JP4882502B2 - Sheet printing system - Google Patents

Sheet printing system Download PDF

Info

Publication number
JP4882502B2
JP4882502B2 JP2006134666A JP2006134666A JP4882502B2 JP 4882502 B2 JP4882502 B2 JP 4882502B2 JP 2006134666 A JP2006134666 A JP 2006134666A JP 2006134666 A JP2006134666 A JP 2006134666A JP 4882502 B2 JP4882502 B2 JP 4882502B2
Authority
JP
Japan
Prior art keywords
sheet
solder paste
substrate
printing
squeegee
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006134666A
Other languages
Japanese (ja)
Other versions
JP2007305888A (en
JP2007305888A5 (en
Inventor
伸一郎 川辺
範昭 向井
章雄 五十嵐
正文 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Priority to JP2006134666A priority Critical patent/JP4882502B2/en
Publication of JP2007305888A publication Critical patent/JP2007305888A/en
Publication of JP2007305888A5 publication Critical patent/JP2007305888A5/ja
Application granted granted Critical
Publication of JP4882502B2 publication Critical patent/JP4882502B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

本発明は基板面上にはんだバンプを形成する印刷装置に係り、特に、マスクとしてシート状部材を用いて印刷する印刷システムに関する。   The present invention relates to a printing apparatus for forming solder bumps on a substrate surface, and more particularly to a printing system for printing using a sheet-like member as a mask.

従来、特許文献１にマスクに代えて、シート状部材にパターンを形成して、そのシート状部材に半田ペーストを充填し、そのシートを基板面に位置合わせして載置して、その後リフローした後にシートを取り除くことで基板面上に所望のパターンのハンダバンプを形成することが開示されている。   Conventionally, instead of a mask in Patent Document 1, a pattern is formed on a sheet-like member, the sheet-like member is filled with a solder paste, the sheet is aligned with the substrate surface, and then reflowed. It is disclosed that a solder bump having a desired pattern is formed on a substrate surface by removing the sheet later.

特開平９−１１６２５７号公報JP-A-9-116257

上記従来技術では、シート状部材に所望の開口を形成して、その開口部に半田ペーストを充填した後に、基板上に載置するために、シート状部材の開口部に半田ペーストが十分充填され、流れ出ないようにする必要があること、高精度の位置合せを行う必要があり、シート状部材を基板面に載置する際にシート状部材にしわ等の発生を抑制する工夫も必要となり実用の点で問題がある。   In the above prior art, a desired opening is formed in the sheet-like member, and the opening is filled with the solder paste, and then the opening of the sheet-like member is sufficiently filled with the solder paste to be placed on the substrate. It is necessary to prevent it from flowing out, it is necessary to perform high-precision alignment, and it is necessary to devise measures to suppress the occurrence of wrinkles on the sheet-like member when placing the sheet-like member on the substrate surface. There is a problem in terms of.

本願発明の目的は、金属マスクに代えてシート状部材を用いてハンダバンプを形成する場合に、上記の問題を解決し、高精度のハンダバンプの形成が可能な印刷システムを提供することにある。   An object of the present invention is to provide a printing system capable of solving the above-described problems and forming a highly accurate solder bump when a solder bump is formed using a sheet-like member instead of a metal mask.

半田ペーストを塗布する基板面上にシート状部材を貼り付ける貼り付け部と、シート状部材に半田ペーストを塗布するための開口パターンを形成するパターン作成部と、開口パターンを形成したシート状部材を設けた基板に半田ペーストを印刷する印刷部と、半田ペーストが印刷された基板を加熱して、半田ペーストを基板面に固着させるリフロー炉と、半田ペーストが固着された基板面からシート状部材を除去する剥離部とから構成した。   An affixing part for attaching a sheet-like member on a substrate surface to which a solder paste is applied, a pattern creating part for forming an opening pattern for applying the solder paste to the sheet-like member, and a sheet-like member on which the opening pattern is formed A printing unit that prints the solder paste on the provided substrate, a reflow oven that heats the substrate on which the solder paste is printed, and fixes the solder paste to the substrate surface, and a sheet-like member from the substrate surface to which the solder paste is fixed It comprised from the peeling part to remove.

