CN113411987A

CN113411987A - PCB (printed circuit board) resistance welding process

Info

Publication number: CN113411987A
Application number: CN202110682212.2A
Authority: CN
Inventors: 尹新梅
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-06-20
Filing date: 2021-06-20
Publication date: 2021-09-17

Abstract

The invention discloses a PCB solder mask process, which comprises the following steps: the PCB resistance welding pretreatment, ink preparation, double-sided coating printing, dry treatment, exposure treatment, development treatment and thermosetting are characterized in that the ink preparation, the double-sided printing and the dry treatment are all completed by adopting an ink coating device, and the ink coating device comprises an ink pool fixed on a base, a frame for mounting the PCB, a turnover mechanism and a heating device; and a roller coating mechanism for coating ink on the PCB is arranged on the ink pool. The invention creatively concentrates all the ink configuration, double-sided printing and drying treatment in the solder resist process flow in the ink coating device to be completed, and the three processes can be synchronously operated in the device, thereby further saving the production and processing time of the PCB, and further greatly improving the processing efficiency.

Description

PCB (printed circuit board) resistance welding process

Technical Field

The invention relates to the technical field of PCB production, in particular to a PCB anti-welding process.

Background

At present, the conventional production flow of the PCB board includes: cutting material → pasting dry film and film → exposing → developing → etching → film removing → drilling → copper deposition electroplating → solder mask → silk screen printing → surface processing → forming → electric measurement. The outer layer board surface of the PCB board is distributed with a plurality of bonding pads needing to be pasted with components, the main function of the solder mask is to expose the bonding pads, and the part of the outer layer which does not need to be pasted with the components is protected by solder mask ink. The solder resist ink can prevent solder from flowing when components are soldered, so that the components are connected with tin to cause short circuit, and the solder resist ink has a protection effect. Because the ink has an important protection effect, the quality and efficiency of the solder resist ink have an important influence on the forming of the whole PCB in the normal process of the PCB, in the prior art, the ink is coated on the PCB usually by a single-side coating operation, the coating and drying operation of the other side can be carried out after the ink on the side is heated and dried, the PCB needs to move back and forth on different devices in the whole operation process, and the operation of technical personnel is troublesome.

Disclosure of Invention

The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, one objective of the present invention is to provide a PCB solder mask process, which creatively concentrates all the ink configuration, double-sided printing and drying processes in the solder mask process flow on an ink coating device to be completed, and the double-sided printing of the PCB is realized by the operation of a turnover mechanism in the ink coating device, and the three processes can be operated synchronously in the device of the present application, so as to further save the PCB production and processing time, thereby greatly improving the processing efficiency.

The invention provides a PCB (printed circuit board) solder mask process, which comprises the following steps: the PCB resistance welding pretreatment, ink preparation, double-sided coating printing, dry treatment, exposure treatment, development treatment and thermosetting are characterized in that the ink preparation, the double-sided printing and the dry treatment are all completed by adopting an ink coating device, and the ink coating device comprises an ink pool fixed on a base, a frame for mounting the PCB, a turnover mechanism and a heating device;

the ink pool is provided with a roller coating mechanism for coating ink on the PCB;

the frame is arranged on the turnover mechanism, and the frame enables two sides of the PCB to be in contact with the roller coating mechanism through the action of the turnover mechanism to complete printing and coating of ink;

the heating device is used for heating and drying the PCB coated with the printing ink.

Preferably, the frame is including having magnetic fixed block, movable frame and fixed frame, the top and the bottom of movable frame and fixed frame all are open structure, and the inside of movable frame and fixed frame all is provided with the storage tank with PCB board looks adaptation, the cross-section of storage tank is greater than the cross-section of opening part, one side of fixed frame edge horizontal direction fixed connection in fixed block wherein, one side rotation of movable frame and fixed block is connected, and movable frame and fixed frame cooperation can realize opening and shutting and install the PCB board in the storage tank.

Preferably, tilting mechanism is fixed in the bottom of fixed plate, and fixedly connected with is the support mounting panel of L type on the base, and the terminal surface is fixed with the cylinder under the horizontal end at support mounting panel top, and the piston rod of cylinder links to each other with the fixed plate top.

