JP2004146604A - Method for correcting wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for correcting a wiring board in which a wiring material can be shot at a desired position without short-circuiting adjacent interconnect lines when a fine wiring pattern is corrected by ejecting the wiring material. <P>SOLUTION: The method for correcting a wiring board comprises a first ejection step (step S1) for ejecting a liquid drop having a first dot diameter smaller than the width and interval of interconnect lines toward a defective part of a wiring board, a step (step S2) for making a decision whether the shooting position of the liquid drop having a first dot diameter on the wiring board is shifted relatively from the defective part of the wiring board or not, and a second ejection step (step S4) for ejecting a liquid drop having a second dot diameter larger than the first dot diameter toward the defective part. If the relative position is shifted, a step (step S3) for measuring the shift of relative position and adjusting the position of an ink jet head based on the shift thus measured is carried out after the decision step. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wiring board repairing method for repairing a defect (breakage or the like) of a wiring pattern formed on a wiring board of an electronic circuit or an integrated circuit of an electronic device such as a liquid crystal, and more particularly, to a liquid wiring material using an ink jet head. To a wiring board correcting method for correcting a defective part of a wiring pattern by ejecting the same to a defective part.
[0002]
[Prior art]
As a method for forming a wiring pattern on a printed circuit board which is a circuit board for an electronic circuit of an electronic device such as a liquid crystal device or an integrated circuit, there are a photolithography method and an ink jet method.
[0003]
In the above photolithography method, after forming a metal thin film on the entire surface of a printed board by sputtering or vapor deposition, an unnecessary portion is etched by photolithography to form a wiring pattern composed of a necessary conductive film pattern. I have.
[0004]
On the other hand, in the ink jet method, a wiring material is directly applied to a printed board by an ink jet head to draw a wiring pattern.
[0005]
The ink-jet method has attracted attention because it eliminates the need for a mask required in the photolithography method, and can be operated in the air, so that it can flexibly cope with a change in circuit design on a printed circuit board.
[0006]
Further, with the recent development of ink jet heads (hereinafter, simply referred to as heads), heads capable of discharging finer droplets have been developed, and thus finer wiring patterns can be drawn.
[0007]
Further, with the development of the on-demand type head, more flexible drawing becomes possible, and therefore, application to local drawing such as a defective portion of a wiring is expected. For example, it has been considered to use an on-demand type head for a method of correcting a defect (such as disconnection) in a wiring pattern formed on a circuit board.
[0008]
For example, Japanese Patent Application Laid-Open No. 58-176995 (Patent Document 1) discloses that an electric circuit pattern is produced and corrected using an ink jet recording head.
[0009]
Here, an inspection process is performed after the wiring pattern manufacturing process, and a defective portion of the circuit is detected from the electrical characteristics of the circuit. Then, in a subsequent repairing step, a wiring material is applied to the defective portion to perform the repair.
[0010]
In Japanese Patent Application Laid-Open No. 61-270725 (Patent Document 2), as a method of correcting a pattern defect of a glass hard mask for a printed board, a printed board for a printed board is mounted on an XY moving table movable in the XY directions. A glass hard mask is placed, and a correction liquid containing a small amount of an anti-drying agent is used in a correction liquid containing an optical light shielding agent to locally correct a defect, and these are applied to correct a pattern defect portion. An apparatus is disclosed.
[0011]
Here, the detection of the pattern defect portion to be corrected is performed by the television camera and the television image monitor, and the operator operates the XY movement table while watching the television image monitor.
[0012]
Further, in Japanese Patent Application Laid-Open No. 3-27753 (Patent Document 3), in order to teach a printing position in an ink jet printer, a display light projection unit for emitting display light for displaying a position where ink is sprayed is provided. Provided.
[0013]
In Japanese Patent Application Laid-Open No. 8-292317 (Patent Document 4), in a color filter manufacturing apparatus using an ink jet apparatus, a relative position is detected from a relative displacement between a substrate and a drawing head, and a substrate of ink discharged from the drawing head is detected. There is disclosed a technique for detecting a landing position on the upper side and performing positioning between the substrate and the drawing head based on the detection result of the landing position and the detection result of the relative position.
[0014]
Also, in Japanese Patent Application Laid-Open No. 2000-162404 (Patent Document 5), an observation unit that observes and measures the landing position of a landed droplet, and discharges next time based on the landing position of the minute droplet measured by the observation member. There has been disclosed a technology for providing a corrector for correcting a landing position of a microdroplet, and discharging a liquid to an accurate position.
[0015]
[Patent Document 1]
JP-A-58-176995 (publication date: October 17, 1983)
[0016]
[Patent Document 2]
JP-A-61-270725 (publication date: December 1, 1986)
[0017]
[Patent Document 3]
Japanese Patent Application Laid-Open No. Hei 3-17753 (published February 28, 1991)
[0018]
[Patent Document 4]
JP-A-8-292317 (published November 5, 1996)
[0019]
[Patent Document 5]
JP-A-2002-162404 (publication date: June 7, 2002)
[0020]
[Problems to be solved by the invention]
In recent years, due to a demand for finer screen resolution, wiring patterned on a circuit board such as a glass substrate used for a liquid crystal panel or the like has been further miniaturized. For this reason, the wiring distance between adjacent wirings tends to be narrow.
[0021]
By the way, in a wiring pattern formed by a photolithography method, the probability of occurrence of a defect (a disconnection or the like) increases as the pattern becomes finer.
[0022]
In addition, the size of liquid crystal panels has been increasing, and as a result, the size of circuit boards has also increased. In this case, if all the circuit boards in which the wiring pattern has a defect in the wiring forming step are discarded, the yield decreases and the price of the liquid crystal panel increases. For this reason, even in a circuit board having a defect, by correcting the defective portion, the yield is improved, and the price increase of the liquid crystal panel is suppressed.
[0023]
In the conventional wiring correction method using the ink jet method, the ink landing accuracy is not sufficient, and when discharging to a fine wiring pattern, the ink may land between other wirings and short-circuit them. There is. For this reason, it is necessary to improve the landing position accuracy of the ink. However, when the ink droplets are miniaturized, the landing accuracy is affected not only by mechanical factors such as head mounting tolerance but also by the influence of the surrounding environment. Could not be improved.
[0024]
Here, the distribution of the landing positions will be described below with reference to FIG. FIG. 6 is a graph showing a distribution of landing positions of ink ejected from one nozzle of the inkjet head. The horizontal axis is the distance between the target position and the actual ink landing position, and the vertical axis is the number of ink landings when repeated ejection is performed.
