JP2004358353A - Liquid drop discharge device, liquid drop discharge method, thin film forming method and electro-otical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid drop discharge device capable of preparing a desired film and wiring by providing a first nozzle for forming the film and the wiring and a second nozzle for discharging liquid drops for correcting defects of the discharge by the first nozzle, and further by discharging the liquid drops for correction by the second nozzle in accordance with detection of the above defects by a detecting part, a liquid drop discharge method, a thin film forming method and an electro-optical device. <P>SOLUTION: The liquid drop discharge device is provided with a feed mechanism for transferring a medium, the first nozzle for discharging the liquid drops to the medium fed by the feed mechanism, the detecting part detecting the defects on the medium when the discharge of the liquid drops becomes defective, and the second nozzle discharging the liquid drops to a discharge defective part when the discharge defective part is detected by the detecting part. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a droplet discharge device that discharges droplets using an inkjet method to draw on a medium, a discharge method and a thin film forming method using the droplet discharge device, and an electro-optical device formed by the droplet discharge device. Related to the device.
[0002]
[Prior art]
2. Description of the Related Art In recent years, a droplet discharge device (hereinafter, referred to as an “inkjet device”) using an inkjet method (a droplet discharge method) includes an inkjet head having a plurality of nozzles and a feeding mechanism of a medium to be discharged. For example, when used in the manufacturing process of a thin film device, a droplet containing a material for forming a conductive film or the like or an ink for a light emitting layer is discharged from a nozzle while a medium to be discharged is fed by a feed mechanism. Then, a desired film or wiring is formed.
[0003]
[Problems to be solved by the invention]
However, there are cases where some nozzles are clogged and the droplets cannot be ejected due to an increase in the viscosity of the droplets or the incorporation of bubbles, and when the nozzles are clogged, the desired film or wiring is not obtained. In this case, dots may be missing, which may cause unevenness or disconnection.
In the above-described ink jet device, there is a problem that the unevenness or disconnection cannot be repaired because the nozzle only discharges to a necessary portion for forming the film or the wiring.
[0004]
The present invention has been made in view of such a problem,
A first nozzle for forming the film or the wiring, a second nozzle for performing discharge for correcting a defective portion of the discharge by the first nozzle, and a detecting portion for detecting the defective portion. It is an object of the present invention to form a desired film or wiring by detecting the above-mentioned condition and performing ejection for correction by the second nozzle.
[0005]
[Means for Solving the Problems]
In order to solve such a problem, a droplet discharge device according to the present invention includes a medium, a first nozzle that moves relative to the medium and discharges droplets toward the medium, A detection unit that detects a defective application position; and a second nozzle that discharges a droplet to the defective application position when the detection unit detects the defective application position.
According to this configuration, based on the result detected by the detection unit, the desired nozzle or film is discharged by using a correction nozzle toward the coating failure portion, thereby forming the desired film or wiring. be able to.
[0006]
According to another aspect of the present invention, there is provided a liquid ejecting apparatus configured to detect a medium, a first nozzle that moves relative to the medium and ejects a droplet toward the medium, and detects an application failure portion on the medium. A liquid ejecting apparatus having a detecting unit for detecting a defective application and a second nozzle for ejecting a droplet to the defective application when the detecting unit detects the defective application. A member, and the first nozzle and the second nozzle are provided on the moving member.
In this way, it is possible to perform the ejection for drawing the film or the wiring pattern and the ejection for correction in close proximity, and it is possible to reduce the distance that the nozzle moves for correction. Due to the above shortening, it is possible to prevent the displacement due to the movement error, that is, it is possible to enhance the position accuracy of the ejection for correction. Furthermore, since the first nozzle and the second nozzle are provided in the same moving mechanism, a moving mechanism for correction is not required, and an inexpensive and simple device can be provided.
[0007]
Further, the detection unit may detect the application failure portion before starting the droplet discharge by the first nozzle or after ending the droplet discharge.
This makes it possible to accurately detect the defective coating portion with high accuracy.
[0008]
Further, the first nozzle discharges the droplets so that a drawing row is formed on the medium, and when the application failure portion is detected, the second nozzle emits the application failure. The ejection of the liquid to the location may be performed before rendering a rendering row subsequent to the rendering row in which the defective application location is detected.