Preferably, heating device installs the lower terminal surface at the fixed plate, tilting mechanism is including distributing in the connecting rod of heating device both sides face and fixing the slide rail in the edge of heating device bottom both sides, the one end of connecting rod rotates with heating device's lateral wall to be connected, be formed with first spout along its length direction on the pole wall of connecting rod, the fixed block all rotates along its length direction's both ends and installs the spacing gyro wheel of second, the rolling surface embedding of the spacing gyro wheel of second is to first spout in and sliding connection with it, the fixed frame is kept away from the one end both sides of fixed block and all rotates and is connected with first spacing gyro wheel, the rolling surface embedding of first spacing gyro wheel is to the slide rail in and sliding connection with it, the lower terminal surface of fixed plate all is fixed with magnetism piece of inhaling in the both sides of heating device, the fixed block contacts with magnetism piece bottom and is stopped by it when being in the horizontality.

Preferably, a heating fan is arranged in the heating device, the lower end face of the heating device is the same as the opening section of the frame, and a plurality of air outlets are distributed on the lower end face of the heating device in a rectangular shape.

Preferably, roller coating mechanism is including the ink roller, the pivot both ends of ink roller all outwards extend and are connected with the slider that is the rectangle along its axis direction, the outside of arbitrary slider is fixed with first motor, the output of first motor cup joints with the pivot of ink roller is fixed, the second spout with slider looks adaptation is seted up to the opening part at ink pond top, the inside one end of second spout is fixed with the second motor, the output drive of second motor is connected with the lead screw, the length direction along the second spout of lead screw extends to its other end, and the lead screw rotates with the other end of second spout and is connected, the slider adopts threaded connection with the lead screw.

The invention also provides a using method of the ink coating device, which comprises the following steps: pouring prepared ink into an ink pool, opening the frame by rotating the movable frame, putting a PCB to be processed into the frame, in an initial state, enabling the fixed block and a magnetic suction block on the right side of the fixed plate to be adsorbed and fixed to enable the frame and the PCB inside the frame to be kept in a horizontal state, starting the air cylinder to drive the fixed plate to move downwards until the PCB is contacted with an ink roller inside the ink pool, respectively starting the first motor and the second motor, driving the ink roller to rotate by the first motor, driving the lead screw to rotate by the second motor, further driving the slide block to slide along the second sliding groove, enabling the ink roller to be continuously contacted with the ink in the advancing process, coating the ink on the PCB in a uniform printing manner, after the single-side printing of the PCB is completed, enabling the air cylinder to be recovered to the initial state, starting the heating device to heat and pre-dry the back side of the PCB, and after the ink on the PCB is adhered, clockwise rotating the connecting rod to enable the driving frame to rotate by ninety degrees, the rightmost end of the sliding rail slides to the right side through the first limiting idler wheel, the frame finishes overturning, and the heating device continuously heats and dries the printing ink. In the process of frame upset, the spacing gyro wheel of second upwards slides along first spout, starts cylinder drive fixed plate once more this moment and moves down until the PCB board contacts with the inside ink roller in ink pond and accomplishes the printing ink coating print jobs of PCB board another side, treats printing ink above the PCB board and thoroughly dries the back, overturns the frame again through the same step and heats the printing ink of drying to PCB board another side again.

The beneficial effects of the invention are as follows: the invention creatively concentrates all the ink configuration, double-sided printing and drying treatment in the solder resist process flow into the ink coating device for completion, and the double-sided printing of the PCB is realized by the operation of the turnover mechanism in the ink coating device, and the operation is simple and convenient, after the single-sided printing of the PCB is completed, the heating device can pre-dry the ink on the surface, the printing ink can be turned over to coat the other surface after the ink is adhered, and the heating device can continuously dry the coated ink, at the moment, the whole device can simultaneously perform the ink printing and drying, after the ink printing on the other surface of the PCB is completed, the pre-drying can be performed, and then the turning can be performed again for complete drying, and the three process flows are applied to the ink coating device in the invention, thereby avoiding the trouble of transferring the PCB on different devices and effectively saving the processing time, and above-mentioned three processes can operate in step in the device of this application, and further save PCB board production process time to machining efficiency brings huge promotion.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view showing the construction of an ink applying apparatus according to the present invention;

FIG. 2 is a schematic view showing the structure of an ink applying apparatus according to the present invention;

FIG. 3 is a schematic structural view of a first state of the turnover mechanism in the present invention;

FIG. 4 is a schematic structural view of another state of the turnover mechanism in the present invention;

FIG. 5 is a schematic structural view of a frame for fixing a PVC sheet according to the present invention;

FIG. 6 is a schematic view of an assembly structure of the heating device and the fixing plate according to the present invention;

FIG. 7 is a schematic view of the structure of the ink reservoir of the present invention.