印刷対象の基板面にシート状部材を貼り付けた後に、シート状部材に開口を設けて、その後印刷部にてマスクを介してシート開口パターンに半田ペーストを供給する構成としたため、小さく、密集した開口パターンにスキージ印刷法で高精度の印刷を可能にした。   After the sheet-like member is attached to the substrate surface to be printed, an opening is formed in the sheet-like member, and then the solder paste is supplied to the sheet opening pattern via the mask in the printing unit. High-precision printing is possible on the aperture pattern by the squeegee printing method.

図１にシート印刷システムの全体構成の概略を示す。   FIG. 1 shows an outline of the overall configuration of the sheet printing system.

本システムは図に示すように、被対象印刷物である基板１の印刷面にシート状部材１１を貼り付けるフィルム貼り付け部２と、貼り付けたシート面にレーザ光又は露光法を用いて印刷するパターンの穴あけ加工を施すパターン作成部３と、穴あけ加工を施したシート面上の残渣を取り除く洗浄部４と、基板面と略同じか多少小さめの開口を設けたマスクを備え、マスク上面よりスキージを移動することにより半田ペーストをマスク開口部から、シート面に設けたパターン開口部を介して基板面に供給する印刷部５と、半田ペーストにより印刷された基板を搬入して半田ペーストを溶融して、基板面に固着させるリフロー炉６と、半田ペーストが固着された基板面からシート部材を剥離するフィルム剥離部７とからなる。   As shown in the figure, the present system prints a film pasting part 2 for pasting a sheet-like member 11 on the printing surface of a substrate 1 that is an object to be printed, and a laser beam or an exposure method on the pasted sheet surface. A pattern creating unit 3 for drilling a pattern, a cleaning unit 4 for removing residues on the drilled sheet surface, and a mask provided with an opening that is substantially the same as or slightly smaller than the substrate surface. The printing unit 5 for supplying the solder paste from the mask opening to the substrate surface through the pattern opening provided on the sheet surface and the substrate printed with the solder paste are carried in to melt the solder paste. The reflow furnace 6 is fixed to the substrate surface, and the film peeling portion 7 is used to peel the sheet member from the substrate surface to which the solder paste is fixed.

図２に基板にフィルムを貼り付け（ａ）,穴あけ加工（ｂ）,半田ペーストの塗布（ｃ）の状態を示す。   FIG. 2 shows a state in which a film is attached to the substrate (a), drilling (b), and solder paste application (c).

