JP5913050B2 - Laminating equipment - Google Patents

Description

  The present invention relates to a dry film laminating apparatus for attaching a dry film to a main surface of a base substrate of a printed wiring board.

  In the method of laminating a light-sensitive layer on a substrate plate, steam is applied to both sides of the substrate plate immediately before lamination, and a part of the vapor is condensed to form a thin water layer on the light-sensitive layer. A method is known in which a light-sensitive layer is allowed to absorb a water layer and the light-sensitive layer is adhered to a substrate plate (Patent Document 1).

Japanese Patent Publication No. 1-44393

  However, by simply applying a vapor to the main surface of the base substrate of the printed wiring board and condensing a part of the vapor, the surface of the base substrate on which the unevenness due to the wiring pattern etc. is formed can be wetted evenly and sufficiently. Therefore, there is a problem that the dry film cannot follow the unevenness of the main surface of the base substrate, and as a result, the two cannot be brought into close contact with each other.

  On the other hand, when a dry film is bonded in a state where excess liquid adheres to the surface of the base substrate, there arises a problem that the adhesion between the base substrate and the dry film is inhibited.

  The problem to be solved by the present invention is to provide a laminating apparatus that keeps the surface of the base substrate sufficiently wet without unevenness, and prevents excess liquid from remaining on the base substrate when the dry film is bonded. That is.

  The present invention relates to a laminating apparatus for laminating a dry film for forming a circuit on a main surface of a base substrate of a printed wiring board that is conveyed along a predetermined conveying direction. A transport unit configured to transport the dry film so as to be in contact with a surface; and a upstream side of the predetermined position in a transport path of the base substrate, and a liquid material on the main surface of the base substrate A liquid material applying means for applying the liquid material, and a pressure bonding means for pressing the dry film against the main surface of the base substrate on which the liquid material is applied at the predetermined position, while heating the dry film. The position where the liquid material is applied to the main surface of the base substrate by the object applying means is lower than the position where the dry film is pressed against the base substrate by the pressure-bonding means. By providing a laminate and wherein, to solve the above problems.

  In the above invention, between the position where the liquid material is applied to the main surface of the base substrate and the position where the dry film is pressed against the main surface of the base substrate, the base substrate is set against the horizontal plane. It can be configured to convey at an inclination angle of 1 ° or more and 10 ° or less.

  In the above invention, the apparatus further comprises a guide roller for transporting the base substrate, and the guide roller is upstream of the liquid application means in the transport path of the base substrate, and the liquid material is applied thereto. It can install so that it may contact | connect the said base material in a position higher than a position.

  In the above invention, a heating roller for heating the base substrate is further provided, and the heating roller is upstream of the liquid application unit in the transport path of the base substrate, and the liquid material is applied thereto. It can install so that it may contact | connect the said base material in a position higher than a position.

  In the above invention, the liquid material may contain water and a surfactant.

  According to the present invention, since the liquid material is applied to the main surface of the base substrate at a position upstream of the position where the dry film is pressed against the base substrate that is sequentially conveyed, the dry film is pressure-bonded. Before wetting the main surface of the base substrate evenly and thoroughly, remove excess liquid from the base substrate so that no excess liquid remains on the base substrate when dry film is pressed. Can do.

  As a result, the dry film is made to follow the unevenness of the printed wiring board formed on the main surface of the base substrate, and the dry film is closely adhered to the unevenness of the printed wiring board formed on the main surface of the base substrate. Therefore, it is possible to suppress the occurrence of defects in the printed wiring board due to the problem of bonding of the dry film and improve the production yield.

It is a side view of the lamination apparatus of embodiment which concerns on this invention.

  Hereinafter, a laminating apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  The laminating apparatus 100 of this embodiment according to the present invention is an apparatus used in a printed wiring board manufacturing process. Specifically, the laminating apparatus 100 according to this embodiment includes an etching resist layer (photosensitive layer) for forming a circuit pattern by etching on a base substrate in which through holes and via holes are formed in a copper clad laminate material (CCL). It is used in a step of attaching a dry film functioning as a resist layer) to the main surface of the base substrate.

  FIG. 1 is a side view of a laminating apparatus 100 according to this embodiment of the present invention. The laminating apparatus 100 shown in FIG. 1 is a main surface of a base substrate B of a long printed wiring board that is sequentially sent from the upstream side along the arrow F along the downstream side (precisely along the transport direction T). In addition, a laminating process (sticking process) of the long dry film D is performed.

