JP5615002B2 - Printer apparatus and printing method therefor - Google Patents

Description

  The present invention relates to a printer apparatus that performs printing by attaching ink, and a printing method thereof.

  The above-described printer device (inkjet printer) performs, for example, a combination of an operation of moving the print medium and the printer head relative to each other and an operation of ejecting ink from the printer head on a sheet-like or flat print medium. Thus, a desired image can be printed. Such a printer apparatus attaches minute ink droplets to a position as controlled on the print medium by performing relative movement control between the print medium and the printer head and ink ejection control in the printer head with high accuracy. High quality printing is possible. Taking advantage of the features of this printer device, for example, by discharging conductive ink with conductivity from the printer head and adhering it so as to compensate for the disconnected portion of the circuit wiring formed exposed on the circuit board, the circuit wiring In recent years, a technique for repairing the image has been developed (see, for example, Patent Document 1).

  First, the circuit board is heated in a reflow furnace in a state where the electronic component is placed, so that the circuit wiring formed on the circuit board and the electronic component are connected and surface-mounted. After surface mounting, the presence or absence of disconnected circuit wiring is inspected using an inspection device, and circuit boards that pass the inspection are shipped as non-defective products, while circuit boards that are determined to have disconnected circuit wiring are discarded. It had been. At this time, for example, if some of the circuit wiring is defective even if the surface-mounted electronic components are normal, the normal electronic components are also discarded together, which is very wasteful and has an environmental impact. Was also enormous. On the other hand, when a broken circuit wiring is repaired using a printer device, a circuit board that has been discarded as a defective product can be regenerated into a non-defective product, so that it is possible to eliminate waste and reduce the burden on the environment. There is.

JP 2006-261228 A

  In recent years, with the increase in functionality and miniaturization of electrical equipment on which circuit boards are mounted, there is a demand for surface mounting electronic components with high density even on circuit boards. Such a circuit board is configured, for example, such that circuit wirings having a line width of about 10 μm are densely exposed at intervals of about several μm. By the way, when conducting ink is ejected from the printer head and adhered to the circuit board, the ink droplets adhere to the circuit board even if ejection control is performed so that the ink droplet diameter is as small as possible within the range where mist does not occur. For example, it spreads to a size of about 50 μm. Therefore, when the conductive ink is ejected and adhered toward the disconnected portion, the conductive ink spreads and adheres to the adjacent circuit wiring. As a result, adjacent circuit wirings that should not be connected to each other are connected to cause a short circuit, and the function of the circuit board cannot be secured. As described above, there is a problem that it is difficult to form the circuit wiring so as to compensate for the circuit wiring densely exposed on the circuit board by using the printer device.

  The present invention has been made in view of the above problems, and a printer device capable of forming circuit wiring so as to compensate for circuit wiring densely exposed on a circuit board, and printing thereof It aims to provide a method.

  In order to achieve the above object, a printer device according to the present invention includes a substrate support unit (for example, the table 12 in the embodiment) that supports a circuit board, and the circuit device supported by the substrate support unit in a state of facing the circuit substrate. A printer device that is movably provided along a circuit board and has a printer head that ejects ink toward the circuit board, wherein the printer head ejects insulating ink having insulation properties A circuit board supported by the substrate support means by controlling the movement and ink ejection of the insulating printer head. On the other hand, by discharging insulating ink to an external region surrounding a predetermined circuit formation region on the surface of the circuit board, the circuit formation region is moved to the surface side. An insulating head control unit (for example, the controller 43 in the embodiment) that forms an insulating pattern for circuit formation (for example, the insulating pattern 45a in the embodiment) that surrounds and controls the movement and ink ejection of the conductive printer head. A conductive head control unit (for example, the controller 43 in the embodiment) for forming a circuit wiring by attaching conductive ink to the circuit forming region in the circuit forming insulating pattern formed by being controlled by the insulating head control unit; Is provided.