[0025]
From the graph shown in FIG. 6, it can be seen that the distribution of the ink landing positions is distributed with a “variation” around the distance having the “displacement” with respect to the target position. The deviation and the variation are not always constant and differ depending on the head nozzle, the ink material, and the ejection position.
[0026]
One of the causes of the deviation is that the ink ejection direction is not perpendicular to the wiring substrate but is inclined. This inclination is caused by the nozzle accuracy, the shape of the nozzle tip, and the surface condition, and it is difficult to completely eliminate the inclination. Since the head or the recording medium has undulation, and the feed direction of the relative position moving mechanism between the head and the recording medium does not completely match the parallelism with the recording medium surface, the distance between the head and the recording medium is small. Is not always completely the same, and changes when the relative position between the head and the recording medium is changed. Due to the change in the distance between the head and the wiring board and the above-described inclination of the ejection direction, even when the same head is used, the magnitude of the deviation or variation varies depending on the ink ejection position.
[0027]
For example, as shown in FIG. 7, the nozzle 100a of the head 100 is moved directly above the target position a in order to land ink at the target position a of the wiring board 200, and the relative positioning between the substrate and the nozzle is adjusted there. Think about doing it. The distribution of the landing positions of the droplets spreads over a range of variation Ca around a position having a deviation of the distance Ka from the target position a. In order to reduce the error of the landing position, the head 1 or the wiring board 2 is moved by the distance Ka. At this time, the distribution of the landing positions is a distribution centered on the target position a. Consider a case where the head is moved and ink is landed on the target position b. Due to the undulation of the substrate and the like, the distribution of the landing positions near the target position b is different from the distribution near the target position a, and spreads over a range of variation Cb from the position immediately below the nozzle to a position separated by a distance Kb. For this reason, the center of the distribution is shifted by (Kb−Ka). As described above, even when the horizontal relative position between the target position and the nozzle position is adjusted when the head is at the specific position, the error distribution is different when the head is moved, so that accurate landing is achieved. Can't position.
[0028]
Further, as the droplet diameter becomes smaller, the landing accuracy tends to deteriorate due to the influence of air resistance and the like. For this reason, even though fine droplets can be ejected and the width of the wiring can be reduced, the distance between adjacent wirings is also reduced, so that it is necessary to improve the landing position accuracy of the ink.
[0029]
Although Patent Literature 1 describes a method of detecting a defective portion of a circuit, it does not describe a method of accurately matching a defective position with an ink landing position. For this reason, when applying a material to a defective portion in a repair process in a fine wiring pattern, the ink does not land accurately at the defective position, and as a result, not only the defective portion cannot be connected, Wiring may be short-circuited.
[0030]
Further, in Patent Document 2 described above, a television image monitor is provided to confirm the correction position, but the intersection of the television screen indicating the ink landing position indicates the target positions a and b shown in FIG. It does not indicate the actual landing position. For this reason, the ink does not accurately land on the defect position targeted for landing, and as a result, not only the defective portion cannot be connected, but also other wiring may be short-circuited.
[0031]
Further, in Patent Literature 3, the display light projection unit is provided on the head to display the landing position of the ink. However, the display light projection unit must be provided on the head, and the mechanism is complicated. The ink landing positions displayed by the display light projection unit indicate the target positions a and b shown in FIG. 7, but do not indicate the actual ink landing positions. For this reason, the ink does not accurately land on the defect position targeted for landing, and as a result, not only the defective portion cannot be connected, but also other wiring may be short-circuited.
[0032]
Further, in Japanese Patent Application Laid-Open No. H11-157, when an impact is performed for positioning, an extra pattern is drawn due to the impact. In order to avoid this extra landing, in the example of Patent Document 3, after landing on a dummy substrate and completing position adjustment, the substrate on which the color filter is drawn is fixed, and the color filter is patterned by inkjet. I have.
[0033]
For this reason, even if the drawing start position in the continuous drawing by the ink jet can be adjusted, the position adjustment in landing at a specific position, such as correction of a defective portion, cannot be performed. In addition, since the deviation and variation of the landing positions of the ink as described with reference to FIG. 7 are not taken into account, when a fine wiring pattern is corrected, the ink does not land accurately on the defect position, and as a result, the defective portion Not only cannot be connected, but also there is a possibility that other wiring may be short-circuited.
[0034]
In Patent Document 5, an observation unit that observes and measures the landing position of a landed droplet, and corrects the landing position of a microdroplet ejected next time based on the landing position of the microdroplet measured by the observation member And corrective means for discharging the liquid to an accurate position, but the observed landing droplet is a droplet of a normal size. Therefore, when correcting a fine wiring pattern, the observed droplet itself may cause a short circuit in another wiring due to a positional shift.
[0035]
As described above, according to the technology disclosed in each of the above patent documents, when the wiring pattern is miniaturized and the line width of the wiring is also miniaturized, a defect (such as disconnection) generated in the wiring is corrected. Cannot be accurately landed, and a short circuit occurs between adjacent wirings.
[0036]
The present invention has been made in view of the above problems, and an object of the present invention is to correct a fine wiring pattern by discharging a wiring material without short-circuiting adjacent wirings and to change a desired wiring material. It is an object of the present invention to provide a method of repairing a wiring board that can be landed at a position.
[0037]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a wiring board repairing method of the present invention is directed to a wiring board repairing method in which a droplet containing a repair material is ejected to the defective location by repairing a defective portion. A first discharging step of discharging a droplet having a first dot diameter smaller than the wiring interval toward a defective portion of the wiring substrate; and, in the first discharging step, a droplet having a first dot diameter being formed on the wiring substrate. A determining step of determining whether or not a relative position between the landing position on which the liquid droplet has landed and the defective portion of the wiring board is shifted; and forming a droplet having a second dot diameter larger than the first dot diameter. And a second ejection step for ejecting to a defective portion. When it is determined in the determination step that the relative position is shifted, the displacement amount of the relative position is measured after the determination step. Discharge the wiring board and droplets by the amount Performing an adjusting step of adjusting the landing position of the droplet by relative movement of the ejecting means, and adjusting the landing position of the droplet by the adjusting step, and discharging the droplet by the second discharging step. It is characterized by.
[0038]
According to the above configuration, when the relative position between the landing position where the droplet having the first dot diameter lands on the wiring board and the defective portion of the wiring board is different, the amount of displacement of the relative position is determined. After adjusting the landing position of the droplet by measuring and moving relative to the wiring substrate and the ejection means for ejecting the droplet by the measured deviation amount, the droplet having the second dot diameter, which is a droplet for correction, Is ejected to the defective portion, so that the defective portion can be surely corrected.
