JP2001160684A - Apparatus and method for manufacturing multilayer wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To raise the packaging density of a conductive paste in through-holes formed on a base to thereby reduce and stabilize the connection resistance in a multilayer wiring board, wherein the conductive paste is filled in the through-holes to connect a front wiring layer to a back wiring layer. SOLUTION: A semi-hardened prepreg sheet base 1 having releasing films 2 on both surfaces and through-holes 3 piercing the base is laid on a vacuum stage 7 through a gas-permeable sheet 8, a coat film of a conductive paste 5 is formed on the base surface using a squeegee 11, and a rotary roller pressure fitting unit 12 is rotated and run to pressure-fit and fill the conductive paste 5 in the through-holes 3 one after another. Thus, the high density filling of the conductive paste is enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a multilayer wiring board on which semiconductor elements, chip parts and the like are mounted and in which these parts are interconnected.

[0002]

2. Description of the Related Art With the advance of miniaturization and high density of electronic equipment, higher density and multilayer wiring boards are supplied with high connection reliability in both industrial and consumer fields. It has come to be required.

In response to the demand, an inner via connection method in which an arbitrary electrode is interlayer-connected at an arbitrary wiring pattern position, that is, an all-layer IVH (Interstitial Via Hole) resin multilayer substrate has been developed.

Hereinafter, a method for manufacturing the wiring board will be described by taking a double-sided wiring board as an example.

FIGS. 7A to 7G are schematic sectional views showing a conventional method for manufacturing a double-sided wiring board in the order of steps.

First, as shown in FIG. 7A, a prepreg sheet (base material) 1 is prepared. As the prepreg sheet 1, for example, a base material made of a semi-cured composite material in which a thermosetting epoxy resin is impregnated into a nonwoven fabric of aromatic polyamide fibers is used.

[0007] Next, as shown in FIG. 7 (b), a plastic sheet 2 is temporarily attached to both sides of the prepreg sheet 1. An Si-based release agent is applied to an adhesive surface of each plastic sheet 2 with the prepreg sheet 1. As the plastic sheet 2, for example, a polyethylene terephthalate film (hereinafter referred to as a PET film) can be used.

Next, as shown in FIG. 7 (c), a plurality of through holes 3 are formed at predetermined positions of a prepreg sheet 1 having plastic sheets 2 adhered to both sides thereof by using a laser processing method or the like.
To form

Next, the through-hole 3 is filled with a conductive paste. The filling of the conductive paste is performed by the method shown in FIG. That is, a gas-permeable sheet (for example, a paper sheet) 8 is laid on a flat suction stage 7, and the base material 1 provided with the through-holes 3 is placed thereon and fixed by vacuum suction. Then, the conductive paste 5 is formed on the surface of the plastic sheet 2.
Is supplied, and the squeegee 6 is moved to perform printing, so that the conductive paste 5 is filled in the through holes 3.

Next, as shown in FIG. 7E, the plastic sheets 2 adhered to both sides of the prepreg sheet 1 are peeled off.

Then, as shown in FIG. 7 (f), a metal foil 4 such as a copper foil is placed on both sides of the prepreg sheet 1 and heated and pressed by a hot press in this state, so that the prepreg sheet 1 and the metal foil 4 is adhered. At this time, the metal foils 4 on both surfaces of the prepreg sheet 1 are electrically connected by the conductive paste 5 filled in the through holes 3 by a so-called via hole connection.

Thereafter, as shown in FIG. 7 (g), the metal foils 4 on both sides are selectively etched to form a circuit pattern 9, whereby a double-sided wiring board 10 is obtained.