This makes it possible to shorten the time from the ejection of the droplet in which the coating failure has occurred to the ejection of the droplet for correction, and to enhance the adhesion of the coating solution for correction.
[0009]
Further, the droplet is a coating liquid in which a film material is dissolved or dispersed in a solvent,
The coating liquid may be discharged to form a thin film.
According to this configuration, based on the result detected by the detection unit, the desired thin film can be formed by performing a discharge for correction toward the defective application portion using a correction nozzle and performing the discharge for correction. it can.
[0010]
Further, the droplet discharging method according to the present invention includes a step of discharging droplets on a medium,
A step of detecting whether or not there is a defect in the droplet discharge; and performing a droplet discharge for correcting the defect based on the detection result.
[0011]
Further, the thin film forming method according to the present invention is a step of forming a thin film by discharging a film material by the first nozzle,
A step of detecting whether or not there is a defect in the thin film by the detection unit;
In the detecting step, when a defect of the thin film is detected, a step of moving the second nozzle to a position corresponding to the defective portion of the thin film based on the detection result,
Correcting the defect of the thin film by discharging the film material by the second nozzle.
[0012]
Further, the first nozzle discharges the droplets so that a drawing row is formed on the medium, and discharges a film material by the second nozzle when the defective application portion is detected. Is performed at the same time as the first nozzle draws a drawing row subsequent to the drawing row in which the thin film loss is detected.
This makes it possible to shorten the time from the ejection of the droplet in which the thin film has been lost to the ejection of the droplet for correction, thereby improving the adhesion of the coating solution for correction.
[0013]
Further, it is also possible to provide an electro-optical device characterized by being formed by the droplet discharge device according to the present invention.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments according to the present invention will be described with reference to the drawings.
=== Overall configuration example of device ===
FIG. 1 is a schematic diagram showing a main configuration of a droplet discharge device and a thin film forming device of the present embodiment.
In the present description, a thin film forming apparatus 50 for discharging a coating liquid to form a circuit pattern (metal wiring) on an appropriate substrate P will be described as an embodiment of a droplet discharging apparatus.
As shown in FIG. 1, a thin film forming apparatus 50 includes a movable carriage 1 as a moving member, a carriage drive motor 2 for moving the carriage 1, and a substrate feed for feeding a substrate P as an example of a medium. A motor 3, a drive shaft 4 driven by the carriage drive motor 2 to move the carriage 1, a drive shaft 5 driven by the substrate feed motor 3 to feed the substrate P, and a control unit for controlling the thin film forming apparatus. A control circuit 6, a mounting table 7 for the substrate P moving via the substrate feed motor 3 and the drive shaft 5, a nozzle cleaning unit 8 for removing dirt and the like of the nozzles, and a liquid fixed to the mounting table 7. The base 9 is provided with detectors 10a and 10b for detecting a droplet ejection failure, a heater 15 for drying the application liquid ejected onto the substrate P, and the like.
[0015]
=== Configuration example around the carriage ===
Next, the configuration around the carriage will be described. FIG. 2 is a schematic view showing the periphery of the carriage of the thin film forming apparatus.
As shown in FIG. 2, the carriage 1 is provided with an ejection head 12 configured by a nozzle group including a plurality of ejection nozzles for ejecting the application liquid. The carriage 1 moves on the mounting table 7 in the sub-scanning direction via the drive shaft 5 while moving in the main scanning direction via the drive shaft 4, ie, while the provided ejection head 12 moves. The application liquid is discharged toward.
[0016]
=== Configuration Example of Discharge Head ===
The configuration of the ejection head will be described with reference to FIGS. FIG. 3 is an explanatory diagram showing an example of the arrangement of the nozzles on the lower surface of the ejection head 12, and FIG. 4 is an explanatory diagram showing an application example of the arrangement of the nozzles on the lower surface of the ejection head 12.
As shown in FIG. 3, the ejection head 12 includes a first nozzle group 20 as a first nozzle and a second nozzle group 21 as a second nozzle.