  As shown in FIG. 1, a laminating apparatus 100 according to this embodiment includes a base material transport device 10 that transports a base substrate B for a printed wiring board, a film transport device 20 that transports a dry film D, and a liquid material. A liquid material coating device 30 for coating and a pressure bonding device 40 for laminating the dry film D to the base substrate B are provided. The laminating apparatus 100 according to the present embodiment further includes a foreign matter removing device 50 that removes foreign matters such as dust attached to the main surface of the base substrate B, and a heating device 60 that heats the base substrate B.

  Each configuration will be described below. As shown in FIG. 1, the substrate transport apparatus 10 of the present embodiment transports a base substrate B of a printed wiring board along a predetermined transport direction T. Specifically, the base material conveyance device 10 holds the wound base material B, and sequentially feeds the base material B in a roll shape, and the base material delivery roller 11 that sequentially feeds the base material B. A substrate take-up roller 12 to be taken, and guide rollers 13 and 14 which are provided between the substrate take-out roller 11 and the substrate take-up roller 12 and support the base substrate B along the transport direction T. The conveyance direction T is a movement direction of the base substrate B, and is not limited to one direction, and includes a plurality of different directions depending on the conveyance path of the base substrate B.

  The base substrate B1 (B) delivered from the substrate delivery roller 11 is a material in which through holes and via holes are formed in a copper clad laminate material (CCL). The copper clad laminate material (CCL) in the present embodiment is a material in which a copper foil is pasted on both main surfaces of an insulating base material such as polyimide, polyethylene terephthalate, and polyethylene naphthalate. As will be described in detail later, the base film B1 (B) in the present embodiment has a dry film D attached to its main surface at a predetermined position (K2, h0). Incidentally, the base substrate B2 (B) to which the dry film D is attached is wound around the substrate take-up roller 12 and sent to a circuit pattern forming process performed at a later stage.

  Next, the film transport apparatuses 21 and 22 (hereinafter, these may be collectively referred to as 20 symbols) will be described. The film transport apparatus 20 of the present embodiment transports the dry film D so that the dry film D can come into contact with the main surface of the base substrate B at a predetermined position (K2, h0). Incidentally, the term “main surface” in the present embodiment is the one main surface facing the upper side (+ y side) in the drawing or the lower side (−y side) in the drawing in both the base substrate B and the dry film D. Or any one of the other main surfaces facing each other, or both the one main surface and the other main surface.

  As shown in FIG. 1, the film transport device 20 of the present embodiment is dry so that the main surface of the dry film D1 can come into contact with one main surface of the base substrate B (main surface facing the upper side in the drawing). The first film transport device 21 that transports the film D1 and the dry film D2 so that the main surface of the dry film D2 can come into contact with the other main surface of the base substrate B (the main surface facing the lower side in the figure). And a second film conveying device 22 for conveying.

  The first film transport device 21 of the present embodiment includes a film feed roller 21A that holds the wound dry film D1 and sequentially feeds the dry film D1. The release paper D1B of the fed dry film D1 is taken up by the release paper take-up roller 21B, and only the dry film D1A forming the photosensitive resist layer is conveyed so as to be in contact with one main surface side of the base substrate B. The

The second film transport device 22 of the present embodiment is also configured in the same manner as the first film transport device 21, and the dry film D2 is fed from the film feed roller 22A and the release paper is removed by the release paper take-up roller 22B. D2A is conveyed so that it can contact the other main surface side of the base substrate B.

  The first film transport device 21 and the second film transport device 22 described above are disposed so that the dry film D contacts the base substrate B at a predetermined position (K2, h0).

  Next, the liquid material applicator 30 will be described. The liquid material applicator 30 of the present embodiment is upstream of a predetermined position (K2, h0) where the above-described dry film D can contact the main surface of the base substrate B (in the direction opposite to the arrow F, −x side) and below (−y side), and a liquid material is applied to the main surface of the base material B.

  Although the liquid thing of this embodiment is not specifically limited, It is water (liquid state water), the liquid containing water, or the liquid containing water and an additive. As the additive, a substance that improves the wettability of the liquid applied to the base substrate B can be selected. As additives, surfactants, methanol, ethanol and other alcohols, polyethylene glycol, and lactic acid can be used.