[0039]
Moreover, since the droplet having the first dot diameter ejected before the droplet having the second dot diameter has a dot diameter smaller than the wiring width and the wiring interval on the wiring board, the first dot diameter is smaller. A short circuit between adjacent wiring lines does not occur due to the landing of the droplet.
[0040]
Therefore, according to the above-described wiring board repair method, it is possible to land a wiring material at a desired position without short-circuiting adjacent wiring.
[0041]
Here, the determination as to whether or not the relative position is deviated is made, for example, by comparing the center of the landing position of the droplet ejected in the first ejection step with the center of the defective portion of the wiring pattern. It is conceivable that the determination is made by determining whether or not they are performed. At this time, when the centers are compared, it is not necessary to determine whether or not there is a perfect match. The size of the dot diameter of the droplet ejected in the first ejection step, the size of the defective portion of the wiring pattern, Considering the width, the wiring interval, and the like, the center of the landing position of the droplet ejected in the first ejection step coincides when the center of the defective portion of the wiring pattern is within a predetermined range. May be determined.
[0042]
Further, the magnitude of the deviation of the relative position may be determined based on the wiring width, the wiring interval, and the like.
[0043]
If it is determined in the determining step that the relative position is not deviated, droplets may be discharged in the second discharging step after the determining step.
[0044]
In this case, between the first discharge step and the second discharge step, there is no need to measure the above-described displacement amount and adjust the landing position of the droplet based on the displacement amount, so that the wiring pattern is corrected. Time can be reduced.
[0045]
The second dot diameter may be substantially the same as the wiring width.
[0046]
In this case, since the correction is performed using a droplet having a dot diameter substantially equal to the wiring width, the line width of the defective portion can be made the same as the wiring width, and the wiring is disconnected by forming the dot diameter only in the wiring pattern forming direction. Can be repaired. Therefore, in the repairing step of repairing a defective portion of the wiring substrate by discharging a droplet having the second dot diameter, the droplet discharging means or the holding means for holding the wiring substrate is moved in a direction perpendicular to the wiring pattern forming direction. You don't have to.
[0047]
In the first ejection step, a plurality of droplets having the first dot diameter may be ejected.
[0048]
In this case, the droplets landed on the wiring board form a group and form a landed droplet group, and the diameter of the landed droplet group is larger than the first dot diameter. Can be used to specify the landing position.
[0049]
Further, the wiring board repair method of the present invention, in order to solve the above problems, the correction of the defective portion of the wiring board, in the wiring board repair method for discharging a droplet containing a repair material to the defective location, A first discharging step of discharging a plurality of droplets having a first dot diameter smaller than the wiring width and the distance between adjacent wirings toward a defective portion of the wiring substrate; and a first discharging step in the first discharging step. A determining step of determining whether or not a relative position between a landing position where the droplet having the dot diameter lands on the wiring board and a defective portion of the wiring board is displaced; And a second ejection step of ejecting a plurality of spots to the location. If it is determined that the relative position is deviated in the determination step, the deviation amount of the relative position is measured after the determination step. Wiring board and droplets by the amount of displacement An adjusting step of adjusting the landing position of the droplet by relatively moving the discharging means for discharging is performed. After the landing position of the droplet is adjusted by the adjusting step, the discharging of the droplet by the second discharging step is performed. It is characterized by doing.
[0050]
According to the above configuration, in the first discharging step, the droplet having the first dot diameter discharged has a dot diameter smaller than the wiring width and the wiring interval. Does not cause a short circuit between adjacent wirings.
[0051]
In addition, when there is a deviation between a landing position where the droplet having the first dot diameter lands on the wiring substrate and a defective portion of the wiring substrate, the above-mentioned deviation amount is measured, and the wiring is measured by the measured deviation amount. After adjusting the landing position of the droplet by relatively moving the substrate and the discharging means for discharging the droplet, a plurality of droplets having the first dot diameter are discharged to the defective portion, so The defect can be corrected.
[0052]
In this case, since it is not necessary to change the dot diameter of the droplet to be discharged in the first discharge step and the second discharge step, an inkjet head that can discharge only the dot diameter of a single-sized droplet is used. be able to. Further, in the case of a driving method in which the change in the dot diameter of the droplet is controlled by controlling the number of electric signal pulses applied to the ink jet head, the driving circuit and the like can be simplified since this is not necessary.
[0053]
When it is determined in the determination step that the relative position is not shifted, the droplet may be discharged in the second discharge step.
[0054]
In this case, between the first ejection step and the second ejection step, the above-described deviation amount is measured, and an adjustment step of adjusting the landing position of the droplet based on the deviation amount is not required. The correction time can be reduced.
[0055]
Further, in the adjusting step, the deviation amount may be calculated as a single landing position by statistical analysis based on the landing positions of the plurality of droplets discharged in the first discharging step.
[0056]
In this case, since the positions of the landing droplet groups formed by the landing of the plurality of droplets discharged in the first discharging step are performed by statistical analysis, the landing positions of the droplets are accurately predicted in consideration of variation. be able to.
[0057]
Therefore, it is possible to correct the wiring pattern more accurately.
[0058]
BEST MODE FOR CARRYING OUT THE INVENTION
[Embodiment 1]
An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a flowchart showing the flow of processing of the wiring board repair method, FIG. 2 is a schematic configuration diagram of a wiring board repair apparatus for realizing the wiring board repair method shown in FIG. 1, and FIG. FIG. 7 is a conceptual diagram showing a specific example of correction according to FIG.
[0059]
As shown in FIG. 2, the wiring board repairing apparatus according to the present embodiment fixes an XY stage (holding means) 3 which fixes a wiring board 2 having a defective wiring pattern and is movable in the XY directions. An inkjet head 1 for ejecting ink 7 as droplets, a CCD camera 4 for observing the surface of the wiring board 2, a monitor 6 for displaying an image from the CCD camera 4, and an inkjet head (ejection means) 1. And an ink jet control device 5 for controlling the diameter, ejection speed, and the like of the droplet to be ejected.
[0060]
The CCD camera 4 is installed such that the landing position of the ink 7 discharged from the inkjet head 1 on the wiring board 2 is substantially at the center of the screen of the monitor 6.
[0061]
The inkjet head 1 and the CCD camera 4 are fixedly supported by a support member 9. The support member 9 is attached to a support frame 8 provided on a mounting table 10 that supports the XY stage 3 so as to be movable in the XY directions.