図１及び図２において、まずフィルム貼り付け部２では、膜厚５０μｍ〜１００μｍのフィルムをロール状に収納した収納ロール１０から、フィルム（以下シート状部材と称する）１１を繰り出しローラ（図示せず）により繰り出して、レジストローラ部８にて搬送ローラからなる搬送路上を送られてきた基板１（本実施例では樹脂製基板を用いている）の先端部とシート状部材１１の先端部の位置合せを行う。その後、基板１の先端部から後端部までシート状部材１１を加熱加圧ローラ１２により貼り付け、後端部側に設けたシートカッタ（図示せず）にて余剰シートをカットする。なお、ここではシート状部材１１をロール状に巻きつけたものを繰り出すことで説明したが、基板形状にカットされたシート状部材１１を収納したシートカセットから１枚ずつ取り出して貼り合せても良いことは言うまでもない。フィルム貼り付け部２にはフィルム先端部と基板先端部との位置合せするためのレジストローラ８と、加熱加圧ローラ１２が設けてあり、基板１面にシート状部材１１を加熱・加圧しながら貼り付けることで、皺なくシート状部材１１を貼り付けることができる。   1 and 2, first, in the film affixing unit 2, a film (hereinafter referred to as a sheet-like member) 11 is fed out from a storage roll 10 in which a film having a film thickness of 50 μm to 100 μm is stored in a roll shape (not shown). ) And the position of the front end portion of the substrate 1 (which uses a resin substrate in this embodiment) and the front end portion of the sheet-like member 11 that have been fed by the registration roller unit 8 on the transport path composed of the transport rollers. Align. Thereafter, the sheet-like member 11 is pasted from the front end portion to the rear end portion of the substrate 1 by the heat and pressure roller 12, and an excess sheet is cut by a sheet cutter (not shown) provided on the rear end portion side. Here, the sheet-like member 11 wound in the form of a roll has been explained. However, the sheet-like member 11 cut into a substrate shape may be taken out one by one and bonded together. Needless to say. The film affixing unit 2 is provided with a registration roller 8 for aligning the film leading end and the substrate leading end, and a heating and pressing roller 12, while heating and pressing the sheet-like member 11 on the surface of the substrate 1 By sticking, the sheet-like member 11 can be stuck without any wrinkles.

シート状部材１１を貼り付けた基板１は、搬送ローラ又は搬送ベルトからなる搬送路上を移動しパターン作成部３に送られる。そこで、基板テーブル上に載置され、位置合せされる。位置合せ終了後に、予め設定されている開口パターンに合せてレーザ光１３を照射して、シート状部材１１に所望のパターン（開口パターン２３）を形成する。なお、シート状部材に開口パターン２３を設けるレーザ光は（図では１つのレーザ光としているが、複数の平行光を用いる構成としても良い。シート状部材１１にパターンの形成された基板１は、ローラ又は搬送ベルト上を移動して洗浄部４に送られる。洗浄部４では、シート状部材１１表面に洗浄液噴射部１９から斜め方向に洗浄液を噴射することで余剰シート部材（レーザ加工により開けられた開口部の残渣）を洗い流した後、図示していない乾燥器により乾燥される。   The substrate 1 to which the sheet-like member 11 is attached moves on a conveyance path composed of a conveyance roller or a conveyance belt and is sent to the pattern creating unit 3. Therefore, it is placed on the substrate table and aligned. After the alignment is completed, a desired pattern (opening pattern 23) is formed on the sheet-like member 11 by irradiating the laser beam 13 with a preset opening pattern. The laser beam for providing the opening pattern 23 on the sheet-like member (in the figure, it is a single laser beam, but a configuration using a plurality of parallel lights may be used. The substrate 1 on which the pattern is formed on the sheet-like member 11 includes: It moves on a roller or a conveyor belt and is sent to the cleaning unit 4. In the cleaning unit 4, an excess sheet member (which is opened by laser processing) is ejected onto the surface of the sheet-like member 11 from the cleaning liquid injection unit 19 in an oblique direction. The residue in the opening is washed away and dried by a drier not shown.