  In this embodiment, the liquid material is a liquid containing water and a surfactant. Examples of the surfactant in this embodiment include fatty acid sodium, sodium alpha sulfonated fatty acid ester, sodium alkyl sulfate ester, sodium alkyl ether sulfate, sodium alpha olefin sulfonate, sodium alkyl sulfonate, and the like (anionic). Surfactants, cationic surfactants such as benzalkonium chloride and distearyldimethylammonium chloride, lauryl dimethylaminoacetic acid betaine, cocamidopropyl betaine, 2-alkyl-N-carboxymethyl-N-hydroxy Amphoteric surfactants such as ethyl imidazolinium betaine, sodium lauroyl glutamate, lauryl dimethylamine N-oxide, or glyceryl laurate, polyoxyethylene alkyl ether, Polyoxyethylene alkylphenyl ethers, polyoxyalkylene alkyl ethers, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, non-ionic, such as polyoxyethylene fatty acid esters (nonionic) can be used a surfactant.

  Although not particularly limited, in this embodiment, a nonionic surfactant is used as a surfactant to be added to water. Although not particularly limited, in the present embodiment, a liquid containing A: polyoxyalkylene alkyl ether, which is the nonionic surfactant, and water is used as the liquid. In the liquid material of the present embodiment, the concentration of the surfactant A: polyoxyalkylene alkyl ether is preferably 0.01 to 1.0 vol%, and can be 0.05 to 0.1 vol%.

  The liquid material coating device 30 can be provided on both the one main surface side and the other main surface side of the base substrate B to be conveyed. As shown in FIG. 1, the liquid material application device 30 of the present embodiment includes a first liquid material application device 31 that applies a liquid material to one main surface (the main surface facing the upper side in the drawing) of the base substrate B; And a second liquid material application device 32 that applies a liquid material to the other main surface of the base substrate B (main surface facing downward in the drawing).

  The aspect of the liquid material applicator 30 is not particularly limited. In the present embodiment, a tank 31A in which the liquid material M is stored, and a liquid material supply tank 32A in which the liquid material M supplied from the tank 31A is stored. A tank-type liquid material applicator 30 including a liquid object application roller 32R that applies the liquid object M in the tank 32A to the main surface of the base substrate B can be provided.

  As shown in FIG. 1, the tank-type liquid material applicator 30 (32) is configured such that a rotatable liquid material application roller 32 </ b> R is in contact with the liquid material M stored in the tank 32 </ b> A and the other main base material B is connected. This is a device for applying the liquid material M adhering to the surface of the liquid material application roller 32R to the other main surface of the base substrate B in contact with the surface (main surface facing the lower side in the figure). The extra liquid material M applied to the base base material B drops from the base base material B to the tank 32A and is stored in the tank 32A, so that the excessive liquid object M can be recovered and reused.

  In the present embodiment, the supply path (pipe) 31H for supplying the liquid material M from the external tank 31A for storing the liquid material M and the main surface of the base substrate B are in contact with each other and supplied via the supply path 31H. In addition, a roller-type liquid material applicator 30 including a liquid material application roller 31R that applies the liquid material M to the main surface of the base substrate B can be provided.

  As shown in FIG. 1, in the roller-type liquid material applicator 30 (31), a supply path 31H for the liquid material M supplied from the tank 31A is arranged in the rotation shaft, and the periphery thereof is made of urethane, polyvinyl alcohol, or the like. The liquid material application roller 31R configured to be covered with a water retentive material is brought into contact with one main surface (the main surface facing the upper side in the drawing) of the base substrate B so as to ooze out from the surface of the liquid material application roller 31R. This is an apparatus for applying the coming liquid M to one main surface of the base substrate B. Since the liquid material application roller 31R is covered with a water retentive material, if there is an excess liquid material, it can also absorb (water absorption). When the liquid material application roller 31R absorbs the liquid and the water absorption is saturated, the liquid material application roller 31R flows from the liquid material application roller 31R to the tank 32A described above and is stored in the tank 32A. And can be reused.

  In this embodiment, as shown in FIG. 1, in order to apply the liquid material M to one main surface of the base substrate B, a roller-type liquid material application device 31 is disposed, and the other main surface of the base substrate B is disposed. In order to apply the liquid material M to the main surface facing downward in the drawing, a tank-type liquid material application device 32 can be arranged.

  In the present embodiment, the roller-type liquid material application device 31 and the type liquid material application device 32 are disposed on the upstream side (upstream side in the transport path) of the pressure bonding device 40 described later, thereby sending the liquid-type liquid material application device 31 and the type liquid material application device 32. The liquid material M can be applied evenly and sufficiently to the main surface of the base substrate B to be applied.

  By the way, when a liquid material M such as water is applied to the dry film D, the surface of the dry film D can be deformed because the liquid material M has affinity with the components of the dry film D and the surface viscosity is reduced. It becomes easy to follow the uneven | corrugated shape of the surface (main surface) of the base material B which is. In addition, the liquid M applied to the base substrate B is taken into the uneven gap of the printed wiring board in place of the air that originally existed in the uneven gap of the printed wiring board. Since the liquid M is compatible with the dry film D, the dry film D adheres to the base substrate B in a state in which the air in the concavo-convex gap of the printed wiring board is removed.

