JP2009253110A - Adhesive injecting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve productivity by reducing contamination in a laminated wafer in the injection treatment of the adhesive of the laminated wafer when manufacturing a semiconductor device and a semiconductor circuit device. <P>SOLUTION: A device injects an adhesive into a gap between adjacent wafers of the laminated wafer in which at least two wafers are bonded, and has a coating, seal-curing, adhesive-injecting, and adhesive preparation chambers arranged in line. The coating chamber has a coating means for applying the resin of sealant onto the periphery end face of the laminated wafer. The seal-curing chamber has a sealant curing means for curing the applied resin. The adhesive injection chamber is used for injecting an adhesive into the gap between the adjacent wafers of the laminated wafer in which seal is formed by a vacuum differential pressure method. The adhesive preparation chamber is used for preparing an adhesive used in the adhesive injection chamber. The adhesive injection chamber has: an exhaust section for evacuating the air inside of the adhesive injection chamber; a gas introduction section for introducing gas into the adhesive injection chamber; and a liquid-contact section for receiving the adhesive from the adhesive preparation chamber to allow the adhesive to abut on the injection port of the adhesive formed on the periphery end face of the laminated wafer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to manufacturing of a stacked semiconductor device, and more particularly to an adhesive injection device for injecting an adhesive made of an insulating resin between stacked wafers when manufacturing a three-dimensional semiconductor device or a semiconductor integrated circuit.

  In semiconductor manufacturing, it is known to stack a plurality of wafers on which semiconductor devices or semiconductor integrated circuits have been fabricated in advance and electrically connect these stacked wafers with vertical wiring to form a three-dimensional semiconductor stacked circuit device. Yes. In the manufacture of this three-dimensional semiconductor laminated circuit device, a semiconductor device or a semiconductor integrated circuit is laminated together by laminating an upper layer wafer and a lower layer wafer prepared in advance, and an insulating resin is injected between the upper and lower two layers to produce a three-dimensional structure. Manufactures semiconductor laminated circuit devices.

  For example, in Patent Document 1, a plurality of semiconductor chips formed by cutting into chips are stacked in a container, and an insulating resin layer is injected between the semiconductor chips by injecting resin into the container through a plurality of slits. A method for manufacturing a semiconductor device for forming a semiconductor device is disclosed.

  Patent Document 2 discloses a method of injecting a resin by a vacuum differential pressure method by forming a seal by providing a rectangular Cu wall on the wafer surface when bonding the wafers when manufacturing a laminated wafer.

FIG. 16 is a diagram for explaining a process of injecting an insulating adhesive into a gap between wafers using a seal. In this injection step, the adhesive injection device 200 surrounds the Cu bump 201 provided on the wafer, forms the Cu wall 203 leaving a part of the entrance 204, and places it in the vacuum chamber (FIG. 16 (a)). In the vacuum state, the entrance 204 is immersed in the insulating adhesive 205 (FIG. 16B), and then N ₂ gas is leaked to break the vacuum state to the atmospheric state (FIG. 16C) to insulate the gap between the wafers. The adhesive 215 is injected (FIG. 16D).

  Patent Document 2 discloses a method of injecting a resin by a vacuum differential pressure method as a method of injecting a resin into a laminated wafer by arranging an adhesive all around the wafer without providing a seal on the laminated wafer. Has been.

  In FIG. 17, the adhesive injection device 210 includes a container 211 including an upper jig 212 and a lower jig 213, and an upper stage 213 and a lower stage 214 for fixing the container 211, in a vacuum chamber 215. The laminated wafer 220 is arranged in the 211. The vacuum chamber 215 is connected to an evacuation device 216 that evacuates the interior, an inert gas introduction unit 217 that introduces an inert gas into the interior, and an adhesive supply unit 218 that supplies an adhesive into the container 211. Has been.

  By introducing an inert gas into the container 211, a pressure difference is generated between the container and the laminated wafer, whereby an adhesive is injected from the entire circumference of the laminated wafer.

JP 2004-207416 A JP 2006-49441 A Japanese Patent Laid-Open No. 11-261001

  As described above, semiconductor chips formed by cutting a semiconductor wafer are stacked in a container, and when an insulating resin layer is formed by injecting resin between these semiconductor chips, the outer peripheral end face of the wafer is sealed, When injecting an insulating adhesive from the inlet into the gap between the wafers, the process of cutting the semiconductor wafer to form a semiconductor chip and the process of forming a seal on the outer peripheral edge of the wafer in a container of another device There is a need to do. For this reason, the semiconductor chip and the wafer on which the seal is formed are once taken out to the outside air when being introduced into the container for injecting the adhesive. At this time, it is exposed to the atmosphere of the outside air, and there is a problem that it may be affected by contamination such as adhesion of fine particles to the wafer surface.