シート状部材１１に開口パターン２３を形成された基板１は、印刷部５に設けてあるテーブル１６面上に搬送され、テーブル１６上に載置・固定される。なお、この印刷部のテーブル１６は上下に移動可能なように構成されている。テーブル１６上部にはマスク１５が設けてあり、そのさらに上部にはスキージ１４が上下及びＸ方向（又はＹ方向）に移動可能に設けてある。この使用するマスクは基板の形状に合わせて四角の開口を設けたもので、通常のスクリーン印刷に設けるマスクのように半田ペーストを塗布する開口を設けたものでない。このようにマスクを設ける理由は、余分な半田ペーストをシート面状に残留させずに、マスク面状に使用しなかった半田ペーストを載せて、次の基板の半田ペースト塗布に用いるためである。このために、本図ではスキージ１４は１つしか示していないが、往復動できるようにダブルスキージ構成となっている。テーブル１６面上に基板１が載置され固定されると、テーブル１０を上昇させてマスク１５面と基板１のシート部材１１の面が略同じ水平位置になるようにセットされる。本実施例のマスク１５は、前述のように、基板サイズに応じた四角形の開口が、基板サイズと略同じか、基板サイズより若干小さく設けてある。この開口部内にシート状部材１１に設けた開口パターン２３が全て入っている状態となっている。そして、スキージ１４を降下させ、スキージ１４下端部に供給された半田ペースト２５をシート状部材１１の開口部に充填しながらＸ方向に移動させる。   The substrate 1 on which the opening pattern 23 is formed in the sheet-like member 11 is transported on the surface of the table 16 provided in the printing unit 5, and is placed and fixed on the table 16. Note that the table 16 of the printing unit is configured to be movable up and down. A mask 15 is provided above the table 16, and a squeegee 14 is provided above the table 16 so as to be movable in the vertical direction and the X direction (or Y direction). The mask to be used is provided with a square opening in accordance with the shape of the substrate, and is not provided with an opening for applying a solder paste unlike a mask provided for normal screen printing. The reason why the mask is provided in this manner is that an excess solder paste is not left on the sheet surface, but a solder paste that is not used on the mask surface is placed and used for applying the solder paste on the next substrate. For this reason, only one squeegee 14 is shown in the figure, but a double squeegee configuration is provided so that it can reciprocate. When the substrate 1 is placed and fixed on the surface of the table 16, the table 10 is raised and set so that the surface of the mask 15 and the surface of the sheet member 11 of the substrate 1 are in substantially the same horizontal position. As described above, the mask 15 of this embodiment has a square opening corresponding to the substrate size that is substantially the same as or slightly smaller than the substrate size. All the opening patterns 23 provided in the sheet-like member 11 are in the opening. Then, the squeegee 14 is lowered, and the solder paste 25 supplied to the lower end of the squeegee 14 is moved in the X direction while filling the opening of the sheet-like member 11.

シート状部材１１に設けた開口パターン２３を介して、半田ペースト２５を基板に塗布した後に、スキージ１４を上昇させると共に、基板１を載置したテーブル１０を降下させてマスク面を基板面から離間させる。次にテーブル面上の基板をリフロー炉６に搬送し、リフロー炉内に設けてある加熱機構１７を動作させて基板面を加熱して半田ペースト２５を溶融・固着させる。   After applying the solder paste 25 to the substrate through the opening pattern 23 provided in the sheet-like member 11, the squeegee 14 is raised and the table 10 on which the substrate 1 is placed is lowered to separate the mask surface from the substrate surface. Let Next, the board | substrate on a table surface is conveyed to the reflow furnace 6, the heating mechanism 17 provided in the reflow furnace is operated, the board | substrate surface is heated, and the solder paste 25 is fuse | melted and fixed.

リフローが終了すると、基板はフィルム剥離部７に搬送され、そこで開口の設けられたシート状部材が基板面から剥離される。本実施例の剥離部７は、フィルム状部材１１を上部より溶剤を基板面全面に吹き付けて、溶解して取り除く構成としてあり、溶剤噴射部
２０から溶剤を噴射してシート状部材１１を溶かして取り除いた後、洗浄工程で溶剤等を洗い流す構成としてある。 When the reflow is completed, the substrate is conveyed to the film peeling unit 7, where the sheet-like member provided with the opening is peeled from the substrate surface. The peeling part 7 of the present embodiment is configured to remove the film-like member 11 by spraying the solvent over the entire surface of the substrate from the top and dissolving it. The solvent-jetting part 20 sprays the solvent to melt the sheet-like member 11. After removal, the solvent is washed away in the cleaning process.

