TWI461133B - Printer device and printing method thereof - Google Patents

Description

Printing machine and printing method thereof

The present invention relates to a printing machine for attaching ink to perform printing and a printing method therefor.

The above-described printing machine (inkjet printer) can be combined by, for example, an operation of relatively moving a printing medium with a print head and an operation of ejecting ink from a printing head. The desired image is printed on a sheet-like or flat-shaped print medium. The printing machine performs high-accuracy relative movement control of the printing medium and the printing head, and ink ejection control of the printing head, thereby allowing micro ink droplets to adhere to the original control position on the printing medium. High quality printing. In recent years, it has been developed to utilize such a printing machine feature, for example, by ejecting and attaching a conductive conductive ink from a printing head to expose a broken portion of a circuit wiring formed on a circuit board, thereby repairing The technique of circuit wiring (refer to, for example, Patent Document 1).

The circuit board is first heated in a reflow furnace while the electronic component is mounted, thereby connecting the circuit wiring formed on the circuit board and the electronic component to surface mounting. After the surface mounting, the inspection device is used to check whether there is a broken circuit wiring or the like, and the circuit board that has passed the inspection is shipped as a good product. On the other hand, the circuit board that is determined to have the broken circuit wiring is discarded. At this time, for example, even if the surface-mounted electronic components are normal but a part of the circuit wiring is defective, the normal electronic components are disposed of together, which causes great waste and imposes a great burden on the environment. In this regard, when the printed circuit board is used to repair the broken circuit wiring, the circuit board that has been previously discarded as a defective product can be regenerated, thereby eliminating waste and reducing the burden on the environment.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Laid-Open Patent Publication No. 2006-261228

Recently, with the high functionality and miniaturization of electrical equipment carrying a circuit board, it has been required to mount the electronic components on the circuit board at a high density. Such a circuit board is configured such that, for example, circuit wirings having a line width of about 10 μm are densely exposed at intervals of about several μm. However, when the conductive ink is ejected from the printing head and adhered to the circuit board, the ink droplets are adhered even if the ink droplet diameter is controlled as small as possible within a range in which mist is not made. It is diffused to a size of, for example, about 50 μm on the circuit board. Therefore, when the conductive ink is ejected toward the broken portion, the conductive ink is diffused and adhered to the adjacent circuit wiring. As a result, the adjacent circuit wirings that should not be connected are connected to each other to cause a short circuit, and the function of the circuit board cannot be ensured. Thus, there is a problem in that it is difficult to use a printing machine to form a circuit wiring in such a manner that the circuit wiring formed on the circuit board is densely exposed.

The present invention has been made in view of the above problems, and an object thereof is to provide a printer capable of forming a circuit wiring for repairing a circuit wiring formed on a circuit board in a dense manner, and a printing method therefor.

In order to achieve the above object, a printing machine of the present invention has: a substrate supporting means (for example, a table 12 of an embodiment) for supporting a circuit substrate; and a printing head, the circuit substrate supported by the substrate supporting means Provided in a state of being movable along the circuit substrate to eject ink toward the circuit substrate; the print head is configured to: an insulating print head for ejecting an insulating ink having an insulating property; And a conductive print head for ejecting conductive conductive ink; and an insulating head control unit (for example, a controller 43 of the embodiment) for controlling movement of the insulating print head and ink ejection, and The circuit board supported by the substrate supporting means sprays the insulating ink onto an outer region of a predetermined circuit forming region surrounding the surface of the circuit board to form an insulating pattern for circuit formation in which the circuit forming region is exposed on the surface side and is surrounded (for example) Insulation pattern 45a) of the embodiment; and a conductive head control unit (for example, controller 43 of the embodiment) for controlling Moving said first conductive printing ink and the discharge, and the ink adhered to the conductive circuit by the control section controls the insulating head is formed with the forming of the circuit pattern of the insulating region, to form the circuit wiring.