  In addition, as described above, when the adhesive is injected from the entire circumference of the laminated wafer using a pressure difference between the container and the laminated wafer, the laminated wafer is placed in a single container. When the laminated wafer becomes larger due to processing, and the adhesive injection time increases, the increase in the injection time directly affects the increase in the manufacturing time of the semiconductor device, which causes a reduction in the production amount. is there.

  In addition, when the adhesive resin is injected between the wafers of the laminated wafers by the vacuum differential pressure method, the inside of the container is reduced to a vacuum state, so that the container is evacuated or the gas is released from the adhesive resin. Although it is necessary to perform foaming, the time required for each of these processes is different. Therefore, when the adhesive injection process is performed in an inline consistent process, the time required for the adhesive injection process greatly affects the overall processing time, and is a factor that suppresses the improvement in productivity of semiconductor device manufacturing. It has become.

  Accordingly, the present invention solves the above-described conventional problems, and reduces contamination of the laminated wafer and improves productivity in the process of injecting the adhesive of the laminated wafer in manufacturing a semiconductor device or a semiconductor circuit device. For the purpose.

  The present invention is an apparatus for injecting an adhesive into a gap between adjacent wafers of a laminated wafer in which at least two wafers are bonded together, and includes an application means for applying a sealing resin to the outer peripheral end surface of the laminated wafer. An application chamber, a seal curing chamber provided with a sealing material curing means for curing the applied resin, an adhesive injection chamber for injecting an adhesive by a vacuum differential pressure method into a gap between adjacent wafers of the laminated wafer on which the seal is formed, An adhesive preparation chamber for preparing an adhesive used in the adhesive injection chamber is provided in-line.

  The adhesive injection chamber of the present invention receives an adhesive from an exhaust part for evacuating the adhesive injection chamber, a gas introduction part for introducing gas into the adhesive injection chamber, and an adhesive preparation chamber. And a wetted part for bringing the agent into contact with the adhesive inlet formed on the outer peripheral end surface of the laminated wafer.

  In the present invention, a sealing material is formed on the laminated wafer by the coating chamber and the seal curing chamber, and the adhesive prepared in the adhesive preparation chamber is injected into the gap between the laminated wafers on which the seal is formed by the adhesive injection chamber. By arranging these chambers in-line via a gate valve, the adhesive injection process is performed in a consistent process without being exposed to the outside air.

  In this in-line arrangement, by setting the number of processing chambers according to the time required for each process, it is possible to mitigate the suppression of improvement in productivity due to variations in the processing time of each process.

  The adhesive injection device of the present invention includes an adhesive curing chamber provided with an adhesive curing means for curing the adhesive on the downstream side of the inline-arranged adhesive injection chamber. The adhesive curing chamber cures the adhesive injected into the gap between the laminated wafers in the adhesive injection chamber.

  The adhesive preparation chamber provided in the present invention includes a preheating chamber having an adhesive heating means for heating the adhesive and a defoaming chamber for discharging bubbles from the adhesive by decompression. The preheating chamber and the defoaming chamber, and the defoaming chamber and the adhesive injection chamber are connected via a gate valve.

  The preheating chamber heats the adhesive to reduce the viscosity of the adhesive and improves the injection speed during injection. The adhesive heated in the preheating chamber is sent to the defoaming chamber. In the defoaming chamber, air bubbles are discharged from the adhesive.

  By making the preheating chamber a separate chamber from the adhesive injection chamber, it is possible to prevent the laminated wafer and the adhesive from being affected by the temperature rise in the same chamber.

  In addition, by making the defoaming chamber separate from the adhesive injection chamber, the generation and collapse of bubbles generated when defoaming the adhesive prevents splashing of the adhesive and contamination of the wafer surface. be able to.

  The adhesive injection chamber is provided with a laminated wafer heating means for heating the laminated wafer. By heating the laminated wafer with the laminated wafer heating means, the viscosity of the adhesive is lowered, and the injection speed at the time of injection is improved.

  The gas introduction part provided in the adhesive injection chamber returns the pressure in the adhesive injection chamber to atmospheric pressure, and further pressurizes the adhesive injection chamber to atmospheric pressure or higher. Thus, a pressure difference is generated inside and outside the laminated wafer, and an adhesive is injected between the wafers of the laminated wafer by the differential pressure. By applying the pressure to atmospheric pressure or higher, the injection rate of the adhesive can be improved.

  Moreover, it is good also as a structure provided with two or more paths of an adhesive agent injection chamber and an adhesive agent preparation chamber with respect to a seal hardening chamber. By providing the plurality of paths, it is possible to mitigate an increase in processing time due to an increase in the adhesive injection time.

  The adhesive injection device of the present invention can perform a consistent process by performing a series of steps in each chamber connected inline by a gate valve, and can avoid the influence of contamination because it is not exposed to the outside air. .

  Note that one form of curing in the curing apparatus is an ultraviolet curable resin, and the resin applied by the coating apparatus is irradiated with ultraviolet rays to be cured. In another form of curing, the resin is a thermosetting resin, and the resin applied by the coating apparatus is heated and cured.

  ADVANTAGE OF THE INVENTION According to this invention, in the injection | pouring process of the adhesive agent of the laminated wafer in manufacture of a semiconductor device or a semiconductor circuit device, contamination of a laminated wafer can be reduced and productivity can be aimed at.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic diagram for explaining an outline of manufacturing a three-dimensional stacked semiconductor device. In FIG. 1, the stacked semiconductor device adheres the stacked wafer by injecting an adhesive in a gap between the portion of the stacked wafer on which the seal is formed and a seal forming step for forming a seal on the outer peripheral end surface of the stacked wafer. And performing a bonding process.

  FIG. 1 shows an example in which the seal forming process and the bonding process are arranged in an inline manner. The seal forming process is performed by the seal application unit 3 and the seal curing unit 4, and the bonding process is performed by the adhesive injection unit 6 arranged on the downstream side of the seal curing unit 4.

  The seal application unit 3 includes a coating device in the seal coating chamber 30, the seal curing unit 4 includes a curing device in the seal curing chamber 40, and the adhesive injection unit 6 injects an adhesive into the adhesive injection chamber 60. Equipment. Gate valves 111 and 112 are provided between the processing units of the seal application chamber 30, the seal curing chamber 40, and the adhesive injection chamber 60. Gate valves 110 and 113 are provided between the seal application chamber 30 and the outside air, and between the adhesive injection chamber 60 and the outside air.

  The seal application unit 3 introduces the laminated wafer 10 into the seal application chamber 30 through the gate valve 110, and applies a sealant resin to the outer peripheral end face of the introduced laminated wafer 10 to form a seal.

  The seal curing unit 4 introduces the laminated wafer 10 on which the seal is formed through the gate valve 111 into the seal curing chamber 40, and cures the resin of the introduced sealing material of the laminated wafer 10 by the seal curing device 41. As a result, the applied sealant resin is cured to form a seal. This seal detects a boundary portion in order to form a pressure difference for introducing an insulating resin as a sealant between adjacent wafers of the laminated wafer by a differential pressure method.

The seal curing unit 4 introduces the laminated wafer 10 whose seal has been cured through the gate valve 112 into the adhesive injection chamber 60 of the adhesive injection unit 6, and injects the adhesive 61 between the introduced laminated wafers 10. To do. The laminated wafer 10 into which the adhesive 61 has been introduced is led out to the outside air through the gate valve 113 of the adhesive injection chamber 60. The adhesive injection chamber 60 includes a vacuum pump 64 that evacuates the adhesive injection chamber 60 and a gas introduction unit 65 that introduces a gas such as N ₂ gas to return the adhesive injection chamber 607 to the atmosphere. The adhesive injection unit 6 is laminated by a vacuum differential pressure method using a pressure difference between a vacuum state caused by evacuation of the vacuum pump 64 and a pressure state caused by gas introduction of the gas introduction unit 65 or pressure caused by pressure exceeding the atmospheric pressure. An adhesive is introduced into the gap between the wafers 10.

  The seal application chamber 30 includes an elevating unit 33 that moves the container holding the insulating resin of the sealant up and down, and the adhesive injection chamber 60 is an elevating unit that moves the container holding the insulating resin of the adhesive up and down. 63.

  In the present invention, the laminated wafer 10 is held in a cassette in each process such as a seal forming process (seal application process, seal curing process) and an adhesion process (adhesive injection process, adhesive curing process) performed on the laminated wafer 10. This cassette is used as a unit. Thereby, a plurality of laminated wafers can be collectively processed.

  FIG. 2 is a view for explaining the cassette of the present invention. In addition, the cassette shown in FIG. 2 is an example, and is not limited to this configuration.

  2, the cassette 100 includes two frames 100a and 100b that sandwich the laminated wafer 10 in the front-rear direction in the axial direction, and connecting members (100c to 100e) that connect the two frames 100a and 110b. The connecting members (100c to 100e) can connect the frames 100a and 100b, hold the laminated wafer 10 in the cassette 100, and can also serve as a rotating roller that rotationally drives the laminated wafer 10.

  FIG. 2 shows a driving roller 100c that transmits a rotational driving force to the laminated wafer 10, a driven roller 100d that rotatably supports the laminated wafer 10, and rotates according to the rotational driving of the driving roller 100c, and a laminated member. The structure provided with the pressing roller 100e which hold | maintains by pressing the wafer 10 with respect to the driving roller 100c and the driven roller 100d is shown.

  FIG. 2A shows a configuration of only the cassette 100, and FIG. 2B shows a state in which the laminated wafer 10 is held in the cassette 100. FIG. The driving roller 100c is driven by a driving mechanism (not shown) and rotationally drives the laminated wafer 10 to be supported. The driven roller 100d rotates according to the rotation of the rotating laminated wafer 10. The driven roller 100d may be driven by being connected to the drive roller 100c via a transmission mechanism (not shown) or may be driven to rotate by a drive mechanism (not shown).

  The pressing roller 100e can be moved toward and away from the installed laminated wafer 10, and the laminated wafer 10 can be held in the cassette 100 by contacting and holding the laminated wafer 10 from above in FIG. it can. Although a mechanism for pressing the pressing roller 100e against the laminated wafer is not shown in FIG. 2, it can be pressed by, for example, a pressing spring.

  3 and 4 are diagrams for explaining the outline of the operation of the adhesive injection device of the present invention. FIG. 3 shows a flowchart, and FIG. 4 shows an example of each state of operation.

  First, a seal is formed on the outer peripheral end surface of the laminated wafer 10 except for the injection port. This seal forming step includes a step of applying a sealing material resin to the outer peripheral end surface of the laminated wafer 10 (FIG. 4A) (S1a), and a step of curing the applied sealing material resin (FIG. 4B). (S1b). The sealing material 41 is cured by the seal curing device 41. For example, when the resin is an ultraviolet curable resin, the seal curing device 41 is cured by irradiating ultraviolet rays, and when the resin is a thermosetting resin, it is cured by heating (S1).

Next, an adhesive made of an insulating resin is injected between the laminated wafers 10. The adhesive is injected by evacuating the container containing the laminated wafer 10 with a vacuum pump (S2a), bringing the adhesive into contact with the laminated wafer 10 by contacting the adhesive (S2b), and then placing N into the container. By introducing _two gases or the like, the internal pressure is released to atmospheric pressure or pressurized to a pressure higher than atmospheric pressure, and the wetted adhesive is applied to the inside of the laminated wafer 10 by using the differential pressure inside and outside the laminated wafer 10. Inject. In the injection of the adhesive, in order to facilitate the injection into the laminated wafer 10, the adhesive may be heated to lower the viscosity of the adhesive (S2c). Thereby, the adhesive 61 is injected between the wafers of the laminated wafer 10 (S2).

  After injecting an adhesive between the wafers of the laminated wafer 10, excess adhesive adhering to the injection port is wiped off. For example, the adhesive can be wiped by bringing the wiping material of the wiping device 81 into contact with the inlet of the laminated wafer 10 (FIG. 4D) (S3). After the excess adhesive is wiped off, the injected adhesive is cured to bond the laminated wafer. The adhesive can be cured by heating, for example (FIG. 4 (e)) (S4).

  After the adhesive is cured, the laminated wafer 10 is taken out from the adhesive injection device (S5).

  In the present invention, these steps for the laminated wafer 10 are performed in units of cassettes with a plurality of laminated wafers 10 attached to the cassette 100.

  Hereinafter, the structure of the seal | sticker application part 3 of a seal | sticker formation apparatus is demonstrated using FIGS. This configuration example is an example in which the outer peripheral end face of the laminated wafer is continuously sealed by bringing a coating roller into which a sealing material resin has penetrated into contact with the outer peripheral end face of the laminated wafer, and rotating the laminated wafer.

  First, a configuration example of the seal application unit 3 of the seal forming apparatus will be described. FIG. 5 is a schematic plan view of the configuration example, and FIG. 6 is a schematic perspective view of the configuration example.

  5 and 6, the seal application unit 3 introduces the laminated wafer 10 held in the cassette 100, and applies a sealing material resin to the outer peripheral end face of the laminated wafer 10. The laminated wafer 10 is placed on the driving roller 100c and the driven roller 100d of the cassette 100, and pressed and held downward by the pressing roller 100e. The pressing roller 100e presses the laminated wafer 10 downward by a pressing spring 35, for example. The driven roller 100d may be a driving roller. The laminated wafer 10 is axially rotated by a driving roller 100c driven by a driving mechanism (not shown).

  Further, the seal application unit 3 includes an application roller 34 that contacts the outer peripheral end surface 11 of the laminated wafer 10 and applies a resin as a seal material. Moreover, the container 32 holding the resin 31 of a sealing material is provided. A part of the application roller 34 is immersed in the resin 31 of the sealing material held in the container 32 to impregnate or adhere the resin of the sealing material to the roller surface.

  The seal application unit 3 rotates the laminated wafer 10 by the driving roller 100c, the driven roller 100d, and the pressing roller 100f, and presses the application roller 34 against a part of the outer peripheral end surface 11 of the laminated wafer 10. Since the resin of the sealing material 31 is impregnated or adhered to the roller surface of the application roller 34, the resin of the sealing material is removed from the roller surface to the outer periphery by bringing the application roller 34 into contact with the outer peripheral end surface 11 of the laminated wafer 10. It is transferred to the end surface 11 and resin is applied to the outer peripheral end surface 11.

  In addition, by contacting the outer peripheral surface of the application roller 34 with the scraper 36, the resin adhered excessively to the roller surface is removed, and the amount of resin on the application surface contacting the outer peripheral end surface 11 of the laminated wafer 10 is kept constant. Can do.

  Next, the resin coating operation of the sealing material will be described using the flowchart of FIG.

  First, the laminated wafer 10 is attached to the seal application unit 3 (S11), and the application roller 34 is raised by a raising mechanism (not shown) and brought into contact with the starting point 37a of the laminated wafer 10 (S12a).

  After making contact with the starting point 37a of the laminated wafer 10, the laminated wafer 10 is rotated by the driving roller 100c, and the sealing resin 31 is transferred from the coating roller 34 to the outer peripheral end face 11 of the laminated wafer 10.

  The resin 31 is applied while rotating the laminated wafer 10. As a result, on the outer peripheral end face 11 of the laminated wafer 10, the sealing material resin 31 is applied to the application range 12, and the sealing material resin 31 is not applied to the application exclusion range (S12b).

  After the resin 31 is applied, the application roller 34 is moved from the outer peripheral end surface 11 of the laminated wafer 10 by an elevating mechanism (not shown) to separate the application roller 34 from the outer peripheral end surface 11 of the laminated wafer 10 (S12c). A coating process is performed by S12a-S12c (S12).

  In the seal application unit 3, the resin of the sealing material is applied to the outer peripheral end surface 11 of the laminated wafer 10, and then the laminated wafer 10 is moved to the seal curing unit 4. In the seal curing unit 4, the resin applied to the laminated wafer 10 is cured. For example, when the resin is an ultraviolet curable resin, the resin is cured by irradiation with ultraviolet rays, and when the resin is a thermosetting resin, the resin is cured by heating (S13). After the resin of the sealing material is cured, the laminated wafer is taken out from the seal forming apparatus (S14), and then an adhesive is injected into the gap between the wafers of the laminated wafer to adhere the wafer.

  Next, a configuration example of the adhesive injection part 6 will be described. FIG. 8 is a schematic plan view of the configuration example, and FIG. 9 is a schematic perspective view of the configuration example.

  8 and 9, the adhesive injection unit 6 introduces the laminated wafer 10 held in the cassette 100, and injects the adhesive between the wafers of the laminated wafer 10 in which the sealing resin 31 is formed on the outer peripheral end surface. To do. The laminated wafer 10 is mounted in the adhesive injection chamber 60 with the injection port 16 positioned in the cassette 100 at the lower position. At this time, the phase alignment of the plurality of laminated wafers 10 is completed in the seal application unit 3.

  The adhesive injection unit 6 includes a container 62 that holds the insulating resin of the adhesive 61 in order to inject the adhesive in contact with the injection port 16 of the laminated wafer 10. The adhesive injection chamber 60 includes a vacuum pump 64 that depressurizes the inside to a vacuum, and a gas introduction unit 65 that introduces a gas to return or pressurize the inside.

  The container 62 can be moved up and down by an elevating part 63. By raising the container 62, the adhesive 61 is brought into contact with the inlet 16 of the laminated wafer 10, and by lowering the container 62, the adhesive 61 Can be separated from the inlet 16 of the laminated wafer 10.

  Next, the operation of injecting the adhesive resin will be described with reference to the flowchart of FIG. 10 and the diagram for explaining the injection operation of FIG.

  First, the inside of the adhesive injection chamber 60 is evacuated by the vacuum pump 64 (S21). The laminated wafer 10 in which the seal is formed on the outer peripheral end face by the seal forming step is introduced into the adhesive injection chamber 60 (S22), and the cassette 100 is positioned in the adhesive injection chamber 60 to position the laminated wafer 10 ( FIG. 11 (a)) (S23).

  In the laminated wafer 10 introduced into the adhesive injection chamber 60 in a vacuum state, the gap between the wafers of the laminated wafer 10 is also in a vacuum state. The elevating unit 63 is driven to raise the container 62, and the liquid of the adhesive 61 is brought into contact with the inlet 16 of the laminated wafer 10 (FIG. 11B) (S24).

Thereafter, N ₂ gas is introduced into the adhesive injection chamber 60 by the gas introduction unit 65, and the pressure in the adhesive injection chamber 60 is increased to atmospheric pressure or a pressure higher than atmospheric pressure. A pressure difference is caused between the inside and outside of the laminated wafer 10 by the pressure increase in the container due to this gas introduction. Due to this pressure difference, the resin of the adhesive 61 penetrates into the gaps between the wafers of the laminated wafer 10, and the adhesive can be injected. At this time, the adhesive 61 is heated to lower the viscosity of the adhesive 61, thereby facilitating the injection of the adhesive 61 (FIG. 11 (c)) (S25).

  After the injection of the adhesive 61 is completed, the elevating unit 63 is driven to lower the container 62, and the adhesive 61 is separated from the injection port 16 of the laminated wafer 10 (S26).

  The laminated wafer 10 into which the adhesive 61 has been injected is moved into the wiping chamber 80 of the wiping unit 8 while being held in the cassette 100 (S27).

  FIG. 12 is a diagram for explaining a configuration example of the wiping unit 8. In FIG. 12, the wiping unit 6 includes a wiping device 81 for wiping off excess adhesive adhering to the inlet 16 of the laminated wafer 10. The wiping device 81 is attached to the injection port 16 by, for example, attaching a wiping material 82 in an endlessly rotatable manner between two rollers, and contacting the injection port 16 of the laminated wafer 10 while rotating the wiping material 82. Wipe off any excess adhesive.

  The wiping device 81 can be moved up and down by an elevating unit (not shown). By lifting the wiping device 81, the wiping material is brought into contact with the inlet 16 of the laminated wafer 10 (S27), and the wiping material is rotated. The excess adhesive is wiped off (S28). After wiping off, the wiping device 81 is lowered and the cassette 100 is taken out from the wiping chamber 80 to take out the laminated wafer 10 (S29).

  Next, another configuration of the adhesive injection device of the present invention will be described with reference to FIG. In the configuration shown in FIG. 13, a plurality of adhesive injection chambers 60 </ b> A and 60 </ b> B are provided as the adhesive injection part 6 provided on the downstream side of the seal curing part 4.

  The adhesive injection chamber 60A is connected via a gate valve 112A, and the adhesive injection chamber 60B is connected via a gate valve 112B. The adhesive injection chamber 60A is a container 62A containing an adhesive 61, an elevating part 63A for moving the container 62A up and down, a vacuum pump 64A for evacuating the adhesive injection chamber 60A, and introducing gas into the adhesive injection chamber 60A. The adhesive injection chamber 60B includes a container 62B containing an adhesive 61, an elevating unit 63B that moves the container 62B up and down, a vacuum pump 64B that evacuates the adhesive injection chamber 60B, A gas introduction part 65B for introducing gas into the adhesive injection chamber 60B is provided.

  The laminated wafer 10 housed in the cassette 100 is introduced from the seal curing chamber 40A via the gate valves 112A and 112B.

  Here, when the injection speed performed in the adhesive injection section 6 is slower than the curing speed in the seal curing section 4, the processing speed of the laminated wafer depends on the speed of the adhesive injection section 6 where the processing speed is low. In the configuration shown in FIG. 13, the overall processing speed of the adhesive injection device is improved by increasing the number of the adhesive injection chambers 60 of the adhesive injection unit 6 having a low processing speed.

  FIG. 14 is a schematic configuration diagram for explaining the overall configuration of the adhesive injection device 1 of the present invention. In addition, the seal application part 3, the seal hardening part 4, the adhesive injection part 6, the wiping part 8 and the adhesive hardening part 9 described above are the respective constituent parts forming the entire adhesive injection device 1, and are shown in FIG. The configuration shown is one configuration example that makes the adhesive injection process more efficient.

  In FIG. 14, the adhesive injection device 1 includes a preprocessing unit 2, a seal application unit 3, a seal curing unit 4, an exhaust unit 5, an adhesive injection unit 6, and an adhesive preparation unit along the processing flow of the laminated wafer. 7, wiping unit 8, adhesive curing unit 9, pretreatment chamber 20, seal coating chamber 30, seal curing chamber 40, exhaust chamber 50, adhesive injection chamber 60 and adhesive preparation chamber 70 constituting each unit, wiping The chamber 80 and the adhesive curing chamber 90 are arranged in-line. The adhesive preparation chamber 70 is arranged in parallel with the adhesive injection chamber 60, the adhesive prepared in the adhesive preparation chamber 70 is moved to the adhesive injection chamber 60, and an adhesive injection process is performed. After the injection of the adhesive to the laminated wafer 10 is completed, the adhesive is again returned to the adhesive preparation chamber 70 to prepare for the injection of the adhesive in the laminated wafer 10 held in the next cassette 100.

  The adhesive preparation chamber 70 includes a preheating chamber 70a that heats the adhesive to lower the viscosity, and an adhesive defoaming chamber 70b that discharges bubbles in the reduced pressure adhesive. On the other hand, the adhesive injection chamber 60 includes a first adhesive injection chamber 60a and a second adhesive injection chamber 60b. The first adhesive injection chamber 60 a and the second adhesive injection chamber 60 b are arranged inline between the exhaust chamber 50 and the wiping chamber 80. The first adhesive injection chamber 60a receives the adhesive that has been degassed from the adhesive defoaming chamber 70b, and performs an adhesive injection process. On the other hand, the second adhesive injection chamber 60b is used for the injection process in the first adhesive injection chamber 60a and returns the remaining adhesive to the preheating chamber 70a. The preheating chamber 70a preheats the adhesive returned from the second adhesive injection chamber 60b again and sends it to the adhesive defoaming chamber 70b to perform the defoaming process.

  As described above, the adhesive circulates through the preheating chamber 70a, the adhesive defoaming chamber 70b, the first adhesive injection chamber 60a, and the second adhesive injection chamber 60b.

  In the above configuration, the laminated wafer 10 is attached to the cassette 100 in the pretreatment chamber 20 of the pretreatment unit 2. Subsequent processing of the laminated wafer 10 is performed in a state of being attached to the cassette 100. Further, a turbo molecular pump (TMP) and an oil rotary vacuum pump (DRP) are connected to the exhaust chamber 50 of the exhaust unit 5 to reduce the pressure in preparation for the pressure in the first adhesive injection chamber 60a. An oil rotary vacuum pump (DRP) is connected to the first adhesive injection chamber 60a and the adhesive defoaming chamber 70b.

  Further, the preheating chamber 70a is supplied with the adhesive from the adhesive supply chamber 70c and is replenished with the adhesive reduced by the injection of the adhesive.

  FIG. 15 is a flowchart for explaining an operation example of the adhesive injection device 1.

  In the flowchart of FIG. 15, the operation of the adhesive injection device 1 includes a seal formation process S10, an adhesive injection process S20, an adhesive wiping process S30, an adhesive curing process S40, a removal process S50 from the apparatus, Agent preparation processing S100.

  In the seal forming process S10, as shown in the flowchart of FIG. 7, the laminated wafer 10 installed in the cassette 100 is attached to the adhesive injection device 1 (S10a), and a sealing material is applied to the outer peripheral end face of the laminated wafer 10 (S10b The applied sealing material is cured (S10c), and the laminated wafer 10 is taken out from the apparatus for the sealing process in a state where it is installed in the cassette 100 (S10d).

  On the other hand, in the adhesive preparation process S100, the introduced adhesive (S101) is subjected to a preheating process and a defoaming process (S102).

  In the adhesive injection process S20, the adhesive 61 is brought into contact with the inlet of the laminated wafer 10 using the laminated wafer 10 that has been sealed by the seal formation process of S10 and the adhesive 61 prepared in the preparation process S100. (S20a) After heating and lowering the viscosity, the adhesive 61 is injected between the wafers of the laminated wafer 10 by releasing the pressure and releasing the pressure (S20b), and the injection is completed. (S20c), the laminated wafer 10 is separated from the adhesive 61 together with the cassette 100 (S20d).

  After the adhesive injection process S20, an adhesive wiping process S30, an adhesive curing process S40, and a removal process S50 from the apparatus are performed.

  According to the present invention, since a series of processing is performed in the line, it is not exposed to the external atmosphere, so that contamination of the adhesive to be injected can be prevented.

  The seal forming method and the seal forming apparatus of the present invention can be applied to a three-dimensional semiconductor device and a three-dimensional semiconductor circuit device.

It is the schematic for demonstrating the outline of manufacture of a three-dimensional laminated semiconductor device. It is a figure for demonstrating the cassette of this invention. It is a flowchart for demonstrating the outline of operation | movement of the adhesive agent injection apparatus of this invention. It is a figure which shows each state example of the operation | movement for demonstrating the outline of operation | movement of the adhesive agent injection apparatus of this invention. It is a schematic plan view for demonstrating the structural example of the seal application part of the seal | sticker formation apparatus of this invention. It is a schematic perspective view for demonstrating the structural example of the seal application part of the seal | sticker formation apparatus of this invention. It is a flowchart for demonstrating the application | coating operation | movement of resin of the sealing material of this invention. It is a schematic plan view for demonstrating the structural example of the adhesive agent injection part of this invention. It is a schematic perspective view for demonstrating the structural example of the adhesive agent injection part of this invention. It is a flowchart for demonstrating the injection | pouring operation | movement of resin of the adhesive agent of this invention. It is a figure for demonstrating the injection | pouring operation | movement of resin of the adhesive agent of this invention. It is a figure for demonstrating one structural example of the wiping off part of this invention. It is a figure for demonstrating another structure of the adhesive agent injection apparatus of this invention. It is a schematic block diagram for demonstrating the whole structure of the adhesive agent injection apparatus 1 of this invention. It is a flowchart for demonstrating the operation example of the adhesive agent injection apparatus of this invention. It is a figure for demonstrating the process of inject | pouring an insulating adhesive material into the clearance gap between wafers using the conventional seal | sticker. It is a figure for demonstrating the process of arrange | positioning the adhesive agent to the perimeter of the conventional wafer, and inject | pouring resin by a vacuum differential pressure method.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Adhesive injection apparatus, 2 ... Pre-processing part, 3 ... Seal application part, 4 ... Seal hardening part, 5 ... Exhaust part, 6 ... Adhesive injection part, 7 ... Adhesive preparation part, 8 ... Wiping part, 9 ... Adhesive curing part, 10 ... Laminated wafer, 10a to 10n ... Laminated wafer, 10A, 10B ... Wafer, 10C ... Interval, 11 ... Wafer end face, 12 ... Coating range, 13 ... Coating exclusion range, 14 ... Notch, 15 ... Orientation flat, 16 ... injection port, 17 ... positioning member, 18 ... seal, 20 ... pretreatment chamber, 30 ... seal application chamber, 31 ... seal material, 32 ... container, 33 ... elevating part, 34 ... application roller, 35 ... presser Spring, 36 ... Scraper, 37 ... Sealing material application part, 37a ... Application start part, 37b ... Application end part, 38 ... Holding roller, 40 ... Seal hardening chamber, 41 ... Seal hardening device, 50 ... Exhaust chamber, 60a, 60b ... adhesive injection chamber, DESCRIPTION OF SYMBOLS 1 ... Adhesive, 62 ... Container, 63 ... Elevating part, 64 ... Vacuum exhaust pump, 65 ... Gas introduction part, 70 ... Preheating chamber, 70a ... Defoaming chamber, 70c ... Adhesive supply chamber, 80 ... Wiping chamber, 81 ... Wiping device, 82 ... Wiping material, 90 ... Adhesive curing chamber, 91 ... Adhesive curing device, 110-113 ... Gate valve.

Claims (6)

An apparatus for injecting an adhesive into a gap between adjacent wafers of a laminated wafer in which at least two wafers are bonded together,
A coating chamber provided with a coating means for coating a resin of a sealing material on the outer peripheral end surface of the laminated wafer;
A seal curing chamber provided with a sealing material curing means for curing the applied resin;
An adhesive injection chamber for injecting an adhesive by a vacuum differential pressure method into a gap between adjacent wafers of the laminated wafer on which the seal is formed;
Arranged inline with an adhesive preparation chamber for preparing an adhesive used in the adhesive injection chamber,
The adhesive injection chamber is
An exhaust section for evacuating the adhesive injection chamber;
A gas introduction part for introducing gas into the adhesive injection chamber;
An adhesive injection device comprising: a liquid contact portion that receives an adhesive from the adhesive preparation chamber and makes the adhesive contact an adhesive inlet formed on an outer peripheral end surface of the laminated wafer.   The adhesive injection device according to claim 1, further comprising an adhesive curing chamber including an adhesive curing unit that cures the adhesive on a downstream side of the adhesive injection chamber of the in-line arrangement. The adhesive preparation room is
A preheating chamber having an adhesive heating means for heating the adhesive, and a defoaming chamber for discharging bubbles from the adhesive by decompression,
The defoaming chamber is formed by connecting the preheating chamber and the defoaming chamber and between the defoaming chamber and the adhesive injection chamber via a gate valve and heating the adhesive heated in the preheating chamber. The adhesive injection device according to claim 1, wherein an adhesive is sent from the defoaming chamber to the adhesive injection chamber. The adhesive injection chamber is
The adhesive injection device according to any one of claims 1 to 3, further comprising a laminated wafer heating means for heating the laminated wafer. The gas introduction part provided in the adhesive injection chamber is,
The adhesive injection device according to any one of claims 1 to 4, wherein the adhesive injection chamber is returned to atmospheric pressure, or the adhesive injection chamber is pressurized to atmospheric pressure or higher.   The adhesive injection device according to any one of claims 1 to 5, wherein a plurality of paths of the adhesive injection chamber and an adhesive preparation chamber are provided for the seal curing chamber.