components are normal but some of the circuit wirings are defective, the normal electronic components are discarded together, which is extremely wasteful, and imposes a great burden on the environmental belt 4 322173 201132255. In this regard, when a printer is used to repair a broken circuit wiring, a circuit board that has been previously discarded as a defective product can be regenerated, thereby eliminating waste and reducing the burden on the environment. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] JP-A-2006-261228 SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] Recently, *Electrical and Mechanical Devices Carrying Circuit Substrates Functionalization and miniaturization of the bureau have required high-density surface mounting of electronic components in circuit boards. Such a circuit board is constituted by, for example, a circuit in which a line width of about 10 // m is spaced apart from each other by a number of intervals of about / m. However, when the conductive ink is ejected from the printing head and adhered to the circuit board, the ink droplets are controlled to be smaller as much as possible within a range in which mist is not made. It will adhere to the circuit board and spread to a size of, for example, about 50 #m. Therefore, if the conductive ink is ejected toward the broken portion, the conductive ink will diffuse and adhere to the adjacent circuit wiring. As a result, adjacent circuit wirings that should not be connected are connected to each other to cause a short circuit, and the function of the circuit board cannot be ensured. Thus, there is a problem that it is difficult to use a printing machine to form a circuit wiring in such a manner that the circuit wiring formed on the circuit board is densely exposed. The present invention has been made in view of the above problems, and an object thereof is to provide a printer capable of forming a circuit wiring for repairing a circuit wiring formed on a circuit board in a dense manner, and a printing method therefor. 5 322173 201132255 [Means for Solving the Problem] In order to achieve the above object, the printing machine of the present invention has a substrate supporting means (for example, a table 12), a core supporting circuit substrate, and a printing head. Provided to be movable along the circuit board in a state of being opposed to the circuit board of the building of the substrate supporting means for ejecting ink toward the circuit board; the print head is configured to have an insulating print The head ' is used to eject an insulating insulating ink; and the conductive printing head ' is used to eject a conductive ink having conductivity; and includes: an insulating head control unit (for example, control of the embodiment (4) 43), _(4) the foregoing insulating column The movement of the printing head and the ink ejection' and the insulating substrate are sprayed on the outer surface of the predetermined circuit forming region surrounding the surface of the circuit substrate to form the circuit forming region exposed on the surface of the circuit substrate supported by the substrate supporting means An insulating pattern for forming a circuit surrounded by a side material (for example, an insulating pattern 45a of the embodiment); and a conductive head control portion (for example, The control of the form ϋ 43) is formed by controlling the movement of the conductive print head and the ink discharge, and attaching the conductive ink to the circuit for forming the insulating pattern for circuit formation formed by the control of the insulating head control unit. Area to form circuit wiring. In the above printing machine, preferably, the insulating head control unit may perform movement control and ink discharge control of the insulating print head, and form an insulating pattern for circuit formation as the insulating pattern for circuit formation, and the circuit is formed. A slit-like circuit formation region having a smaller droplet diameter than the conductive ink ejected from the conductive print head is formed by an insulating pattern. In addition, in the circuit board supported by the substrate supporting means, it is preferable to include a defective position detecting means (for example, the image forming apparatus 47 of the embodiment) for detecting a defective portion of the circuit wiring formed on the circuit board. In addition, the circuit forming insulating pattern provided with the circuit forming region is formed as the insulating pattern for circuit formation, in such a manner that the defective portion