なお、上記説明では、シートの溶解に溶剤を用いることで説明したが、溶剤を用いる代わりに、光を照射して、溶かしたり、熱風を吹き付けて溶かす方法を用いても良いことは言うまでも無い。   In the above description, the solvent is used for dissolving the sheet, but it goes without saying that instead of using the solvent, a method of irradiating with light to melt or blowing hot air may be used. No.

以上の様に、本発明のシート印刷システムでは、半田ペーストを塗布する基板面状にシート状部材を貼り付け、その後シート状部材を露光等により半田ペーストを塗布する穴開け加工を施して、シート上部より半田ペーストを塗布する構成としたため、基板のペースト塗布位置等が変わっても、露光位置を変えるだけ対応することができるために、これまでのマスク交換当の手間がかからなくなり、柔軟に対応できる。さらに、シート部材の厚みを変えるだけで、塗布する半田ペーストの量を簡単に変えることが可能となり、用途に応じた半田ペースト塗布ができる。   As described above, in the sheet printing system of the present invention, the sheet-like member is pasted on the surface of the substrate to which the solder paste is applied, and then the sheet-like member is subjected to punching processing to apply the solder paste by exposure or the like. Since it is configured to apply solder paste from the top, even if the paste application position on the substrate changes, it can respond only by changing the exposure position, so there is no need to replace the mask so far and flexibly Yes. Furthermore, it is possible to easily change the amount of solder paste to be applied simply by changing the thickness of the sheet member, and solder paste can be applied according to the application.

シート印刷システムの全体構成を示す図である。1 is a diagram illustrating an overall configuration of a sheet printing system. シート貼り付け基板，開口パターン形成，印刷の状態を示す概略図である。It is a schematic diagram showing the state of sheet pasting board, opening pattern formation, and printing.

符号の説明Explanation of symbols

１…基板、２…フィルム貼り付け部、３…パターン作成部、４…洗浄部、５…印刷部、６…リフロー炉、７…剥離部。
DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... Film sticking part, 3 ... Pattern preparation part, 4 ... Cleaning part, 5 ... Printing part, 6 ... Reflow furnace, 7 ... Stripping part.

Claims (2)

半田ペーストを塗布する基板面上にロール状に巻き取られているシート状部材を所定の大きさにカットして、前記カットされたシート状部材を加熱加圧して貼り付ける貼り付け部と、前記シート状部材に半田ペーストを塗布するための開口パターンをレーザ光により形成するパターン作成部と、前記シート状部材の面上の残渣を洗浄するためにシート部材表面に斜めに洗浄液を噴き付けるための噴射部を備えた洗浄部と、前記開口パターンを形成したシート状部材を設けた基板を載置するテーブルと、半田ペーストを印刷するためのスキージとを備えた印刷部と、半田ペーストが印刷された基板を加熱して、半田ペーストを基板面に固着させるリフロー炉と、半田ペーストが固着された基板面からシート状部材を除去するため溶剤を噴射してシート状部材を取り除くシート剥離部と、溶剤を洗い流す洗浄部からなるシート印刷システム。 A sheet-like member wound in a roll shape on a substrate surface to which a solder paste is applied is cut into a predetermined size, and an affixing unit for attaching the cut sheet-like member by heating and pressing; and A pattern creating unit for forming an opening pattern for applying a solder paste on the sheet-like member by laser light , and a spray for injecting a cleaning liquid obliquely on the surface of the sheet member in order to wash the residue on the surface of the sheet-like member A printing unit including a cleaning unit including an ejection unit, a table on which a substrate provided with a sheet-like member on which the opening pattern is formed, a squeegee for printing solder paste, and a solder paste are printed. A reflow furnace for fixing the solder paste to the substrate surface by heating the substrate, and spraying a solvent to remove the sheet-like member from the substrate surface to which the solder paste is fixed A sheet peeling portion to remove over preparative shaped member, sheet printing system comprising a cleaning unit to wash away the solvent. 請求項１に記載のシート印刷システムにおいて、前記印刷部には印刷対象の基板形状と同じか多少小さな開口を備えたマスクを備え、マスク面からシート状部材面を移動するスキージ先端部に半田ペーストを供給した後、スキージをマスク面及びシート状部材面に押し付け力を作用させながら移動することで、シート状部材に設けた開口パターンに半田ペーストを供給するシート印刷システム。   2. The sheet printing system according to claim 1, wherein the printing unit includes a mask having an opening that is the same as or slightly smaller than the shape of a substrate to be printed, and a solder paste on a tip of a squeegee that moves the sheet-like member surface from the mask surface. Printing system for supplying solder paste to the opening pattern provided in the sheet-like member by moving the squeegee while pressing the squeegee against the mask surface and the sheet-like member surface.
JP2006134666A 2006-05-15 2006-05-15 Sheet printing system Expired - Fee Related JP4882502B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006134666A JP4882502B2 (en) 2006-05-15 2006-05-15 Sheet printing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006134666A JP4882502B2 (en) 2006-05-15 2006-05-15 Sheet printing system