[0013]

However, in the above-mentioned conventional method of printing and filling a conductive paste, the conductive paste 5 supplied on the plastic sheet 2 is slid with the squeegee 6 on the surface of the plastic sheet 2. To fill the through hole 3. Therefore, when the squeegee passes, the conductive paste near the surface in the filled through hole 3 may be slightly scraped off. As a result, FIG.
As shown in (e), a depression 55 is formed on the surface of the conductive paste 5 in the through hole 3 after the printing and filling, and the filling amount varies such that the through hole 3 is not sufficiently filled. There was a case. Therefore, the double-sided wiring board 10 after the heating and pressurization manufactured by this method has a variation in the density of the conductive paste 5 in the through hole 3, and the front and back metal foils 4 connected via the conductive paste 5 This has caused a variation in connection resistance.

The conductive paste 5 is composed of fine metal particles for imparting conductivity, an organic material serving as an adhesive, and an additive such as a solvent. The volume ratio to the resin component is approximately 5
0:50. In order to reduce the connection resistance and reduce the variation, it is essential to increase the density of the metal fine particles of the conductive paste 5 filling the through holes 3. In the conventional printing and filling method, the resin component in the conductive paste 5 in the through-hole 3 is converted into the sheet 8 by interposing a gas-permeable sheet 8 under the base material 1 and performing suction under reduced pressure using the suction stage 7. Had been adsorbed. With this method, only the resin component in the vicinity of the portion of the conductive paste 5 that is in contact with the sheet 8 could be adsorbed, and the density of the fine metal particles of the conductive paste 5 in the through-hole 3 could not be efficiently increased.

The present invention solves the above-mentioned conventional problems, improves the density of conductive metal fine particles in a via hole, suppresses variation in connection resistance, reduces connection resistance, and improves connection reliability. An object of the present invention is to provide a method and an apparatus for manufacturing a multilayer wiring board for realizing a high-quality, high-performance wiring board.

[0016]

The present invention has the following configuration to achieve the above object.

According to the method for manufacturing a multilayer wiring board of the present invention, a step of providing a through-hole in a base material having a release film on both sides thereof, and the step of forming the through-hole formed base material through a sheet having air permeability. A step of placing the conductive paste on a flat stage, a step of applying a conductive paste on the surface of the base material to a constant thickness, and running the rotary roller press-fitting body to provide the conductive paste on the base material Press-fitting sequentially into the through holes. According to this configuration, the rotating roller press-fitting body is caused to travel while applying a predetermined pressure in the direction of the base material, so that the pressing force of the rotating roller press-fitting body and the rotation pressing by the angle formed by the roller outer peripheral surface and the base material surface are performed. The conductive paste can be sequentially filled with pressure into the through holes by pressure. As a result, by improving the filling density, both the connection resistance and its variation can be reduced, and a highly reliable multilayer wiring board with excellent stability of the connection portion can be provided.

In the above-mentioned manufacturing method, in the step of press-filling the conductive paste into the through-hole, the air-permeable sheet further has an absorbing / adsorbing property, and the excess paste in the conductive paste in the through-hole is provided. Preferably, the resin component is adsorbed on the sheet. According to such a configuration,
Due to the synergistic effect of the sheet having the suction-adsorbing property and the conductive paste being press-fitted and filled, the amount of the metal fine particles of the conductive paste in the through hole relatively increases, and the paste filling with a high metal fine particle density and can do.

In the above-mentioned manufacturing method, in the step of applying the conductive paste, a coating film forming apparatus separated from the surface of the substrate by a predetermined distance is run to form a conductive film having a predetermined thickness on the surface of the substrate. Preferably, after the step of forming a conductive paste coating film and press-fitting using the rotary roller press-fitting body, the method further includes a step of removing and collecting excess conductive paste remaining on the surface of the base material. According to this configuration, it contributes to shortening and simplifying the manufacturing process.
Here, for example, a squeegee can be used as the coating film forming apparatus. In the present invention, the squeegee means a broad concept including a so-called doctor knife (or doctor blade) and the like.