In the above printing machine, it is preferable that the insulating head control unit performs the movement control and the ink discharge control of the insulating print head, and forms an insulating pattern for forming a circuit as the insulating pattern for circuit formation, and the circuit is formed. The insulating pattern exposes a slit-like circuit formation region in which a droplet having a smaller width than that of the conductive ink ejected from the conductive print head is formed.

Further, in the circuit board supported by the substrate supporting means, it is preferable to include a defect position detecting means (for example, the image forming apparatus 47 of the embodiment) for detecting a position at which a defective portion of the circuit wiring formed on the circuit board is exposed; In addition, an insulating pattern for circuit formation provided with a circuit formation region is formed as the insulating pattern for circuit formation, in such a manner that the defective portion detected by the defect position detecting means is repaired and the circuit wiring is connected.

The printing method of the present invention is a printing method of a printing machine for ejecting ink on a side of a printing head supported by a substrate supporting means while moving a printing head along the circuit substrate. The printing head is configured to: an insulating printing head for ejecting an insulating insulating ink; and a conductive printing head for ejecting a conductive conductive ink; and the printing method has the following steps In the first step, the insulating substrate is sprayed on the outer surface of the predetermined circuit forming region surrounding the surface of the circuit board with respect to the circuit board supported by the substrate supporting means, so that the circuit forming region is exposed on the surface side and surrounded. In the second step, the conductive ink is adhered to the circuit formation region of the circuit formation insulating pattern formed in the first step to form a circuit wiring.

Further, in the first step, it is preferable that an insulating pattern for forming a circuit is formed as the insulating pattern for forming a circuit, and the pattern for forming a circuit is exposed to have a conductive width which is ejected from the conductive print head. The droplet diameter of the ink is a small slit-shaped circuit formation region.

The printing machine of the present invention forms an insulating pattern for circuit formation which is exposed on the surface side by an insulating print head forming circuit formation region, and is formed by a conductive print head to adhere the conductive ink to the circuit formation region. The wiring is structured. Therefore, by forming the portion of the circuit wiring to be exposed and forming the insulating pattern for circuit formation so as to cover the portion where the circuit wiring should not be formed, the dense exposed surface can be formed on the circuit substrate regardless of the diameter of the droplet of the conductive ink. The circuit wiring on the circuit is formed by repairing the circuit wiring.

Further, the insulating head control unit performs the movement control of the insulating print head and the ink discharge control so as to form an insulating pattern for circuit formation having a slit-like circuit formation region having a smaller droplet diameter than that of the conductive ink. good. According to this configuration, even if the exposed adjacent circuit wirings are closer to each other than the droplet diameter of the conductive ink, the circuit wirings can be formed without short-circuiting the circuit wirings.

Further, it is preferable to include a defect position detecting means for detecting the position of the defective portion of the circuit wiring, and to form a circuit pattern insulating pattern in which the circuit forming region is provided so as to repair the defective portion and connect the circuit wiring. In the case of this configuration, the portion where the circuit wiring is to be formed is specifically defined by the defect position detecting means, and then the insulating pattern for circuit formation which exposes the portion is formed, whereby the circuit wiring having the defective portion can be surely repaired. .

The printing method of the present invention has a first step of forming an insulating pattern for circuit formation in which a predetermined circuit formation region is exposed on the surface side, and a circuit formation region in which the conductive ink is adhered to the circuit formation insulating pattern to form The second step of circuit wiring. Therefore, the conductive ink can be attached after the portion for forming the circuit wiring is exposed, and the insulating pattern for circuit formation is formed so as to cover the portion where the circuit wiring should not be formed. Therefore, regardless of the droplet diameter of the conductive ink, the circuit wiring can be formed in a manner that is dense and exposes the circuit wiring formed on the circuit board.

Further, in the first step, it is preferable to form an insulating pattern for circuit formation having a slit-like circuit formation region having a smaller droplet diameter than that of the conductive ink. In the case of this configuration, even if the exposed adjacent circuit wirings are closer to each other than the droplet diameter of the conductive ink, the circuit wirings are not short-circuited to each other to form circuit wiring.