In the figure: 1. a base; 2. supporting the mounting plate; 3. a cylinder; 4. a fixing plate; 5. a fixed block; 6. an ink reservoir; 7. a heating device; 8. a magnetic block; 9. a connecting rod; 10. a slide rail; 11. a movable frame; 12. a first limit roller; 13. a second limiting roller; 14. a first chute; 15. a fixing frame; 16. a containing groove; 17. an air outlet; 18. an ink roller; 19. a slider; 20. a first motor; 21. a second chute; 22. a lead screw; 23. a second motor.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The embodiment discloses a PCB solder mask process, which comprises the following steps: the method comprises the steps of PCB resistance welding pretreatment, ink preparation, double-sided coating printing, drying treatment, exposure treatment, development treatment and thermosetting. The PCB resistance welding pretreatment, exposure treatment, development treatment and thermosetting in the PCB resistance welding process all adopt the mature technology at present. As a core technical scheme, the ink preparation, the double-sided printing and the drying treatment in the invention are all completed by adopting an ink coating device, so that the frequent moving operation of the PCB on each device can be reduced, and the processing time is effectively saved. Specifically, the ink coating device comprises an ink pool 6 fixed on the base 1, a frame for mounting the PCB, a turnover mechanism and a heating device 7. A roller coating mechanism for coating ink on the PCB is arranged on the ink pool 6; the frame is arranged on the turnover mechanism, and the frame enables two sides of the PCB to be in contact with the roller coating mechanism through the action of the turnover mechanism to complete printing and coating of ink; the heating device 7 is used for heating and drying the PCB coated with the printing ink.

As shown in fig. 5, the frame in this embodiment includes the fixed block 5 with magnetism, the movable frame 11 and the fixed frame 15, the top and the bottom of the movable frame 11 and the fixed frame 15 are both open structures, and the inside of the movable frame 11 and the fixed frame 15 is provided with the containing groove 16 matched with the PCB, the cross section of the containing groove 16 is greater than the cross section of the opening, so the PCB can be avoided slipping from the frame, the fixed frame 15 therein is fixedly connected to one side of the fixed block 5 along the horizontal direction, the movable frame 11 is connected with one side of the fixed block 5 in a rotating manner, and the movable frame 11 can be matched with the fixed frame 15 to open and close to install the PCB in the containing groove 16.

Referring to fig. 1, tilting mechanism is fixed in the bottom of fixed plate 4 in this embodiment, fixedly connected with is the support mounting panel 2 of L type on the base 1, the terminal surface is fixed with cylinder 3 under the horizontal end at support mounting panel 2 top, the piston rod of cylinder 3 links to each other with fixed plate 4 top, be close to ink bath 6 through cylinder 3 drive tilting mechanism and frame, when the frame needs the upset, then cylinder 3 drive tilting mechanism and frame rebound form certain space for tilting mechanism's work.

Further, the heating device 7 is installed on the lower end face of the fixing plate 4, the turnover mechanism comprises connecting rods 9 distributed on two side faces of the heating device 7 and sliding rails 10 fixed on edges of two sides of the bottom of the heating device 7, one end of each connecting rod 9 is rotatably connected with the side wall of the heating device 7, a first sliding groove 14 is formed in the rod wall of each connecting rod 9 along the length direction of the connecting rod, second limiting rollers 13 are rotatably installed at two ends of the fixing block 5 along the length direction of the fixing block, the rolling surfaces of the second limiting rollers 13 are embedded into the first sliding grooves 14 and are in sliding connection with the first sliding grooves, first limiting rollers 12 are rotatably connected to two sides of one end, far away from the fixing block 5, of the fixing block 15, the rolling surfaces of the first limiting rollers 12 are embedded into the sliding rails 10 and are in sliding connection with the first limiting rollers, magnetic attraction blocks 8 are fixed on two sides of the lower end face of the fixing plate 4, the fixing block 5 is in a horizontal state and is contacted with and stopped by the bottoms of the magnetic attraction blocks 8, therefore, the frame and the PCB inside the frame can be always kept in a horizontal state, and uniform coating and printing of ink are facilitated.