  In the above-described printer apparatus, the insulating head control unit exposes a slit-like circuit forming region having a width smaller than a droplet diameter of the conductive ink ejected from the conductive printer head as the circuit forming insulating pattern. It is preferable that movement control and ink ejection control of the insulating printer head are possible so as to form an insulating pattern for circuit formation.

  Further, the circuit board supported by the substrate support means includes defect position detection means (for example, the imaging device 47 in the embodiment) for detecting the position of the defective portion of the circuit wiring exposed and formed on the circuit board, As the circuit forming insulating pattern, it is preferable to form a circuit forming insulating pattern provided with a circuit forming region so as to connect the circuit wiring by making up for the defective portion detected by the defect position detecting means.

  The printing method according to the present invention is a printing method of a printer device that performs printing by ejecting ink while moving along a circuit board with the printer head facing the circuit board supported by the board support means. The printer head includes an insulating printer head that discharges insulating ink having insulating properties, and a conductive printer head that discharges conductive ink having conductivity. An insulating pattern for circuit formation surrounding the circuit board supported by the means by discharging insulating ink to an external area surrounding a predetermined circuit forming area on the surface of the circuit board to expose the circuit forming area on the surface side And a conductive ink is attached to the circuit formation region in the circuit forming insulating pattern formed in the first step. And a second step of forming a tract wiring.

  Further, in the first step, the circuit forming insulating pattern in which a slit-shaped circuit forming region having a width smaller than a droplet diameter of the conductive ink discharged from the conductive printer head is exposed as the circuit forming insulating pattern. It is preferable to form a pattern.

  The printer device according to the present invention forms an insulating pattern for circuit formation by exposing the circuit forming area to the front side by an insulating printer head, and forms circuit wiring by attaching conductive ink to the circuit forming area by the conductive printer head. Configured to do. Therefore, by exposing a portion where circuit wiring should be formed and forming an insulating pattern for circuit formation so as to cover the portion where circuit wiring should not be formed, regardless of the droplet diameter of the conductive ink The circuit wiring can be formed so as to compensate for the circuit wiring densely exposed on the circuit board.

  The insulating head controller controls the movement of the insulating printer head and the ink ejection control so as to form a circuit forming insulating pattern having a slit-like circuit forming region having a width smaller than the droplet diameter of the conductive ink. Preferably it is possible. If comprised in this way, even if it is a case where adjacent circuit wiring is exposed and formed closer than the droplet diameter of conductive ink, circuit wiring can be formed, without short-circuiting circuit wiring.

  Further, it is preferable that a defect position detecting unit for detecting the position of the defective portion of the circuit wiring is provided, and a circuit forming insulating pattern provided with a circuit forming region so as to connect the circuit wiring so as to compensate the defective portion is preferably formed. In the case of this configuration, after identifying the portion where the circuit wiring needs to be formed by the defect position detection means, the circuit wiring having the defective portion is formed by forming the insulating pattern for circuit formation that exposes this portion. It can be reliably restored.

  The printing method according to the present invention includes a first step of forming a circuit forming insulating pattern that surrounds a predetermined circuit forming region exposed on the surface side, and conductive ink is attached to the circuit forming region in the circuit forming insulating pattern. And a second step of forming circuit wiring. Therefore, the conductive ink can be applied after the portion where the circuit wiring should be formed is exposed and the circuit forming insulating pattern is formed so as to cover the portion where the circuit wiring should not be formed. Therefore, regardless of the droplet diameter of the conductive ink, the circuit wiring can be formed so as to compensate for the circuit wiring densely exposed on the circuit board.

  In the first step, it is preferable to form an insulating pattern for forming a circuit having a slit-shaped circuit forming region having a width smaller than a droplet diameter of the conductive ink. In the case of this configuration, even if adjacent circuit wirings are exposed and formed closer to the droplet diameter of the conductive ink, circuit wiring can be formed without short-circuiting the circuit wirings.