In the above, the coating film forming apparatus, the rotating roller press-in body, and the removing and collecting apparatus for removing and collecting excess conductive paste are sequentially run on the base material placed on the stage. By doing so, it is preferable that the step of applying the conductive paste, the step of press-fitting the conductive paste into the through holes, and the step of removing and collecting the excess conductive paste be performed in succession. According to such a configuration, the application, filling, and collection of the conductive paste can be efficiently performed by a series of continuous operations, and the pressure filling of the conductive paste into the through holes is efficiently performed, and the manufacturing process is streamlined. It is also easier to plan.

Further, in the above, the traveling mechanism having the rotary roller press-fitting body and a squeegee provided in front and behind the rotary roller press-fitting body so as to be able to adjust a height position (and further adjust a pressing force as necessary). Run back and forth on the stage,
In both forward and backward movements of the traveling mechanism, a conductive paste coating film having a constant thickness is formed on the surface of the base material using the squeegee in the traveling direction, and the conductive paste is applied by the rotary roller press-fitting body. It is preferable that the paste is press-fitted into the through-hole, and excess conductive paste is removed and collected by using the squeegee at the rear in the traveling direction. According to such a configuration,
Since the paste can be filled each time the traveling mechanism moves forward and backward, it contributes to shortening the manufacturing time.

Further, in the above-mentioned manufacturing method, it is preferable that the thickness of the conductive paste applied on the surface of the substrate is equal to or greater than the thickness of the substrate. According to such a configuration, it is possible to prevent a shortage of the filling amount at the time of press-fitting filling by the rotary roller press-fitting body, secure uniformity of filling, and obtain a highly reliable multilayer wiring board.

[0023] Further, in the apparatus for manufacturing a multilayer wiring board of the present invention, there is provided a suction stage on which a release film is attached on both sides and on which a base material having a through hole is placed, and a suction stage between the base material and the stage. A sheet having air permeability (preferably further absorbing and adsorbing), a coating film forming apparatus for applying a conductive paste on the surface of the base material to a constant thickness, and a coating film of the conductive paste. A rotary roller press-fitting body for press-fitting the conductive paste into the through-hole by rotating and running; and a removing and collecting device for removing and collecting excess conductive paste remaining on the base material surface after press-fitting and filling. It is characterized by. According to this configuration, the conductive paste can be filled into the through-holes of the base material at high density, uniformly and reliably, so that both the connection resistance and the variation thereof can be reduced, and the stability of the connection portion is improved. An excellent and highly reliable multilayer wiring board can be efficiently provided.

The above-mentioned manufacturing apparatus includes the above-mentioned coating film forming apparatus,
The rotating roller press-fitting body and the removal and recovery device are sequentially moved on the base material placed on the stage to apply a conductive paste and press-fit the conductive paste into the through-hole. It is preferable that the apparatus is configured to continuously remove and collect excess conductive paste. According to such a configuration, the application, press-fitting, and collection of the conductive paste on the base material to be filled can be efficiently performed by a series of continuous operations, and the manufacturing process can be rationalized.

In the above manufacturing apparatus, the traveling mechanism including the rotary roller press-fitting body and a squeegee provided so as to be able to adjust a height position before and after the rotary roller press-fitting body may reciprocate on the stage. It is installed so that the squeegee on the front in the running direction functions as the coating film forming apparatus and the squeegee on the rear in the running direction functions as the removal and recovery device in both forward and backward movements of the running mechanism. Is preferred. According to such a configuration, the paste can be filled at the time of traveling and returning of the traveling mechanism, so that the production efficiency can be improved.

[0026]

Embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1) FIGS. 1A to 1E are schematic cross-sectional views showing the first half of a method of manufacturing a multilayer wiring board according to a first embodiment of the present invention in the order of steps. In the present embodiment, a manufacturing process of a double-sided wiring substrate, which is a part of a process of forming a resin multilayer substrate having an all-layer IVH structure, will be described as an example.