  Thus, the presence of the liquid material M is effective in terms of bringing the dry film D and the base substrate B into close contact with each other. However, when the amount of the liquid material M is too large, the following disadvantages are present. May occur.

  That is, when an excessive amount of the liquid material M is applied to the base substrate B, the film of the liquid material M on the base substrate B becomes thick, and the contact area between the printed wiring board of the base substrate B and the dry film D And the inconvenience of weakening the adhesion between the base substrate B and the dry film D occurs. When the adhesion between the base substrate B and the dry film D becomes weak, the position of the base substrate B and the dry film D is shifted in the subsequent pressure bonding process, or the dry film D is distorted, so that accurate circuit formation is achieved. May be hindered. Further, when an excessive amount of the liquid material M is applied to the base substrate B, a large amount of vapor is generated during the pressure-bonding process, and this vapor may cause wrinkles on the dry film D. If wrinkles are generated in the dry film D, the thickness of the dry film D may be biased, or the dry film D may be lost, and similarly, accurate circuit formation may be hindered.

  In view of these, in the present embodiment, the position (K1, h1) where the liquid material M is applied to the main surface of the base substrate B by the liquid material application devices 31 and 32 is the same as the position where the dry film D is the base substrate. Each member is arranged so as to be lower than the position (K2, h0) pressed against the material B.

  As in this embodiment, the position (K1, h1) where the liquid M is applied to the main surface of the base substrate B is more than the position (K2, h0) where the dry film D is pressed against the base substrate B. Since it is low, even if the excessive liquid material M is applied to the main surface of the base substrate B in the liquid material application apparatus 30 (31, 32), the excess liquid material M is long base material B. Are gradually moved toward the liquid material applicator 30 (31, 32) provided at a low position through the main surface, and finally collected in the tank 32A. That is, since the excess liquid M is removed, a thin film of the liquid M is formed on the main surface of the base substrate B when it is fed into the crimping device 40 (the liquid M becomes thicker). Only). Further, since the excess liquid M is returned to the upstream side, it is not brought into the pressure device 40 on the downstream side.

  As a result, while the liquid M is sufficiently applied to the main surface of the base substrate B, the excess liquid M is removed from the base substrate B before the dry film D is pressure-bonded. By intervening M, it is possible to prevent the disadvantage that the adhesion between the base substrate B and the dry film is hindered.

  Further, since the excess liquid M is not brought into the pressure bonding device 40, the liquid M dropped during the pressure bonding is a laminating device such as the dry film D, the shaft of the film transport device 20, and the shaft of the substrate take-up roller 12. The problem of adhering to 100 members and contaminating them can be prevented.

  Although not particularly limited, in the present embodiment, the position (K1, h1) where the liquid M is applied to the main surface of the base substrate B and the position (K2) where the dry film D is pressed against the main surface of the base substrate B. , H0) is configured to maintain a predetermined inclination angle α with respect to the horizontal plane. As shown in FIG. 1, the inclination angle α reaches from a relatively low position (K1, h1) to a relatively high position (K2, h0) (K2, h0). This is the angle formed by the direction of the transport path and the horizontal direction (x direction in the figure).

  In this embodiment, the base material B is inclined so that the inclination angle α is 1 ° or more, so that the extraneous liquid M is connected to the base substrate B at a relatively low position. It moves to the liquid applicator 30 side. Even during this movement, the liquid M spreads over the entire base material B (unevenness of the printed wiring) and returns to the liquid coating device 30 while wetting the base material B evenly. When the liquid M contains water and a surfactant, the wettability with the base substrate B (unevenness of the printed wiring) is improved, so that the liquid M is the entire base substrate B (unevenness of the printed wiring). It becomes easy to spread.