The first nozzle group 20 is composed of a nozzle row 20a and a nozzle row 20c arranged in a straight line along the sub-scanning direction, and a nozzle row 20b arranged at a predetermined interval in the main scanning direction from each nozzle row. Is done.
Further, the respective nozzle rows constituting the first nozzle group 20 include a discharge nozzle 24 at a rear end in the sub-scanning direction in the nozzle row 20a, a discharge nozzle 25 at a front end in the sub-scanning direction in the nozzle row 21b, and a nozzle row 20b. The ejection nozzle 26 at the rear end in the sub-scanning direction and the ejection nozzle 27 at the front end in the sub-scanning direction in the nozzle row 20c are arranged at an interval equal to the nozzle pitch x.
The first nozzle group 20 discharges a coating liquid in which a film material is dispersed toward a substrate (not shown) to draw and form a thin circuit pattern (hereinafter referred to as a “drawing nozzle”). ").
Further, the second nozzle group 21 is constituted by a nozzle row 21a located behind the nozzle row 20c constituting the first nozzle group 20 in the sub-scanning direction, and facilitates position control when correcting a defective ejection portion. In order to achieve the above, the discharge nozzle 23 at the rear end in the sub-scanning direction in the last nozzle row 20c constituting the first nozzle group 20 and the discharge nozzle 22 at the front end in the sub-scanning direction in the nozzle row 21a have a nozzle pitch x. Are arranged with an interval X that is an integral multiple of.
The second nozzle group 21 is a nozzle (hereinafter, referred to as a “correction nozzle”) for correcting a defective portion on the substrate P caused by the droplet discharge by the first nozzle group 20.
[0017]
Further, a nozzle row forming the first nozzle group 20 and a nozzle row forming the second nozzle group 21 in which the discharge nozzles 22 are arranged along the sub-scanning direction at intervals X that are integral multiples of the nozzle pitch x. As shown in an explanatory view showing the arrangement of nozzles on the lower surface of the ejection head 12 in FIG. 4 in place of the nozzle row 21a, the nozzle row 21a constituting the second nozzle group 21 is arranged in any direction including the main scanning direction shown The arrangement of the ejection nozzles 22 arranged in a vertical direction may have the same effect, and the nozzle pitch may be changed depending on the arrangement angle.
[0018]
In the above-described embodiment, the first nozzle group 20 has been described as including three nozzle rows, and the second nozzle group 21 has been described as including one nozzle row. However, the present invention is not limited to this. Absent. As long as each of the first nozzle group 20 and the second nozzle group 21 is constituted by one or more nozzle rows, the same effect is obtained.
[0019]
Further, the number of nozzle rows constituting the first nozzle group 20 and the number of nozzle rows constituting the second nozzle group 21 are set to the same number, and the rearmost ejection nozzle of the first nozzle group 20 and the second nozzle group 21 If the interval with the most advanced ejection nozzle is set to the nozzle pitch x, it is possible to perform the drawing of the correction in the previous row while drawing the next row, and it is not necessary to perform the drawing of the correction again. Shortening can be achieved.
[0020]
=== Configuration example of detection unit and detection method example ===
An example of a configuration example and a detection method of the detection unit will be described with reference to FIGS. 5 and 6. FIG. 5 is a schematic diagram illustrating a configuration of the detection unit 10a, and FIG. 6 is an explanatory diagram illustrating a sensor output (output signal) of the detection unit 10a.
According to FIG. 5, the detection unit 10a detects droplets ejected from a plurality of ejection nozzles 22 constituting nozzle rows 20a and 20b (two nozzle rows are shown in this drawing) provided in the ejection head 12. And a processing device (not shown) for performing analysis based on an output signal from the detection mechanism 30. As the detection mechanism 30, a transmission-type laser sensor, which is an example of a sensor including a light emitting unit 30a and a light receiving unit 30b, can be suitably used. However, it is not limited to this.
The detection unit 10a has a moving mechanism (not shown) in the sub-scanning direction, and is movable in the sub-scanning direction.
[0021]
An embodiment of a method for detecting a defective nozzle will be described.