[0062]
In the present embodiment, a disconnection of a wiring pattern is assumed as a defect in the wiring board 2. That is, the disconnection of the wiring pattern of the wiring board 2 is displayed on the display screen 6a of the monitor 6.
[0063]
Here, the wiring board 2 has a wiring pattern formed by a wiring step (not shown), for example, a photolithography step, or an ink jet apparatus. As a result of the inspection of the wiring pattern, it is determined that the pattern has a defect. It was done.
[0064]
In the case where the wiring pattern is formed by ink jet, the wiring pattern may be formed by using a wiring board repair apparatus shown in FIG. The inspection method may be any of visual observation, observation using a microscope, electric observation using current / impedance, and observation using image recognition.
[0065]
In the wiring board repairing apparatus having the above configuration, the wiring board 2 in which the existence of the defect is confirmed is fixed to the XY stage 3 of the wiring board repairing apparatus. Then, the XY stage 3 is moved so that a defective portion of the wiring board 2 is detected, and the defective portion is located almost directly below the ejection port of the inkjet head 1. At this time, the defective part enters the field of view of the CCD camera 4, and the defective part and its periphery are displayed on the display screen 6 a of the monitor 6.
[0066]
Since the CCD camera 4 is installed so that the ink landing position is located at the center of the monitor screen, the XY stage 3 is moved while looking at the display screen 6a of the monitor 6, and the defective portion is positioned at the center of the monitor screen. Move.
[0067]
At this time, for example, a defective portion (dotted line portion) 21 of the wiring pattern 20 is displayed on the display screen 6a of the monitor 6 as shown in FIG.
[0068]
Hereinafter, a method of correcting the defective portion 21 of the wiring pattern 20 of the wiring board 2 will be described below with reference to the flowchart shown in FIG.
[0069]
First, preliminary ejection of droplets is performed as a first ejection step (step S1). That is, the ink jet head 1 is pulse-driven by the ink jet control device 5 to eject one droplet. This is called pre-ejection. This pre-discharge is intended to discharge at the position of the defective portion 21 of the wiring pattern 20, and is not intended to discharge to a location which does not contribute to repair of the defective portion 21.
[0070]
When the preliminary ejection is performed as described above, the droplets that have landed on the wiring substrate spread, and small points 22 are formed. The droplet size is adjusted so that the dot diameter d of the small point 22 is smaller than the line interval W of the wiring pattern 20, and ejection is performed. This control is performed by the inkjet control device 5 described above. When the wiring width is smaller than the wiring interval W, the droplet is adjusted so that the diameter of the small point 22 is smaller than the wiring width.
[0071]
That is, in the first ejection, the ink is ejected with a dot diameter d smaller than the actually required dot diameter D. Therefore, even if the ink landing position is shifted from a desired position, it reaches the adjacent wiring pattern 20. It is not formed by For this reason, even when the small point 22 deviates from the defective portion 21, there is no possibility that it will cause a short circuit between the wirings.
[0072]
Next, as a determination step, it is determined whether or not there is a relative displacement (step S2). Here, the relative position between the landing position where the small point 22 which is the droplet having the first dot diameter lands on the wiring board in step S1 which is the first ejection step, and the defective portion 21 which is the repaired part of the wiring board. It is determined whether or not the position is shifted. At this time, it is determined whether or not the relative position shift of the droplet is determined by determining whether or not the droplet has landed at the center position of the defective portion 21. That is, if the pre-discharged droplet has not landed at the center position of the defective portion 21, it is determined that the relative position is shifted (there is a relative position shift), and the droplet is landed at the center position of the defective portion 21. For example, it is determined that the relative position is not shifted (there is no relative position shift).
[0073]
Here, it is determined whether or not the relative position is shifted, for example, by determining the center of the landing position of the droplet (small point 22) ejected in the first ejection step and the defect portion 21 of the wiring pattern 20. It is conceivable that the determination is made by comparing with the center to determine whether or not they match. At this time, when comparing the centers, it is not necessary to determine whether or not there is a perfect match. The size of the dot diameter of the droplet ejected in the first ejection step, the size of the defective portion 21 of the wiring pattern 20 When the center of the landing position of the droplet ejected in the first ejection step falls within a predetermined range from the center of the defective portion 21 of the wiring pattern 20 in consideration of the wiring width, the wiring interval, and the like. It may be determined that they match.
[0074]
Further, the magnitude of the deviation of the relative position may be determined based on the wiring width, the wiring interval, and the like.
[0075]
If it is determined in step S2 that there is no relative displacement, the process proceeds to step S4 shown in FIG. 1, and the second ejection process, that is, ejection of the droplet to the defective portion is performed. That is, immediately after the preliminary ejection, the droplet for correcting the defective portion is ejected.
[0076]
On the other hand, if it is determined in step S2 that there is a relative displacement, a process for adjusting the displacement of the landing position of the droplet, that is, the following step S3 shown in FIG. A certain step S4 is executed.
[0077]
That is, the position of the inkjet head 1 is adjusted as an adjustment step (step S3). Here, the displacement amount of the relative position is measured, and the landing position of the droplet is adjusted by relatively moving the wiring substrate and the droplet discharge means (inkjet head 1) by the displacement amount.
[0078]
That is, the position of the landed ink is observed by the CCD4 camera. Then, the relative position shift amount between the center of the small point 22 and the center of the defective portion 21 is measured from the display screen 6a of the monitor 6. Here, the shift amount is measured visually by the operator. The measurement of the relative displacement amount means the measurement of the landing position displacement amount of the droplet.
[0079]
For example, in the case where the main discharge is performed as it is after the preliminary discharge, despite the deviation of the landing position of the droplet, the correction portion is formed in the circular region 23b indicated by the dashed line. The term “main discharge” as used herein means discharge of droplets performed at a dot diameter D substantially equal to the line width. With such a dot diameter, in the case of the wiring pattern 20 shown in FIG. 3, at least in the direction perpendicular to the wiring pattern 20 (vertical direction in the drawing), repair is performed by one ejection, so The working time can be reduced as compared with the case where the diameter d is used.
[0080]
However, as described above, when the main ejection is performed as it is despite the deviation of the landing position of the droplet after the preliminary ejection, the correction unit (circular region 23b) straddles the adjacent wiring pattern 20. Since it is formed, a short circuit occurs between the wirings. In order to avoid this, the wiring substrate and the inkjet head 1 are relatively moved by the following relative positional deviation amount to adjust the landing position of the droplet.