  Although not particularly limited, the inclination angle α is preferably 1 ° or more and 10 ° or less. More preferably, the angle is 1 ° or more and 4 ° or less. When the inclination angle α of the base substrate B is larger than 10 °, the flow of the liquid material M becomes too fast, and before the film of the liquid material M is formed by evenly conforming to the main surface of the base substrate B, This is because the liquid material M may return to the liquid material coating apparatus 30. Further, if the inclination angle α of the base substrate B is larger than 10 °, it is necessary to enlarge the tank 32A for supplying the liquid material of the tank-type liquid material coating apparatus 31, which hinders the downsizing of the laminating apparatus 100. There is a fear. Further, when the size of the liquid supply tank 32A is increased, the amount of liquid stored in the tank 32A is increased, resulting in an increase in operating cost. In addition, when the inclination angle α of the base substrate B is larger than 10 °, the base substrate B may be distorted or twisted due to an uneven force acting on the base substrate B. When the base base B is distorted or twisted, there is a disadvantage that stress is applied to the printed wiring board formed on the main surface of the base substrate B, or a positional deviation from the dry film D to be attached occurs. There is. In consideration of the above, in this embodiment, the inclination angle α is in the above range, and the inclination angle α in the laminating apparatus 100 according to the example is 2 °.

  In this way, by applying an inclination angle α to the pass line (conveyance path) from the application position of the liquid M on the base substrate B to the pressure bonding position of the dry film D, the base substrate B is applied to the main surface. Since the liquid material M can be moved gradually along the main surface of the base substrate B toward the liquid coating device 30 having a lower height, the excess liquid material M is not sent to the pressure bonding device 40 side. Can be.

  In other words, in the present embodiment, since the excess liquid object M can be removed, the liquid application device 30 on the upstream side does not have to worry about the harmful effects caused by applying the excessive liquid object M. The base substrate B can be sufficiently wetted by the liquid material applicator 30 such as an immersion type (tank type) or a liquid application type (roller type). As a result, it is possible to prevent the occurrence of uneven wetting caused by avoiding the liquid material M from being applied excessively.

  In addition, since the excess liquid M is returned to the liquid application device 30 while spreading on the main surface of the base substrate B, a uniform film of the liquid M can be formed evenly on the surface of the base substrate B.

  In the present embodiment, the position h1 in the height direction (y direction) of the position (K1, h1) where the liquid M is applied to the main surface of the base substrate B is strictly the thickness t of the base substrate B. Can be described as (K1, h1 + t) (K1, h1-t) (K1, h1 + t / 2) (K1, h1-t / 2). In the present embodiment, for the sake of brevity, the thickness of the base substrate B is ignored for convenience, and the position where the liquid material M is applied to the main surface of the base substrate B is expressed as (K1, h1). Similarly, the position h0 in the height direction (y direction) of the position (K2, h0) where the dry film D is pressed against the base substrate B by the crimping apparatus 40 in this embodiment is strictly the thickness of the base substrate B. Considering t, it can also be described as (K2, h0 + t) (K2, h0-t) (K2, h0 + t / 2) (K2, h0-t / 2). In this embodiment, for the sake of brevity, the thickness of the base substrate B is ignored for convenience, and the position where the dry film D is pressed against the base substrate B by the pressure bonding device 40 is expressed as (K2, h0). Similarly, a position (K3, h3) where a guide roller 13 described later contacts the base substrate B, a position (K5, h5) where the foreign matter removing roller contacts the base substrate B, and a position (K5, h5) where the heating roller contacts the base substrate B ( Regarding K6, h6), the thickness of the base substrate B is ignored for the sake of convenience and will be briefly described.

  Next, the crimping apparatus 40 of the laminating apparatus 100 of this embodiment will be described. The crimping device 40 in the laminating apparatus 100 of the present embodiment is provided on the downstream side of the liquid material coating device 30. The crimping device 40 presses the dry film D against the main surface of the base substrate B on which the liquid M has been applied while heating.

  As shown in FIG. 1, the crimping device 40 of this embodiment includes a first crimping device 41 that presses the dry film D against one main surface of the base substrate B (main surface facing the upper side in the figure) while heating, And a second pressure bonding device 42 that presses the dry film D against the other main surface (the main surface facing the lower side in the drawing) of the base substrate B while heating.

  Although not particularly limited, the first pressure roller 41 and the second pressure roller 42 of the present embodiment are along the width direction of the base substrate B and the dry film D (the direction perpendicular to the scale direction along the transport direction T). The first pressure roller 41 and the second pressure roller 42 are provided with the rotation shafts 41S and 42S and the heaters (heating elements) inside the rotation shafts 41S and 42S, and the outer peripheral surface can be heated. Can do. The first pressure roller 41 and the second pressure roller 42 press the base substrate B sandwiched between the dry films D from both main surface sides, and the outer peripheral surface that circulates with the rotation of the rotation shafts 41S and 42S. The dry film D that comes into contact is heated, and the dry film D is laminated to the base substrate B.