In the detection unit 10a, while continuously ejecting droplets from the plurality of ejection nozzles 22, as shown in FIG. 5, the ejection head 12 is placed between the light emitting unit 30a and the light receiving unit 30b that are being irradiated with the laser. When the detection unit 10a is moved so that the ejected droplets intersect, the laser detects the droplets, outputs a signal, and transmits the signal to the processing device. For example, assuming that the ejection head 12 is provided with 100 ejection nozzles, if all the nozzles know normal operation, as shown in FIG. A corresponding 100 pulse sensor output (output signal) is detected.
Here, for example, when the # 99 discharge nozzle is clogged or the like and is a defective nozzle, as shown in FIG. 6B, the sensor output is the 99th output corresponding to the # 99 discharge nozzle. The level remains undetected for the coating liquid and does not reach the level for detecting the coating liquid. The processing device detects this sensor output and detects a defective nozzle.
[0022]
Note that the detection unit 10a may be provided with an image processing device that reads a liquid ejection result. This makes it possible to determine in advance from the image whether or not an ejection failure has occurred in the ejection nozzle before specifying the location of the ejection nozzle where the ejection failure has occurred.
[0023]
In the above description, the detection of a defective nozzle is described as being performed by moving the detection unit 10a, but the present invention is not limited to this. For example, the same detection can be performed by moving the mounting table of the substrate P and performing the detection operation.
[0024]
In the above description, the detection unit 10a has been described. However, even in a configuration in which a plurality of detection units are provided, the detection unit 10a has the same configuration and function as the detection unit 10a.
[0025]
By using the thin film forming apparatus of this configuration,
A defective portion of the ejection by the first nozzle for forming the film or the wiring is detected by the detecting portion, and based on a result detected by the detecting portion, the defective portion is directed to a defective portion of the ejection by the first nozzle. Then, by performing ejection for correction by the second nozzle, it is possible to form a desired film or wiring.
[0026]
=== Circuit board configuration and manufacturing method example ===
Next, as an embodiment according to the present invention, a configuration and a manufacturing method of a circuit board formed by forming a circuit pattern (metal wiring) on an appropriate board P will be described with reference to FIGS. This will be described with reference to FIG. FIG. 8 is a diagram showing a circuit board having a square spiral circuit pattern as an example of the circuit pattern.
The coating liquid used in the production of this circuit pattern is a liquid that can be discharged from the nozzles by the discharge head 12, and is sufficient for electric wiring by drying and heating and baking a thin film of the coating liquid formed on the substrate P. As long as a circuit conductor having conductivity that can be used can be obtained, preferably, a fine metal powder dispersion in which fine metal particles such as gold and silver are uniformly and stably dispersed in an organic solvent is used. You.
Further, as a base material of the substrate P, any material can be used as long as it can withstand a firing temperature required for forming a circuit conductor by applying a thin film made of the coating liquid at a desired position and firing it. Although it is not limited to the size and the like, preferably, various substrates such as a glass substrate, a metal substrate such as a silicon wafer having at least a part of the surface subjected to insulation treatment, and a heat-resistant synthetic resin substrate such as a polyimide resin are used. be able to.
[0027]
Here, a method for forming a circuit pattern composed of circuit conductors on the substrate P using the coating liquid and the droplet discharge device shown in FIGS. 1 and 2 will be described by way of an example.
According to FIG. 8, the discharge head positioned at the droplet discharge start position 12a in the drawing area of the first row (the area where the discharge head performs discharge while moving in the main scanning direction from the discharge start position to the discharge end position). Numeral 12 moves in the main scanning direction while discharging a coating liquid from a nozzle (not shown) corresponding to a line L1 parallel to the main scanning direction. When reaching the line L2 perpendicular to the main scanning direction, the nozzle moves to the discharge end position 12b while discharging the coating liquid from the nozzles corresponding to L1 and L2, and draws a circuit pattern by moving the first row of the discharge head 12. . Subsequently, the discharge nozzle 12 moves in the sub-scanning direction (actually, the substrate moves by moving the mounting table 7 of the substrate P), and moves from the discharge start position 12c of the drawing area of the second row in the same manner as the first row. The droplets are ejected while discharging. In the subsequent drawing area, drawing is similarly performed, and drawing of a square spiral circuit pattern as shown in the figure is completed.
[0028]
After forming a circuit pattern using a coating liquid on the substrate P, the substrate P is dried, and further baked at a temperature equal to or higher than the temperature at which the metal fine particles contained in the coating liquid are sintered on the substrate P. The fine particles are bonded to the substrate and to each other to form a circuit pattern made of a conductor having sufficient conductivity.
After the firing, the substrate P on which the circuit pattern is formed is cut as necessary, and electronic components such as ICs and LSIs can be mounted.
[0029]
=== Example procedure of thin film formation method ===
Next, a method for forming a thin film according to an embodiment of the present invention will be described with reference to FIGS. FIG. 7 is a flowchart for explaining the thin film forming method.
First, the user instructs a control unit (not shown) to perform drawing in the thin film forming apparatus (step S102).
Next, the control unit drives the substrate feed motor 3 to move the substrate P to the leading position of the drawing (step S104).
Subsequently, the controller drives the carriage drive motor 2 to move the carriage 1 in the main scanning direction and to a position facing the detection unit 10a.
Subsequent movement of the substrate P in the sub-scanning direction is performed by driving the substrate feed motor 3, and movement of the carriage 1 in the scanning direction is performed by driving the carriage drive motor 2 to cause the detection unit 10 to move in the sub-scanning direction. Are moved by driving a moving mechanism (not shown).
[0030]
Next, although not shown in FIG. 1, the discharge head 12 performs flushing for continuously discharging the coating liquid from the discharge nozzles to adjust the discharge state, and at the same time, moves the detection unit 10 a in the sub-scanning direction. The above-described ejection failure nozzle is detected (step S106).
If the ejection failure nozzle is not detected in the determination in step S106 (step S108), the process proceeds to the next step S120. If a defective ejection nozzle is detected by the determination in step S106 (step S108), the process proceeds to step S110, where the carriage 1 is moved to a position facing the nozzle cleaning unit 8, and the ejection nozzle Is performed, and the process proceeds to the next step S120.
In step S120, the carriage 1 starts moving in the main scanning direction from the position on the left end side of the substrate P by driving the carriage drive motor 2, and moves the ejection head (not shown) provided on the carriage 1 toward the substrate P. To start the discharge of the coating liquid in which the film material is dispersed. That is, drawing of a circuit pattern as an example of a thin film pattern is started. Further, the carriage 1 discharges the coating liquid while moving to form a circuit pattern, and ends the drawing of the first drawing line by setting the position passing the right end of the substrate P as the discharge end position (step S122). ).
Note that the circuit pattern formed in the drawing row is configured by a pattern including a line shape by continuous ejection, a pattern intermittently arranged in an island shape, and the like.
[0031]
Next, the carriage 1 moves to a position facing the detection unit 10b, and the ejection head 12 performs flushing for continuously ejecting the application liquid from an ejection nozzle (not shown in FIG. 1) to adjust the ejection state. At the same time, the detection unit 10b moves in the sub-scanning direction and detects the above-described ejection failure nozzle (step S124).
If the determination in step S124 (step S126) shows that a defective ejection nozzle is not detected, the process proceeds to the next step S144.
[0032]
A procedure when a discharge failure nozzle is detected by the determination in step S124 (step S126) will be described below.
First, when a discharge failure nozzle is detected in the determination in step S126, the position of the detected discharge failure nozzle is stored in the control circuit (step S130). Storing the position of the ejection failure nozzle is the same as storing the application failure position on the medium. In this description, it is assumed that the ejection nozzle 28 shown in FIG. 3 is a defective ejection nozzle that is clogged and cannot perform normal ejection. When the ejection nozzle 28 causes ejection failure, a state where the position of the ejection nozzle 28 is missing, that is, a so-called dot missing state occurs.
[0033]
Next, the carriage 1 moves to a position facing the nozzle cleaning unit 8, and the nozzle cleaning unit 8 cleans all the ejection nozzles (step S132).