1 is a perspective view of a printer apparatus to which the present invention is applied. FIG. 3 is a control system diagram of the printer apparatus. It is a top view of a circuit board. It is a top view of a circuit board, (a) shows the state by which the insulating mask was printed, (b) shows the elements on larger scale of FIG. 4 (a), respectively. It is a top view of a circuit board, Comprising: The state to which the conductive ink was adhered to the circuit formation area is shown. It is a flowchart at the time of repairing circuit wiring. It is a top view which shows the insulating mask of another form, Comprising: (a) shows the state before electroconductive ink adheres, (b) shows the state to which electroconductive ink was adhered, respectively. It is a top view which shows the insulating mask of another form, Comprising: (a) shows the state before electroconductive ink adheres, (b) shows the state to which electroconductive ink was adhered, respectively.

  Embodiments of the present invention will be described below with reference to the drawings. First, the configuration of a printer apparatus 1 to which the present invention is applied will be described with reference to FIGS. For convenience of explanation, the front and rear, the left and right, and the up and down directions of the printer apparatus 1 are indicated by the arrow directions in the drawings, and the description will be made using these directions.

  In the following, as shown in FIG. 1, a printer apparatus 1 configured by mounting an insulating printer head 45 and a conductive printer head 46 movably to the left and right with respect to a guide rail 42 that can be moved back and forth. A configuration example to which the present invention is applied will be described. In addition to the configuration in which the insulated printer head 45 and the conductive printer head 46 are mounted on the guide rail 42, for example, a configuration in which the insulated printer head 45 and the conductive printer head 46 are mounted and moved on an articulated robot arm (scalar robot) is also possible.

  As shown in FIG. 1, the printer device 1 includes a support portion 2 having a function as a base provided at a lower portion, and a main body portion 3 attached to the support portion 2 so as to be movable back and forth. The support unit 2 includes a plurality of support legs 11, a table 12 that is horizontally supported by the support legs 11 and has a flat support surface on the upper surface, and a back-and-forth movement provided to extend in the front-rear direction at the left and right ends of the table 12. It consists of mechanisms 20 and 30. The configuration in which the main body 3 is moved with respect to the support unit 2 may be, for example, a configuration in which the main body 3 is mechanically moved, or a configuration in which the printer head having one line width is electrically scanned and moved to the print position. It may be.

  In addition, a decompression chamber (not shown) is formed on the lower side (back side) of the table 12, and a plurality of supply / exhaust passages in which the support surface formed on the upper surface of the table 12 and the decompression chamber penetrate vertically. The air is communicated by a hole (not shown), and air in the decompression chamber can be sucked in or fed into the decompression chamber by a supply / exhaust blower (not shown). Thereby, for example, the printing object (circuit board 50) placed on the surface of the table 12 can be sucked and fixed to the table 12 by sucking air from the decompression chamber and sucking air from the supply / discharge hole to the decompression chamber. It is like that.

  The main body 3 is formed to extend left and right across the upper side of the table 12, and is supported by the front and rear moving mechanisms 20 and 30 so as to be movable back and forth at the left and right ends. The forward / backward moving mechanisms 20 and 30 are mechanisms for supporting the left and right end portions of the main body 3 and moving the front and rear, respectively, and are operated synchronously to move the main body 3 straight back and forth with respect to the table 12. Can be done. These back-and-forth moving mechanisms 20 and 30 include, for example, an endless ring-shaped belt (not shown) that extends in the front-and-rear direction, and front-and-rear drive motors 29 and 39 that rotationally drive the belt. In addition, the structure of the back-and-forth movement mechanisms 20 and 30 is not limited to this, and various known techniques can be used.

  A guide rail 42 extending left and right is formed inside the main body 3, and a carriage 44 is attached to the guide rail 42 so as to be movable left and right. The carriage 44 is, for example, a guide rail 42 by a left / right moving mechanism configured to include an endless ring-shaped belt (not shown) arranged to extend left and right and a left / right drive motor 49 that rotationally drives the belt. Move up and down. In addition, the structure of a left-right moving mechanism is not limited to this, A various well-known technique can be used.

  In addition to an unillustrated printer head for color printing such as yellow, magenta, cyan, and black, an insulating printer head 45, a conductive printer head 46, and an imaging device 47 are mounted on the carriage 44.