Embodiments of the present invention will be described below with reference to the drawings. First, the configuration of the printer 1 to which the present invention is applied will be described with reference to Figs. 1 and 2 . For convenience of explanation, the front, rear, left and right, and up and down directions of the printing machine 1 are displayed in the directions of arrows in the respective drawings, and the following description will be made using this direction.

In the following, as shown in Fig. 1, a description will be given of a configuration example in which the present invention is applied to a printing machine 1, which is provided with a guide rail 42 that can be moved back and forth in a manner that can be moved left and right. The print head 45 and the conductive print head 46 are formed. Further, in addition to the configuration in which the insulating print head 45 and the conductive print head 46 are placed on the guide rail 42, it may be configured to be mounted on, for example, a SCARA robot.

As shown in Fig. 1, the printing machine 1 includes a support portion 2 having a function of being provided as a base at a lower portion, and a main body portion 3 attached to the support portion 2 so as to be movable back and forth. The support portion 2 is composed of the following members: a plurality of support legs 11; a platform 12, which is supported by the support legs 11 The support is horizontal and has a planar support surface on the upper surface; and the front and rear moving mechanisms 20, 30 are extended to the left and right ends of the platform 12 toward the front and rear. Further, the configuration in which the main body portion 3 is moved relative to the support portion 2 may be configured to be, for example, mechanically moved, or may be configured to move the print head of one line width to the print position by electrically scanning the print head.

In addition, a decompression chamber (not shown) is formed on the lower side (back side) of the platform 12, and the support surface and the decompression chamber formed on the upper surface of the platform 12 are through a plurality of supply and discharge holes through the upper and lower sides ( It is connected without being connected, and the air in the decompression chamber is sucked or sent to the decompression chamber by a blower (not shown). By sucking air into the decompression chamber through the supply and exhaust holes, for example, the air in the decompression chamber is sucked and fixed, that is, the printing object (circuit board 50) placed on the surface of the stage 12 is adsorbed and fixed to the stage 12.

The main body portion 3 is formed to extend above and below the platform 12 and to the left and right, and is supported at the left and right end portions to be movable forward and backward by the front and rear moving mechanisms 20 and 30. The front and rear moving mechanisms 20 and 30 are mechanisms for respectively supporting the left and right end portions of the main body portion 3 and moving them forward and backward, but the two are synchronized, and the main body portion 3 is moved forward and backward with respect to the platform 12 straight. The front and rear moving mechanisms 20 and 30 are configured such that, for example, an endless endless belt (not shown) that extends forward and backward, and a rear drive motor 29, 39 for driving the endless belt. . Further, the configuration of the front and rear moving mechanisms 20 and 30 is not limited thereto, and various conventional techniques can be used.

A guide rail 42 extending left and right is formed inside the main body portion 3, and a carriage 44 is attached to the guide rail 42 so as to be movable to the right and left. The carrier 44 is moved to the left and right on the guide rail 42 by a right and left moving mechanism. The left and right moving mechanism is configured to extend, for example, an endless belt (not shown) that extends to the left and right, and to make the belt The left and right drive motors 49 are rotationally driven. Further, the configuration of the right and left moving mechanism is not limited thereto, and various conventional techniques may be used.

The carrier 44 is provided with an insulating print head 45 and a conductive column in addition to a print head for color printing such as yellow, magenta, cyan, and black, which are not shown. The print head 46 and the image pickup device 47.

The insulating print head 45 has a plurality of discharge nozzles (not shown) formed on the lower surface (the surface facing the stage 12), and is configured to discharge the insulating ink having the insulating property downward from the discharge nozzle. In the insulating ink, it is preferable to expose the circuit wirings 52 to 55 (refer to FIG. 3) formed on the surface of the circuit board 50, and it is preferable to use hardening by ultraviolet (UV light) irradiation, for example. A UV-curable cation polymerization ink, a radical polymerization ink, or a cation-radical hybrid ink. Further, the insulating print head 45 is preferably configured to have a resolution of, for example, about 1200 dpi (the ink droplet diameter is, for example, about 20 μm). When the insulating mask 45a described later is formed, it is possible to smoothly form the contour while ensuring the positional accuracy of the insulating mask 45a. Further, when the insulating mask 45a is formed using the UV curable ink, the UV light from the UV irradiation device (not shown) is irradiated for a predetermined time after the UV curable ink is adhered or allowed to permeate, so as to be hardened. The insulating mask 45a is formed to function as a mask.

Similarly to the above-described insulating print head 45, the conductive print head 46 has a plurality of discharge nozzles (not shown) formed on the lower surface thereof, and is configured to discharge conductive ink having conductivity from the discharge nozzle downward. In the conductive ink, for example, Ag particles having a particle diameter of several nm to several tens of nm are dissolved in a solvent. Further, the resolution of the conductive print head 46 is, for example, about 600 dpi or 300 dip, so that the discharged conductive ink is difficult to atomize. Therefore, when the conductive ink is adhered to the circuit board 50 as will be described later, the ink floats without being attached to the periphery, and the short-circuit or the like is not easily generated.

The imaging device 47 is configured by an imaging element (not shown) such as a CCD (Charge Coupled Device), and images the surface of the printing object (circuit substrate 50) supported by the stage 12.

An operation portion 41 composed of an operation switch or a display device or the like is provided on the front side of the left side of the main body portion 3. Inside the left end side of the main body portion 3, a controller 43 is mounted, and the controller 43, as shown in Fig. 2, is capable of transmitting and receiving signals or data to the operation unit 41 and each constituent member. connection. Thereby, the controller 43 outputs an operation signal to each component member based on the operation signal from the operation unit 41 to perform operation control. Further, in the controller 43, a memory 43a in which various materials are stored is built in, and the data can be memorized in the memory 43a or the stored data can be read from the memory 43a.

As described above, the configuration of the printing press 1 has been described above. The operation of the printing machine 1 when color printing is performed on, for example, a flat printing medium (not shown) will be described below. Further, at this time, printing is performed by operating the printing head for color printing without operating the insulating print head 45 and the conductive print head 46.

First, the supply and discharge blowers are operated in a state where the printing medium is placed on the stage 12 to adsorb and fix the printing medium to the stage 12. In this state, the main body portion 3 (rail 42) is moved forward and backward, the carrier 44 is moved back and forth, and the color ink is ejected downward from the color printing head. The desired printing is performed by attaching the color ink to the surface of the printing medium. Since the printing machine 1 is controlled by the controller 43, the movement control of the printing head for color printing with respect to the printing medium and the ink ejection control of the printing head for color printing (timing and timing) can be performed with good precision. Since the size of the ink droplets is configured, the fine color ink droplets can be attached to the original control position on the printing medium to perform high-quality printing.

The operation of the printing press 1 when performing color printing on a flat printing medium has been described above. As described above, although the carrier print unit 45 and the conductive print head 46 are mounted on the carrier 44, the characteristics of the printer 1 capable of attaching minute ink droplets to the original control position on the printing medium are utilized. The user is formed when the circuit wiring is formed on the circuit board. Recently, with the increase in the functionality and miniaturization of electrical equipment in which a circuit board is mounted, for example, a circuit board in which circuit wirings having a line width of about 10 μm are spaced apart from each other by a distance of several μm has been developed. In the printing machine 1 of the present invention, a circuit board having such a circuit wiring can be formed by reliably forming a circuit wiring without causing a short circuit or the like.

Therefore, the feature configuration will be described in detail along the flowchart shown in FIG. 6 with reference to FIGS. 3 to 5 in the following. In addition, the following is a description of a case where a part of the circuit wiring which is broken and disconnected is connected and repaired.

First, the circuit board 50 shown in Fig. 1 will be briefly described. On the upper surface of the flat circuit board 50, a plurality of circuit wirings are formed in advance in correspondence with the mounted electronic component 60. After the electronic component 60 is placed on the circuit board 50, it is heated in the reflow furnace, thereby soldering the circuit wiring and the electronic component 60 to each other. Then, the inspection device is used to check whether or not the circuit wiring is broken, and the circuit board 50 that has been determined to be unbroken is shipped, and the circuit board 50 is shipped as a good circuit. The substrate 50 is adsorbed and fixed at a predetermined position on the stage 12. At this time, for example, a positioning jig (not shown) can be used to adsorb and fix the circuit board 50 to a predetermined position on the stage 12. Further, the shape data of the circuit wiring formed on the circuit board 50 is exposed and stored in the memory 43a in advance.

Further, in step S101 shown in Fig. 6, the front and rear drive motors 29, 39 and the left and right drive motors 49 are driven so that the image pickup device 47 is positioned above the circuit board 50, and the surface image of the circuit board 50 is imaged. The acquired imaging data is transmitted from the imaging device 47 to the controller 43. Then, the controller 43 compares the shape data of the previously stored circuit wiring with the image data from the image pickup device 47 to detect the position and the range of the broken portion (defective portion) of the circuit substrate 50.

In Fig. 3, a portion of a plurality of circuit wirings 52 to 55 formed on the circuit substrate 50 is shown. The circuit wirings 52 to 55 are formed by exposing and forming, for example, a line width of about 10 μm and a space of about several μm. The circuit wiring 54 in the circuit wirings 52 to 55 is disconnected by the defective portion 54a. However, in the above manner, the controller 43 detects the position and the range of the defective portion 54a. In addition, in FIGS. 3 to 5, hatching is illustrated for the circuit wirings 52 to 55 for the sake of clarity.

However, since the droplet diameter of the conductive ink ejected from the conductive print head 46 is, for example, about 40 μm, when the conductive ink is directly attached to the defective portion 54a, the circuit wiring 54 and the circuit wirings 52, 53, 55 are passed through The attached conductive ink is connected to cause a short circuit. Therefore, in step S102, the formation region of the insulating mask 45a is set based on the position and range of the defective portion 54a detected in the above-described step S101. At this time, after referring to the shape data of the circuit wiring stored in the memory 43a, the circuit wiring 54 located at the left and right ends of the defective portion 54a and the slit 45b for forming the circuit for exposing the defective portion 54a are set. The insulating mask 45a is covered so as to surround the circuit forming slit 45b without exposing the circuit wiring (the circuit wirings 52, 53, 55 of FIG. 4(a)) except the circuit wiring 54. By the insulating mask 45a, the defective portions 54a to be connected to be repaired with the circuit wiring can be exposed while covering the circuit wirings 52, 53, 55 which are not connected to the circuit wiring 54.

Proceeding to step S103, the controller 43 controls the driving of the front and rear drive motors 29, 39, the left and right drive motors 49, and the insulating print head 45, and the insulating ink is adhered to the region of the insulating mask 45a set in the above step S102. In the above step S102, since it is attached to the circuit substrate in advance Since the area of the insulating mask 45a is set in the area where the insulating ink is expanded by 50 (see FIG. 4(b)), for example, the circuit wirings 53, 55 are not exposed by the circuit forming slit 45b.

Next, the process proceeds to step S104, and the conductive ink is ejected from the conductive print head 46 toward the circuit forming slit 45b to form a repair circuit 46a (see FIG. 5). At this time, the droplet diameter of the conductive ink is larger than the slit 45b for forming the circuit, but since the insulating mask 45a is formed so as not to be directly connected to the circuit wirings 52, 53, 55, the circuit wirings 52 to 55 are not passed. Conductive inks are shorted to each other. In addition, the conductive ink is adhered to the circuit forming slit 45b, and the circuit wiring (repairing circuit) is formed in the exposed defective portion 54a, and the broken circuit wiring 54 is connected and repaired.

After the repair circuit 46a is formed in this manner and dried to a drying time consistent with the characteristics of the conductive ink, the sintering temperature (for example, about 150 ° C to 200 ° C) and the sintering time (for example, 20 minutes to the characteristics of the conductive ink) are obtained. Sintering is performed for about 2 hours, whereby the repair circuit 46a is firmly fixed to the circuit substrate 50, and the flow is completed. As described above, according to the printer 1 of the present invention, even if the circuit wiring is dense and the formed circuit substrate is exposed, the circuit wiring can be surely formed (repaired) without occurrence of a short circuit or the like. Therefore, it is possible to reproduce a good circuit substrate which has been previously discarded as a defective product, thereby eliminating waste and reducing the burden on the environment.