  Further, although not particularly limited, the first pressure roller 41 and the second pressure roller 42 have a virtual line I connecting the rotation shaft 41S of the first pressure roller 41 and the rotation shaft 42S of the second pressure roller 41 of the base substrate B. It arrange | positions so that it may become substantially perpendicular | vertical with respect to the extension surface of both main surfaces (front and back). As described above, by arranging the first pressure roller 41 and the second pressure roller 42, the pressure applied from the first pressure roller 41 to the one main surface side of the base substrate B and the second pressure roller 42 during lamination. Since the pressure applied to the other main surface side can be made uniform, it is possible to prevent a biased force from being applied to the base substrate B.

  The substrate transport apparatus 10 of the present embodiment includes one or a plurality of guide rollers that guide the base substrate B. Among the guide rollers, at least one guide roller 13 is a position on the upstream side of the installation position of the liquid application device 30 in the conveyance path of the base substrate B, and a position where the liquid material M is applied ( K1 and h1) are installed so as to be in contact with the base material B at a position higher than that. Specifically, the guide roller 13 is upstream (in the direction opposite to the arrow F, −x side) and above (+ y side) the position (K1, h1) where the liquid M is applied to the base substrate B. It is installed so that the base substrate B passes through the position (K3, h3). That is, the position (K3, h3) is included in the outer peripheral surface of the guide roller 13 of the present embodiment.

  In this way, the guide roller 13 that feeds the base substrate B at a position upstream of the transport path from the position where the liquid material M is applied to the main surface of the base substrate B is liquid on the main surface of the base substrate B. Since the base material B is in contact with the base material B at a position higher than the position where the material M is applied, the liquid material M applied to the base material B on the downstream side of the transport path travels along the base material B, and the upstream guide roller. It is possible to prevent the flow up to 13. That is, while the liquid material application apparatus 30 (31, 32) applies a sufficient amount of the liquid material M to the base substrate B, the liquid material M hardly adheres to the base material B on the upstream side (is less likely to be contaminated). Can be. As a result, it is possible to prevent the liquid M from adhering to the untreated base material B to be fed from now on.

  Although not particularly limited, in the present embodiment, the base group between the position (K1, h1) where the liquid M is applied to the main surface of the base substrate B and the guide position (K3, h3) of the base substrate B. The material B is configured to maintain a predetermined inclination angle β with respect to the horizontal plane. The inclination angle β is horizontal with respect to the direction of the conveyance path from the relatively low (−y direction in the figure) position (K1, h1) to the relatively high (+ y direction in the figure) position (K3, h3). The angle formed by the direction (x direction in the figure). Although not particularly limited, the inclination angle β is preferably 1 ° or more and 10 ° or less, similarly to the inclination angle α. More preferably, the angle is 1 ° or more and 4 ° or less.

  Base substrate B and heating rollers 61 and 62 between positions (K5, h5) where clean rollers 51 and 52, which will be described later, are in contact with base substrate B, and positions (K1, h1) where liquid material M is applied, The base substrate B between the position (K6, h6) where the base substrate B is in contact and the position (K1, h1) where the liquid M is applied also has a predetermined inclination angle γ with respect to the horizontal plane. The angle γ may be the same angle as the inclination angle β or may be a different angle.

  Furthermore, the laminating apparatus 100 of this embodiment includes a foreign matter removing apparatus 50. The foreign matter removing device 50 includes a first clean roller 51 and a second clean roller 52 (which are also collectively referred to as clean rollers 51 and 52) having an adhesive layer formed on the outer periphery.

  The first clean roller 51 and the second clean roller 52 make the base substrate B sandwiched by bringing the adhesive layer into contact with the main surface of the base substrate B (the surface on which the printed wiring board is formed). Foreign matter adhering to the main surface of the material B is transferred to the adhesive layer on the surfaces of the clean rollers 51 and 52 to remove this (foreign matter). As described above, since the base substrate B can be cleaned before the dry film D is bonded to the base substrate B, the lamination is performed with foreign matter sandwiched between the base substrate B and the dry film D. Inconvenience can be prevented.

  The clean rollers 51 and 52 are positioned upstream (in the direction opposite to the arrow F, −x side) and above (+ y side) from the position (K1, h1) where the liquid M is applied to the base substrate B. It is installed so that the base substrate B passes through (K5, h5). That is, the positions (K5, h5) are included in the outer peripheral surfaces (contact surfaces with the base material B) of the clean rollers 51 and 52 of the present embodiment.