  The insulating printer head 45 has a large number of discharge nozzles (not shown) formed in the lower surface (the surface facing the table 12), and discharges insulating ink having insulation properties downward from the discharge nozzles. It is configured to be possible. As this insulating ink, those having good adhesion to the circuit wirings 52 to 55 (see FIG. 3) exposed on the surface of the circuit board 50 are selected and cured by, for example, irradiation with ultraviolet light (UV light). So-called UV curable cationic polymerization ink, radical polymerization ink, or cation-radical hybrid ink can be used. The insulating printer head 45 preferably has a resolution of about 1200 dpi (ink droplet diameter of about 20 μm, for example). This is because, when an insulating mask 45a described later is formed, the contour can be smoothly formed while ensuring the positional accuracy of the insulating mask 45a. When the insulating mask 45a is formed using UV curable ink, immediately after the UV curable ink is attached or within a predetermined time during which bleeding is allowed, a UV irradiation device (not shown) is used. By irradiating and curing the UV light, the insulating mask 45a is formed so as to exhibit a function as a mask.

  As with the insulated printer head 45, the conductive printer head 46 has a large number of discharge nozzles (not shown) formed in its lower surface, and discharges conductive conductive ink from the discharge nozzles downward. It is configured to be possible. As the conductive ink, for example, an ink formed by dissolving Ag particles having a particle diameter of several nm to several tens of nm in a solvent is used. The resolution of the conductive printer head 46 is, for example, about 600 dpi or 300 dpi, and the discharged conductive ink is less likely to be mist. Therefore, as described later, when the conductive ink is attached to the circuit board 50, the conductive ink does not float and adhere to the surroundings, so that problems such as a short circuit are less likely to occur.

  The imaging device 47 is configured to incorporate an imaging element (not shown) such as a CCD, for example, and can image the surface of the printing object (circuit board 50) supported by the table 12.

  An operation unit 41 including operation switches and display devices is provided on the left front side of the main body 3. A controller 43 is mounted inside the left end side of the main body 3, and this controller 43 is connected to the operation unit 41 and each component so as to be able to transmit and receive signals and data as shown in FIG. Yes. Thereby, the controller 43 outputs an operation signal to each component based on the operation signal from the operation part 41, and performs operation control. Further, the controller 43 has a built-in memory 43a in which various data are stored, and the data can be stored in the memory 43a and the data stored in the memory 43a can be read out.

  So far, the configuration of the printer apparatus 1 has been described. Hereinafter, for example, the operation of the printer apparatus 1 when color printing is performed on a flat print medium (not shown) will be described. At this time, printing is performed by operating the printer head for color printing without operating the insulating printer head 45 and the conductive printer head 46.

  First, the supply / discharge blower is operated in a state where the print medium is placed on the table 12, and the print medium is sucked and fixed to the table 12. In this state, the operation of moving the main body 3 (guide rail 42) back and forth, the operation of reciprocating the carriage 44 left and right, and the operation of discharging color ink downward from the printer head for color printing are combined. While performing, desired ink is applied by attaching color ink to the surface of the print medium. The printer apparatus 1 is configured such that the controller 43 accurately controls the movement of the printer head for color printing with respect to the print medium and the ink ejection control (ejection timing and ink droplet size) in the printer head for color printing. Therefore, high-quality printing is possible by attaching minute color ink droplets to a position as controlled on the print medium.

  The operation of the printer apparatus 1 when performing color printing on a flat print medium has been described above. As described above, the insulating printer head 45 and the conductive printer head 46 are mounted on the carriage 44, and this is a printer device capable of adhering minute ink droplets to a controlled position on the print medium. Taking advantage of the feature 1, the circuit wiring is formed on the circuit board. In recent years, with the increase in functionality and miniaturization of electrical equipment on which circuit boards are mounted, for example, circuit wirings having a line width of about 10 μm are densely exposed at intervals of about several μm. A circuit board has been developed. The printer device 1 according to the present invention is characterized by a configuration in which circuit wiring can be reliably formed on a circuit board having such circuit wiring without causing problems such as a short circuit.