First, as shown in FIG. 1A, a release film such as a PET film 2 is formed on both surfaces of a semi-cured substrate 1 in which a thermosetting epoxy resin is impregnated into a non-woven fabric of aromatic polyamide fibers. Is temporarily adhered, a plurality of through holes 3 are formed at required positions of the base material 1 including the PET film 2 by a laser beam or the like. A Si-based release agent is applied to the surface of the PET film 2 on the substrate 1 side.

Next, the base material 1 having the through holes 3 formed thereon is shown in FIG.
As shown in (b), the substrate 1 is placed on a flat suction stage 7 via a gas-permeable sheet (for example, a paper sheet) 8, and the substrate 1 is fixed and held on the stage 7 by the suction pressure of the suction stage 7. I do.

Next, a coating film of the conductive paste 5 is formed on the PET film 2 on the upper surface of the substrate 1. As shown in FIG. 1 (c), the conductive paste 5 is supplied onto the PET film 2 on the upper surface side of the base material 1 and a squeegee (film forming apparatus) 11 is formed in the direction of the arrow. By moving, the conductive paste coating film 5 having a uniform thickness is formed on the upper surface side PET film 2. At this time, the squeegee 11 is maintained while maintaining the distance between the surface of the upper PET film 2 and the lower end of the squeegee 11 at a constant value equal to or greater than the thickness of the substrate 1.
Is preferably moved.

Next, as shown in FIG. 1 (d), the rotating roller press-fitting body 12 having a cylindrical shape is coated with a conductive paste while applying a predetermined constant load in the direction of the stage 7 (downward in the drawing). The film 5 is rotated and driven in the direction of the arrow. Depending on the pressing force of the rotary roller press-fitting body 12 and the angle formed between the outer peripheral surface of the roller and the surface of the PET film 2,
The conductive paste coating film 5 applied thereon is pushed into the through-holes 3 formed in the base material 1 and is sequentially press-fitted and filled, thereby performing paste filling with a high filling density.

After filling the conductive paste, as shown in FIG. 1 (e), the squeegee (removal and recovery device) 14 for removing and recovering the paste is moved in the direction of the arrow while the lower end thereof is substantially in contact with the surface of the PET film 2. By making PET
Excessive conductive paste 5 remaining on film 2 is scraped and collected.

Next, as shown in FIG.
The base material 1 on which the ET film 2 was temporarily attached and the conductive paste 5 was filled in the through holes was removed from the stage 7, and FIG.
As shown in (b), the PET films 2 on both sides are removed. At this time, as shown, the conductive paste 5 slightly protrudes from the front and back surfaces of the substrate 1.
A filled substrate 1 is obtained.

Thereafter, as shown in FIG.
A metal foil 4 such as a copper foil is laminated on both sides of the substrate 1 and subjected to a curing treatment by applying heat and pressure, and the base material 1 and the metal foil 4 are bonded to each other.

Next, as shown in FIG.
The wiring pattern 9 is formed by a normal printed wiring method, and the wiring pattern 9
Are the inner via holes 5 formed by the conductive paste 5.
6, a double-sided wiring board 10 connected between layers is obtained.

By laminating a plurality of double-sided wiring boards 10 formed as described above, a resin multilayer wiring board can be obtained.

(Embodiment 2) Next, a second embodiment of the present invention will be described.

In the present embodiment, instead of the air-permeable sheet 8 (see FIG. 1C) interposed between the base material 1 and the stage 7 in the first embodiment, Embodiment 2 is different from Embodiment 1 in that a sheet (for example, filter paper) excellent in absorbing and adsorbing the resin component in the conductive paste is used.

As a result, as in the first embodiment, when the conductive paste coating film 5 is formed on the surface of the PET film 2 on the upper surface side of the base material 1, In the conductive paste 5 press-fitted into the inside 3, the resin component 13 having a higher fluidity than the metal fine particles is pushed out from the inside of the through-hole 3 toward the sheet placed on the lower surface of the base material 1 by the pressing force, and the sheet is formed. Absorbed and absorbed (Fig. 1 (d),
(E)). As a result, in the present embodiment, the density of the fine metal particles of the conductive paste 5 in the through-hole 3 can be relatively further increased.