As shown in fig. 6, a heating blower is disposed inside the heating device 7, the lower end surface of the heating device 7 has the same cross section as the opening of the frame, and a plurality of air outlets 17 are distributed on the lower end surface of the heating device 7 in a rectangular shape.

As shown in fig. 7, the roller coating mechanism in this embodiment includes an ink roller 18, both ends of a rotating shaft of the ink roller 18 extend outwards along an axial direction thereof and are connected with rectangular sliding blocks 19, a first motor 20 is fixed on an outer side of any sliding block 19, an output end of the first motor 20 is fixedly sleeved with the rotating shaft of the ink roller 18, a second sliding groove 21 matched with the sliding block 19 is provided at an opening at the top of the ink pool 6, a second motor 23 is fixed at one end inside the second sliding groove 21, a lead screw 22 is connected to an output end of the second motor 23 in a driving manner, the lead screw 22 extends to the other end along a length direction of the second sliding groove 21, the lead screw 22 is rotatably connected with the other end of the second sliding groove 21, and the sliding block 19 and the lead screw 22 are connected by a thread.

The detailed working principle of the ink coating device in the invention is as follows: pouring prepared ink into an ink pool 6, opening a frame by rotating a movable frame 11, putting a PCB to be processed into the frame, in an initial state, adsorbing and fixing a fixed block 5 and a magnetic suction block 8 on the right side of a fixed plate 4 to keep the frame and the PCB inside the frame in a horizontal state, starting an air cylinder 3 to drive the fixed plate 4 to move downwards until the PCB is contacted with an ink roller 18 inside the ink pool 6, respectively starting a first motor 20 and a second motor 23, driving the ink roller 18 to rotate by the first motor 20, driving a lead screw 22 to rotate by the second motor 23, further driving a sliding block 19 to slide along a second sliding groove 21, continuously contacting the ink roller 18 with the ink in a traveling process, uniformly printing and coating the ink on the PCB, after finishing single-sided printing of the PCB, recovering the air cylinder 3 to the initial state, starting a heating device 7 to heat and pre-dry the back side of the PCB, after ink adhesion on the PCB board, clockwise rotation connecting rod 9 makes drive frame rotate ninety degrees, slides first spacing gyro wheel 12 to the rightmost end of slide rail 10 rightwards, and the frame is accomplished the upset, and heating device 7 lasts heats the stoving to ink. In the process of frame upset, spacing gyro wheel 13 of second upwards slides along first spout 14, starts cylinder 3 drive fixed plate at this moment again and removes down until the PCB board contacts with the inside ink roller 18 of ink bath 6 and accomplishes the printing ink coating printing operation of PCB board another side, treats that printing ink on the PCB board thoroughly dries the back, overturns the frame again through the same step and heats the drying to the printing ink of PCB board another side.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.

Claims

1. A PCB solder mask process comprises the following steps: the PCB resistance welding method comprises the steps of PCB resistance welding pretreatment, ink preparation, double-sided coating printing, drying treatment, exposure treatment, development treatment and thermosetting, and is characterized in that the ink preparation, the double-sided printing and the drying treatment are all completed by an ink coating device, and the ink coating device comprises an ink pool (6) fixed on a base (1), a frame for mounting the PCB, a turnover mechanism and a heating device (7);

a roller coating mechanism for coating ink on the PCB is arranged on the ink pool (6);

the heating device (7) is used for heating and drying the PCB coated with the printing ink.

2. The PCB solder mask process according to claim 1, wherein the frame comprises a fixed block (5) with magnetism, a movable frame (11) and a fixed frame (15), the top and the bottom of the movable frame (11) and the fixed frame (15) are both in an open structure, a containing groove (16) matched with the PCB is arranged inside each of the movable frame (11) and the fixed frame (15), the section of the containing groove (16) is larger than that of the open structure, the fixed frame (15) is fixedly connected to one side of the fixed block (5) along the horizontal direction, the movable frame (11) is rotatably connected with one side of the fixed block (5), and the movable frame (11) is matched with the fixed frame (15) to realize opening and closing to install the PCB in the containing groove (16).