  Then, this characteristic configuration will be described in detail below along the flowchart shown in FIG. 6 with additional reference to FIGS. In the following, description will be given by taking as an example the case where repair formation is performed so as to connect circuit wirings that are partially broken and disconnected.

  First, the circuit board 50 shown in FIG. 1 will be briefly described. On the upper surface of the flat circuit board 50, a plurality of circuit wirings are exposed in advance corresponding to the electronic component 60 to be mounted. After the electronic component 60 is placed on the circuit board 50, the circuit wiring and the electronic component 60 are soldered by being heated in a reflow furnace. Then, each circuit wiring is inspected for disconnection using an inspection device, and the circuit board 50 that is judged as a non-defective product without the disconnected circuit wiring is shipped, while it is determined that there is a disconnected circuit wiring. The circuit board 50 is sucked and fixed at a predetermined position on the table 12. At this time, the circuit board 50 can be sucked and fixed at a predetermined position on the table 12 by using, for example, a positioning jig (not shown). The circuit wiring shape data exposed on the circuit board 50 is stored in advance in the memory 43a.

  In step S101 shown in FIG. 6, the front and rear drive motors 29 and 39 and the left and right drive motor 49 are driven so that the imaging device 47 is positioned above the circuit board 50, and a surface image of the circuit board 50 is taken. The acquired imaging data is transmitted from the imaging device 47 to the controller 43. Then, the controller 43 compares the shape data of the circuit wiring stored in advance with the imaging data from the imaging device 47, and detects the position and range of the disconnection portion (defective portion) on the circuit board 50.

  FIG. 3 shows a part of the plurality of circuit wirings 52 to 55 formed on the circuit board 50. The circuit wirings 52 to 55 are configured to be exposed and formed with an interval of about several μm, for example, with a line width of about 10 μm in response to a demand for higher density. Of the circuit wirings 52 to 55, the circuit wiring 54 is disconnected by the defective portion 54 a, and the position and range of the defective portion 54 a are detected by the controller 43 as described above. In FIGS. 3 to 5, the circuit wirings 52 to 55 are hatched to make them easy to understand.

  By the way, since the droplet diameter of the conductive ink discharged from the conductive printer head 46 is, for example, about 40 μm, if the conductive ink is directly attached to the defective portion 54a, the circuit wiring 54 and the circuit wiring 52 are passed through the attached conductive ink. , 53, 55 are connected to cause a short circuit. Therefore, in step S102, the formation region of the insulating mask 45a is set based on the position and range of the defect portion 54a detected in step S101. At this time, the circuit wiring shape data stored in the memory 43a is referred to, and then the circuit wiring 54 located at the left and right ends of the defective portion 54a and the circuit forming slit 45b for exposing the defective portion 54a are exposed to this circuit. An insulating mask 45a is set so as to surround the formation slit 45b so as not to expose circuit wiring other than the circuit wiring 54 (circuit wirings 52, 53, and 55 in FIG. 4A). The insulating mask 45a can cover the circuit wirings 52, 53, and 55 that should not be connected to the circuit wiring 54, while exposing the defective portion 54a that needs to be connected by supplementing the circuit wiring.

  In step S103, the controller 43 controls the driving of the front and rear drive motors 29 and 39, the left and right drive motor 49, and the insulating printer head 45, and the insulating ink adheres to the region of the insulating mask 45a set in step S102. Is done. In step S102, since the region of the insulating mask 45a is set in consideration of the region where the insulating ink attached to the circuit board 50 spreads in advance (see FIG. 4B), for example, the circuit wiring is formed by the circuit forming slit 45b. 53 and 55 are not exposed.