The present embodiment is the same as Embodiment 1 except for the above, and duplicate description will be omitted.

(Embodiment 3) Next, a third embodiment of the present invention will be described.

In the same manner as in the first embodiment, as shown in FIG. 1 (a), the base material 1 having the releasable PET films 2 temporarily adhered to both sides and having the through holes 3 formed at predetermined positions was prepared. obtain.

As shown in FIG.
The substrate 1 is fixed on the stage 7 by the suction pressure of the suction stage 7. Further, a printing filling frame 16 having an opening at the center in the outer peripheral area where the through hole 3 is not formed on the upper surface of the base material 1.
Pressure contact. Note that as the sheet 8, the sheet described in Embodiment 1 or 2 can be used.

In the present embodiment, the PE on the upper surface side of the substrate 1 is
A series of steps of forming a conductive paste coating film on the T film 2, filling the through-hole 3 with the conductive paste by press-fitting, and removing and collecting the excess conductive paste is performed by a traveling mechanism 15 shown in FIG. Is moved in the direction of the arrow.

The traveling mechanism 15 includes a rotary roller press-fitting body 12 having a cylindrical shape, and a coating film forming squeegee (coating film forming apparatus) 1 provided in front of the rotating roller press-fitting body 12 in the moving direction.
1 and a removal and recovery squeegee (removal and recovery device) 14 provided rearward in the moving direction of the rotary roller press-fitting body 12. The rotating roller press-fitting body 12 rotates and travels in the direction of the arrow while applying a predetermined constant load in the direction of the stage 7 (downward in the drawing). The lower end of the coating film forming squeegee 11 is held at a certain height from the surface of the upper surface side PET film 2 (preferably, at least as high as the thickness of the base material 1). Further, the lower end of the squeegee 14 for removal and collection is held at a height that is substantially in contact with the surface of the upper PET film 2. The traveling mechanism 15 moves along a traveling guide rail 20 installed in parallel with the upper surface of the stage 7.

The traveling mechanism 15 is connected to the printing filling frame 1 on the left side of the drawing.
The conductive paste 5 is supplied onto the left side edge of the upper surface side PET film 2 in the state of being retracted on the upper surface 6. Thereafter, the traveling mechanism 15 is moved in the direction of the arrow as shown in FIG. Then, the conductive paste 5 supplied in front of the coating film forming squeegee 11 is formed as a conductive paste coating film 57 having a certain thickness corresponding to a gap formed between the tip of the squeegee 11 and the PET film 2. . Next, the coating film 57
Is the pressing force of the rotary roller press-fitting body 12 and the outer peripheral surface of the roller.
Depending on the angle formed by the surface of the ET film 2, the base material 1 is sequentially press-fitted into the through-hole 3. Finally, the excess conductive paste 58 remaining on the surface of the PET film 2 is scraped off and collected by the squeegee 14 for removal and collection.
As a result, only the inside of the through hole 3 of the base material 1 is filled with the conductive paste 5 at a high density.

Thereafter, a double-sided wiring board is obtained through the same steps as those shown in FIG. 2 of the first embodiment.

In the present embodiment, the step of applying the conductive paste, the step of press-fitting and filling with a roller, and the step of removing and collecting the surplus paste can be performed continuously as a series of operations, so that uniformity of paste filling can be easily obtained. In addition, the present invention contributes to shortening of manufacturing tact time and cost reduction, for example, by easily performing pressure filling.

In this embodiment, an example has been described in which the squeegee 11 for forming the coating film, the press-fitting body 12 for the rotating roller, and the squeegee 14 for removing and collecting are integrally connected to the traveling mechanism 15 to perform interlocking traveling. The same effect can be obtained even in a system in which the vehicle travels individually and sequentially.

(Embodiment 4) Next, a fourth embodiment of the present invention will be described with reference to FIGS.