Next, the correction nozzle row 21a (the ejection nozzle 22 is opposed to the ejection nozzle 22 in the present example) is stored in the ejection nozzle 12 provided in the carriage 1 in step S130. The substrate P is moved to a position opposite to the position of the discharge nozzle 28 causing the discharge failure (actually, the substrate P is moved by driving the substrate feed motor 3). Next, while moving the carriage 1 from the right end to the left end of the substrate P in a direction opposite to the moving direction of the carriage 1 in steps S120 and S122, the discharge nozzles 22 of the correction nozzle row 21a are moved. Then, the coating liquid for correction is discharged toward the defective portion of the circuit pattern, the defective portion of the circuit pattern is corrected, and the discharge for correction is completed by passing through the left end of the substrate P (step S136). Subsequently, the procedure proceeds to step S144.
[0034]
Next, in step S144, the control circuit makes a determination as to whether or not the ejection has been completed. If it is determined that the ejection has been completed, the control terminates the ejection and stops the apparatus (step S148). If it is determined that the ejection has not been completed, the next step is to drive the substrate feed motor 3 to move the substrate P by a predetermined amount (step S146) to prepare for the ejection of the application liquid to the next drawing row.
[0035]
Subsequent procedures are performed by repeating the flow from step S106 to step S148.
[0036]
In addition, in the above-described determination in step S126, when it is determined that there is no ejection failure nozzle, the drawing of the second row is performed in a direction opposite to the moving direction of the carriage when drawing the front row (here, the first row). That is, drawing is performed while moving the carriage 1 in a direction toward the left end of the substrate P with the right end side of the substrate P as a discharge start position. Thereafter, if there is no ejection failure nozzle in the front row, so-called bidirectional drawing, in which the carriage 1 moves while moving in the opposite direction to the front row, is performed.
In the bidirectional drawing, by providing ejection failure nozzle detection units on the left end side and the right end side of the substrate P, detection can be performed immediately at the end of one line of drawing, thereby improving the drawing speed. Can be.
[0037]
Also, in one-direction drawing in which drawing is performed only in a fixed carriage movement direction,
Since the discharge start position is always on the same side of the substrate P, the detection unit may be provided on either the left end side or the right end side of the substrate P. This simplifies the configuration of the apparatus and can reduce costs.
In addition, in the above-described one-way drawing, by providing the detection unit on the end side of the one-line drawing, it is possible to correct the movement time for returning the carriage. As a result, the time required for the repair process can be further reduced.
[0038]
Further, the first nozzle and the coating liquid discharged by the second nozzle may use a different coating liquid for each of the nozzles, for example, changing the concentration of the film material dispersed in the solvent. Alternatively, the solvent can be changed or the film material can be changed.
As a result, it is possible to prevent a drawback that may occur due to a difference in the surface state of the already drawn pattern, for example, that the application liquid ejected for correction is not formed, and that the predicted drawing is performed. It becomes possible to select and correct the coating liquid according to the pattern failure state.
Further, it is possible to correct not only a defect in a dot unit but also a plurality of continuous dots, that is, a linear defect.
[0039]
Further, in the above-described embodiment, an example is described in which the carriage that moves in the main scanning direction as the moving member and the mounting table on which the substrate as an example of the medium moves in the sub-scanning direction are used. That is, a carriage that moves in the sub-scanning direction and a mounting table that moves in the main scanning direction may be used. Further, one of the carriage and the substrate may be fixed, and the other may move in both the main scanning direction and the sub-scanning direction.
[0040]
In addition, the defective application location may mean a defective landing position of a droplet, a defective bleeding of a landed droplet, or an insufficient landing amount of a droplet.
[0041]
According to the above-described embodiment, correction of a defective pattern of a circuit pattern, which is an example of drawing formed by discharging a coating liquid from the first nozzle, can be performed in a normal drawing process. Therefore, it is not necessary to use a dedicated correction device or the like, and it is possible to reduce or eliminate the manufacturing cost of the device or the like, or to reduce the defect of the circuit pattern.
Furthermore, since the correction can be performed immediately after the occurrence of the ejection failure, it is possible to prevent a change in the application liquid of the circuit pattern due to the drawing, for example, a change such as drying of the drawing pattern. By applying the correction coating liquid in the same state as the above coating liquid, the adhesion between both coating liquids can be improved.