detected by the defect position detecting means is repaired and the circuit wiring is connected. The printing method of the present invention is a printing method for a printing machine which ejects ink while moving the printing head along the circuit substrate in a state in which the circuit board supported by the substrate supporting means is moved in a relatively opposed state. The printing head is configured to: an insulating printing head for ejecting an insulating ink having an insulating property; and a conductive printing head for ejecting a conductive ink having conductivity; and the printing method is The method has the following steps: First, the circuit board cut by the substrate supporting means means a predetermined circuit forming area surrounding the surface of the circuit board, and is formed into a region (4), which is made of black and boiled: and the second step is made to conduct electricity. The circuit formation region of the circuit formation insulating pattern formed in the first step of Fig. 1 is formed to form electricity, and in the i-th step, a line is preferable. The insulating pattern is formed by forming the circuit for forming the insulating layer (4) into a pattern for forming a circuit, and exposing a conductive layer which is different in thickness from the conductive ytterbium pattern ′ and which is formed by the slit of the circuit forming ink. The effect] t into the area. The printing machine of the present invention is formed by forming an insulating pattern for forming a circuit forming region 322173 7 201132255 by an insulating printing head and exposing it on the surface side, and forming a conductive pattern by a conductive printing head to adhere the conductive ink to the circuit. The circuit is formed by forming a circuit wiring. Therefore, the portion for forming the circuit wiring is exposed, and the insulating pattern for forming the circuit is formed so as to cover the portion where the circuit wiring should not be formed. Regardless of the diameter of the droplet of the conductive ink, the male collector can be exposed to the circuit. The circuit wiring on the substrate is formed into a circuit and wiring by repairing. Further, the insulating head control unit performs the movement control and the ink ejection control of the insulating print head so as to form an insulating pattern for circuit formation having a slit-like circuit formation region having a smaller droplet diameter than that of the conductive ink. It is better. According to this configuration, even if the adjacent circuit wirings which are formed are exposed to be closer to each other than the droplet diameter of the conductive ink, the circuit wirings can be formed without short-circuiting the circuit wirings. Further, it is preferable to provide a defect position detecting means for detecting the position of the defective portion of the circuit wiring, and to form a circuit pattern insulating pattern in which the circuit forming region is provided so as to repair the defective portion and connect the circuit wiring. In the case of this configuration, the portion where the circuit wiring is to be formed is specifically defined by the defect position detecting means, and then the insulating pattern for circuit formation which exposes the portion is formed, whereby the circuit wiring having the defective portion can be surely repaired. . The printing method of the present invention has a second formation of an insulating pattern for forming a circuit in which a predetermined circuit formation region is exposed on the surface side, and a circuit formation region in which the conductive ink is adhered to the insulation pattern for circuit formation. The second step H of the circuit wiring can be performed by exposing a portion where the wiring of the circuit 322173 8 201132255 is to be formed, and forming the insulating pattern for circuit formation so as to cover the portion of the blade which should not form the circuit wiring, and then attaching the conductive ink. Therefore, regardless of the direct flow of the conductive ink, the circuit wiring can be formed in a patched manner in a dense and exposed circuit wiring formed on the circuit substrate: • In addition, in the first step, it is formed to have It is preferable that the insulating pattern for circuit formation of the slit-shaped circuit formation region having a small droplet width of the conductive ink is small. In the case of this configuration, even if the exposed adjacent circuit wirings are closer to each other than the droplet diameter of the conductive ink, the circuit wirings are not short-circuited to each other to form circuit wiring. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, the configuration of the printer 1 to which the present invention is applied will be described with reference to Figs. 1 and 2 . For convenience of explanation, the front, rear, left and right and up and down directions of the printing machine 1 are displayed in the direction of the arrows in the respective drawings, and the following description will be made using this direction. In the following, as shown in Fig. 1, a description will be given of a configuration example in which the present invention is applied to a printing machine 1, which is provided with a guide rail 42 that can be moved back and forth in a manner that can be moved left and right. The print head and the conductive print head 46 are formed. Further, in addition to the configuration in which the insulating print head 45 and the conductive print head 46 are placed on the guide rail 42, it may be configured to be mounted on, for example, a SCARA robot. As shown in Fig. 1, the printing machine 1 includes a support portion 2 having a function of being provided as a base at a lower portion, and a main body portion 3 for welcoming the support portion 2 so as to be movable forward and backward. . The support portion 2 is composed of the following members: a plurality of support legs U; the platform 12 is horizontally supported by the support leg u 9 322173 201132255 and has a planar support surface on the upper surface; and 20, 30, toward the wide. ......- ' ^ ^ ' and moving mechanism before and after
體部3相對於支撐部2移動之構成， 動之構成，或亦可為使1線寬之列e丨 列印位置之構成。 、丨叫不）而逑逍，且藉由未圖示 而得以抽吸上述減壓室之空氣或 此，藉由例如抽吸減壓室之空氣 另外，在平臺之下側（背側）係形成有減壓室 示），而形成於平臺12上表面之支撲面與減壓室，係經由 上下貫通之複數個供排孔（未圖示）而連通， '卸一 之供排鼓風機（blower)，而相 將空氣送入至減壓室。藉此， 並從供排孔抽吸空氣至減壓室，即得以將載設於平臺以表 面之印刷對象物（電路基板50>及附固定於平臺12。 本體部3係跨越上述平臺12上方並朝左右延伸形成， 且在左右端部藉由前後移動機構2Q、3Q支撐為可前後移 動。前後移動機構2G、30雖係為分別支撐本體部3之左右 端部並且使之前後移動之機構，惟兩者係同步動作 ，而得 以使本體部3相對於平臺12筆直地前後移動。此等前後移 動機構20、30所具備之構成為：例如朝前後延伸配設之無 端環狀帶（endlessbelt)(未圖示）、及用以使該環帶旋轉驅 動之前後驅動馬達29、39。另外，前後移動機構20、30 之構成，並不以此為限，亦可使用各種習知技術。 在本體部3之内部係形成有左右延伸之導軌犯，而在 此導軌42上，以可朝左右自由移動之方式安裝有載具 (Carriage)44。此载具44係藉由左右移動機構而在導軌 10 322173 201132255 42上左右移動’該左右移動機構所具備之構成為：例如朝 左右延伸所配設之無端環帶（未圖示）、及使該環帶旋轉驅 動之左右驅動馬達49。另外，左右移動機構之構成並不以 此為限，亦可使用各種習知技術。 在栽具44中，除未圖示之例如黃色、洋紅色 (magenta)、青藍色（cyan)及黑色等彩色印刷用之列印頭以 外’尚载設有絕緣列印頭45、導電列印頭46及攝像裴置 47 ° '絕緣列印頭45係在其下面（與平臺12相對向的面）開 設形成有多數個噴出喷嘴（未圖示），而構成為可從該喷出 喷嘴將具有絕緣性之絕緣油墨朝向下方喷出。以此絕緣油 墨而言’係可選擇與露出形成於電路基板50表面之電路配 線52至55(參照第3圖）密接性較佳者，可使用例如經紫 外線（uv光）照射而硬化之所謂—硬化型陽離子（catic>n) 聚合系油墨、自由基（radical)聚合系油墨、或陽離子—自 由基’tb成（hybrid)油墨。此外，絕緣列印頭45係以解析度 為例如1200dpi左右（油墨液滴直徑為例如2〇左右）之 構成為佳。此係由於形成後述之絕緣遮罩45a時，可一面 確保該絕緣遮罩45a之位置精確度一面順暢地形成輪廓之 故。另外，使用uv硬化型油墨而形成絕緣遮罩45a時，係 在剛附著UV硬化型油墨後或容許滲透之預定時間内，照射 來自UV照射裝置（未圖示）之UV光使之硬化，以形成絕緣 遮罩4 5 a而付以發揮遮罩之功能。 導電列印頭46與上述絕緣列印頭45同樣係在其下面 322173 11 201132255 開设形成有多數個喷出噴嘴（未圖示），而構成為可從該喷 出喷嘴將具有導電性之導電油墨朝向下方喷出。以此導電 '由墨而s，係使用將例如數nm至數十nm粒子徑之Ag粒子 溶解於溶劑所構成者。此外，導電列印頭46之解析度係例 如為600dpi或300dip左右，而使所喷出之導電油墨難以 霧化。因此，如後所述地使導電油墨附著於電路基板5〇 時，油墨會浮游而不會附著於周圍，而不易產生短路等之 缺失。 攝像裝置47係内建例如CCD(Charge Co叩led Device，電荷耗合元件）等攝像元件（未圖示）所構成，而得 以對平臺12所支撐之印刷對象物（電路基板5Q)之表面進 行攝像。 在本體部3之左側箭而 的 , H # ，糸设有由操作開關（switch) 類或顯不裝置㈣所構叙操作部4卜 侧内部，係載設有控制器43， 卩3之左编 示，係以可對於操作部41及二控制器43 ’如第2圖所 傳送接收之方式連接。藉此，構件進行信號或資料之 41之操作信號而對各構成構盗43係根據來自操作部 制。此外，在控制器43中，係兩出動作信號以進行動作控 憶體43a，而得以將資料記情於内建有5己憶有各種資料之記 43a讀取所記憶之資料。；此5己憶體43a，或從記憶體 如上所述’上文中已說明 對於例如平板狀印刷媒體（未_ 之構成。以下說明 機1之動作。另外，此時，传不）施行彩色印刷時之印刷 不使絕緣列印頭45及導電列 322173 201132255 印頭46運轉，而藉由使彩色印刷用列印頭運轉來施行印 刷。 首先，在載設印刷媒體於平臺12之狀態下使供排鼓風 機運轉，以將印刷媒體吸附固定於平臺12。在此狀態下， 係一面組合進行使本體部3(導執42)朝前後移動之動作、 使載具44朝左右往返移動之動作、及使彩色油墨從彩色印 刷用列印頭朝向下方喷出之動作，一面使彩色油墨附著於 印刷媒體表面’藉此而得以實施所希望的印刷。由於此印 刷機1係藉由控制器43，而可以良好精確度進行彩色印刷 用列印頭相對於印刷媒體之移動控制、及彩色印刷用列印 頭之油墨喷出控制（喷出時機（timing)及油墨滴之大小）之 構成，因此可使微小彩色油墨滴附著於印刷媒體上之原定 控制位置而進行高品質之印刷。 以上已說明對平板狀印刷媒體施行彩色印刷時之印刷 機1的動作。如上所述，在載具44雖載設有絕緣列印頭 45及導電列印頭46’惟此係活用可將微小油墨滴附著於印 刷媒體上之原定控制位置之印刷機丨的特徵，而於電路基 板上形成電路配線時所使用者。在最近，隨著載設電路基 板之電氣機器之高功能化及小型化，已開發一種例如線寬 為1〇#m左右之電路配線彼此隔開數左右間隔而密集 露出形成所構成之電路基板。本案發明 之印刷機1係以對 於具有此種€_線之f路絲，亦可確實剌彡成電路配 線而不會產生短路等缺失之構成為其特徵構成。 因此以下—面追加參照第3圖至第5圖，一面沿著 13 322173 201132255 第6圖所示之流程圖詳細說明該特徵構成。另外，以下係 例示將一部分缺破而斷線之電路配線予以連接修復之情形 進行說明》 首先簡單說明第1圖所示電路基板50。在平板狀電路 基板50之上側表面，係與所載設之電子零件60對應而預 先露出形成有複數個電路配線。在對於此電路基板50載設 電子零件60之後，在回焊爐内進行加熱，藉此將電路配線 與電子零件60予以焊錫連接。然後，使用檢查裝置檢查各 電路配線是否有斷線，經判斷為無斷線之電路配線而為良 品之電路基板50係予以出貨，另一方面，經判斷為有斷線 之電路配線之電路基板50則吸附固定於平臺12上之預定 位置。此時，可使用例如定位治具（未圖示），藉以將電路 基板50吸附固定於平臺12上之預定位置。另外，露出形 成於電路基板50之電路配線之形狀資料，係預先記憶於記 憶體43a。 再者，在第6圖所示之步驟S101中，係驅動前後驅動 馬達29、39及左右驅動馬達49以使攝像裝置47位於電路 基板50上方，並進行電路基板50之表面圖像之攝像。所 取得之攝像資料，係從攝像裝置47傳送至控制器43。