In the present embodiment, similarly to the third embodiment, a conductive paste film is formed on the PET film 2 on the upper surface side of the base material 1 and the conductive paste is press-filled into the through holes 3. A series of steps of removing and collecting excess conductive paste is performed by moving the traveling mechanism 15. The present embodiment is different from the third embodiment in that the above-described series of steps is performed only when the traveling mechanism 15 moves in the direction of the arrow in FIG. 3 (that is, from left to right in FIG. 3). In the present embodiment, the above-described series of steps can be performed when the traveling mechanism 15 moves in any one of the two directions. Differs in that

That is, as shown in FIG. 4, the rotary roller press-fitting body 12 is connected to the traveling mechanism 15 via the pressing force applying mechanism 18. A squeegee 1 for forming and removing and collecting the conductive paste 5 is provided before and after the rotary roller press-fitting body 12.
1 and 14, respectively, are squeegee height position control setting mechanisms 1
It is connected to the traveling mechanism 15 via 7, 19. The pressurizing mechanism 18 includes a position where the rotary roller press-fitting body 12 presses the upper surface side PET film 2 of the base material 1 on the stage 7 with a predetermined pressure (a press-fitting filling position) and a predetermined height higher than the upper surface side PET film 2. The rotary roller press-fitting body 12 can be held so that it can be set to the position where it is lifted and retracted (retracted position). Further, the squeegee height position control setting mechanisms 17 and 19 are configured such that the lower ends of the squeegees 11 and 14 have a predetermined gap from the surface of the upper surface side PET film 2 (conductive paste coating film forming position) and the upper surface side PET film. 2 (a conductive paste removing and collecting position) and a position (a retracting position) where the upper surface side PET film 2 is lifted to a predetermined height and retracted (a retracting position).
The squeegees 11 and 14 can be held.

First, as shown in FIG. 4, the squeegee height position control setting mechanism 17 moves the squeegee 11 to the conductive paste film forming position, and the squeegee height position control setting mechanism 19 moves the squeegee 14 to remove the conductive paste. Hold each in the collection position. Further, the rotary roller press-fitting body 12 is held at the press-fitting and filling position, and a predetermined constant load is applied by the pressing force applying mechanism 18 in the direction of the stage 7 (downward in the drawing). Then, the traveling mechanism 15 is connected to the traveling guide rail 20.
Along the print filling frame 16 at the left end position in FIG.

Further, in the same manner as in Embodiment 1, FIG.
As shown in FIG. 4 (a), the base material 1 on which the releasable PET films 2 are temporarily attached on both sides and the through holes 3 are formed at predetermined positions is flattened through a sheet 8 as shown in FIG. The substrate 1 is placed on the suction stage 7, and the substrate 1 is fixed and held on the stage 7 by the suction pressure of the suction stage 7. Further, a printing filling frame 16 having an opening at the center is pressed against the outer peripheral area of the upper surface of the base material 1 where the through holes 3 are not formed. Note that as the sheet 8, the sheet described in Embodiment 1 or 2 can be used.

In this state, the conductive paste 5 is placed on the upper PET film 2 in the running direction of the squeegee 11 in the running direction.
And the traveling mechanism 15 is caused to travel along the traveling guide rail 20 in the direction of the arrow. The conductive paste 5 has a thickness corresponding to a gap formed between the tip of the squeegee 11 and the PET film 2 and is formed as a conductive paste coating film 57 on the surface of the PET film 2. Next, the coating film 57 is sequentially press-fitted and filled into the through holes 3 of the base material 1 according to the pressing force of the rotary roller press-fitting body 12 and the angle formed by the outer peripheral surface of the roller and the surface of the PET film 2. Finally, the excess conductive paste 58 remaining on the PET film 2 is removed and collected by the squeegee 14. The above-described series of steps is performed while the traveling mechanism 15 is traveling, and the traveling mechanism 15 reaches the print filling frame 16 on the right end side as shown in FIG. The substrate 1 after the printing and filling is removed from the suction stage 7.