However, the above-described insulating mask 45a may be set to, for example, the insulating mask 45c shown in Fig. 7(a). As shown in FIG. 7(b), the insulating mask 45c is set to have a front-back width slightly larger than the droplet diameter of the conductive ink (the front and rear widths of the repairing circuit 46a), and the ink formed by the insulating ink as a whole is formed. The brush area becomes smaller. Therefore, the circuit wiring can be formed in the defective portion 54a exposed to the circuit forming slit 45d while reducing the consumption of the insulating ink and reducing the running cost. When the droplet diameter or the landing position of the conductive ink is easily staggered, the insulating mask 45c is formed to be large in advance so as to prevent the conductive ink from directly adhering to the insulating mask 45c. The circuit substrate 50 of the square (the insulating mask 45c is not formed) is preferable.

Further, the above-described insulating mask 45a may be set to, for example, an insulating mask 45e shown in Fig. 8(a). The insulating mask 45e covers the circuit wiring 53 and the circuit wiring 55 adjacent to the circuit wiring 54, and is set such that the circuit forming slit 45f extends left and right to expose the circuit wiring 54. In the insulating mask 45e, the circuit wiring 54 can be repaired by forming the repair circuit 46a by adhering only the conductive ink to the defective portion 54a as shown in, for example, Fig. 8(b). This insulating mask 45e is particularly effective when a plurality of defective portions 54a are present in the circuit wiring 54. That is, as for the insulating mask 45e formed to extend left and right, the repair circuit 46a may be formed only at a necessary position. Therefore, it is not necessary to form the insulating mask 45e for each of the defective portions 54a, and the setting and formation of the insulating mask 45e are relatively simple. Further, by forming the insulating mask 45e, not only local repair of the circuit wiring as described above but also circuit wiring can be newly added.

In the above embodiment, in addition to the print head for color printing, two types of printing such as color printing and circuit wiring printing can be performed by mounting the insulating print head 45 and the conductive print head 46. The printing machine 1 will be described. However, the present invention is not limited to this configuration, and may be designed to be mounted only, for example. The insulating print head 45 and the conductive print head 46 are not provided with a print head for color printing, but are dedicated to the structure of circuit wiring.

In the above-described embodiment, the case where the defective portion of the circuit wiring is repaired by using the printing machine 1 of the present invention has been described. However, in addition to this, the image pickup device 47 can detect the circuit wiring such as a surface damage. And fix it.

Further, in the above-described embodiment, the ink is sprayed and fixed to the stage 12, and the insulating head 45 and the conductive print head 46 (the carrier 44) are ejected while moving the ink toward the front, back, left, and right sides. Be explained. The present invention is not limited to a printing machine applied to this form, and can be applied, for example, to fixing the insulating print head 45 and the conductive print head 46 such that the circuit substrate 50 is opposed to the insulating print head 45 and the conductive print head 46. A printing machine that moves toward the front, back, left, and right.

In the above embodiment, as the insulating ink, for example, a UV curable ink, an aqueous latex ink, a transparent or white organic solvent ink, or a color ink can be used. On the other hand, as the conductive ink, a solution such as a dispersion-type aqueous solvent ink of conductive particles such as nano copper or nano silver or a metal salt which is electrically conductive by precipitation by heating can be used. The heated conductive ink is prepared.

1. . . Printing machine

2. . . Support

3. . . Body part

11. . . Supporting foot

12. . . Platform (substrate support means)

20. . . Front and rear moving mechanism

29, 39. . . Front and rear drive motor

41. . . Operation department

42. . . guide

43a. . . Memory

43. . . Controller (insulation head control unit, conductive head control unit)

44. . . vehicle

45. . . Insulated print head

45a. . . Insulation pattern (insulation pattern for circuit formation)

45b, 45d, 45f. . . Slot for circuit formation

45c, 45e. . . Insulating mask

46a. . . Repair circuit

46. . . Conductive print head

47. . . Camera device (defect position detection means)

49. . . Left and right drive motor

50. . . Circuit substrate

52, 53, 54, 55. . . Circuit wiring

54a. . . Defective part

60. . . Electronic parts

Figure 1 is a perspective view of a printing press to which the present invention is applied.