[0081]
For example, the position of the inkjet head 1 is adjusted by moving the XY stage 3 in the X direction and then in the Y direction instead of moving the inkjet head 1. That is, after the XY stage 3 is moved by the relative positional deviation obtained in the measurement step, the landing position of the droplet ejected by the inkjet head 1 is made to exactly match the defective portion 21. Here, the operator drives the XY stage 3 so that the small point 22 comes to the center of the display screen 6a of the monitor 6.
[0082]
Finally, a droplet is discharged to the defective portion 21 as a second discharging step (step S4). In other words, the inkjet head 1 is driven, ink as a conductive material is applied to the defective portion 21, the connecting portion 23 is formed, and the wiring is connected. The droplet size at this time is controlled to a normal size by the inkjet control device 5. Therefore, the dot diameter D, which is the ink landing diameter, has a width sufficient to connect the wiring.
[0083]
In this manner, by performing the preliminary ejection of the ink (first ejection step), the relative displacement between the ejection port of the inkjet head 1 and the defective portion 21 is quantitatively observed, and the ejection position of the droplet is accurately determined. Can be adjusted.
[0084]
Since this preliminary ejection is controlled by the inkjet control device 5, no special device such as an optical system is required. Further, even when the ink jet head 1 is replaced, it is not necessary to adjust the landing position and the laser irradiation position each time, and it is not necessary to make the landing position coincide with the intersection of the monitor 6. Further, even if the thickness of the wiring board 2 fixed to the XY stage 3 is different, the correction liquid (correction ink) can be applied with high accuracy.
[0085]
The control of the landing droplet size does not depend on the voltage applied to the head, but may be, for example, a method of changing the pulse width and the driving frequency. Further, the ink may be heated by irradiating the nozzle tip portion with a laser to change the surface tension and viscosity of the ink.
[0086]
In addition, instead of controlling the droplet size, the main discharge is performed with the same droplet diameter as that of the pre-discharge, and the landing diameter reaches a size sufficient for wiring connection by controlling the number of droplet discharges. You may do so.
[0087]
[Embodiment 2]
Another embodiment of the present invention will be described below with reference to FIGS. The wiring board repairing apparatus described in the present embodiment is the same as the wiring board repairing apparatus described in the first embodiment, and a description thereof will be omitted.
[0088]
FIG. 4 shows the vicinity of the defective portion of the wiring board 2 displayed on the display screen 6a of the monitor 6 shown in the first embodiment.
[0089]
First, preliminary ejection of droplets is performed as a first ejection step shown in FIG. 1 (step S1). Here, different from the first embodiment, a plurality of inks 24a are ejected as a preliminary ejection to form the landing droplet group 24. In this case, the ink diameter is selected or controlled so as to be sufficiently smaller than the width of the wiring pattern 20 or the wiring interval. As a result, there is no possibility that adjacent arrangement patterns may be short-circuited due to ejection of a plurality of bullets.
[0090]
Next, as a determination step, it is determined whether or not there is a relative displacement (step S2). Here, the landing position of the landing droplet group 24 formed by arranging a plurality of small dots 22 which are droplets of the first dot diameter on the wiring substrate in step S1 which is the first ejection process, and the wiring substrate Then, it is determined whether or not the relative position with respect to the defective portion 21 which is the correction portion is shifted. At this time, it is determined whether or not the relative position shift of the droplet is determined by determining whether or not the droplet has landed at the center position of the defective portion 21. That is, if the landed droplet group 24 ejected in advance has not landed at the center position of the defective portion 21, it is determined that the relative position shift has occurred (there is a relative position shift), and If it has landed, it is determined that the relative position has not shifted (no relative position shift).
[0091]
Therefore, if it is determined in step S2 that there is no relative displacement, the process proceeds to step S4 shown in FIG. 1, and the second ejection process, that is, ejection of the droplet to the defective portion is performed. That is, immediately after the preliminary ejection, the droplet for correcting the defective portion is ejected.
[0092]
On the other hand, if it is determined in step S2 that there is a relative displacement, a process for adjusting the displacement of the landing position of the droplet, that is, the following step S3 shown in FIG. A certain step S4 is executed.
[0093]
That is, the position of the inkjet head 1 is adjusted as an adjustment step (step S3). Here, the relative position deviation amount is measured, and the landing position of the droplet is adjusted by relatively moving the wiring substrate and the droplet discharge means (inkjet head 1) by the deviation amount.
[0094]
Here, the distribution of the landing droplet group 24 on the wiring board 2 is measured, and the center thereof is obtained. Here, the center is the top position of the distribution of FIG. 6 described above. Then, the relative position shift between the center position of the landed droplet group 24 and the center position of the defective portion 21 of the wiring pattern 20 is measured, and the shift amount is obtained.
[0095]
Then, the wiring board and the inkjet head 1 are relatively moved by an amount corresponding to the deviation of the relative position, and the position of the inkjet head 1 is adjusted. Here, similarly to the first embodiment, the position of the inkjet head 1 is not moved by moving the XY stage 3 in the X direction and then in the Y direction instead of moving the inkjet head 1. Adjustments are made. That is, after the XY stage 3 is moved by the relative positional deviation obtained in the second step, the landing positions of the droplets discharged by the inkjet head 1 are made to exactly match the defective portions 21. At this time, the operator may confirm the display screen 6a of the monitor 6 and finely adjust the alignment between the inkjet head 1 and the defective portion 21.
[0096]
Finally, a droplet is discharged to the defective portion 21 as a second discharging step (step S4). Here, as in the first embodiment, the ink droplets are increased by the inkjet control device 5 so that the ink droplets have a dot diameter equal to or slightly larger than the line width of the wiring pattern. Land at 21. Thereby, the connection part 23 is formed, and the defective part 21 is connected.
[0097]
The movement amount (adjustment amount) of the XY stage 3 when the position adjustment of the inkjet head 1 is performed in the above-described adjustment step includes a characteristic of each inkjet head 1 and a deviation of the landing accuracy depending on the head position. Therefore, the landing accuracy in the second ejection step is improved, and the defective portion 21 of the wiring pattern can be connected without short-circuiting the adjacent wiring.
[0098]
As described above, when the ink is ejected with an ink diameter sufficiently small (for example, submicron to several microns) with respect to the width of the wiring pattern 20 or the wiring interval, the ink composed of the CCD camera 4 and the monitor 6 is used. Depending on the performance of the landing position detection device, the landing position may not be recognized in some cases. More specifically, as the ink diameter is reduced, the resolution of the ink landing position detecting device is required to be improved. On the other hand, since the entire image of the wiring substrate 2 needs to be captured, the variable range of the magnification is large. Is required.