Next, the unfilled new base material 1 is again
It is set on the suction stage 7 via. Then, the rotary roller press-fitting body 12 and the squeegees 11 and 14 are lifted to the retreat position, and the traveling mechanism 15 is moved rightward from the conductive paste 58 collected on the print filling frame 16 as shown by a two-dot chain line 21 in FIG. To move. In the previous printing and filling, the squeegee 14 serving as the removal and collection squeegee was located at the conductive paste coating formation position, and in the preceding printing and filling, the squeegee 11 serving as the coating formation squeegee was located at the conductive paste removal and collection position, and The rotary roller press-fit body 12 is held at the press-fit filling position. In this state, as shown in FIG. 6, the traveling mechanism 15 is moved backward in the direction of the arrow along the traveling guide rail 20. Thus, the conductive paste can be filled under pressure as in the case of the forward movement shown in FIG. Travel mechanism 15
Reaches the upper left side of the print filling frame 16, the print filling is completed. Thereafter, the substrate 1 after the printing and filling is removed from the suction stage 7, and an unfilled new substrate is installed instead. Further, the rotary roller press-fitting body 12 and the squeegee 1
4 are moved to the outside (left side) of the collected conductive paste by lifting the rollers 1 and 14 to the retracted position, and the process of FIG. 4 is performed.

By repeating the above operation, the traveling mechanism 15
Continuous filling by reciprocating travel of the printer enables printing filling with high production efficiency.

The filled base material is the same as in the first embodiment.
Through the same steps as those shown in FIG. 2, a double-sided wiring board is obtained.

In each of the above embodiments of the present invention, the manufacturing process of the double-sided wiring board in the process of forming the resin multilayer board having the all-layer IVH structure has been described as an example. The technology of the present invention can also be applied to a resin film substrate or an inorganic material substrate such as a ceramic, and the same effects as those of the present invention can be obtained.

[0060]

As described above, according to the present invention, it is possible to fill a conductive paste into a through-hole at a uniform and high filling density, and to form a wiring board having a via-hole conductor with high connection reliability. . Furthermore, by disposing an absorbing and adsorbing sheet on the lower surface of the base material, it is possible to adsorb the excess resin component of the conductive paste, and it is possible to further increase the density of fine metal particles in the through-hole, thereby uniformly forming a low connection resistance via hole. be able to.

[Brief description of the drawings]

FIG. 1 is a process cross-sectional view showing a first-half manufacturing process of a resin multilayer wiring board according to a first embodiment of the present invention.

FIG. 2 is a process cross-sectional view showing a latter half of a manufacturing process of the resin multilayer wiring board according to the first embodiment of the present invention.

FIG. 3 is a side sectional view showing a method and an apparatus for manufacturing a resin multilayer wiring board according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing one manufacturing step of a resin multilayer wiring board according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing one manufacturing step of a resin multilayer wiring board according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view showing one manufacturing step of a resin multilayer wiring board according to a fourth embodiment of the present invention.

FIG. 7 is a process cross-sectional view showing a process for manufacturing a resin multilayer wiring board by a conventional squeegee printing and filling method.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 base material 2 release film (plastic sheet (PET film)) 3 through hole 4 metal foil 5 conductive paste 6 squeegee 7 suction stage 8 air-permeable sheet 9 wiring pattern 10 double-sided wiring board 11 squeegee for coating film formation (Film forming device) 12 Press-in body of rotating roller 13 Resin component in conductive paste 14 Squeegee for removal and recovery (Removal and recovery device) 15 Running mechanism 16 Printing frame 18 Pressurizing mechanism 17 and 19 Squeegee height position control Setting mechanism 20 Travel guide rail 56 Inner via hole 57 Conductive paste coating film 58 Excessive conductive paste