[0042]
=== Other Embodiments ===
The droplet discharge device of the present embodiment can discharge liquids having various functions, and can be used for manufacturing various electro-optical devices (devices). The invention is applied not only to the formation of the metal wiring on the circuit board described above, but also to the manufacture of color filters used in liquid crystal display devices, organic EL devices, PDP devices, and color liquid crystal display devices, as well as lens formation and resist formation devices. be able to. Therefore, as an example of another application example, a method for manufacturing a liquid crystal display device and a method for manufacturing an organic EL device using the droplet discharge device will be described with reference to FIGS. 9 and 10, and other devices will be simply described. Will be described.
[0043]
FIG. 9 is a cross-sectional view of the liquid crystal display device. As shown in the figure, the liquid crystal display device 100 is configured by combining a color filter 110 and a counter substrate 126 between upper and lower polarizing plates 122 and 127 and sealing a liquid crystal 125 between the two. Further, alignment films 121 and 124 are formed between the color filter 110 and the counter substrate 126, and a TFT (thin film transistor) element (not shown) and a pixel electrode 123 are formed in a matrix on the inner surface of the counter substrate 126. Is formed.
[0044]
The color filter 110 includes pixels (filter elements) arranged in a matrix, and boundaries between pixels are separated by banks 112. Any one of red (R), green (G), and blue (B) filter materials (functional liquid) is introduced into each of the pixels. That is, the color filter 110 includes a light-transmitting substrate 111 and a light-shielding bank 112. The portion where the bank 112 is not formed constitutes the pixel, and the filter material of each color introduced into the pixel constitutes the colored layer 113. An overcoat layer 114 and an electrode layer 115 are formed on the upper surfaces of the bank 112 and the coloring layer 113.
[0045]
In the droplet discharge device of the present embodiment, the R, G, and B functional liquids are selectively discharged into the pixels formed by the banks 112 by the discharge head 12 for each of the colored layer forming regions. are doing. Then, by drying the applied functional liquid, the colored layer 113 to be a film forming unit is obtained. In the droplet discharge device, various film formation units such as the overcoat layer 114 are formed by the discharge head 12.
[0046]
Similarly, an organic EL device and a method of manufacturing the same will be described with reference to FIG. FIG. 10 is a sectional view of the organic EL device. As shown in the figure, in the organic EL device 200, a circuit element portion 202 is laminated on a glass substrate 201, and an organic EL element 204 mainly constituting the circuit element portion 202 is laminated on the circuit element portion 202. A sealing substrate 205 is formed above the organic EL element 204 with a space for an inert gas.
[0047]
In the organic EL element 204, a bank 212 is formed by an inorganic bank layer 212a and an organic bank layer 212b overlaid thereon, and the banks 212 define pixels in a matrix. In each pixel, a pixel electrode 211, a light-emitting layer 210b of any of R, G, and B and a hole injection / transport layer 210a are stacked from below, and a plurality of thin films of Ca, Al, or the like are entirely formed. Are covered with a counter electrode 203 laminated over the entire surface.
[0048]
Then, in the droplet discharge device of the present embodiment, a film forming section of each of the R, G, and B light emitting layers 210b and the hole injection / transport layers 210a is formed. In the droplet discharge device, after forming the hole injection / transport layer 210a, the counter electrode 203 is formed by using a liquid metal material such as Ca or Al as a functional liquid to be introduced into the discharge head 12. I have.
[0049]
In the method of manufacturing a PDP device, fluorescent materials of R, G, and B colors are introduced into the plurality of discharge heads 12, and the fluorescent materials are selectively discharged to form fluorescent materials in a large number of concave portions on the substrate. I do.
[0050]
In the method of forming a lens, a lens material is introduced into a plurality of ejection heads 12, and the lens material is selectively ejected to form a large number of microlenses on a transparent substrate. For example, the present invention is applicable to the case of manufacturing a device for beam convergence.
[0051]
In the method of manufacturing a lens, a translucent coating material is introduced into the plurality of ejection heads 12, and the coating material is selectively ejected to form a coating film on the surface of the lens.
[0052]
In the resist forming method, a resist material is introduced into a plurality of discharge heads 12, and the resist material is selectively discharged to form a photoresist of an arbitrary shape on a substrate. For example, the present invention can be widely applied not only to the formation of banks in the above-described various display devices but also to the application of a photoresist in a photolithography method which is a main body of semiconductor manufacturing technology.