  In step S104, the conductive ink is ejected from the conductive printer head 46 toward the circuit forming slit 45b and attached to form a repair circuit 46a (see FIG. 5). At this time, although the droplet diameter of the conductive ink is larger than that of the circuit forming slit 45b, the insulating mask 45a is formed so as not to be directly connected to the circuit wirings 52, 53, 55. 52 to 55 are not short-circuited with each other. Further, when conductive ink is attached to the circuit forming slit 45b, circuit wiring (repair circuit) is formed in the exposed defective portion 54a, and the disconnected circuit wiring 54 is connected and repaired.

  After the repair circuit 46a is formed in this way, it is dried for a drying time according to the characteristics of the conductive ink, and then a sintering temperature (for example, about 150 ° C. to 200 ° C.) and a sintering time according to the characteristics of the conductive ink. The repair circuit 46a is firmly fixed to the circuit board 50 by sintering (for example, about 20 minutes to 2 hours), and this flow ends. As described above, according to the printer device 1 of the present invention, circuit wiring is densely exposed so that circuit wiring can be reliably formed on a circuit board without causing problems such as a short circuit ( Repair). Therefore, a circuit board that has been discarded as a defective product can be regenerated as a non-defective product, which eliminates waste and reduces the environmental load.

  By the way, the above-described insulating mask 45a can be set as an insulating mask 45c shown in FIG. As shown in FIG. 7B, the insulating mask 45c is set to have a front and rear width that is slightly larger than the droplet diameter of the conductive ink (front and rear width of the repair circuit 46a), and the print area of the insulating ink is small as a whole. It has become. Therefore, the circuit wiring can be formed in the defective portion 54a exposed from the circuit forming slit 45d while reducing the consumption cost of the insulating ink and reducing the running cost. However, if the droplet diameter or landing position of the conductive ink tends to vary, the circuit substrate 50 positioned outside the insulating mask 45c (where the insulating mask 45c is not formed) is taken into consideration when the variation is taken into consideration. On the other hand, it is preferable that the insulating mask 45c is previously formed large so that the conductive ink does not adhere directly.

  Further, the above-described insulating mask 45a can be set like an insulating mask 45e shown in FIG. 8A, for example. The insulating mask 45e covers the circuit wiring 53 and the circuit wiring 55 adjacent to the circuit wiring 54, and the circuit forming slit 45f is set to extend left and right to expose the circuit wiring 54. For example, as shown in FIG. 8B, the conductive wiring is attached only to the defective portion 54a to form the repair circuit 46a on the insulating mask 45e, whereby the circuit wiring 54 can be repaired. This insulating mask 45e is particularly effective when there are a plurality of defective portions 54a in the circuit wiring 54. In other words, the repair circuit 46a may be formed only in a necessary portion with respect to the insulating mask 45e formed extending left and right. Therefore, it is not necessary to form the insulating mask 45e for each defective portion 54a, and the setting and formation of the insulating mask 45e are simplified. Further, by forming the insulating mask 45e, not only the partial repair of the circuit wiring as described above but also a new circuit wiring can be additionally formed.

  In the above-described embodiment, the printer apparatus 1 that can perform both color printing and circuit wiring printing by mounting the insulating printer head 45 and the conductive printer head 46 in addition to the printer head for color printing will be described. did. The present invention is not limited to this configuration, and for example, only the insulated printer head 45 and the conductive printer head 46 are mounted without mounting a printer head for color printing, and the configuration is specialized for circuit wiring printing. Is also possible.

  In the above-described embodiment, the case where the defective portion of the circuit wiring is repaired by using the printer device 1 according to the present invention has been described as an example. However, in addition to such a case, for example, the circuit wiring with a damaged surface is used. It is also possible to detect and repair by the imaging device 47.

  In the above-described embodiment, the circuit board 50 is fixed to the table 12 by suction, and the ink is ejected while the insulating printer head 45 and the conductive printer head 46 (carriage 44) are moved back and forth and left and right. Explained. The present invention is not limited to the printer apparatus of this embodiment. For example, the insulated printer head 45 and the conductive printer head 46 are fixed, and the circuit board 50 is moved back and forth and right and left with respect to them. The present invention can also be applied to a printer device.

