JP4644266B2 - Manufacturing method of electronic parts - Google Patents

Description

The present invention relates to a method for manufacturing an electronic component that performs resin sealing having a precise shape with a voidless of the electronic component, formation of a solder bump, filling a hole in a substrate, or dispensing.

  Conventional techniques are disclosed in the following documents. For example, it is well known to seal (package) an integrated circuit formed on a workpiece as a conventional packaging technique. The mainstream is the transfer molding method, but as a method using a plastic material made of a liquid synthetic resin, a dispenser method and a printing method are well known. The printing method includes a method of defoaming by air printing and a vacuum differential pressure printing method. For ceramic substrates, the vacuum differential pressure printing method is mainly employed. A part of the plastic material substrate has been adopted and is gradually expanding, but it has not yet become mainstream due to various problems. It is also applied to a wafer level CSP manufacturing process or its sealing. In the future, as electronic components are becoming more and more complex, three-dimensional, or embedded in a substrate, a sealing method having a precise shape with a voiceless is required.

  The printing method has recently attracted attention as compared to the conventional transfer method for forming solder bumps. Various techniques have been proposed as an important technique in how to fill a high-viscosity solder paste into a stencil with a high aspect ratio without voids in response to a narrow pitch. A method of printing and filling a head of a printing press using an atmospheric printing press with an open squeegee, a sealed squeegee, a press-fitting squeegee, a sealed squeegee, or a roller press-fitting squeegee is introduced. There is also a method in which a photosensitive dry film is laminated by forming a bump on the wafer, vias are formed, solder paste is filled by a printing method, reflow is performed to form bumps, and the film is peeled off.

Filling vias and through-holes on a printed circuit board or a wafer substrate includes a method of filling by air printing or vacuum differential pressure printing using a squeegee using a conductive paste and a non-conductive paste. Development of a process requiring simpler and lower cost by the batch lamination method is in progress. As for the printing method of the conductive paste, the development of the paste is being promoted with the aim of improving the electrical characteristics and reliability. A vacuum printing method in which various vias are simply filled with a voidless dress is entering the practical stage, but there is a demand for improvement due to disadvantages such as an overwhelming apparatus and low productivity. Also, for filling the through hole, use a mask and jig to align and fill the workpiece with resin, and then form plugs on the upper and lower surfaces of the workpiece, and then cure and polish both sides of the workpiece to flatten it. ing.
Patent No.3198273 Japanese Patent No. 3084440 Japanese Patent Application No. 2001-33147 Japanese Patent No. 3113974 Japanese Patent No. 2873501 JP-A-5-90271 JP 2001-232758 A Electronic Journal April 2003 issue

  The principle of using a stencil to print a high-viscosity resin flat with a squeegee into a shape with a gap does not hold. As shown in FIG. 15 (a), the resin m attached to the squeegee 60 and the workpiece 2 has a vertical gap at the opening 103 of the stencil 1, and a velocity gradient is generated with respect to the movement of the squeegee 60. The rear resin m is stretched and printed several tens of microns thinner than the specified thickness. This is a resin supply method that is not affected by viscosity or gaps.

  At the end of the opening 103 of the stencil 1, as shown in FIG. 15 (b), the resin m pushed in by the squeegee 60 is dammed at the end of the opening 103 and is further pressurized and released when passing. And printed several tens of microns thicker than the specified thickness. In this method, the filling pressure at the tip of the squeegee is always kept constant regardless of the shape of the mask or the workpiece 2.

  The opening 103 of the stencil 1 shown in FIG. 15 and the printing start part of the groove between the chips in the opening 103 (not shown) cannot follow the filling pressure of the squeegee 60 and become unfilled or thin. Cannot print, causing voids. Due to the above three factors, the liquid resin cannot be printed in a precise shape, and has been dealt with by reducing the viscosity of the resin at the expense of the mask shape, wasteful operation of the squeegee 60, and reliability. However, the essential solution has not been made. This is a resin supply method having a strong filling power that is not affected by the shape of the printing part.

  A high-viscosity resin with a high percentage of filler, etc. in a state of high-strength wirebonding and netting with the sealing of a laminated type BGA or CSP cannot be filled with the function of the squeegee. Therefore, if the printing is performed under vacuum and a vacuum differential pressure is applied, a filling effect can be expected to some extent, but there is no mechanism for eliminating the remaining voids, and the voids remain finely dispersed. Basically, it is a necessary condition that the resin fills the cavity and pushes out the air before applying the differential pressure. A very thin package has a high risk of voids due to the fact that the wire is close to the surface and short-circuited with the cavity and no differential pressure is generated. In addition, since the three-dimensionally stacked mounting is wire-bonded with high density and flip-chiped, and filling is required even in minute gaps, a method that has a strong filling function and can be printed precisely is indispensable. is there. Furthermore, in order to incorporate an electronic component into a substrate, it is necessary to fill a liquid resin with a voidless coating and to coat with a uniform thickness. This is a powerful filling method and voidless filling method that are not affected by viscosity.

  When various types of resin are filled into the vias of the wafer substrate or the laminated substrate, a strong printing pressure is required, and the resin is squeezed out from the via due to the squeegee biting or the viscosity of the resin, and further contracted by curing. In order to cover this, various masks are used to precisely align, fill and interpolate, but a convex hard plug is formed, which is very difficult to polish. This is a hole filling method that directly fills the workpiece 2 without any stencil, precision alignment device, and cleaning device, and can cover the recesses and shrinkage of the resin with a void dress, thereby minimizing polishing.

  More specifically, a mask is positioned on the upper surface of the workpiece, a jig for forming a plug is positioned and printed on the lower portion, and plugs (convex printing) are formed on both surfaces of the workpiece, and then cured and polished. In this case, holes having different diameters are selected and printed, and then hardened and polished for each hole diameter. Further, with the miniaturization and the large-sized substrate, the mask pattern and the work pattern need to be printed separately in two times because the positions of the mask and the work are not aligned due to the elongation of polishing. When a plug is formed, it is difficult to polish, and it is necessary to use a device that uniformly grinds the plug and copper plating and manages the thickness and elongation. If boyidization is required, printing will be performed under vacuum, and if there is a mask, the apparatus will be equipped with alignment, cleaning, etc., which will be large and expensive like a plant, and will be a low productivity apparatus. There is a need for a hole filling method in which a plug is formed without using a jig or a mask with a voidless, so that holes of different diameters can be filled at the same time and processing is minimized.

In the solder bump forming, Japanese Open No. 2001-232758, and the solder paste printing method according to JP-A-10-34878 JP has been proposed. The biggest drawback of these methods is that the resin is filled with the rotation of the roller and the mask, and the resin remaining on the mask is scraped off with a scraper or blade, so that the filling power is extremely weak. In this method, the half range of the roller 30 contributes to filling, and the other half hinders resin filling. Japanese Open No. 2001-232758 in order to compensate for this is that pressurized air pressurized distance also long, high viscosity resins vary in amount of resin is not uniformly react. As a whole, the apparatus is quite large, so it is difficult to adopt it for a vacuum apparatus.

In addition, these systems are described with reference to FIGS. 16A and 16B, and the stencil (mask) 1 and the roller 30 are close to each other, and the resin m is supplied by the squeegee 601 disposed before and after the roller 30. Also, it is filled by removing . When filling the wide space of the stencil 1 or the work 2, the resin m only circulates around the roller 30 as indicated by the arrow 30x or the arrow 30y, and has a very large defect that hardly contributes to the filling.

Japanese Open No. 2001-232765, the rear portion of the roller is printed thicker extruded without being stopped resin m in total the difference in pressurization pressure becomes the internal pressure rises scraper forces and the resin m retract the resin m . Even if the space for filling is small, the majority contributes to filling, but the force to pull back the resin m from the middle also works, so that strong filling is not achieved and the printing shape cannot be controlled.

Unstable printing shape pressure between the rear of the blade and a rear roller 30 is pulled back at the rear of the Japanese open flat 10-34878 discloses also in small spaces roller half of filling power contribution effect is but weakly roller 30 Cannot be controlled. Further, the printing method having the blade or scraper shape described above has a defect that the resist is destroyed and peeled off when directly printing on the substrate formed of the resist. The stencil method has reached its limit due to the formation of finer bumps, and the method is almost changed to a method in which a pattern is formed with a resist. There is a need for basic technical elements that can directly print flat and convex shapes directly on workpieces that require space in a variety of shapes, with strong filling power.

  Japanese Patent Application Laid-Open No. 2001-232758 is that it is extremely difficult to change resin because the periphery of the roller is wrapped in a strong frame. The device must be disassembled and cleaned. Recently, there are many types of solder alone. In addition, it is necessary to perform various hole fillings for resin sealing, and the key to practical use is whether the resin can be easily changed with as little solvent as possible. The part that comes into contact with the resin must have a structure in which one squeegee can be easily removed and cleaned easily, leaving only one roll.

  Furthermore, in this method, since the periphery of the roller is completely sealed, air is also taken in at the boundary between the mask and the scraper. Japanese Patent Laid-Open No. 10-34878 also describes that when a solder paste is filled in a substrate on which vias are formed by various methods such as resist, air in the vias is taken into the resin, and the resin continues to rotate around the roller. The solder paste that is accumulated in proportion to the travel distance and contains a large amount of voids is supplied. Even if it is filled, the amount of solder is reduced and a precision bump cannot be manufactured, and voids are included inside. Also, recent solders are very susceptible to oxidation due to the miniaturization of the balls, which causes a major problem in the melting of the solder in the subsequent process.

  Further, in the above vacuum differential pressure printing method, since the plastic material strongly adheres to the workpiece 2 and the stencil plate 1 in the printing step of pressing and filling the plastic material m into the workpiece 2, the stencil plate 1 is separated from the workpiece 2. It is difficult to separate this plastic material in the process. The thus-adhered plastic material m hangs down from the stencil plate 1 while adhering to the stencil plate 1, and the shape of the sealing portion (package) is lost.

  Specifically, as shown in FIG. 17A, when the stencil printing method is performed using a high-viscosity plastic material m such as a resin, the plastic material m is applied to the stencil 1 and the workpiece (circuit board) 2. When adhering and separating the workpiece 2 from the stencil 1, the periphery of the sealing portion made of the plastic material m forming the sealing portion is pulled. Thereby, the edge part of the sealing part which consists of the plastic material m becomes thick, or the vicinity becomes thin, and thickness nonuniformity generate | occur | produces. Further, since the plastic material m hanging from the stencil 1 adheres to the back surface of the stencil 1 or drops to the workpiece 2 due to the reaction of cutting, each time the printing method is performed, the stencil 1 or the workpiece 2 cleaning is essential. In addition, the amount of the plastic material m to be used for printing also becomes a factor that varies.

  In addition, as shown in FIG. 4B, in order to flatten the sealing portion having the above thickness unevenness, an attempt is made to leave it in the atmosphere for a certain period of time, but the plastic material m is cured. If the viscosity is lowered in the middle of the process, this causes a problem that it flows out and the shape of the sealing part is broken. As countermeasures, attempts have been made to reduce the flow of the plastic material m by a cavity down method, or to make a dam-shaped weir that regulates the flow of the plastic material m in advance with a dispenser or the like, but the manufacturing process is complicated. There is a problem of becoming.

  In solder bump formation, the viscosity of the solder paste is extremely high, and various filling methods have been proposed. However, when the pitch is narrowed, the aspect ratio becomes large, the difference between the adhesive strength of the solder paste filled in the workpiece 2 and the adhesive strength due to the area of the side wall is reduced, the transfer is very unstable, and the resin comes out of the stencil, There are cases where some parts are left out, and there are cases where they do not come out, and it has been compensated by measures to reduce adhesion by improving the shape and surface roughness of the stencil and coating the release material. Is now required not to remain. This is the dispensing method of the solder paste filled in the stencil holes.

  In order to cope with the miniaturization, a method of making a mask with a resist on a wafer substrate or a resin substrate, filling the vias with solder by air printing, reflowing, and peeling the resist is carried out. When air printing is performed, air remains inside and the filling amount is insufficient. Furthermore, air proportional to the travel distance is accumulated in the solder during printing, and the amount of solder is insufficient. In addition, since a squeegee is used, it is viscous and printed in a concave shape, and the amount of solder is insufficient. It also causes voids inside the bumps. A method of quantitative filling with a solderless solder resin is desired.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing an electronic component suitable for manufacturing a precise electronic component.

  The present invention relates to an electronic component printing apparatus in which a plastic material is pressed and filled into a workpiece that is horizontally positioned with one surface facing upward, and an axial end portion is supported in the vicinity of the workpiece. A roller having a peripheral surface close to one surface of the workpiece, a moving unit that moves the roller along one surface of the workpiece, and a direction in which the moving unit rolls forward with respect to a moving direction in which the roller moves. Rotating means for rotating the roller, and a squeegee that is pressed against one surface of the workpiece in proximity to or in contact with the roller.

  Further, the present invention relates to a printing apparatus for electronic parts in which a plastic material is pressed and filled into a workpiece positioned horizontally with one surface facing upward, and an axial end portion is provided in the vicinity of the workpiece. A roller that is supported and has a peripheral surface close to one surface of the workpiece, a moving means that moves the roller along one surface of the workpiece, and a forward rotation with respect to a moving direction in which the moving means moves the roller A rotation means for rotating the roller in a direction, a squeegee supported so as to be able to turn along the peripheral surface of the roller in proximity to or in contact with the roller, and a reaction force of torque that causes the rotation means to rotate the roller. Printing pressure generating means for pressing the squeegee against one surface of the workpiece. The concept of the workpiece includes at least a workpiece and a surface mounting portion such as an integrated circuit formed on one surface thereof.

  Furthermore, the rotating means includes a rotating machine having a rotor and a stator that are relatively rotatable and are mounted on the roller, and extends in the axial direction of the roller, penetrates the end of the roller, and projects the tip to the outside of the roller. A rotating shaft, a speed reducer that connects the rotor of the rotating machine to the supporting shaft, and a link member that extends in the radial direction of the roller from the vicinity of the tip of the supporting shaft to support the squeegee, and the rotor The squeegee receives a reaction force for rotationally driving the rotor, and transmits the rotation of the rotor to the support shaft while decelerating with the speed reducer.

  Further, the roller includes an inner casing that houses the rotating machine, and a cylindrical outer casing that is disposed around the inner casing and is rubber-lined, and the roller is disposed between the inner casing and the cylindrical outer casing. In addition, a gap for attracting air is provided.

  Further, the support shaft comprises a hollow shaft having one end evacuated and the other end communicated with the roller, and the roller is forcibly cooled by evacuating the air in the roller through the support shaft. It is characterized by that.

  Further, the printing pressure generating means includes a brake device that brakes rotation of the roller, and the rotating member rotates the link member with a reaction force of torque that rotates the roller against braking of the brake device. The squeegee is pressed against one surface of the workpiece by turning in a direction opposite to the rotating direction of the roller.

  Further, the moving means includes a pinion having a diameter equal to or less than a roller diameter coupled to an end portion of the roller, a rack laid on the side of the workpiece and extending in the moving direction, and rotatable inside the roller. A rotating machine having a rotor, meshing the rack with the pinion, and rotating the pinion together with the roller in accordance with the rotation of the rotor of the rotating machine, thereby moving the roller in the moving direction. It is characterized by.

  Furthermore, the moving means is characterized in that a bracket that rotatably supports the roller is moved in the moving direction by a drive source provided outside the roller.

Furthermore, the onset Ming, a stencil of the plastic material has a through hole pattern passable, characterized in that superimposed on a surface of the workpiece.

This onset Ming, an upper sealing chamber printing apparatus for pushing filled with plastic material to the work piece and that the stencil of the plastic material overlaps on one side of the workpiece has a through hole pattern passable houses having one surface, A lower sealed chamber for accommodating an alignment table defined in the upper sealed chamber across the stencil and positioning the workpiece in a horizontal posture with the one surface facing upward so that the height can be adjusted; the upper sealed chamber and the lower sealed chamber; And a differential pressure generating means for generating a differential pressure between the sealed chamber and the sealed chamber.

  Further, the differential pressure generating means includes a vacuum pump connected to the upper sealed chamber and the lower sealed chamber, two leak valves respectively connected to the upper sealed chamber and the lower sealed chamber, the upper sealed chamber, A stop valve that opens and closes between the lower sealed chamber and the vacuum pump, the vacuum pump evacuates the upper sealed chamber and the lower sealed chamber, and after printing, the two leak valves and the stop valve A combination of the operations described above is characterized by individually allowing or sealing the flow of air into the upper sealed chamber and the lower sealed chamber.

  Further, the present invention relates to a method for manufacturing an electronic component in which a plastic material is pressed and filled into a horizontally positioned workpiece, and the workpiece having one surface is positioned in a horizontal posture with the one surface facing upward. A step of waiting a roller connected to a rotating machine in a horizontal posture in the vicinity of the workpiece; a step of rotating the roller by the rotating machine and supplying the plastic material to a peripheral surface of the roller; The roller is moved along one surface of the workpiece while the peripheral surface of the roller is close to one surface of the workpiece, and at the same time, the roller is moved forward in the moving direction in which the roller moves. A step of rotating a roller by the rotating machine; and a squeegee that is supported along the circumferential surface of the roller in proximity to or in contact with the roller. Characterized in that it comprises the steps of pressing on one side of Kupisu, the.

  The present invention also relates to a method for manufacturing an electronic component in which a plastic material is pressed and filled into a horizontally positioned workpiece, and the workpiece having one surface is positioned in a horizontal posture with the one surface facing upward. And a step of superimposing a stencil having a through hole pattern through which the plastic material can pass on one surface of the workpiece, a step of waiting a roller connected to a rotating machine in a horizontal posture near the stencil, and Rotating the roller by the rotating machine and supplying the plastic material to the peripheral surface of the roller; and bringing the roller along the upper surface of the stencil while bringing the peripheral surface of the roller close to the upper surface of the stencil Rotating the roller by the rotating machine in a direction forwardly moving with respect to a moving direction in which the roller moves, The squeegee proximity or in contact with the over La is supported along the circumferential surface of the roller, characterized in that it comprises the steps of: pressing the stencil.

  The present invention also relates to a method for manufacturing an electronic component in which a plastic material is pressed and filled into a horizontally positioned workpiece, and the workpiece having one surface is positioned in a horizontal posture with the one surface facing upward. And a step in which a roller having a rotating machine with a rotor rotating around the stator is waited in a horizontal position in the vicinity of the workpiece, the roller is rotated by the rotating machine, and the plastic is provided on a peripheral surface of the roller. A step of supplying a material, and returning the excess plastic material to the roller peripheral surface, enabling powerful de-moulding if it is in a vacuum, and bringing the roller peripheral surface close to one surface of the workpiece while the roller is moved to the workpiece At the same time as moving along one surface of the piece, the roller is rotated by the rotating machine in a forward direction with respect to the moving direction in which the roller moves. And a step of pressing a squeegee adjacent to the roller and rotatably supported along the circumferential surface of the roller against one surface of the workpiece by a reaction force of torque that causes the rotating machine to rotate the roller; , Including.

  The present invention also relates to a method for manufacturing an electronic component in which a plastic material is pressed and filled into a horizontally positioned workpiece, and the workpiece having one surface is positioned in a horizontal posture with the one surface facing upward. And a step of superimposing a stencil having a through hole pattern through which the plastic material can pass on one surface of the workpiece, and a roller having a rotating machine in which a rotor rotates around the stator. A step of waiting in a posture, and a step of rotating the roller by the rotating machine and supplying the plastic material to the peripheral surface of the roller (the plastic material on the peripheral surface of the roller is strongly desorbed in a vacuum). The roller is moved along the upper surface of the stencil while the peripheral surface of the roller is close to the upper surface of the stencil. A step of rotating the roller by the rotating machine in a forward rotation direction with respect to the moving direction, and a squeegee supported so as to be rotatable along the peripheral surface of the roller in proximity to or in contact with the roller. And a step of pressing the stencil against the stencil by a reaction force of a torque that causes the rotating machine to rotate the roller.

Furthermore, the onset Ming, characterized in that it comprises a step of positioning the workpiece in the atmospheric pressure. Positioning the workpiece in a vacuum. In this case, excessive plastic material may adhere to the roller and circulate while touching the vacuum to perform strong defoaming. Alternatively, the step of positioning the workpiece in atmospheric pressure and the step of positioning the workpiece in vacuum are continuously combined.

The present invention also includes a step of superimposing a stencil having a through hole pattern penetrating the upper surface and the lower surface on a workpiece positioned in a horizontal posture, and bringing the lower surface of the stencil in proximity to the workpiece; a step you pressure supplying plastic material to a hole pattern, when the rollers are rotated by a rotating machine is moved along a surface of the workpiece at the same time, the roller in the direction of advance with respect to the direction in which the roller is moved is rotated, the squeegee to pivot along the circumferential surface of the roller, the steps of the rotating machine is pushed filled pre Symbol thermoplastic material by pressing the workpiece by the reaction force of the torque for rotating the roller, the Generating a differential pressure across the stencil so that the air pressure on the upper surface side of the stencil is higher than that on the lower surface side. And butterflies.

The present invention also includes a step of positioning the workpiece on an alignment table capable of adjusting the height in a horizontal posture, and a stencil having a through hole pattern penetrating the upper surface and the lower surface above the previous workpiece positioned on the alignment table. a step of supporting a horizontally, by adjusting the height of the alignment table, the steps of close the lower surface of the stencil to said workpiece, you pressure supplying plastic material to the through hole pattern of the stencil And at the same time, the roller rotated by the rotating machine is moved along one surface of the workpiece, and at the same time, the roller is rotated in a forward direction with respect to the moving direction of the roller, along the circumferential surface of the roller. The squeegee that turns is rotated by the reaction force of the torque that causes the rotating machine to rotate the roller. A step of pushing the filling pre Symbol thermoplastic material by pressing the scan, as the lower surface of pressure of the stencil is higher than the upper surface, that includes the steps of: generating a differential pressure across said stencil Features.

Furthermore, the onset Ming, by adjusting the height of the alignment table, characterized in that it comprises a step of separating the workpiece downwardly of the stencil. In addition, at least one of the air pressure on the upper surface side of the stencil and the air pressure on the lower surface side is set to atmospheric pressure or vacuum pressure. Further, the plastic material is a resin for insulatingly sealing the workpiece. The plastic material is a solder paste for forming solder bumps. Alternatively, the plastic material is a conductive paste or a non-conductive paste that fills the wafer and the resin substrate, and the through hole is blinded by laminating an adhesive film on the back surface, and the same diameter or different diameter holes are vacuumed at once. Filling, forming a convex plug, curing or semi-curing, and peeling back film.

Furthermore, the onset Ming, in the method described above, the plastic material is a conductive paste or non-conductive paste filling the wafer and the resin substrate, a step of pushing the filling under vacuum the plastic material, the plastic material Filling the plastic material in a vacuum or in the air after curing, or filling in the air after vacuum filling.

According to the present onset Akira, the following effects can be achieved. That is, while rotating a roller by a rotating machine, a plastic material is supplied to the peripheral surface of the roller, and while rotating the roller, the same along one surface of a circuit board and surface mounting (hereinafter referred to as “workpiece”). When the roller is moved linearly, the plastic material is pushed between the roller and the workpiece while adhering to the peripheral surface of the roller. On the other hand, the squeegee is pressed against one surface of the workpiece in the process of moving along the one surface of the workpiece while the roller rotates. In this state, the plastic material pushed between the roller and the workpiece is controlled by a squeegee having an angle and a length suitable for filling, while escaping backward with respect to the moving direction of the roller. The resin between the squeegee and the squeegee is also sealed.

  Therefore, the plastic material is sent by the rotation and movement of the roller between the roller and the workpiece, and is strongly pressed by the resultant force of the filling force of the squeegee and the filling force of the roller. The substrate is pressed and filled directly, and the squeegee angle and contact length, and the rotation speed and movement speed of the roller are adjusted to optimize the filling force according to the purpose. Can be printed regardless of the shape and area, and if the filling force is zero at the tip of the squeegee, the resin is cut flat, and if the filling force is positive, it is printed in a convex shape (Fig. 2). It is an epoch-making invention of basic elemental technology that fills and prints a member having a gap.

  In addition, if there is a slight gap between the squeegee and the roller, excess resin circulates around the roller.Using this, for example, when combined with vacuum, it adheres to the surface of the roller and circulates to expose the vacuum. Then, a completely defoamed plastic material (see reference numeral 235 in FIG. 11) is supplied, and a higher voidless than the conventional vacuum differential pressure method can be achieved. If the squeegee printing pressure, the roller rotation, and the moving speed can be adjusted independently, respectively, it can be easily adapted by optimizing for a wide range of applications.

  In order to reduce the size of the device to the limit and simplify it, the squeegee receives the reaction force that the rotor rotates, and the rotation of the rotor is transmitted to the spindle while being decelerated by the speed reducer. If configured, the following effects can be achieved. That is, the force for pressing the squeegee against the workpiece can be increased or decreased simply by adjusting the reaction force according to the viscosity of the plastic material, in other words, by adjusting the load applied to the roller. Further, since the pinion coupled to the end of the roller is engaged with a rack laid on the side of the workpiece and extending in the moving direction, and the roller is rotated by a rotating machine, the entire apparatus can be miniaturized to the limit. Control can be performed simply by forward, reverse, and stop, and any process can be realized immediately.

  Therefore, when the apparatus is placed in a vacuum with the intention of completely eliminating voids from the plastic material, the volume of the sealed chamber that forms such a vacuum, for example, can be greatly reduced, and actuators such as pneumatic equipment Therefore, it is possible to reduce the size of a vacuum pump or the like for evacuating the sealed chamber, reduce the strength of the sealed chamber, reduce the weight, reduce the tact time, and improve productivity. Alternatively, when the bracket for rotatably supporting the roller is configured to move in the moving direction by a drive source provided outside the roller, there is an advantage that the feeding amount of the plastic material can be freely adjusted. A little complicated.

  Further, in the case where the roller includes an inner casing that houses the rotating machine and a cylindrical outer casing that is disposed with a gap around the inner casing, the cylindrical outer casing is obtained by rotating the rotor of the rotating machine. At the same time, the inner casing rotates. These rotation directions coincide with the forward rotation direction with respect to the movement direction in which the entire roller moves along the upper surface of the stencil plate.

Also, by providing a gap between the inner casing of the roller and the cylindrical outer casing, the heat generated by the rotating machine is prevented from being conducted to the plastic material adhering to the peripheral surface of the roller, and the viscosity of the plastic material Can be prevented from changing under the influence of temperature. Furthermore, when the inner casing of the roller and the cylindrical outer casing are provided with through holes in both end flanges, and applied to a vacuum printing coater or a vacuum printing machine that is a part of the present invention, vacuuming is repeated. Can be positively cooled, so that the viscosity of the thermoplastic material can be reliably stabilized. For further forced cooling, the support shafts at both ends are hollow and connected to a vacuum pump. The roller is always made in a state of being polished by a squeegee contact with the resin and consumables, it is necessary that the cylindrical outer casing easily replaced, tubular outer casing in order that is valid.

Furthermore, according to this onset bright, the stencil having a through hole pattern for passing the thermoplastic material, be superimposed on a surface of the workpiece, it is possible to achieve the effects described above, CSP, an electronic component such as a BGA Compared with the conventional vacuum differential pressure printing method for surface-mounted substrates, the defoaming effect by rotating the roller and the effect of strengthening the filling force enable a higher degree of flatness and precise sealing with higher voids.

Further, according to this onset bright, the workpiece being positioned in a horizontal position, by superimposing the stencil having a through hole pattern penetrating the upper and lower surfaces, to void-less brought closer to the lower surface of the stencil in the workpiece, The upper and lower sealed chambers are evacuated and the workpiece is pressed and filled with the plastic material through the perforation pattern of the stencil by the above method. Since the atmospheric air can be allowed or sealed individually, the differential pressure across the stencil is controlled by operating each leak valve and stop valve so that the pressure on the upper surface side of the stencil is higher than the lower surface side. Is generated.

  As a result, the plastic material tends to be pushed downward from the through-hole pattern of the stencil, so that the plastic material is well transferred to the workpiece. If this is applied to bump formation, the solder paste filled in the high-aspect through-holes is transferred with adhesive force and differential pressure, and high-precision bump formation can be performed at a narrow pitch.

  Alternatively, by supporting the stencil having a through hole pattern penetrating the upper surface and the lower surface in a horizontal posture above the workpiece positioned in the horizontal posture as described above on the alignment table, and adjusting the height of the alignment table, With the upper and lower sealed chambers evacuated by bringing the underside of the stencil closer to the workpiece, supplying plastic material, starting the vacuum pump, and evacuating the upper and lower sealed chambers By the above method, the workpiece can be filled with the plastic material through the piercing pattern of the stencil. Further, by operating individual leak valves and stop valves, a differential pressure is generated across the stencil so that the air pressure on the lower surface side of the stencil becomes higher than that on the upper surface side.

  As a result, a small amount of air in the lower sealed chamber tries to pass upward between the plastic material and the periphery of the through hole pattern, so that when the plastic material is cut well from the periphery of the through hole pattern, It is possible to prevent the plastic material from flowing out to the periphery by lowering the viscosity during curing. It is an innovative method that can be applied mainly to resin sealing and achieve a precise shape.

  In particular, when the stencil has high rigidity and air is prevented from entering between the stencil and the work piece, the work piece can be separated downward from the stencil by adjusting the height of the alignment table. . As a result, the gap between the workpiece and the stencil can be positively widened, so that the air in the lower sealed chamber can easily pass between the two, and the above effect can be achieved regardless of the material and thickness of the stencil. Can be achieved. Furthermore, if at least one of the atmospheric pressure on the upper surface side or the atmospheric pressure on the lower surface side of the stencil plate is set to atmospheric pressure or vacuum pressure, it can be applied to the atmospheric printing method.

  In addition, when the above vacuum printing coater is used for sealing, the resultant force of the filling force of the squeegee and roller works, and the resin is strongly filled with unevenness and multiple wires in a very complicated shape, and the residual air is compressed. It is pushed out from the wall surface of the workpiece and the substrate or chip, then returned to atmospheric pressure and impregnated in every corner with differential pressure, and the surface is printed with the resin pressure set near zero at the tip of the squeegee and cut flat. A conventional vacuum printer supplies the resin with a squeegee, fills it with a vacuum differential pressure, and finishes it with a vacuum. However, if the resin is thinly covered on the upper part of the wire, it is not filled when the differential pressure is applied. There is a problem that the portion and the external pressure are short-circuited and cannot be filled, and that residual air remains as microvoids.

  In addition, when used for filling holes in a substrate, the through holes are filled by laminating an adhesive film on the back of the substrate, forming blind vias, using a maskless vacuum printing coater, filling and printing in vacuum, When it is impregnated with atmospheric pressure and the filling force is set to the plus side at the tip of the squeegee and printing is performed, a plug is formed on the upper surface (convex printing), and the lower portion is filled on the same surface as the substrate. This is semi-cured or cured to remove the film. This method can fill holes with different diameters at the same time, does not require a mask, does not require alignment, and greatly simplifies the polishing process. The conventional device was a simple plant but achieved an innovative hole filling method. did. Furthermore, if a workpiece with a high aspect is filled once and then cured and filled and cured again, perfect filling can be completed without any filling mistakes. Further, direct printing has an advantage that it can be refilled even if there is an unfilled portion, and there is no defective product.

  Furthermore, when applied to bump formation, vias necessary for bump formation are formed on the substrate with resist, filled with a print coater in a vacuum, without a mask, and returned to atmospheric pressure and impregnated, and the filling pressure at the squeegee tip is near zero. This was achieved by cutting the substrate flatly, reflowing and stripping the resist. In the trial production, a bump of 60 μm was formed with a solder paste having a particle size of 10 μm with SnAgCu, and it was easily formed with an error of 1 μm or less.

  In the following, a printing head will be described as an example of an electronic component printing apparatus E1 that presses and fills an appropriate amount of a plastic material into a workpiece 2 with the stencil 1 superimposed and one surface 21 facing upward, with reference to FIGS. . In addition, the directions indicated by arrows X, Y, and Z in the drawing respectively correspond to the following axial direction, moving direction, and height direction. Illustrations and descriptions of obvious machine elements such as bolts, nuts, keys, keyways, and bearings are omitted. Similarly, the control device for controlling the operation of the printing apparatus E1 and the sensor for detecting the operation / stop are also omitted.

  First, the principle of the print head of the printing apparatus E1 will be described. FIG. 1 shows a roller 3 whose circumferential surface is close to one surface 21 of the workpiece 2, a moving means 4 that moves the roller 3 along the one surface 21 of the workpiece 2 in the direction indicated by the arrow Y, and a moving means 4 Rotating means 5 that rotates the roller 3 in a forward direction with respect to the moving direction in which the roller 3 is moved, and a squeegee 6 that is pressed against one surface 21 of the workpiece 2 in proximity to or in contact with the roller 3.

  As the moving means 4, a ball nut 40 is attached to a bracket (not shown) that supports the roller 3, and a feed screw 41 that is screwed into the ball nut 40 is a drive source such as a motor disposed outside the roller 3. You may apply what moves the roller 3 by rotating. As the rotation means 5, a timing pulley 501 is attached to the output shaft of the rotating machine 50 disposed outside the roller 3, and the timing pulley 502 is provided on the support shaft 34 of the roller 3, and the rotational force of the output shaft of the rotating machine 50 is increased. Alternatively, a belt that transmits to the roller 3 via the timing belt 503 wound around the timing pulleys 501 and 502 may be applied.

  The squeegee 6 only needs to be supported by a support body not shown in the figure so as to be able to turn along the peripheral surface of the roller 3. You may make it press on the one surface 21 moderately. The printing pressure generating means 7 is rotatably attached to a smooth joint 70 provided in the vicinity of the roller 3 so as to be in an upright posture or an inclined posture, and its operating rod 71 is turned to the squeegee 6 via the smooth joint 72. Connect freely.

  Further, one of the pair of squeegees 6 shown in FIG. 1 is pressed against one surface 21 of the workpiece 2 by the printing pressure generating means 7, and the other is lifted from the one surface 21 of the workpiece 2. This is because an appropriate amount of the plastic material m is accumulated below the squeegee 6 positioned in the forward direction with respect to the moving direction Y of the roller 3, and the plastic material m gradually moves downward as the roller 3 rotates. It is intended to be drawn in and further compressed by a squeegee 6 located rearward with respect to the movement direction Y of the roller 3.

  Specifically, as shown in FIGS. 2A and 2B, the plastic material m supplied so as to adhere to the peripheral surface of the roller 3 moves to the lower side of the roller 3 as the roller 3 moves while rotating. It is gradually pulled in and compressed between one surface 21 of the workpiece 2 and the roller 3. The pressure applied to the plastic material m at this time reaches a peak value at a position P 1 where the plastic material m is substantially over the roller 3. Thereafter, the pressure drops until the squeegee 6 reaches the contact position P2 where the squeegee 6 contacts the one surface 21 of the workpiece 2, but is set so that the desired pressure can be maintained at the contact position P2. Accordingly, when filling a via or a through hole of the workpiece 2 (for example, a printed board or a wafer substrate), an appropriate pressure can be accumulated in the plastic material m filled in the via or the through hole. In addition, after the squeegee 6 passes, the plastic material m rises in a convex shape from the via or the through hole.

  Alternatively, as shown in FIGS. 2C and 2D, the plastic material m supplied to adhere to the peripheral surface of the roller 3 is between the one surface 21 of the workpiece 2 and the roller 3 as described above. Compressed. Then, the pressure applied to the plastic material m reaches a peak value at a position P3 that is substantially just below the roller 3, but thereafter, the pressure is set to be zero before reaching the contact position P4. As a result, no pressure remains in the plastic material m filled in the recess of the one surface 21 of the workpiece 2, so that the plastic material m maintains a flat shape even after the squeegee 6 passes as shown in the figure. Become. In order to be suitable for various applications, it is preferable that the rotation, movement, and pressure of the roller 3 can be adjusted independently. The best mode for embodying the above principle will be described in detail below.

  FIG. 3 is a front view of the printing apparatus E1. 4A is a side view of the printing apparatus E1, and FIG. 4B is a cross-sectional view taken along line AA in FIG. FIG. 5 conceptually shows the configuration of the main part of the printing apparatus E1. As shown in these drawings, the printing apparatus E1 is in the vicinity of both sides of a workpiece 2 (hereinafter simply referred to as “circuit board 2”) composed of a circuit board positioned in a horizontal posture and a surface mounting portion thereof. Both end portions 31 in the axial direction X are supported, and the roller 3 that has the peripheral surface 32 close to the one surface 21 of the circuit board 2 through the stencil 1 and the roller 3 is moved in the arrow Y direction along the one surface 21 of the circuit board 2. A moving means 4 for rotating, a rotating means 5 for rotating the roller 3 in the process in which the moving means 4 moves the roller 3, and a squeegee 6 which is close to the roller 3 and supported so as to be rotatable along the peripheral surface 32 of the roller 3. The rotating means 5 includes printing pressure generating means 7 that presses the squeegee 6 against the stencil 1 superimposed on the one surface 21 of the circuit board 2 by the reaction force of the torque that rotates the roller 3.

  The moving means 4 and the rotating means 5 share a rotating machine 50 built in the roller 3 as their respective driving sources. Details are as follows. That is, the moving means 4 includes a pair of pinions 10 respectively coupled to both end portions 31 of the roller 3 and a pair of racks 11 arranged so as to sandwich the circuit board 2 from both sides and fixed to a base or the like not shown in the drawing. And the rotating machine 50 described above. The pair of racks 11 extend in parallel with each other along the movement direction Y, and each of the racks 11 meshes with the pinion 10. In this state, the peripheral surface 32 of the roller 3 is slightly lifted from the stencil 1, and an appropriate gap is maintained between the stencil 1 and the roller 3. In the rotating machine 50, the stator 51 and the rotor 52 are relatively rotatable, and the rotor 52 is rotationally driven inside the cylindrical stator 51 extending in the axial direction X.

  When the rotor 52 is rotationally driven as described above, the pinion 10 is rotated together with the roller 3 accordingly. The reaction force of the rotation of the roller 3 and the pinion 10 is transmitted to the printing pressure generating means 7, and the printing pressure generating means 7 presses the squeegee 6 against the stencil 1 to keep the balance of force. This principle will be described later. When the pinion 10 rotates, the entire roller 3 moves along the movement direction Y to the right or left in the drawing (hereinafter referred to as “forward movement” or “reverse movement”). At the same time, the roller 3 rotates in the forward direction with respect to the direction in which the roller 3 moves forward or backward.

  That is, the roller 3 rotates clockwise in FIG. 4 when moving forward, and rotates counterclockwise when moving backward. Thus, the speed (circumferential speed) of the peripheral surface 32 of the roller 3 that “rotates forward” is generally determined by the ratio of the pitch circle of the pinion 10 to the diameter of the peripheral surface 32 of the roller 3. In the illustrated example, the peripheral speed of the roller 3 is set to a speed of about 1.2 to 1.5 times the moving speed of the roller 3 moving in the arrow Y direction.

  The rotating means 5 includes a pair of support shafts 34 extending in the axial direction X of the roller 3 and penetrating the pinions 10 and projecting from the tip 33 to the outside of the roller 3, and torque generated in the rotor 52 of the rotating machine 50. And a pair of link members 9 extending in the radial direction of the roller 3 from the vicinity of the respective distal ends 33 of the pair of support shafts 34. The pair of link members 9 respectively support both ends of a squeegee support bar 95 that pivotally supports the center of the squeegee 6 with pins 94, and the squeegee 6 can swing slightly with the pin 94 as a fulcrum. Each support shaft 34 can freely rotate with respect to the roller 3 and each pinion 10.

  The vicinity of each tip 33 of the pair of support shafts 34 is respectively supported by a pair of support pieces 35. The pair of support pieces 35 are fixed to a pair of linear motion guide bearings 36, respectively. Further, the pair of linear guide bearings 36 are slidably engaged with a pair of guide rails 37 extending in the moving direction Y, respectively. These members constitute a bracket 38 that slidably supports the roller 3 in the moving direction Y, and plays a role of guiding the roller 3 straight so that the pinion 10 is not detached from the rack 11.

The printing pressure generating means 7 is one in which a band brake 17 that moderately brakes the rotation of the roller 3, in other words, applies a load to the roller 3, is attached to one of the pair of support pieces 35. Since the speed reducer 8 and the band brake 17 are obvious techniques, detailed illustration is omitted, and only the principle that the printing pressure generating means 7 receives the reaction force of the rotation will be described. The speed reducer 8 described below is generally composed of a sector gear 91 directly connected to the rotor 52, a plurality of planetary gears 92 disposed around the sector gear 91, and a casing that houses the gears 91 and 92 .

That is, when the rotating machine 50 is started and the rotor 52 rotates, this rotation is transmitted to the roller 3 while being decelerated by the speed reducer 8. As a result, in the process in which the roller 3 rotates clockwise in FIG. 4, this reaction force is transmitted to one of the support shafts 34 (on the right side in FIG. 3) via the planetary gear 92 . Clockwise torque is generated. As a result, the squeegee 6 represented by a solid line in FIG. 4B is pressed against the stencil 1 superimposed on the one surface 21 of the circuit board 2. Alternatively, when the roller 3 is rotated in the counterclockwise direction in FIG. 4, a counterclockwise torque opposite to that when the rotor 52 is rotating forward is applied to one of the support shafts 34 as a reaction force of the rotation of the roller 3. appear. As a result, the squeegee 6 turns clockwise together with the one link member 9. When the squeegee 6 reaches the position on the right side represented by the phantom line in the drawing, it strikes the stencil 1 and stops.

  Each time the rotating machine 50 repeats forward / reverse rotation, the squeegee 6 repeats the above-described turning operation. Further, the printing pressure generating means 7 applies a load to the roller 3, in other words, the band brake 17 provides resistance to the rotation of the roller 3 by a frictional force obtained by tightening one of the both end portions 31 of the roller 3. Accordingly, the reaction force of the rotating machine 50 can be positively increased, and the force (hereinafter referred to as “printing pressure”) by which the squeegee 6 is pressed against the one surface 21 of the circuit board 2 can be adjusted as desired.

  In addition, although the above operation | movement of the squeegee 6 was described paying attention only to one link member 9, in fact, since the squeegee 6 is a long shape where the full length of the axial direction X reaches 30-90 cm or more, In order to adjust the printing pressure to a practical strength, an equal force must be applied to both ends of the squeegee support bar 95 so that the squeegee 6 does not bend or twist. Therefore, it is desirable to mechanically connect the pair of link members 9.

  For example, the pair of sector gears 91 are fixed to the pair of support pieces 35 of the bracket 38, and the planetary gears 92 that mesh with the individual sector gears 91 are rotatably attached to the appropriate positions of the individual link members 9, respectively. An interlocking mechanism formed by connecting a pair of planetary gears 92 with a connecting shaft 93 is added. As a result, the force for turning one link member 9 around one support shaft 34 is converted into torque for rotating the connecting shaft 93 by the gears 91 and 92 on the one link member 9 side. The torque is converted into a force for turning the other link member 9 around the other support shaft 34 by the gears 91 and 92 on the other link member 9 side.

  In addition, although an example in which one rotating machine 50 is mounted on one roller 3 is illustrated, two rotating machines 50 and two speed reducers 8 connected to the respective rotors 52 are provided on one roller 3. A pair of support shafts 34 may be driven individually. In this case, the two rotating machines 50 can electrically synchronize the drive circuits for driving the two rotating machines 50, and thus the above interlocking mechanism is not necessary. Further, output can be taken out from both ends of the rotor 52 of the rotating machine 50, the speed reducer 8 is individually connected to both ends of the rotor 52, and a pair of support shafts 34 is connected to each of the two speed reducers. good.

  Further, as described above, the moving means 4 attaches the ball nut 40 to the bracket 38 and rotates the feed screw 41 screwed to the ball nut 40 with a drive source such as a motor arranged outside the roller 3. In the case of a device, the above-described pinion 10 and rack 11 can be omitted. Further, the stencil 1 is not an essential element in the configuration and use of the printing apparatus E1, and may be omitted.

  Next, an electronic component manufacturing apparatus E2 incorporating the printing apparatus E1 (printing head) will be described with reference to FIGS. Further, the moving means 4 of the printing apparatus E1 is not limited to the configuration mainly composed of the rotating machine 50 built in the roller 3, but a ball nut or the like that is rotated by a driving source provided outside the roller 3 is used. As described above, the roller 3 may be moved. Fig.6 (a) is a front view of the manufacturing apparatus E2, and FIG. 7 is the front of the principal part. 8 and 9 are a side view and a plan view of the manufacturing apparatus E2, respectively. As shown in these drawings, the manufacturing apparatus E2 includes an upper sealing chamber 13 for storing the printing apparatus E1 and the stencil 1, a lower sealing chamber 14 for storing the alignment table 12, and a differential pressure generating means 15 to be described later. Prepare.

  The alignment table 12 can position the workpiece 2 in a horizontal posture with the one surface 101 facing upward. Specifically, the workpiece 2 is slid along the horizontal plane in a horizontal posture, and the workpiece 2 is rotated in a horizontal posture. Furthermore, the alignment table 12 can displace the position of the workpiece 2 positioned in this way in the height direction indicated by the arrow Z. This is referred to as “height adjustment” below.

  The upper sealing chamber 13 is formed by engraving the upper surface of the base 230 made of aluminum or steel square lump to form the recess 231 and the lower sealing chamber 14 in which the printing apparatus E1 and the stencil 1 can operate. A stencil 1 (see FIG. 13) attached to a frame 18 that can be opened and closed is provided. The pair of guide rails 37 are laid on the bottom surface of the recess 231, and the pair of racks 11 are laid at positions raised from the bottom surface. In addition, an insertion hole 234 is formed in the bottom surface of the recess 231, and the adjustment mechanism 121 disposed below the base 230 is connected to the alignment table 12 in the lower sealed chamber 14 through the insertion hole 234. .

  The adjustment mechanism 121 finely adjusts the position of the alignment table 12 in the horizontal direction in addition to the height adjustment of the alignment table 12. The base 230 is supported by a mount 232 that houses the adjustment mechanism 121 and the differential pressure generating means 15 inside. A space between the alignment table 12 and the insertion hole 234 is sealed with an O-ring or the like. An acrylic resin lid 233 is attached to the upper surface of the base 230 so as to be openable and closable to form the upper sealed chamber 13. The lid 233 has a rigidity that can withstand even if the degree of vacuum in the interior reaches 50 Pas to 100 Pas.

  The differential pressure generating means 15 generates a differential pressure between the upper sealed chamber 13 and the lower sealed chamber 14 in a state where the upper sealed chamber 13 and the lower sealed chamber 14 are separated from each other by a stencil 1 described later. is there. For example, the differential pressure generating means 15 includes one vacuum pump 151 connected to both the upper sealed chamber 13 and the lower sealed chamber 14, and two leak valves 152 connected to the upper sealed chamber 13 and the lower sealed chamber 14, respectively. , 153. Further, a leak valve 152 and a stop valve 155 are provided in the upper sealed chamber 13 between the upper sealed chamber 13 and the lower sealed chamber 14 and the vacuum pump 151 as shown in the piping system diagram of FIG. In addition, a leak valve 153 and a stop valve 154 are connected to the lower sealing chamber 14, and by combining the operations of these valves, a vacuum can be generated freely in the upper sealing chamber 13 and / or the lower sealing chamber 14, and the plastic material Can be cut and dispensed.

Next, a method for manufacturing an electronic component in which the circuit board 2 positioned on the alignment table 12 is filled with an appropriate amount of the plastic material m will be described. In addition, the plastic materials that can be handled by the method include liquid resins such as epoxy resins mixed with filler (for sealing), and conductive paste / epoxy resins having a copper or silver content of 80% or more with an epoxy resin as a binder. A non-conductive paste (for filling holes), a solder paste (for forming bumps), and a polyimide resin / liquid resist (for insulating a workpiece) mixed with a filler such as copper or silica gel are included.

First, as shown in FIGS. 10 and 11, the circuit board 2 is positioned on the alignment table 12. Positioning of the circuit board 2 is performed by positioning pins that are not displayed in the figures provided in the alignment table 12. In this state, it does not matter whether the atmosphere in which the circuit board 2 is placed is atmospheric pressure or vacuum. Further, the stencil 1 may be superposed on the circuit board 2. The stencil plate 1 is not necessary when an appropriate position of the one surface 21 of the circuit board 2 is previously laminated (coated) with a film or the like, but in the following, a through-hole pattern (opening portion) penetrating the one surface 101 and the other surface 102 is used. ) An example in which the stencil plate 1 having 103 is applied will be described.

Subsequently, the roller 3, as shown in FIG. 10, for example, to stand in the vicinity of the stencil 1. In this state, as shown in FIG. 11A, the plastic material m is supplied to the circumferential surface 32 of the roller 3 or one surface 101 of the stencil 1. Then, the roller 3 is moved forward along the one surface 101 of the stencil 1 while the peripheral surface 32 of the roller 3 is brought close to the one surface 101 of the stencil 1, and at the same time, the roller 3 moves forward with respect to the moving direction Y in which the roller 3 moves. The roller 3 is rotated by the rotating machine 50 in the direction. Thereby, the plastic material m adhering to the peripheral surface 32 of the roller 3 is pushed in between the moving roller 3 and the stencil 1.

  In this process, if the heat generated by the rotating machine 50 built in the roller 3 is conducted to the plastic material m attached to the peripheral surface 32 of the roller 3, the viscosity of the plastic material m changes under the influence of temperature. There is. Therefore, as shown in FIG. 12A, the roller 3 is provided with an inner casing 53 that houses the rotor 52 (not shown) of the rotating machine 50, and a gap 54 of about 2 mm around the inner casing 53. It is good also as a double structure provided with the cylindrical outer casing 55 arrange | positioned. Thereby, it is possible to prevent the heat generated by the rotating machine 50 from being conducted to the plastic material m through the peripheral surface 32 of the roller 3. Further, when the rotor 52 of the rotating machine 50 is rotated, the cylindrical outer casing 55 is rotated together with the inner casing 53. This rotational direction is a direction that rolls forward with respect to the moving direction in which the entire roller 3 moves along the upper surface of the stencil 1.

  Further, the vacuum pump 151 may be configured to attract air to the gap 54. In this case, as shown in FIG. 12 (b), a plurality of vent holes 57 communicating with the gap 54 are formed at both end portions 31 of the roller 3, and a hollow shaft is applied to the pair of support shafts 34 of the roller 3. The air gap 54 is connected to the above-described vacuum pump 151 through the inner holes 58 of these hollow shafts. When the vacuum pump 151 is activated, air is introduced into the roller 3 from the plurality of air holes 57, and the air is further discharged out of the roller 3 by the vacuum pump 151. Thereby, since the roller 3 and the rotary machine 50 can be positively cooled, the viscosity of the thermoplastic material m can be reliably stabilized. Further, when the roller 3 is not rotated, it is preferable to completely cut off the electric power supplied to the rotating machine 50 so that the rotating machine 50 does not release extra heat.

  In addition, a rubber lining (covering material) is provided on the peripheral surface 32 of the roller 3 so that the plastic material m attached to the peripheral surface 32 of the roller 3 is favorably pressed between the roller 3 and the stencil 1. Then, adhesion of the plastic material m to the roller 3 may be promoted. Further, since the rubber product wears relatively quickly, the roller 3 can be made to have a double structure as described above from the viewpoint that only the cylindrical outer casing 55 can be removed from the roller 3 when replacing the lining. preferable.

  Subsequently, while the roller 3 rotates and passes over the stencil 1, the squeegee 6 is pressed against the one surface 101 of the stencil 1 by the reaction force of the torque that causes the rotating machine 50 to rotate the roller 3. For this reason, the squeegee 6 restricts the plastic material m pushed between the roller 3 moving forward and the stencil 1 as described above to escape backward in the direction in which the roller 3 moves forward. The Accordingly, the sheet is supplied into the through-hole pattern 103 while being pressurized appropriately between the roller 3 and the stencil 1 moving forward (pressure supply). Thereby, the plastic material m is surely pushed and filled into the one surface 21 of the circuit board 2. The degree to which the plastic material m is pressed as described above is adjusted for the above-mentioned printing pressure in consideration of the viscosity of the plastic material m, the moving speed of the squeegee 6, the angle of the squeegee 6, and the contact length of the resin. And setting / adjustment of the rotation speed of the roller 3 can be set as desired.

  When the stencil 1 is omitted, the squeegee 6 may be brought into direct contact with the one surface 21 of the circuit board 2, but a wide print area is opened in the above-mentioned holding plate or holding frame, leaving no resin on the board. Have a hand-over role. Further, the squeegee 6 may have a vertically symmetrical shape as illustrated in FIG. 11 so that a predetermined leveling effect can be achieved regardless of the forward or backward movement of the roller 3, but both edges (in the drawing) The upper and lower portions) may be asymmetrical. In this case, when the roller 3 moves forward or backward, the plastic material m is used for indentation filling on the forward side, and the angle and contact length of the squeegee 6 are set, and the reverse side makes the surface flat. The angle and length are decided by making it convex or convex.

  Next, another method for manufacturing an electronic component will be described. First, as shown in FIG. 13, the frame 18 is provided at a position corresponding to the base 230 directly above the alignment table 12, and the stencil 1 is positioned in a horizontal posture on the frame 18. On the other hand, the circuit board 2 is positioned on the alignment table 12 in a horizontal posture in the above manner. By appropriately adjusting the height of the circuit board 2, the one surface 21 of the circuit board 2 is brought close to the other surface 102 of the stencil 1.

  Subsequently, the method described as the third embodiment is applied, and the upper sealed chamber 13 and the lower sealed chamber 14 are simultaneously evacuated by the vacuum pump 151. In this process, the voids hidden in the plastic material m under atmospheric pressure can be completely discharged (defoamed). By pressing and supplying the plastic material m to the through-hole pattern 103 of the stencil plate 1, the circuit board 2 is pressed and filled with the plastic material m. Further, the differential pressure generating means 15 is activated between the upper sealed chamber 13 and the lower sealed chamber 14 separated by the stencil 1 to generate a differential pressure.

  If the stop valve 155 shown in the piping system diagram of FIG. 6B is closed and the leak valve 152 is opened, the pressure in the upper sealed chamber 13 increases. Thereby, the plastic material m tends to be pushed out from the through hole pattern 103 of the stencil plate 1. Further, if the alignment table 12 is slightly lowered, the plastic material m is transferred to the circuit board 2 satisfactorily without remaining in the through hole pattern 103 as shown in FIG. Thereafter, the upper sealed chamber 13 and the lower sealed chamber 14 are returned to atmospheric pressure, the cover 233 is opened as shown in FIG. 8, the frame 18 and the stencil 1 are opened, and the circuit board 2 can be removed from the manufacturing apparatus E2. A series of manufacturing processes is completed.

  Next, still another method for manufacturing an electronic component will be described. As shown in FIG. 14, the point that the stencil 1 is positioned on the frame 18 and the circuit board 2 is positioned on the alignment table 12 is the same as in the fourth embodiment. Further, by appropriately adjusting the height of the circuit board 2, the one surface 21 of the circuit board 2 is brought close to the other surface 102 of the stencil 1, and the upper sealed chamber 13 and the lower sealed chamber 14 are simultaneously vacuumed by the vacuum pump 151. In this state, the point that the circuit board 2 is filled with the plastic material m is the same as in the fourth embodiment.

  Subsequently, a differential pressure is generated across the stencil 1. If the stop valve 154 shown in the piping system diagram of FIG. 6B is closed and the leak valve 153 is slightly opened, the internal pressure of the lower sealed chamber 14 increases, so the pressure on the other surface 102 side of the stencil 1 is one surface 101. Higher than the side. As a result, a slight amount of air in the lower sealing chamber 14 tends to pass upward between the plastic material m and the peripheral edge of the through hole pattern 103, so that the plastic material m is well cut from the peripheral edge of the through hole pattern 103. The When the stencil 1 has high rigidity and air is prevented from entering between the stencil 1 and the circuit board 2, the height of the alignment table 12 is adjusted so that the circuit board 2 is separated downward from the stencil 1. By doing so, the gap between the circuit board 2 and the stencil 1 may be widened.

  The upper sealed chamber 13 and the lower sealed chamber 14 described in the fourth and fifth embodiments are not necessarily evacuated, and at least one of the atmospheric pressure on the one surface 101 side of the stencil 1 or the atmospheric pressure on the other surface 102 side is used. Or atmospheric pressure. The plastic material m may be a synthetic resin that insulates and seals the circuit board 2. Alternatively, the plastic material m may be a solder paste for forming solder bumps.

  The present invention is applicable to resin sealing of electronic components surface-mounted on a workpiece, formation of solder bumps on the workpiece, filling of a circuit board, resin coating of a circuit board, various manufacturing processes in the display field, and the like.

The conceptual diagram explaining the principle of the printing apparatus of the electronic component which concerns on embodiment of this invention. (A) The conceptual diagram explaining an example of the operation | movement of the printing apparatus of the electronic component which concerns on embodiment of this invention, (b) expresses the pressure on a vertical axis | shaft as a filling force, and the distance corresponding to each position of a roller and a squeegee (C) is a conceptual diagram for explaining another example of the operation, (d) is a graph showing the pressure as a filling force on the vertical axis, and the distance corresponding to each position of the roller and the squeegee. Graph represented on the horizontal axis. The front view which fractured | ruptured a part of printing apparatus of the electronic component of Example 1 of this invention. FIG. 4A is a side view of the electronic component printing apparatus according to the first embodiment of the present invention, and FIG. 1 is a conceptual diagram illustrating a main part of a printing apparatus for electronic components according to a first embodiment of the present invention. (A) is a front view of the manufacturing apparatus of the electronic component of Example 2 of this invention, (b) is the piping system | strain diagram. The front view of the principal part of the manufacturing apparatus of the electronic component of Example 2 of this invention. The side view of the manufacturing apparatus of the electronic component of Example 2 of this invention. The top view of the manufacturing apparatus of the electronic component of Example 2 of this invention. The conceptual diagram showing the process of the manufacturing method of the electronic component of Example 3 of this invention. (A) is a conceptual diagram showing the principle of the manufacturing method of the electronic component of Example 3 of this invention, (b) is a conceptual diagram showing the other example. (A) is sectional drawing which shows the modification of the roller applied to the manufacturing method of the electronic component of Example 3 of this invention, (b) is the end elevation. The conceptual diagram showing the process of the manufacturing method of the electronic component of Example 4 of this invention. The conceptual diagram showing the process of the manufacturing method of the electronic component of Example 5 of this invention. (A) is the conceptual diagram showing the manufacturing process of the electronic component by the squeegee of a prior art example, (b) is the conceptual diagram showing the finish. (A) is the conceptual diagram showing an example of the manufacturing process of the electronic component by the apparatus of a prior art example, (b) is the conceptual diagram showing the other example. (A) is a conceptual diagram showing the manufacturing process of the electronic component by the stencil of a prior art example, (b) is a conceptual diagram showing the other example.

Explanation of symbols

1: Stencil 101: One side 102: Other side 103: Through hole pattern (opening)
2: Workpiece (circuit board, surface mount part)
21: One surface 3: Roller 31: Both ends 32: Peripheral surface 33: Tip 34: Support shaft 35: Support piece 36: Linear motion guide bearing 37: Guide rail 38: Bracket 4: Moving means 40: Ball nut 41: Feed screw 5: Rotating means 50: Rotating machine 501, 502: Timing pulley 503: Timing belt 51: Stator 52: Rotor 53: Inner casing 54: Air gap 55: Outer casing 57: Vent hole 58: Inner hole 6: Squeegee 7: Printing pressure Generation means 70, 72: Sliding joint 71: Actuating rod 8: Reduction gear 9: Link member 91: Sector gear 92: Planetary gear 93: Connection shaft 94: Pin 95: Squeegee support bar 10: Pinion 11: Rack 12: Alignment table 121 : Adjustment mechanism 13: Upper sealed chamber 14: Lower sealed chamber 15: Differential pressure generating means 151 Vacuum pumps 152, 153: Leak valves 154, 155: Stop valve 17: Band brake 18: Frame body 230: Base 231: Recess 232: Base 233: Lid 234: Insertion hole E1: Printing device E2: Manufacturing device m: Plasticity Materials P1, P3: Position P2, P4: Contact position X: Axial direction Y, Z: Arrow, moving direction

Claims (6)

Superimposing a stencil having a through hole pattern penetrating the upper surface and the lower surface on a workpiece positioned in a horizontal posture to bring the lower surface of the stencil close to the workpiece;
A step you pressure supplying plastic material to the through hole pattern of the stencil,
A roller rotated by a rotating machine is moved along one surface of the workpiece, and at the same time, the roller is rotated in a forward direction with respect to a direction in which the roller moves, and is swung along a circumferential surface of the roller. a step of squeegee, the rotating machine is pushed filled pre Symbol thermoplastic material by pressing the workpiece by the reaction force of the torque for rotating the roller,
Generating a differential pressure across the stencil so that the air pressure on the upper surface side of the stencil is higher than the lower surface side;
The manufacturing method of the electronic component characterized by including. Positioning the workpiece in a horizontal position on a height-adjustable alignment table;
Supporting a stencil having a through hole pattern penetrating the upper surface and the lower surface in a horizontal position above the workpiece positioned on the alignment table;
Adjusting the height of the alignment table to bring the lower surface of the stencil closer to the workpiece; and
A step you pressure supplying plastic material to the through hole pattern of the stencil,
A roller rotated by a rotating machine is moved along one surface of the workpiece, and at the same time, the roller is rotated in a forward direction with respect to a direction in which the roller moves, and is swung along a circumferential surface of the roller. a step of squeegee, the rotating machine is pushed filled pre Symbol thermoplastic material by pressing the workpiece by the reaction force of the torque for rotating the roller,
Generating a differential pressure across the stencil so that the pressure on the lower surface side of the stencil is higher than the upper surface side;
The manufacturing method of the electronic component characterized by including.   The method of manufacturing an electronic component according to claim 2, further comprising a step of separating the workpiece downward from the stencil by adjusting a height of the alignment table.   4. The method of manufacturing an electronic component according to claim 1, wherein at least one of the atmospheric pressure on the upper surface side of the stencil and the atmospheric pressure on the lower surface side is set to atmospheric pressure or vacuum pressure.   The method for manufacturing an electronic component according to claim 1, wherein the plastic material is a resin for insulatingly sealing the workpiece. Method of manufacturing an electronic component according to claim 1乃Optimum 4 wherein the plastic material is a solder paste to form solder bumps.

Images