  As described above, the clean rollers 51 and 52 for cleaning the base substrate B at positions upstream of the transport path from the position where the liquid M is applied to the main surface of the base substrate B are provided on the base substrate B. Since the main surface is in contact with the base material B at a position higher than the position where the liquid material M is applied, the liquid material M applied to the base material B on the downstream side of the transport path is upstream along the base material B. It is possible to prevent flow to the clean rollers 51 and 52 on the side. That is, while the liquid material application apparatus 30 (31, 32) applies a sufficient amount of the liquid material M to the base substrate B, the liquid material M hardly adheres to the base material B on the upstream side (is less likely to be contaminated). Can be. As a result, the liquid material M adheres to the clean rollers 51 and 52 and the foreign matter removal performance of the clean rollers 51 and 52 deteriorates, or the adhesive component dissolves into the liquid material M in contact with the adhesive layer. It is possible to prevent adhesion to the base material B (contamination of the base base material B).

  Furthermore, the laminating apparatus 100 of this embodiment includes a heating device 60. The heating device 60 includes a first heating roller 61 and a second heating roller 62 (also collectively referred to as heating rollers 61 and 62) each having a heater (heat generating element) therein.

  On the outer circumferences of the first heating roller 61 and the second heating roller 62, a conductive layer that transmits heat generated by the heater is formed. The first heating roller 61 and the second heating roller 62 cause the base substrate B to be brought into contact with at least a part of the main surface of the base substrate B (including the portion where the printed wiring board is not formed). The base substrate B is heated by sandwiching. In addition, the structure of the 1st heating roller 61 and the 2nd heating roller 62 is not specifically limited, On the assumption that temperature and a pressing force are adjusted, the above-mentioned 1st pressure roller apparatus 41, the 2nd pressure roller apparatus 42, and It can be set as the same structure. Thus, since the base substrate B can be preheated before the dry film D is bonded to the base substrate B, the temperature change of the base substrate B when the dry film D is hot-pressed (crimped). Can be prevented from becoming too steep. Moreover, by preheating the base substrate B, variation in temperature distribution can be suppressed, and the entire base substrate B can be laminated (attached) under common conditions.

  The heating rollers 61 and 62 are positioned upstream (in the direction opposite to the arrow F, −x side) and above (+ y side) from the position (K1, h1) where the liquid M is applied to the base substrate B. It is installed so that the base substrate B passes through (K6, h6). That is, the positions (K6, h6) are included in the outer peripheral surfaces (the contact surfaces with the base substrate B) of the heating rollers 61 and 62 of the present embodiment.

  As described above, the heating rollers 61 and 62 that heat the base substrate B at positions upstream of the transport path from the position where the liquid material M is applied to the main surface of the base substrate B are the main rollers of the base substrate B. Since the surface contacts the base material B at a position higher than the position where the liquid material M is applied to the surface, the liquid material M applied to the base material B on the downstream side of the transport path travels along the base material B upstream. It is possible to prevent the heat rollers 61 and 62 from flowing. That is, while the liquid material application apparatus 30 (31, 32) applies a sufficient amount of the liquid material M to the base substrate B, the liquid material M hardly adheres to the base material B on the upstream side (is less likely to be contaminated). Can be. Thereby, it is possible to prevent the liquid matter M from adhering to the electrical mechanism of the heating rollers 61 and 62 and causing an electrical failure such as a short circuit.

  As shown in FIG. 1, the laminating apparatus 100 according to the present embodiment conveys the base material B in a V shape with the position (K1, h1) where the liquid material M is applied as a lower vertex. The position (K2, h0) where the dry film D on the downstream side is pressure-bonded is higher than the position (K1, h1) where the liquid M is applied, and the upstream transport passage point (K3, h3), The foreign matter removal position (K5, h5) and the heating position (K6, h6) are also higher than the position (K1, h1) where the liquid M is applied.

  According to the laminating apparatus 100 in the present embodiment, the transport path of the base substrate B that moves along the transport direction T is the transport passage point (K3, h3), the foreign matter removal position (K5, h5), and the heating position (K6). , H6) incline in the descending direction (−y side), and after the liquid material M is applied by the liquid material applicator 30, it turns and inclines in the upward direction (+ y side). The upstream (−x side) and downstream (+ x side) slopes at the position (K1, h1) where the liquid M is applied may be the same slope or different slopes. Good.

  The liquid material is applied to the main surface of the base substrate B at a position lower than the position (K2, h0) where the dry film D is pressed against the base substrate B, and the excess liquid material M is applied to the base substrate B. Therefore, it is possible to prevent the excess liquid material M from remaining on the base substrate B when the dry film D is pressed. As a result, the adhesion between the base substrate B and the dry film D can be improved.