  In the above-described embodiment, as the insulating ink, for example, UV curable ink, water-based latex ink, transparent or white Solbert ink, or color ink can be used. On the other hand, as the conductive ink, for example, a dispersed aqueous solvent ink of conductive particles such as nano copper or nano silver, or a heated conductive ink made of a solution such as a metal salt that is deposited and becomes conductive when heated. Can be used.

1 Printer device 12 Table (substrate support means)
43 Controller (Insulation head controller, conductive head controller)
45 Insulating printer head 45a Insulating pattern (insulating pattern for circuit formation)
46 conductive printer head 47 imaging device (defect position detection means)
50 Circuit board 54 Circuit wiring

Claims (6)

A printing method of a printer device that performs printing by ejecting ink while moving along the circuit board with the printer head facing the circuit board supported by the substrate support means,
The printer head includes an insulating printer head that discharges insulating ink having insulating properties, and a conductive printer head that discharges conductive ink having conductivity.
The insulating ink is solidified on the external region by discharging the insulating ink to an external region surrounding a predetermined circuit forming region on the surface of the circuit substrate with respect to the circuit substrate supported by the substrate supporting means, A first step of forming an insulating pattern for circuit formation that exposes and surrounds the circuit formation region on the surface side;
A second step of forming a circuit wiring by attaching a conductive ink to the circuit formation region in the circuit formation insulating pattern formed in the first step ;
The circuit formation region before the circuit wiring is formed by the second step includes a defective portion of the circuit wiring already formed on the circuit board,
In the second step, the circuit wiring is formed by adhering conductive ink to the circuit formation region to form the circuit wiring so as to compensate the defective portion and connect the circuit wiring .   In the first step, as the circuit forming insulating pattern, a circuit forming insulating pattern in which a slit-shaped circuit forming region having a width smaller than a droplet diameter of the conductive ink ejected from the conductive printer head is exposed. The printing method according to claim 1, wherein the printing method is formed.   The printing method according to claim 1, wherein the resolution of the insulating printer head is higher than the resolution of the conductive printer head.   The insulating ink ejected by the insulating printer head is UV curable ink,
  In the first step, after the insulating ink is ejected to the external region, the insulating ink is cured by irradiating with ultraviolet light immediately after the insulating ink is deposited on the external region or within a predetermined time during which bleeding is allowed. The printing method according to claim 1, wherein the insulating pattern for circuit formation is formed by solidifying insulating ink on the external region.   Board support means for supporting the circuit board;
  A printer device having a printer head that is movably provided along the circuit board in a state of being opposed to the circuit board supported by the board support means and that discharges ink toward the circuit board;
  The printer head is
  An insulating printer head that discharges insulating ink having insulating properties, and a conductive printer head that discharges conductive ink having conductivity.
  By controlling the movement of the insulating printer head and the ink discharge, the insulating ink is discharged to an external area surrounding a predetermined circuit forming area on the surface of the circuit board with respect to the circuit board supported by the board support means. An insulating head controller for solidifying the insulating ink on the external region to form an insulating pattern for circuit formation that exposes and surrounds the circuit forming region on the surface side;
  Conduction for forming circuit wiring by controlling movement of the conductive printer head and ink ejection to attach conductive ink to the circuit forming region in the circuit forming insulating pattern controlled and formed by the insulating head control unit. A head control unit,
  The insulating ink ejected by the insulating printer head is UV curable ink,
  The insulating head controller discharges the insulating ink to the external area, and then cures the insulating ink by irradiating the ultraviolet light immediately after the insulating ink is deposited on the external area or within a predetermined time during which bleeding is allowed. The insulating pattern for circuit formation is formed by solidifying the insulating ink on the external region.
  The conductive head control unit forms a circuit wiring by attaching a conductive ink to the circuit formation region, so that the circuit already formed on the circuit board before the circuit wiring is formed by the conductive head control unit. A printer apparatus characterized in that a circuit wiring is connected by compensating for a defective portion of the wiring.   6. The printer apparatus according to claim 5, wherein the resolution of the insulating printer head is higher than the resolution of the conductive printer head.

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