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yasuhiro Nakaya 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Satoshi Nakamura 1006 Odaka Kadoma Kadoma City, Osaka Matsushita Electric Industrial F Terms (reference) 5E317 AA24 BB03 BB11 CC23 CC25 CD27 CD32 GG09 5E343 AA07 AA15 AA17 BB72 DD05 FF04 GG13 5E346 AA02 AA42 CC04 FF18 GG06 GG15 HH02

Claims (9)

[Claims] 1. A step of providing a through-hole in a substrate provided with a release film on both sides, and a step of placing the substrate having the through-hole formed thereon on a flat stage via a sheet having air permeability. A step of applying a conductive paste on the surface of the base material to a constant thickness, and a step of running a rotary roller press-fitting body and sequentially press-filling the conductive paste into a through-hole provided in the base material. A method for manufacturing a multilayer wiring board, comprising: 2. The step of filling the conductive paste into the through-hole by press-fitting the conductive paste into the through-hole, wherein the excess resin component in the conductive paste in the through-hole is removed by the step of filling the conductive paste into the through-hole. 2. The method of claim 1, wherein the sheet is adsorbed on a sheet.
3. The method for manufacturing a multilayer wiring board according to item 1. 3. In the step of applying the conductive paste, a coating film forming apparatus separated by a predetermined distance from the surface of the base material is run to form a conductive paste coating film having a constant thickness on the surface of the base material. 2. The method for manufacturing a multilayer wiring board according to claim 1, further comprising, after the step of press-fitting and filling using the rotary roller press-fitting body, a step of removing and collecting excess conductive paste remaining on the base material surface. Method. 4. The coating film forming apparatus, the rotary roller press-fitting body, and a removing and collecting apparatus for removing and collecting excess conductive paste are sequentially run on the base material placed on the stage. By doing so, a conductive paste application step,
4. The method for manufacturing a multilayer wiring board according to claim 3, wherein a step of press-fitting the conductive paste into the through-holes and a step of removing and collecting excess conductive paste are continuously performed. 5. A traveling mechanism having the rotary roller press-fitting body and a squeegee provided so that the height position can be adjusted before and after the rotary roller press-fitting body is reciprocated on the stage. In any case of reinstatement,
Forming a conductive paste coating film of a certain thickness on the surface of the base material using the squeegee in front of the traveling direction, press-fitting the conductive paste into the through hole with the rotary roller press-fitting body,
4. The method for manufacturing a multilayer wiring board according to claim 3, wherein the excess conductive paste is removed and collected by using the squeegee at the rear in the traveling direction. 6. The method for manufacturing a multilayer wiring board according to claim 1, wherein the thickness of the conductive paste applied on the surface of the substrate is equal to or greater than the thickness of the substrate. 7. A suction stage on which a substrate having a through-hole is placed, a breathable sheet placed between the substrate and the stage, and a conductive paste on a surface of the substrate. A coating film forming apparatus for applying the conductive paste to a fixed thickness, a rotary roller press-fitting body for press-filling the conductive paste into the through-hole by rotating and running on the coating film of the conductive paste, and a surface of the base material after press-fitting and filling. A removing and collecting device for removing and collecting excess conductive paste remaining on the multilayer wiring board. 8. The method of applying a conductive paste by sequentially moving the coating film forming apparatus, the rotary roller press-fitting body, and the removing and collecting apparatus on the base material placed on the stage. 8. The multilayer wiring board manufacturing apparatus according to claim 7, wherein the press-fitting of the conductive paste into the through-hole and the removal and recovery of excess conductive paste are performed continuously. 9. A traveling mechanism comprising the rotary roller press-fitting body and a squeegee provided so as to be able to adjust a height position before and after the rotary roller press-fitting body is installed so as to be able to reciprocate on the stage, The squeegee in the front of the traveling direction functions as the coating film forming device, and the squeegee in the rear of the traveling direction functions as the removal and recovery device in both forward and backward movements of the traveling mechanism. Equipment for manufacturing multilayer wiring boards.