[0099]
Therefore, there is a problem that the ink landing position detecting device becomes complicated, large, and expensive.
[0100]
Further, in order to determine fine ink, it is required that the density of the ink, particularly the contrast with respect to the wiring substrate 2 be large. However, it is generally required to change the characteristics of the ink or the substrate used as the wiring material according to the requirement. Have difficulty.
[0101]
In order to solve such a problem, according to the method of forming the landing droplet group 24 using a plurality of droplets as preliminary ejection as in the present embodiment, ink having a small dot diameter of about submicron to several microns is used. Is ejected to form ink bullets on the wiring board 2, thereby eliminating the need for an ink landing position detecting device having a large detection resolution, and improving the ink density or contrasting the ink with the wiring board 2. There is no need to improve.
[0102]
[Embodiment 3]
The following will describe still another embodiment of the present invention with reference to FIG. The wiring board repairing apparatus described in the present embodiment is the same as the wiring board repairing apparatus described in the first embodiment, and a description thereof will be omitted.
[0103]
In the present embodiment, a wiring board repairing apparatus having the same configuration as the wiring board repairing apparatus described in the first embodiment is used. The diameter is smaller than that used in the first embodiment, is the same as the landing diameter of the preliminary ejection, and a plurality of ejections are performed to form one line width. Therefore, even when the preliminary ejection is performed, it is not necessary for the control by the inkjet control device 5 to particularly specify the size of the droplet diameter.
[0104]
FIG. 5 shows the vicinity of the defective portion of the wiring board 2 displayed on the display screen 6a of the monitor 6 shown in the third embodiment. It should be noted that the defect repairing process of the wiring board 2 in the present embodiment is substantially the same as that described in the second embodiment, so that the details are omitted.
[0105]
However, in the case of the main ejection in the fourth step, unlike the second embodiment, a plurality of micro-sized droplets are landed in the same manner as in the pre-ejection, so that the correction unit 25 is formed. I have.
[0106]
As described above, in each of the above embodiments, the layer to be corrected in the wiring substrate 2 is not limited to the wiring pattern, and may be an electrode such as a gate electrode or a source electrode in a TFT structure.
[0107]
Further, the material of the ink material may be changed and the target of the layer to be modified may be a semiconductor layer or an insulating layer. In particular, in the case of a semiconductor layer, its characteristics greatly change depending on the position. Therefore, when a defective portion is corrected using the head positioning method of the present invention, effects such as improvement in yield can be obtained.
[0108]
A step of irradiating a laser to a point generated on the wiring board by pre-discharge and heating the point may be provided.
[0109]
The wiring board repair method of the present invention may have the following configuration.
[0110]
That is, the wiring board repair method of the present invention is a method of repairing a wiring board using an inkjet head capable of discharging at least a plurality of drops (droplets) having different dot diameters. A first ejection step of ejecting a drop to the correction portion of the wiring board, a landing position detection step of detecting a difference between the correction portion of the wiring board and the impact position of the drop, and a deviation is recognized as a result of the detection. In the case where there is no drop, a second ejection step of ejecting a drop to a correction portion with a second dot diameter larger than the first dot diameter is provided.
[0111]
Therefore, even if the drop ejected in the first ejection step does not land at a desired position, a short circuit to an adjacent wiring does not occur. Further, when the drop ejected in the first ejection step lands at a desired position, ejection is continued with a dot diameter larger than the first dot diameter. Can be reduced, and the working process time can be shortened.
[0112]
If the correction position of the wiring board is different from the landing position of the drop, the correction is performed by controlling one of the position of the inkjet head and the position of the stage holding the substrate. Further, the magnitude of the deviation is determined based on the width of the wiring pattern, the wiring interval, and the like.
[0113]
Further, the first dot diameter is characterized by a dot diameter smaller than the width of the wiring pattern or an adjacent wiring pattern.
[0114]
According to the above configuration, since the first dot diameter is smaller than the width of the wiring pattern or the distance between adjacent wiring patterns, a short circuit to an adjacent wiring can be reliably prevented. For example, the first dot diameter is set to a size that is a fraction of the width of the wiring pattern or the interval between adjacent wiring patterns.
[0115]
Further, the second dot diameter is substantially equal to the width of the wiring pattern. According to this, since the correction is performed with substantially the same dot diameter as the wiring pattern, the line width of the corrected portion can be made the same as the width of the wiring pattern, and the wiring is formed by forming the dot diameter only in the wiring pattern forming direction. The disconnection can be repaired. Therefore, in the repairing step, it is not necessary to move the inkjet head or the stage holding the wiring substrate in a direction perpendicular to the wiring pattern forming direction.
[0116]
The first ejection step is characterized by ejecting a plurality of drops having a first dot diameter. According to this, the dots formed on the wiring board form a group, and the diameter of the dot group can be made larger than the first dot diameter. The impact position can be specified.
[0117]
The wiring board repair method of the present invention is a method of repairing a wiring board using an inkjet head capable of discharging a drop having a dot diameter smaller than the width of the wiring pattern or an adjacent wiring pattern, wherein the wiring board is repaired. A first ejection step of ejecting a plurality of drops at the correction location, a landing position detection step of detecting a difference between the correction location of the wiring board and a landing location of the drop group, and a result of the above-described detection. Is characterized by having a second ejection step of ejecting a plurality of drops at the correction location.
[0118]
According to this, the above-described effects can be obtained, and it is not necessary to change the size of the dot diameter. Therefore, it is possible to use an inkjet head that can discharge only a single-sized dot diameter. In the case of a driving method in which the change in the dot diameter is controlled by controlling the number of electric signal pulses applied to the ink jet head, the driving circuit and the like can be simplified since this is not necessary.
[0119]
In the landing position detecting step, a single landing position is calculated by statistical analysis based on the landing positions of a plurality of drops.
[0120]
According to this, since the position of the drop group formed by the landing of the plurality of drops is performed by the statistical analysis, the landing position can be accurately predicted in consideration of the variation.