  Incidentally, if the adhesion between the base substrate B and the dry film D is poor, an etching solution (etchant) may enter between the base substrate B and the dry film D in an etching process performed later. Since the etching solution that has entered between the base substrate B and the dry film D also removes even the copper foil that is desired to remain, there may be a case where a missing portion is generated in the wiring pattern and is disconnected. In addition, if there is a bubble between the base substrate B and the dry film D, the light applied during exposure is dispersed by the bubble (air), and the boundary between the portion that has been exposed and the portion that has not been exposed is unclear. It becomes clear. If the exposure is not performed accurately, the circuit pattern corresponding to the mask pattern cannot be formed, and the wiring pattern becomes thinner or thicker. May end up. For such a problem, the laminating apparatus 100 according to this embodiment of the present invention improves the adhesion between the base substrate B and the dry film D. Printed wiring boards on which high wiring patterns are formed can be manufactured with high yield.

  In addition, since the transport direction of the base material B fed into the liquid material coating apparatus 30 is inclined in the downward direction (−y side direction), the liquid material M can be prevented from flowing back to the upstream side. As a result, the base substrate B can be kept clean.

  After forming the photosensitive resist layer by bonding the dry film D to the base substrate B, an exposure process and a development process are performed, and a wiring pattern is formed by removing a conductor layer in a predetermined region by an etching process. Form. Thereafter, a cleaning process, a resist stripping process, a cleaning process after the resist stripping, and a drying process are performed, and finishing processes such as terminal plating, solder resist formation and cutting are performed to obtain a desired printed wiring board. In producing a printed wiring board, processes other than the laminating process in which the laminating apparatus 100 according to the present embodiment is used are not particularly limited, and a technique known at the time of filing can be appropriately applied.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 100 ... Laminating apparatus 10 ... Base material conveying apparatus 11 ... Base material delivery roller 12 ... Base material winding roller 13, 14 ... Guide roller B, B1, B2 ... Base base material 20 ... Film conveying apparatus (conveying means)
21 ... 1st film conveyance apparatus (1st conveyance means)
22 ... 2nd film conveyance apparatus (2nd conveyance means)
21A, 22A ... Film delivery roller 21B, 22B ... Release paper take-up roller D, D1, D1A, D2, D2A ... Dry film 30 ... Liquid material application device (liquid material application means)
31 ... 1st liquid thing application device (1st liquid thing application means)
31A ... tank 31H ... supply path (pipe) of liquid material
31R ... first liquid material application roller 32 ... second liquid material application device (second liquid material application means),
32A ... tank 32R ... second liquid material application roller M ... liquid material 40 ... crimping device (crimping means)
41... First pressure roller (first pressure means)
42. Second press roller (second press means)
DESCRIPTION OF SYMBOLS 50 ... Foreign material removal apparatus 51 ... 1st clean roller 52 ... 2nd clean roller 60 ... Heating device 61 ... 1st heating roller 62 ... 2nd heating roller

Claims (5)

A laminating apparatus for laminating a dry film for circuit formation on a main surface of a base substrate of a printed wiring board that is conveyed along a predetermined conveying direction,
Conveying means for conveying the dry film so as to be able to contact the main surface of the base substrate at a predetermined position;
A liquid material applying means provided on the upstream side of the predetermined position in the path of transporting the base substrate, and applying a liquid material to the main surface of the base substrate;
A crimping means for pressing the dry film while heating the main surface of the base substrate to which the liquid material is applied at the predetermined position;
The position where the liquid material is applied to the main surface of the base substrate by the liquid material application means is a position lower than the position where the dry film is pressed against the base substrate by the pressure bonding means. Laminating equipment.   Between the position where the liquid material is applied to the main surface of the base substrate and the position where the dry film is pressed against the main surface of the base substrate, the base substrate is 1 ° to the horizontal plane. The laminating apparatus according to claim 1, wherein the laminating apparatus is conveyed at an inclination angle of 10 ° or less. A guide roller for conveying the base substrate;
The guide roller is installed to be in contact with the base substrate at a position that is upstream of the liquid application unit and higher than a position where the liquid material is applied in a path for transporting the base substrate. The laminating apparatus according to claim 1 or 2, wherein the laminating apparatus is provided. A heating roller for heating the base substrate;
The heating roller is installed on the upstream side of the liquid application unit in the path of transporting the base material and in contact with the base material at a position higher than the position where the liquid material is applied. The laminating apparatus according to claim 1 or 2, wherein the laminating apparatus is provided.   The laminating apparatus according to any one of claims 1 to 4, wherein the liquid material includes water and a surfactant.

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