然 後，在控制器43比較預先記憶之電路配線之形狀資料與來 自攝像裝置47之攝像資料，以檢測電路基板50之斷線部 分（缺陷部分）之位置及其範圍。 在第3圖中係顯示形成於電路基板50之複數個電路配 線52至55之一部分。電路配線52至55係依高密度化等 14 322173 201132255 的要求，而為例如各線寬10 // m左右且隔開數# m左右間 隔而露出形成所構成。電路配線52至55中之電路配線54 雖係由於缺陷部54a而斷線，惟以上述方式，在控制器43 檢測該缺陷部54a之位置及其範圍。另外，在第3圖至第 5圖中，為易於明暸，對電路配線52至55加上陰影線 (hatching)予以圖示。 然而，由於從導電列印頭46所喷出之導電油墨之液滴 直徑為例如40/ζπι左右，因此若使導電油墨直接附著於缺 陷部54a，則電路配線54與電路配線52、53、55即會經 由所附著之導電油墨連接而成為短路的原因。因此，在步 驟S102中，根據在上述步驟S101所檢測之缺陷部54a之 位置及範圍來設定絕緣遮罩45a之形成區域。此時，在參 照記憶於記憶體43a之電路配線之形狀資料後，對於位於 缺陷部54a之左右兩端之電路配線54及使缺陷部54a露出 之電路形成用狹縫（siit)45b，設定用以包圍該電路形成用 狹缝45b周圍而不使電路配線54以外之電路配線（第4圖 (a)之電路配線52、53、55)露出之方式覆蓋之絕緣遮罩 45a。藉由此絕緣遮罩45a，可一面使需修補電路配線而連 接之缺陷部54a露出，一面將不應與電路配線54連接之電 路配線5 2、5 3、5 5覆蓋。 前進至步驟S103，藉由控制器43控制前後驅動馬達 29、39、左右驅動馬達49及絕緣列印頭45之驅動，再對 於在上述步驟S10 2所設定之絕緣遮罩4 5 a之區域附著絕緣 油墨。在上述步驟S102中，由於預先考慮附著於電路基板 15 322173 201132255 50之絕緣油墨擴展的區域而設定絕緣遮罩45a之區域（參 照第4圖（b))，因此例如電路配線53、55不會因為電路形 成用狹縫45b而露出。 接著前進至步驟S104，從導電列印頭46朝向電路形 成用狹縫45b喷出附著導電油墨，以形成修補電路46a(參 照第5圖）。此時，導電油墨之液滴直徑雖較電路形成用狹 縫45b大，惟由於以不與電路配線52、53、55直接連接之 方式形成絕緣遮罩45a，因此電路配線52至55不會經由 導電油墨而彼此短路。此外，藉由對於電路形成用狹縫45b 附著導電油墨，以於露出之缺陷部54a形成電路配線（修補 電路），而將斷線之電路配線54連接起而予以修復。 以此方式形成修補電路46a之後，且使其乾燥至與導 電油墨特性相符之乾燥時間之後，以與導電油墨特性相符 之燒結溫度（例如150°C至200°C左右）及燒結時間（例如20 分鐘至2小時左右）進行燒結，藉此使修補電路46a牢牢固 定於電路基板50，而此流程即結束。如上所說明，依據本 發明之印刷機1，對於電路配線密集並露出形成之電路基 板，仍可確實形成（修復）電路配線，而不會產生短路等缺 失。因此，可將先前經廢棄為不良品之電路基板再生成良 品，因此具有可消除浪費，亦可降低對於環境造成的負擔。 然而，上述之絕緣遮罩45a，亦可設定成例如第7圖 (a)所示之絕緣遮罩45c。如第7圖（b)所示，此絕緣遮罩 45c係設定成較導電油墨之液滴直徑（修補電路46a之前後 寬度）稍大的前後寬度，而使整體上由絕緣油墨所形成之印 16 322173 201132255 刷區域變小。因此，可一面減少絕緣油墨之消耗量並降低 維護成本（running cost)，一面在露出於電路形成用狹缝 45d之缺陷部54a形成電路配線。惟導電油墨之液滴直牷 或著落位置等易於參差時，經考慮此參差的結果，係以預 先將絕緣遮罩45c形成為較大，以使導電油墨不會直接附 著於位於絕緣遮罩45c外方（未形成絕緣遮罩45c)之電路 基板50為佳。 此外，上述之絕緣遮罩45a亦可設定成例如第8圖（β) 所示之絕緣遮罩45e。絕緣遮罩45e係覆蓋與電路配線54 鄰接之電路配線53及電路配線55，並且設定成使電路形 成用狹縫45f朝左右延伸以使電路配線54露出。對於此絕 緣遮罩45e，可藉由例如第8圖（b)所示地使導電油墨僅附 著於缺陷部54a而形成修補電路46a來修復電路配線54。 當複數個缺陷部54a存在於電路配線54時，此絕緣遮罩 45e尤其有效。亦即，對於朝左右延伸所形成之絕緣遮罩 45e，只要僅在必要位置形成修補電路46a即可。因此，不 需依每一缺陷部54a均形成絕緣遮罩45e，而使絕緣遮罩 45e之設定及形成較為簡易。再者，藉由形成此絕緣遮罩 45e ’不僅可進行如上所述之電路配線之局部性修復，亦可 再新追加形成電路配線。 在上述實施形態中’係就除藉由彩色印刷用列印頭以 外，還可藉由載設絕緣列印頭45及導電列印頭46，而進 行彩色印刷及電路配線印刷等兩種印刷的印刷機丨予以說 明。惟本發明並不限定於此構成， 亦可設計為例如僅載設 322173 17 201132255 絕緣列印頭45及導電列印頭46而不載設彩色印刷用列印 頭，而專用於電路配線印刷之構成。 在上述實施形態中，雖已例示對使用本發明之印刷機 1而修復電路配線之缺陷部之情形進行說明’惟此種情形 以外，亦可藉由攝像裝置47來檢測例如表面受傷之電路配 線並進行修復。 此外，在上述實施形態中，已例示對使電路基板5〇吸 附固定於平臺12，且使絕緣列印頭45及導電列印頭46(载 具44) 一面朝前後左右移動一面喷出油墨之構成進行說 明。本發明並不限定應用於此形態之印刷機，亦可應用於 例如將絕緣列印頭45及導電列印頭46固定，以使電路基 板50相對於絕緣列印頭45及導電列印頭46朝前後左右移 動之構成的印刷機。 在上述實施形態中，以絕緣油墨而言’可使用例如uv 硬化型油墨、水性乳膠油墨（latex ink)、透明或白色的有 機溶劑（v小 < 小卜）油墨、或彩色油墨。另一方面，以導 電性油墨而言，係可使用例如奈米銅或奈米銀等導電性粒 子之分散型水性溶劑油墨、或藉由加熱進行金屬析出而予 以導電化之金屬鹽等之溶液所製成之加熱導電化油墨。 【圖式簡單說明】 第1圖係為應用本發明印刷機之斜視圖。 第2圖係為上述印刷機之控制系統圖。 第3圖係為電路基板之俯視圖。 第4圖係為電路基板之俯視圖，（a)係顯示印刷有絕緣 322173 18 201132255 遮罩之狀態，（t〇係顯示第4圖（a)之部分放大圖。 第5圖係為電路基板之俯視圖，用以顯示導電油墨附 耆於電路形成區域之狀態。 第6圖係為修復電路配線時之流程圖。 第7圖係為顯示另一形態之絕緣遮罩之俯視圖，（a) 係顯示附著導電油墨之前之狀態’（b)係顯示附著有導電油 墨之狀態。 第8圖係為顯示另一形態之絕緣遮罩之俯視圖， 係顯示附著導電油墨前之狀態，（1))係顯示附著有導電油墨 之狀態。 【主要元件符號說明】 印刷機 : 支撐部 t 本體部 1 支撐腳 u 平臺（基板支撐手段) 20 前後移動機構 29、39 前後驅動馬達 41 操作部 42 導轨 43a 43 44 45 記憶體 控制器(絕緣頭控制部、導電頭控制 載具 絕緣列印頭 322173 19 201132255 45a 絕緣圖案（電路形成用絕緣圖案） 45b ' 45d ' 45f 電路形成用狹縫 45c 、 45e 絕緣遮罩 46a 修補電路 46 導電列印頭 47 攝像裝置（缺陷位置檢測手段） 49 左右驅動馬達 50 電路基板 52 、 53 、 54 、 55 電路配線 54a 缺陷部 60 電子零件The configuration in which the body portion 3 is moved relative to the support portion 2 may be configured to be a position in which the line width of the line 1 is printed. , 丨 不 逑逍 逑逍 且 且 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 逑逍 得以 得以 得以 得以 得以 得以 得以 得以 得以 得以 得以 抽吸Formed with a decompression chamber, and the baffle surface and the decompression chamber formed on the upper surface of the platform 12 are connected through a plurality of supply and discharge holes (not shown) which are vertically penetrated, and the unloading blower (blower) ), and the phase sends air to the decompression chamber. Thereby, the air is sucked from the supply and discharge holes to the decompression chamber, that is, the printing object (the circuit substrate 50> mounted on the surface of the platform and attached to the stage 12 is attached. The body portion 3 is above the platform 12 And extending to the left and right, and supported at the left and right ends by the front and rear moving mechanisms 2Q, 3Q to be movable back and forth. The front and rear moving mechanisms 2G, 30 are mechanisms for respectively supporting the left and right ends of the body portion 3 and moving the front and rear portions However, the two are synchronized, and the body portion 3 is moved forward and backward with respect to the platform 12. The front and rear moving mechanisms 20, 30 are configured such that, for example, an