[0121]
A head positioning method for an ink jet head according to the present invention includes a recording medium, an ink jet head, an ink jet head drive control device, a moving mechanism capable of changing a relative position between a recording medium mounting portion and the ink jet head, and recording. In a step of applying an ink material to a recording medium with an apparatus equipped with an observation unit for observing the surface of a desired position of the medium, the inkjet head is moved to a desired position, and the ink is applied to the recording medium as preliminary ejection. A first step of landing, a second step of measuring a relative displacement between the pre-ejection landing position and a desired landing position by using the observation means, the recording medium and the inkjet head A third step of adjusting the relative position of the ink with the moving mechanism, and applying ink to a desired position for the main ejection. It is characterized in that it comprises a fourth step of.
[0122]
For this reason, by performing preliminary ejection in the first step, the relative positional deviation amount between the landing target position and the actual landing position is quantitatively observed, and the ejection position can be accurately adjusted. , Accurate landing can be performed.
[0123]
Further, the droplet diameter of the pre-discharge is smaller than the droplet diameter of the main discharge.
For this reason, landing by pre-ejection for landing position adjustment does not affect the original printing, and accurate landing position adjustment can be performed.
[0124]
In addition, the number of ejections of the droplets of the pre-ejection in the first step is plural, and by performing the statistical analysis in the second step with respect to the landing position of the ink landed in the first step, It is characterized in that the adjustment amount by the moving mechanism in the third step is determined. For this reason, it is possible to avoid a landing error due to the preliminary ejection.
[0125]
Further, the ink droplet diameter or the number of times of ink ejection is controlled so that the diameter and the range of impact on the medium by the preliminary ejection are smaller than the original recording resolution on the recording medium.
[0126]
For this reason, landing by pre-ejection for landing position adjustment does not affect the original printing, and accurate landing position adjustment can be performed.
[0127]
Further, in the step of repairing the circuit board by applying a repair fluid containing a repair material to the circuit board having a defect to be repaired, a first step of landing a droplet of the repair fluid on the circuit board A second step of detecting a relative position between the landing position landed in the first step and the position of the defective portion, and a predetermined movement amount calculated from the relative position detected in the second step And a fourth step of adjusting a relative position between the ink jet head and the circuit board and a fourth step of applying a correction liquid droplet to a defective portion.
[0128]
For this reason, by performing preliminary ejection in the first step, the relative positional deviation amount between the landing target position and the actual landing position is quantitatively observed, and the ejection position can be accurately adjusted. , Accurate landing can be performed.
[0129]
In the above modification of the circuit board, the size of the droplet landed in the first step is smaller than the size of the droplet applied in the fourth step.
[0130]
For this reason, landing by pre-discharge for landing position adjustment does not affect the original wiring patterning, and accurate landing position adjustment can be performed by main discharge.
[0131]
In addition, in the correction of the circuit board, the number of ejections of the droplets of the pre-ejection in the first step is plural, and the landing position of the ink landed in the first step is statistically analyzed in the second step. , The amount of adjustment by the moving mechanism in the third step is determined.
[0132]
For this reason, by performing preliminary ejection in the first step, the relative positional deviation amount between the landing target position and the actual landing position is quantitatively observed, and the ejection position can be accurately adjusted. , Accurate landing can be performed. Further, the diameter of the ink droplet or the number of times of ink ejection is controlled within a range in which the landed diameter on the circuit board landed in the first step is smaller than the wiring pattern interval width.
[0133]
For this reason, by performing preliminary discharge in the first step, the relative positional deviation between the head discharge port and the defective portion is quantitatively observed, and the discharge position can be accurately adjusted. In this case, an unnecessary short circuit can be avoided and an accurate connection can be made.
[0134]
【The invention's effect】
As described above, in the wiring board repair method of the present invention, in the wiring board repair method for performing the repair of the defective portion of the wiring board by discharging the droplet containing the repair material to the defective portion, the wiring width and the wiring interval are used. A first discharging step of discharging a droplet having a small first dot diameter toward a defective portion of the wiring substrate, and the droplet having the first dot diameter lands on the wiring substrate in the first discharging step. A determining step of determining whether a relative position between the landing position and a defective portion of the wiring board is shifted; and discharging a droplet having a second dot diameter larger than the first dot diameter to the defective portion. If it is determined in the determination step that the relative position is shifted, after the determination step, the shift amount of the relative position is measured, and the wiring amount is determined by the shift amount. The substrate and the discharging means for discharging droplets Run the adjustment step of adjusting the landing position of the moved thereby in droplet after landing positions of liquid droplets is adjusted by the adjusting step is configured to perform the ejection of droplets by the second discharge step.
[0135]
Therefore, when the relative position between the landing position where the droplet having the first dot diameter has landed on the wiring substrate and the defective portion of the wiring substrate is displaced, the deviation amount of the relative position is measured. After adjusting the landing position of the droplet by relative movement with the wiring substrate and the ejection means for ejecting the droplet by the amount of the deviation, the droplet having the second dot diameter, which is a droplet for correction, is applied to the defective portion. Since the ink is ejected, the defective portion can be surely corrected.
[0136]
Moreover, since the droplet having the first dot diameter ejected before the droplet having the second dot diameter has a dot diameter smaller than the wiring width and the wiring interval on the wiring board, the first dot diameter is smaller. A short circuit between adjacent wiring lines does not occur due to the landing of the droplet.
[0137]
Therefore, according to the above-described wiring board repair method, there is an effect that the wiring material can be landed at a desired position without short-circuiting the adjacent wiring.
[0138]
If it is determined in the determining step that the relative position is not deviated, droplets may be discharged in the second discharging step after the determining step.
[0139]
In this case, between the first discharge step and the second discharge step, there is no need to measure the above-described displacement amount and adjust the landing position of the droplet based on the displacement amount, so that the wiring pattern is corrected. There is an effect that time can be reduced.
[0140]
The second dot diameter may be substantially the same as the wiring width.
[0141]
In this case, since the correction is performed using a droplet having a dot diameter substantially equal to the wiring width, the line width of the defective portion can be made the same as the wiring width, and the wiring is disconnected by forming the dot diameter only in the wiring pattern forming direction. Can be repaired. Therefore, in the repairing step of repairing a defective portion of the wiring substrate by discharging a droplet having the second dot diameter, the droplet discharging means or the holding means for holding the wiring substrate is moved in a direction perpendicular to the wiring pattern forming direction. Since it is not necessary to reduce the size of the device for realizing the method of repairing the wiring board, it is possible to reduce the size of the device.
[0142]
In the first ejection step, a plurality of droplets having the first dot diameter may be ejected.
[0143]
In this case, the droplets landed on the wiring substrate form a group and form a landed droplet group, and the diameter of the landed droplet group is larger than the first dot diameter. There is an effect that the landing position can be specified even by using.