[0053]
【The invention's effect】
As described above, according to the droplet discharging apparatus, the thin film forming apparatus, the droplet discharging method, the thin film forming method, and the electro-optical device of the present invention,
The desired film or wiring can be formed by performing a discharge for correction toward the defective discharge portion using a correction nozzle based on a result detected by the detection unit.
[0054]
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing a main configuration of a droplet discharge device and a thin film forming device of the present embodiment.
FIG. 2 is a schematic view showing a periphery of a carriage of the thin film forming apparatus.
FIG. 3 is an explanatory view showing an arrangement as an embodiment of nozzles on a lower surface of a discharge head 12;
FIG. 4 is an explanatory diagram showing an arrangement as an application example of an arrangement of nozzles on a lower surface of a discharge head 12.
FIG. 5 is a schematic diagram illustrating a configuration of a detection unit 10a.
FIG. 6 is an explanatory diagram illustrating a sensor output (output signal) of a detection unit 10a.
FIG. 7 is a flowchart for explaining a thin film forming method.
FIG. 8 is a diagram showing a circuit board having a square spiral circuit pattern as an example of a circuit pattern.
FIG. 9 is a sectional view of a liquid crystal display device.
FIG. 10 is a sectional view of an organic EL device.
[Explanation of symbols]
1 carriage
2 Carriage drive motor
3 Board feed motor
4 Carriage feed drive shaft
5 Substrate feed drive shaft
6 control circuit
7 Board mounting table
8 Nozzle cleaning unit
9 base
10a, 10b detector
12 Discharge head
15 heater
20 First nozzle (drawing nozzle)
21 Second nozzle (correction nozzle)
30 Detection mechanism
30a light emitting unit
30b light receiving section
P substrate
50 Thin film forming equipment
100 liquid crystal display
200 Organic EL device

Claims (9)

Medium,
A first nozzle that relatively moves with respect to the medium and ejects droplets toward the medium,
A detection unit that detects an application failure portion on the medium,
A second nozzle configured to discharge a droplet to the defective application location when the detection unit detects the defective application location. The droplet discharging device according to claim 1,
A moving member that moves relatively to the medium,
The droplet discharge device, wherein the first nozzle and the second nozzle are provided on the moving member. The droplet discharging device according to claim 1,
The detection unit may detect the defective application portion either before starting the droplet discharge by the first nozzle or after ending the droplet discharge. apparatus. The droplet discharging device according to claim 1,
The first nozzle ejects the droplets so that a drawing row is formed on the medium, and when the application failure portion is detected,
The liquid, wherein the second nozzle discharges the liquid to the defective application location before the first nozzle draws a rendering row subsequent to the rendering row in which the poor coating location is detected. Drop ejection device. The droplet discharging device according to claim 1,
The droplet is a coating liquid in which a film material is dissolved or dispersed in a solvent,
A droplet discharging apparatus, wherein the coating liquid is discharged to form a thin film. Discharging droplets onto the medium;
Detecting whether there is a defect in the droplet discharge,
Performing a droplet discharge for correcting the defect based on the detection result;
A droplet discharging method comprising: A thin film forming method using the droplet discharge device according to claim 5,
Discharging the film material by the first nozzle to form a thin film;
A step of detecting whether or not there is a defect in the thin film by the detection unit;
In the detecting step, when a defect of the thin film is detected, a step of moving the second nozzle to a position corresponding to the defect of the thin film based on the detection result,
By the second nozzle, a step of correcting the defect of the thin film by discharging a film material,
A method of forming a thin film, comprising: The method for forming a thin film according to claim 7, wherein
The first nozzle discharges the droplets so that a drawing row is formed on the medium, and discharges a film material by the second nozzle when the application failure portion is detected. Correcting the defect of the thin film by:
A method for forming a thin film, wherein a drawing line subsequent to a drawing line in which a defect of the thin film is detected is performed simultaneously with drawing by the first nozzle. An electro-optical device formed by the droplet discharge device according to claim 1.

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