endless loop belt (endlessbelt) is provided to extend forward and backward. (not shown) and the drive motors 29 and 39 for driving the ring belt before and after the rotation of the belt. The configuration of the front and rear moving mechanisms 20 and 30 is not limited thereto, and various conventional techniques may be used. A guide rail that extends left and right is formed inside the main body portion 3, and a carrier (Carriage) 44 is attached to the guide rail 42 so as to be movable to the right and left. The carrier 44 is moved by the left and right movement mechanism. Guide 10 322173 201132255 42 Moves left and right. The left and right moving mechanism is configured such that, for example, an endless belt (not shown) that extends toward the left and right, and a left and right drive motor 49 that rotationally drives the belt. The configuration of the right and left moving mechanism is not limited thereto, and various conventional techniques may be used. In the plant 44, color such as yellow, magenta, cyan, and black, which are not shown, are shown. In addition to the print head for printing, the insulating print head 45, the conductive print head 46, and the image pickup device 47 are mounted. The insulating print head 45 is formed under the surface (the surface facing the platform 12). There are a plurality of ejection nozzles (not shown), and the insulating ink which is insulating can be ejected downward from the ejection nozzle. The insulating ink is selected and exposed on the surface of the circuit substrate 50. For the circuit wirings 52 to 55 (see FIG. 3), for example, a so-called hardened cation (catic>n) polymer ink or radical which is hardened by ultraviolet (uv light) irradiation can be used. Polymeric oil The cation-free radical 'tb hybrid ink. The insulating print head 45 preferably has a resolution of, for example, about 1200 dpi (the ink droplet diameter is, for example, about 2 Å). In the case of the insulating mask 45a, the contour of the insulating mask 45a can be smoothly formed while ensuring the positional accuracy of the insulating mask 45a. When the insulating mask 45a is formed using the uv hardening ink, the UV-curable ink is immediately adhered. After a predetermined period of time during which penetration is allowed, ultraviolet light from a UV irradiation device (not shown) is irradiated to be hardened to form an insulating mask 45 a to provide a function as a mask. The conductive print head 46 has a plurality of discharge nozzles (not shown) formed on the lower surface of the insulating print head 45 in the same manner as the above-described insulating print head 45, and is configured to conduct conductive conductive from the discharge nozzle. The ink is ejected downward. In this way, the ink is composed of, for example, an Ag particle having a particle diameter of several nm to several tens of nm dissolved in a solvent. Further, the resolution of the conductive print head 46 is, for example, about 600 dpi or 300 dip, so that the discharged conductive ink is difficult to atomize. Therefore, when the conductive ink is adhered to the circuit board 5〇 as will be described later, the ink floats without being attached to the periphery, and the short-circuit or the like is less likely to occur. The imaging device 47 is configured by an imaging element (not shown) such as a CCD (Charge Coding Device), and the surface of the printing object (circuit substrate 5Q) supported by the stage 12 is performed. Camera. On the left side of the main body portion 3, H # , 糸 is provided with an operation switch (switch) type or a display device (4), and the inside of the operation portion 4 is arranged, and the controller 43 is provided, and the left side of the 433 The programming is connected in such a manner that the operation unit 41 and the two controllers 43' are transmitted and received as shown in FIG. Thereby, the member performs an operation signal of the signal or the data 41, and the constituent elements are based on the operation unit. Further, in the controller 43, two action signals are output to operate the control body 43a, and the data can be recorded in the data recorded by the built-in memory record 43a. The 5th memory 43a, or the memory as described above, has been described above for, for example, a flat printing medium (the configuration of the machine 1 is described below. In addition, the operation of the machine 1 will be described below). The printing does not operate the insulating print head 45 and the conductive array 322173 201132255 print head 46, but performs printing by operating the color print print head. First, the supply and discharge blowers are operated while the printing medium is placed on the stage 12 to adsorb and fix the printing medium to the stage 12. In this state, the main body portion 3 (the guide 42) is moved forward and backward, the carrier 44 is moved back and forth, and the color ink is ejected downward from the color printing head. The action is such that the colored ink adheres to the surface of the printing medium, thereby enabling the desired printing to be performed. Since the printing machine 1 is controlled by the controller 43, the movement control of the printing head for color printing relative to the printing medium and the ink ejection control of the printing head for color printing can be performed (timing timing) With the configuration of the size of the ink droplets, the fine color ink droplets can be attached to the original control position on the printing medium to perform high-quality printing. The operation of the printer 1 in the case of performing color printing on a flat printing medium has been described above. As described above, although the carrier 44 is provided with the insulating print head 45 and the conductive print head 46', it is characterized in that the printing machine is used to attach the minute ink droplets to the original control position on the printing medium. The user is formed when the circuit wiring is formed on the circuit board. Recently, with the increase in the functionality and miniaturization of electrical equipment in which a circuit board is mounted, for example, a circuit board having a line width of about 1 〇 #m is spaced apart from each other and densely exposed to form a circuit board. . The printing press 1 of the present invention is characterized in that it has a configuration in which the f-wire having such a line is provided, and the circuit wiring can be surely formed without causing a short circuit or the like. Therefore, the following configuration will be described in detail with reference to the flowcharts shown in Fig. 6 of Fig. 13 322173 201132255, with reference to Figs. 3 to 5 . In the following, a case where a part of the circuit wiring that is broken and disconnected is connected and repaired will be described. First, the circuit board 50 shown in Fig. 1 will be briefly described. On the upper surface of the flat circuit board 50, a plurality of circuit wirings are formed in advance in correspondence with the mounted electronic component 60. After the electronic component 60 is placed on the circuit board 50, heating is performed in the reflow furnace, whereby the circuit wiring and the electronic component 60 are solder-bonded. Then, the inspection device is used to check whether or not the circuit wiring is broken, and the circuit board 50 that has been determined to be unbroken is shipped, and the circuit board 50 is shipped as a good circuit. The substrate 50 is adsorbed and fixed at a predetermined position on the stage 12. At this time, for example, a positioning jig (not shown) can be used to adsorb and fix the circuit substrate 50 to a predetermined position on the stage 12. Further, the shape data of the circuit wiring formed on the circuit board 50 is exposed in advance in the memory body 43a. Further, in step S101 shown in Fig. 6, the front and rear drive motors 29, 39 and the left and right drive motors 49 are driven so that the image pickup device 47 is positioned above the circuit board 50, and the surface image of the circuit board 50 is imaged. The captured image data is transmitted from the image pickup device 47 to the controller 43. Then, the controller 43 compares the shape data of the previously stored circuit wiring with the image data from the image pickup device 47 to detect the position and the range of the broken portion (defective portion) of the circuit board 50. In Fig. 3, a portion of a plurality of circuit wirings 52 to 55 formed on the circuit substrate 50 is shown. The circuit wirings 52 to 55 are formed by exposing and forming, for example, a line width of about 10 // m and a space of about #m, depending on the requirements of the high density of 14 322 173, 201132255. The circuit wiring 54 in the circuit wirings 52 to 55 is broken due to the defective portion 54a, but in the above manner, the controller 43 detects the position and the range of the defective portion 54a. Further, in Figs. 3 to 5, hatching is illustrated for the circuit wirings 52 to 55 for the sake of clarity. However, since the droplet diameter of the conductive ink ejected from the conductive print head 46 is, for example, about 40/ζπι, if the conductive ink is directly attached to the defective portion 54a, the circuit wiring 54 and the circuit wiring 52, 53, 55 That is, it will become a cause of a short circuit via the connected conductive ink. Therefore, in step S102, the formation region of the insulating mask 45a is set based on the position and range of the defective portion 54a detected in the above-described step S101. At this time, after referring to the shape data of the circuit wiring stored in the memory 43a, the circuit wiring 54 located at the left and right ends of the defective portion 54a and the circuit forming slit 45b for exposing the defective portion 54a are set. The insulating mask 45a is covered so as to surround the circuit forming slit 45b without exposing the circuit wiring (the circuit wirings 52, 53, 55 of FIG. 4(a)) except the circuit wiring 54. By the insulating mask 45a, the defective portion 54a to be connected to the repaired circuit wiring can be exposed while covering the circuit wirings 5, 5, and 5 5 which should not be connected to the circuit wiring 54. Proceeding to step S103, the controller 43 controls the driving of the front and rear drive motors 29, 39, the left and right drive motor 49, and the insulating print head 45, and then attaches to the area of the insulating mask 45a set in the above step S102. Insulating ink. In the above-described step S102, since the region of the insulating mask 45a is set in consideration of the region in which the insulating ink is spread on the circuit board 15 322173 201132255 50 (see FIG. 4(b)), for example, the circuit wirings 53, 55 are not The circuit is formed by the slit 45b. Next, proceeding to step S104, the conductive ink is ejected from the conductive print head 46 toward the circuit formation slit 45b to form a repair circuit 46a (refer to Fig. 5). At this time, the droplet diameter of the conductive ink is larger than the slit 45b for forming the circuit, but since the insulating mask 45a is formed so as not to be directly connected to the circuit wirings 52, 53, 55, the circuit wirings 52 to 55 are not passed. Conductive inks are shorted to each other. In addition, the conductive ink is adhered to the circuit forming slit 45b, and the circuit wiring (repairing circuit) is formed in the exposed defective portion 54a, and the broken circuit wiring 54 is connected and repaired. After the repair circuit 46a is formed in this manner, and dried to a drying time consistent with the characteristics of the conductive ink, the sintering temperature (for example, about 150 ° C to 200 ° C) and the sintering time (for example, 20) in accordance with the characteristics of the conductive ink. Sintering is performed in a minute to about 2 hours, whereby the repairing circuit 46a is firmly fixed to the circuit substrate 50, and the flow is completed. As described above, according to the printer 1 of the present invention, the circuit wiring can be surely formed (repaired) with respect to the circuit board in which the circuit wiring is dense and exposed, without occurrence of a short circuit or the like. Therefore, it is possible to reproduce a good circuit substrate which has been previously discarded as a defective product, thereby eliminating waste and reducing the burden on the environment. However, the above-described insulating mask 45a may be set to, for example, the insulating mask 45c shown in Fig. 7(a). As shown in FIG. 7(b), the insulating mask 45c is set to have a front-back width slightly larger than the droplet diameter of the conductive ink (the front and rear widths of the repairing circuit 46a), and the ink formed by the insulating ink as a whole is formed. 16 322173 201132255 The brush area becomes smaller. Therefore, the circuit wiring can be formed in the defective portion 54a exposed to the circuit forming slit 45d while reducing the consumption of the insulating ink and reducing the running cost. However, when the droplets of the conductive ink are easily staggered, such as the straight or landing position, the insulating mask 45c is formed to be large in advance so as to prevent the conductive ink from directly adhering to the insulating mask 45c. The circuit board 50 of the outer side (the insulating mask 45c is not formed) is preferable. Further, the above-described insulating mask 45a may be set to, for example, an insulating mask 45e as shown in Fig. 8(β). The insulating mask 45e covers the circuit wiring 53 and the circuit wiring 55 adjacent to the circuit wiring 54, and is set such that the circuit forming slit 45f extends left and right to expose the circuit wiring 54. With respect to the insulating mask 45e, the circuit wiring 54 can be repaired by forming the repairing circuit 46a only by attaching the conductive ink to the defective portion 54a as shown in Fig. 8(b). This insulating mask 45e is particularly effective when a plurality of defective portions 54a are present in the circuit wiring 54. That is, as for the insulating mask 45e formed to extend left and right, the repair circuit 46a may be formed only at a necessary position. Therefore, it is not necessary to form the insulating mask 45e for each of the defective portions 54a, and the setting and formation of the insulating mask 45e are relatively simple. Further, by forming the insulating mask 45e', not only local repair of the circuit wiring as described above but also circuit wiring can be newly added. In the above embodiment, in addition to the print head for color printing, two types of printing such as color printing and circuit wiring printing can be performed by mounting the insulating print head 45 and the conductive print head 46. The printer will be explained. However, the present invention is not limited to this configuration, and may be designed to, for example, only mount 322173 17 201132255 insulating print head 45 and conductive print head 46 without carrying a color printing print head, and is dedicated to circuit wiring printing. Composition. In the above-described embodiment, the case where the defective portion of the circuit wiring is repaired by using the printing machine 1 of the present invention has been described. However, in addition to this, the image pickup device 47 can detect the circuit wiring such as a surface damage. And fix it. Further, in the above-described embodiment, it has been exemplified that the circuit board 5 is adsorbed and fixed to the stage 12, and the insulating head 45 and the conductive print head 46 (carrier 44) are ejected while moving forward, backward, left, and right. The composition is explained. The present invention is not limited to a printing machine applied to this form, and can be applied, for example, to fixing the insulating print head 45 and the conductive print head 46 such that the circuit substrate 50 is opposed to the insulating print head 45 and the conductive print head 46. A printing machine that moves toward the front, back, left, and right. In the above embodiment, as the insulating ink, for example, a uv hardening ink, an aqueous latex ink, a transparent or white organic solvent (v small < small ink) ink, or a color ink can be used. On the other hand, as the conductive ink, a solution such as a dispersion-type aqueous solvent ink of conductive particles such as nano copper or nano silver or a metal salt which is electrically conductive by precipitation by heating can be used. The heated conductive ink is prepared. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a printing press to which the present invention is applied. Figure 2 is a control system diagram of the above printing press. Figure 3 is a plan view of the circuit board. Fig. 4 is a plan view of the circuit board, and (a) shows a state in which the insulating layer 322173 18 201132255 is printed, (t〇 shows a partial enlarged view of Fig. 4(a). Fig. 5 is a circuit board. The top view is for showing the state in which the conductive ink is attached to the circuit formation region. Fig. 6 is a flow chart for repairing the wiring of the circuit. Fig. 7 is a plan view showing the insulating mask of another form, (a) showing The state before the conductive ink is attached '(b) shows the state in which the conductive ink is attached. Fig. 8 is a plan view showing the insulating mask of another form, showing the state before the conductive ink is attached, (1)) The state in which the conductive ink is attached. [Description of main component symbols] Printing machine: Support part t Main body part 1 Supporting foot u Platform (substrate supporting means) 20 Front and rear moving mechanism 29, 39 Front and rear drive motor 41 Operating part 42 Guide rail 43a 43 44 45 Memory controller (insulation Head control unit, conductive head control carrier insulation print head 322173 19 201132255 45a Insulation pattern (insulation pattern for circuit formation) 45b '45d ' 45f Circuit formation slits 45c, 45e Insulation mask 46a Repair circuit 46 Conductive print head 47 Imaging device (defective position detecting means) 49 Left and right drive motor 50 Circuit board 52, 53 , 54 , 55 Circuit wiring 54a Defective part 60 Electronic parts