Figure 2 is a control system diagram of the above printing press.

Figure 3 is a plan view of the circuit board.

Fig. 4 is a plan view of the circuit board, (a) shows a state in which an insulating mask is printed, and (b) shows a partial enlarged view of Fig. 4(a).

Fig. 5 is a plan view of the circuit board for showing a state in which the conductive ink adheres to the circuit formation region.

Figure 6 is a flow chart for repairing circuit wiring.

Fig. 7 is a plan view showing an insulating mask of another form, (a) showing a state before the conductive ink is attached, and (b) showing a state in which the conductive ink is attached.

Fig. 8 is a plan view showing an insulating mask of another form, (a) showing a state before the conductive ink is attached, and (b) showing a state in which the conductive ink is adhered.

45a. . . Insulation pattern (insulation pattern for circuit formation)

45b. . . Slot for circuit formation

50. . . Circuit substrate

52, 53, 54, 55. . . Circuit wiring

54a. . . Defective part

Claims (5)

A printing machine comprising: a substrate supporting means for supporting a circuit substrate; and a printing head disposed in a state of being movable along the circuit substrate opposite to the circuit substrate supported by the substrate supporting means The inkjet head is configured to: eject an ink toward the circuit substrate; the print head comprises: an insulating print head for ejecting an insulating ink having an insulating property; and a conductive print head for ejecting a conductive ink having conductivity; And an insulating head control unit configured to control movement of the insulating print head and ink ejection, and to inject insulating ink to a predetermined circuit forming region surrounding the surface of the circuit substrate for the circuit substrate supported by the substrate supporting means The outer region and the insulating ink are cured on the outer region to form an insulating pattern for forming a circuit for exposing the circuit forming region to the surface side; and a conductive head control portion for controlling the movement of the conductive print head And ejecting the ink, and attaching the conductive ink to the control by the insulating head control unit Forming said circuit forming the circuit pattern of the insulating region, to form the circuit wiring. The printing machine according to the first aspect of the invention, wherein the insulating head control unit is capable of performing movement control and ink discharge control of the insulating print head, and forming an insulating pattern for forming a circuit as the insulating pattern for forming a circuit. The circuit is formed by exposing an insulating pattern to form a droplet having a width greater than that of the conductive ink ejected from the conductive print head A slit-like circuit forming region having a small diameter. The printing machine according to the first or second aspect of the invention, wherein the circuit board supported by the substrate supporting means includes a defect position detecting means for detecting a defect of exposing a circuit wiring formed on the circuit board In the position of the portion, the circuit-forming insulating pattern provided with the circuit-forming region is formed as the insulating pattern for circuit formation, by fixing the defective portion detected by the defect position detecting means. A printing method for printing a printing machine for ejecting ink on a circuit board supported by a substrate supporting means while moving a printing head along the circuit substrate to perform a printing; the print head The method includes: an insulating print head for ejecting an insulating ink having an insulating property; and a conductive print head for ejecting a conductive ink having conductivity; and the printing method has the following steps: the first step, a circuit board supported by the substrate supporting means for spraying an insulating ink onto an outer region of a predetermined circuit forming region surrounding the surface of the circuit substrate, and curing the insulating ink on the outer region to form the circuit forming region on the surface side and In the second step, the conductive ink is adhered to the circuit formation region of the circuit formation insulating pattern formed in the first step to form a circuit wiring. The printing method of claim 4, wherein The first step is to form an insulating pattern for circuit formation as the insulating pattern for forming a circuit, and the insulating pattern for forming the circuit is formed to have a smaller diameter than that of the conductive ink ejected from the conductive print head. The slit-like circuit forms a region.