[0144]
Further, as described above, the wiring board repair method of the present invention corrects a defective portion of the wiring board by ejecting a droplet containing a repair material to the defective portion. A first discharging step of discharging a plurality of droplets having a first dot diameter smaller than the wiring interval toward the defective portion of the wiring substrate, and a liquid having a first dot diameter in the first discharging step. A determining step of determining whether a relative position between a landing position where the droplet lands on the wiring board and a defective portion of the wiring substrate is shifted, and applying the droplet having the first dot diameter to the defective portion. And a second ejection step of performing a plurality of ejections. If it is determined in the determination step that the relative position is deviated, after the determination step, the deviation amount of the relative position is measured, and the deviation amount is determined by the deviation amount. , Discharge to discharge the wiring board and droplets An adjustment step of adjusting the landing position of the droplet by relatively moving the step is performed, and after the landing position of the droplet is adjusted by the adjusting step, the droplet is discharged by the second discharging step. is there.
[0145]
Therefore, in the first discharging step, the droplet having the first dot diameter discharged has a dot diameter smaller than the wiring width and the wiring interval. No short circuit occurs between them.
[0146]
In addition, when there is a deviation between a landing position where the droplet having the first dot diameter lands on the wiring substrate and a defective portion of the wiring substrate, the above-mentioned deviation amount is measured, and the wiring is measured by the measured deviation amount. After adjusting the landing position of the droplet by relatively moving the substrate and the discharging means for discharging the droplet, a plurality of droplets having the first dot diameter are discharged to the defective portion, so The defect can be corrected.
[0147]
In this case, since it is not necessary to change the dot diameter of the droplet to be discharged in the first discharge step and the second discharge step, an inkjet head that can discharge only the dot diameter of a single-sized droplet is used. be able to. In the case of a driving method in which the change in the dot diameter of the droplet is controlled by controlling the number of electric signal pulses applied to the ink jet head, there is no need for such a driving method, so that the driving circuit and the like can be simplified. Play.
[0148]
When it is determined in the determination step that the relative position is not shifted, the droplet may be discharged in the second discharge step.
[0149]
In this case, between the first ejection step and the second ejection step, the above-described deviation amount is measured, and an adjustment step of adjusting the landing position of the droplet based on the deviation amount is not required. There is an effect that the correction time can be reduced.
[0150]
Further, in the adjusting step, the deviation amount may be calculated as a single landing position by statistical analysis based on the landing positions of the plurality of droplets discharged in the first discharging step.
[0151]
In this case, since the positions of the landing droplet groups formed by the landing of the plurality of droplets discharged in the first discharging step are performed by statistical analysis, the landing positions of the droplets are accurately predicted in consideration of variation. Therefore, there is an effect that the wiring pattern can be corrected more accurately.
[Brief description of the drawings]
FIG. 1 is a flowchart showing a processing flow of a wiring board repair method of the present invention.
FIG. 2 is a schematic configuration diagram of a wiring board repairing apparatus that realizes the wiring board repairing method shown in FIG.
3 is a diagram showing an example of correcting a wiring pattern displayed on a monitor provided in the wiring board correcting device shown in FIG. 2;
FIG. 4 is a diagram showing another example of correction of a wiring pattern displayed on a monitor provided in the wiring board correction device shown in FIG. 2;
5 is a diagram showing still another example of correcting a wiring pattern displayed on a monitor provided in the wiring board correcting apparatus shown in FIG. 2;
FIG. 6 is a graph showing an example of distribution of ink landing positions.
FIG. 7 is a diagram showing a deviation of ink landing positions and a change in variation when a relative position between an ink jet head and a wiring substrate changes.
[Explanation of symbols]
1 inkjet head (ejection means)
2 Wiring board
3 XY stage (holding means)
4 CCD camera
5 Inkjet controller
6 Monitor
6a Display screen
7 Ink (droplets)
8 Support frame
9 Supporting members
10 Mounting table
20 Wiring pattern
21 Defects (defects)
22 small dots (droplets)
23 Connection
23b circle area

Claims (7)

The correction of the defective portion of the wiring board, in the wiring board repair method of discharging a droplet containing a repair material to the defective location,
A first discharging step of discharging a droplet having a first dot diameter smaller than the wiring width and the wiring interval toward a defective portion of the wiring substrate;
A determining step of determining whether a relative position between a landing position where a droplet having a first dot diameter has landed on the wiring board in the first discharging step and a defective portion of the wiring board is shifted;
Discharging a droplet having a second dot diameter larger than the first dot diameter to the defective portion,
When it is determined that the relative position is shifted in the determining step, after the determining step, the amount of shift of the relative position is measured, and the discharging means for discharging the wiring board and the droplet by the amount of the shift is measured. And performing an adjustment step of adjusting the landing position of the droplet by relatively moving
A method of repairing a wiring board, comprising: after adjusting a landing position of a droplet in the adjusting step, discharging the droplet in the second discharging step. 2. The method according to claim 1, wherein if it is determined in the determining step that the relative position is not shifted, droplets are discharged in the second discharging step after the determining step. . 3. The method according to claim 1, wherein the second dot diameter is substantially equal to a wiring width. 4. The method according to claim 3, wherein the first discharging step includes discharging a plurality of droplets having a first dot diameter. The correction of the defective portion of the wiring board, in the wiring board repair method of discharging a droplet containing a repair material to the defective location,
A first discharging step of discharging a plurality of droplets having a first dot diameter smaller than the wiring width and the distance between adjacent wirings toward a defective portion of the wiring substrate;
A determining step of determining whether a relative position between a landing position where a droplet having a first dot diameter has landed on the wiring board in the first discharging step and a defective portion of the wiring board is shifted;
A second ejection step of ejecting a plurality of droplets of the first dot diameter to a defective portion,
When it is determined that the relative position is shifted in the determining step, after the determining step, the amount of shift of the relative position is measured, and the discharging means for discharging the wiring board and the droplet by the amount of the shift is measured. And performing an adjustment step of adjusting the landing position of the droplet by relatively moving
A method of repairing a wiring board, comprising: after adjusting a landing position of a droplet in the adjusting step, discharging the droplet in the second discharging step. 6. The method according to claim 5, wherein, if it is determined in the determining step that the relative position is not shifted, the droplet is discharged in the second discharging step after the determining step. 7. The method according to claim 5, wherein in the adjusting step, the deviation amount is calculated as a single landing position by statistical analysis based on the landing positions of the plurality of droplets discharged in the first discharging step. 3. The method for repairing a wiring board according to item 1.

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