3. The PCB solder mask process according to claim 2, wherein the turnover mechanism is fixed at the bottom of the fixing plate (4), the L-shaped supporting and mounting plate (2) is fixedly connected to the base (1), the lower end face of the horizontal end of the top of the supporting and mounting plate (2) is fixed with the air cylinder (3), and the piston rod of the air cylinder (3) is connected with the top of the fixing plate (4).

4. The PCB solder mask process according to claim 3, wherein the heating device (7) is installed on the lower end face of the fixing plate (4), the turnover mechanism comprises connecting rods (9) distributed on two side faces of the heating device (7) and sliding rails (10) fixed on the edges of two sides of the bottom of the heating device (7), one end of each connecting rod (9) is rotatably connected with the side wall of the heating device (7), a first sliding groove (14) is formed in the rod wall of each connecting rod (9) along the length direction of the connecting rod, second limiting rollers (13) are rotatably installed at two ends of the fixing block (5) along the length direction of the fixing block, the rolling surface of each second limiting roller (13) is embedded into the corresponding first sliding groove (14) and is slidably connected with the corresponding first limiting roller (12), the rolling surface of each first limiting roller (12) is embedded into the corresponding sliding rail (10) and is slidably connected with the corresponding fixing frame (15) away from two sides of one end of the fixing block (5), the lower end face of the fixing plate (4) is positioned on both sides of the heating device (7) and is fixed with a magnetic suction block (8), and the fixing block (5) is in a horizontal state and is contacted with the bottom of the magnetic suction block (8) and stopped by the magnetic suction block.

5. The PCB solder mask process according to claim 4, wherein a heating fan is arranged inside the heating device (7), the lower end surface of the heating device (7) is the same as the opening section of the frame, and a plurality of air outlets (17) are distributed on the lower end surface of the heating device (7) in a rectangular shape.

6. The PCB solder mask process according to claim 5, wherein the roller coating mechanism comprises an ink roller (18), both ends of a rotating shaft of the ink roller (18) extend outwards along the axial direction of the ink roller and are connected with rectangular sliding blocks (19), a first motor (20) is fixed on the outer side of any sliding block (19), an output end of the first motor (20) is fixedly sleeved with the rotating shaft of the ink roller (18), a second sliding groove (21) matched with the sliding block (19) is formed in an opening at the top of the ink pool (6), a second motor (23) is fixed at one end inside the second sliding groove (21), a lead screw (22) is connected with an output end of the second motor (23) in a driving manner, and the lead screw (22) extends to the other end along the length direction of the second sliding groove (21), and the screw rod (22) is rotationally connected with the other end of the second sliding chute (21), and the sliding block (19) is in threaded connection with the screw rod (22).

7. The PCB solder mask process according to claim 6, wherein the use method of the ink coating device comprises the following steps: pouring configured ink into an ink pool (6), opening a frame by rotating a movable frame (11), putting a PCB to be processed into the frame, in an initial state, adsorbing and fixing a fixed block (5) and a magnetic suction block (8) on the right side of a fixed plate (4) to enable the frame and the PCB inside the frame to be kept in a horizontal state, starting a cylinder (3) to drive the fixed plate (4) to move downwards until the PCB is contacted with an ink roller (18) inside the ink pool (6), respectively starting a first motor (20) and a second motor (23), driving the ink roller (18) to rotate by the first motor (20), driving a lead screw (22) to rotate by the second motor (23), further driving a sliding block (19) to slide along a second sliding groove (21), continuously contacting the ink during the advancing process of the ink roller (18), and uniformly coating the ink on the PCB, after the single-sided printing of completion PCB board, cylinder (3) resume to initial condition, start heating device (7) and heat the predrying to the back of PCB board, treat the printing ink adhesion on the PCB board after, clockwise turning connecting rod (9) make driving frame rotate ninety degrees, slide first spacing gyro wheel (12) to the rightmost end of slide rail (10) right, the upset is accomplished to the frame, what heating device (7) lasted heats the drying to printing ink. In the process of frame upset, spacing gyro wheel of second (13) upwards slides along first spout (14), starts cylinder (3) drive fixed plate again this moment and moves down until PCB board and inside ink roller (18) of printing ink pond (6) contact completion PCB board other side's printing ink coating printing operation, treats that the printing ink on the PCB board thoroughly dries the back, overturns the frame again through the same step and heats the drying to the printing ink on PCB board other side.