Publications (3)

Publication Number Publication Date
JP2007305888A JP2007305888A (en) 2007-11-22
JP2007305888A5 JP2007305888A5 (en) 2009-04-16
JP4882502B2 true JP4882502B2 (en) 2012-02-22

Family

ID=38839539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006134666A Expired - Fee Related JP4882502B2 (en) 2006-05-15 2006-05-15 Sheet printing system

Country Status (1)

Country Link
JP (1) JP4882502B2 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
JP2002164649A (en) * 2000-11-28 2002-06-07 Ngk Spark Plug Co Ltd Method for manufacturing printed wiring board
JP4707273B2 (en) * 2000-12-26 2011-06-22 イビデン株式会社 Manufacturing method of multilayer printed wiring board
JP2002210552A (en) * 2001-01-15 2002-07-30 Senju Metal Ind Co Ltd Method for manufacturing partially soldered metallic piece

Also Published As

Publication number Publication date
JP2007305888A (en) 2007-11-22

Similar Documents

Publication Publication Date Title
JP4985753B2 (en) Screen printing system and mask cleaning method for screen printing system
JP2018128359A (en) Substrate inspection device, substrate inspection method, and method of manufacturing substrate
US10842025B1 (en) Reel-to-reel slug removal methods and devices in FPC fabrication
JP5062243B2 (en) Screen printing system and mask cleaning method for screen printing system
TW201519723A (en) Method and apparatus for printing small aspect features
JP4882502B2 (en) Sheet printing system
TWI316467B (en)
JP5076749B2 (en) Sheet printing system
KR102023585B1 (en) Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed
JP6892510B2 (en) Screen printing machine
JPH05138396A (en) Production of preform solder sheet
KR100732213B1 (en) Screen printer and printing method
JP2006008276A (en) Peeling device and peeling method
KR100893327B1 (en) Apparatus for and method of manufacturing photosensitive laminated body
JP5830959B2 (en) Image forming apparatus and bonding foil manufacturing apparatus
JP2013199072A (en) Screen printing machine and mask cleaning method in screen printing machine
JP2011126050A (en) Screen printing system and method for cleaning mask of screen printing system
JP2013199073A (en) Screen printing machine and screen printing method
JP2018160640A (en) Substrate manufacturing method and substrate manufacturing device
EP3045304A1 (en) Method for manufacturing printed material, printed material, and manufacturing device
JP2011126052A (en) Screen printing machine and method for cleaning mask of screen printing machine
JPH05110241A (en) Method of supplying solder to printed board
WO2002026007A1 (en) Flux applying method and device, flow soldering method and device and electronic circuit board
JP6754039B2 (en) Manufacturing method of game board
KR200260184Y1 (en) laminating device for processing objects having punching holes

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20070820

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090227

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090227

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110121

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110201

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110331

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110809

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111005

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111108

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111121

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141216

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees