CN104023981A

CN104023981A - Method for producing a printing stencil for technical printing, and printing stencil for technical printing

Info

Publication number: CN104023981A
Application number: CN201280050248.8A
Authority: CN
Inventors: 克里斯提安·可安恩
Original assignee: Christian Koenen GmbH
Current assignee: Christian Koenen GmbH
Priority date: 2011-08-30
Filing date: 2012-08-30
Publication date: 2014-09-03
Anticipated expiration: 2032-08-30
Also published as: JP2014531338A; US9296195B2; DE102011081837B4; WO2013030273A1; US20140305323A1; MY185079A; EP2750891A1; JP6231478B2; CN104023981B; DE102011081837A1; EP2750891B1

Abstract

The present invention relates to a method for producing a printing stencil for technical printing, for applying a printed pattern to a substrate, and to a printing stencil. The method comprises supplying a carrier layer (21) for the printing stencil, supplying a structure layer (22) for the printing stencil, this layer being located beneath the carrier layer (21), making an elongate printed-image opening (22a), corresponding to at least part of the printed pattern, in the structure layer (22), and making carrier-layer openings (21a) in the carrier layer (21) in the region of the printed-image opening (22a). The method is characterized in that, for making the carrier-layer openings (21a), use is made of a laser device which is designed to emit a laser beam in laser pulses, and the task of making the carrier-layer openings (21) comprises making a row of carrier-layer openings (21a) extending in the longitudinal direction of the printed-image opening, wherein, for making each carrier-layer opening (21) in the row, a focussing means of the laser device is positioned at a position of the respective carrier-layer opening (21), and the respective carrier-layer opening (21) is made by means of one or more laser pulses at this position (P1), and the focussing means of the laser device, once a carrier-layer opening has been made, between two successive laser pulses, is displaced relative to the carrier layer, and in the longitudinal direction of the elongate printed-image opening (22a), from the position (P1) of the carrier-layer opening (21a) which has been made to the position (P2) of the carrier-layer opening which is subsequently to be made.

Description

Manufacture the method for printing stencil and the printing stencil of relevant technologies printing for technical printing

Technical field

The present invention relates to a kind of method of the printing stencil for the manufacture of relevant technologies printing, particularly for solar cell printing, for printed patterns is applied to substrate, particularly solar cell substrate, for example, for front side contacts or the rear side contacts of printing solar cell.

Manufacture method comprises: supply one carrier layer for this printing stencil; Supply one structure sheaf for this printing stencil, this structure sheaf position is below carrier layer; In this structure sheaf, produce one and extend printing images opening, this printing images opening to should printed patterns at least partly; And the method for employing, via laser cutting, in the carrier layer in this printing images open area, producing carrier layer opening, the method is that a printing auxiliary agent can be applied to substrate by these carrier layer openings and this printing images opening.

In addition, the present invention is about the printing stencil for technical printing, particularly for solar cell printing, and for printed patterns is applied to substrate, the particularly substrate of solar cell, this printing stencil comprises: a carrier layer for this printing stencil; One structure sheaf for this printing stencil; This structure sheaf is below this carrier layer, wherein, this structure sheaf has a prolongation printing images opening, and this prolongation printing images opening meets at least part of of this printed patterns in this structure sheaf, and wherein, this carrier layer comprises the carrier layer opening that is arranged in this printing images open area.

This printing stencil can be provided for solar cell printing, for example, be (for example) for applying the contact of solar cell, a particularly front contact.In the situation of the printing stencil providing for solar cell printing, the prolongation printing images opening of structure sheaf can provide for example fingertip for contact before printing solar cell.But, the present invention is not confined to the printing stencil for solar cell printing, but (in addition) also relates to for example special and hybrid technology template, and the type template has at least one carrier layer and at least one structure sheaf, metallizes to substrate surface for applying.

Background technology

Be used in solar cell, the substrate via printing screen taking printing contact to solar cell in prior art as known.Particularly, the printing images opening shielding by printing, via scraper, by applying the printing paste of common argentiferous to the substrate of solar cell, use printing screen taking metallization, contact and/or the conductor rail of printing solar cell contact as known, wherein, the printing images opening essence of printing screen meets at least part of of the printing images of wanted printing solar cell or printing images.

This printing screen has a gauze hole, this gauze hole is clipped in framework, and this gauze hole embeds a structure sheaf, such as a thin photoemulsion layer (for example, referring to according to the printing screen of No. 10 2,007 052 679A1, DE), and bearing structure layer and/or serve as a carrier layer for structure sheaf.This photoemulsion layer has printing images opening, meets the printing images that will print contact, and wherein, also extend in the region of the printing images opening of structure sheaf in the gauze hole of stablizing photoemulsion layer.In order to manufacture this printing screen, gauze hole is clipped in a framework conventionally, then applies a photosensitive material (a for example emulsion layer or a film).Then, printing images forms by exposing for example photosensitive material.

But, use this printing screen to exist defect with contact to the solar cell substrate that applies solar cell, particularly the fingertip of the relevant front contact that prints so-called solar cell.Fingertip should with consistent as far as possible height, minimum may width (for example from approximately 20 μ m(microns) to 100 μ m(microns) scope in) to be printed on substrate, so that the energy efficiency of consistent as far as possible cross-sectional area of conductor (impedance) and increase solar cell to be provided.Meanwhile, for the energy efficiency of solar cell, fingertip must enable one with minimum power line that may resistance, that is, fingertip must have the length-width ratio of maximum possible, because the resistance of fingertip depends on the cross section of fingertip.The compression of fingertip may reduce the conductibility of fingertip, so reduces the whole efficiency of solar cell.Therefore, if may, the length-width ratio of fingertip should be consistent, particularly in the whole length of fingertip.

When using printing screen just to produce following defect, special for the contact that applies solar cell to solar cell substrate.The intersection point in the gauze hole in the printing images open area of photoemulsion layer and particularly gauze hole can damage the uniformity that printing paste is applied to solar cell substrate during typography.This causes disadvantageous restriction in the conductive section of fingertip, and disadvantageous edges corrugated to printing images generation, particularly by causing near the mesh intersection point of printed edge (edge of printing images opening).In addition, about length-width ratio, directly proportional attainable maximum print cream intensity and maximum height height that can attainable printing fingertip are subject to the mesh-structured restriction of printing images open area center line.

In addition, gauze hole expands during typography, and due to contact and the movement of scraper, because the resiliency characteristics in gauze hole, this can make printing images distortion.When using various printings to shield repeatedly printed base plate, a typography is used various printing screens to realize with multiple steps conventionally, with the some parts of multiple step printings contact.When using known printing screen, the inhomogeneities of overall printing image just may occur in the transition region of overall printing image, wherein, because the distortion of above-mentioned particular printing images, so that the printing images of various printing screen is adjacent to each other.

In addition, owing to thirsting for the open area of the printed patterns that can have large printing screen, therefore the use that printing is shielded needs very fine mesh to shield for stable printing.But, this mesh height sensitive for damages, so only has short service life.

The known printing of above-mentioned relevant use is shielded in order to printing solar cell substrate, contact is applied to the defect of substrate (the particularly substrate of solar cell), 10 2,011 003 No. 287 proposals of patent application DE are a kind of for applying the solution of contact to substrate, the particularly substrate of solar cell.

The printing stencil of proposing for 10 2,011 003 No. 287 according to patent application DE comprises a carrier layer and a structure sheaf, it is all for printing stencil, this structure sheaf is positioned under this carrier layer, wherein, structure sheaf has a prolongation printing images opening, and this prolongation printing images opening meets at least part of of printed patterns.At this, the prolongation printing images opening of structure sheaf meets the printed patterns of the fingertip of the contact, front side of (for example) solar cell.In the region of printing images opening, carrier layer comprises prolongation carrier layer opening, and it is extending longitudinally printing images opening, and this prolongation carrier layer opening is essence rectangular aperture and/or selectively slightly circular in corner, and in each situation, stablize net mould and separate by one.In the top view of printing stencil, by adopting a method to make carrier layer superposition of end gap printing images opening, printing stencil can pass through at least one opening, apply a printing auxiliary agent (such as contact material) to substrate, the method is, printing stencil has an opening, and this opening forms from printing images opening and carrier layer opening, and can apply printing auxiliary agent (such as contact material) to substrate via this opening.Printing auxiliary agent is to extend below carrier layer, so that conforming 3 degree space forms to be provided.

According to a prior art approach, carrier layer opening can produce in carrier layer via laser cutting.At this, be, for via a focusing arrangement, a position (for example, in a corner) that will produce carrier layer edge of opening is located and focused on to the laser beam of Laser Devices knownly.So, laser beam essence directly focuses on the surface (that is, essence is directly focusing on the focus point on carrier layer surface) of carrier layer, or higher or lower than some μ m(micron of carrier layer surface), this depends on laser cutting method.At the shutter device of opening Laser Devices, focusing arrangement can be controlled, to guide the laser beam for the carrier layer edge of opening cut vector layer opening along producing, with the edge cuts carrier layer opening along carrier layer (referring to for example Fig. 3 A).

Thus, when producing carrier layer opening, need to use very high accuracy guide laser bundle, in addition, once near the whole circumference of each carrier layer opening, must guiding laser focusing bundle.Therefore, this is very consuming time with manufacture method.If the printing images opening of structure sheaf is the printing images opening of a fingertip of the front contact of solar cell, need to cut each multiple indivedual carrier layer openings of numerous fingertips, the cycle for the manufacture of the carrier layer opening of a single printing stencil of therefore producing is very long and additionally need to use very expensive laser cutting device.

Summary of the invention

There is the printing stencil of a carrier layer and a structure sheaf about above-mentioned consuming time and expensive manufacture, an object of the present invention is will improve to manufacture to comprise the printing stencil of a carrier layer and a structure sheaf, is easier to, the effectively more economical and more production of efficient mode of time to realize.

In order to reach above-mentioned target of the present invention, a kind of method for the manufacture of printing stencil is to propose according to independent entry with using this method to manufacture printing stencil.Independent entry is about preferred specific embodiment of the present invention.

Idea of the present invention is, without the edge of the carrier layer opening along producing, via the carrier layer opening of a laser focusing Shu Ercong carrier layer cut vector layer, laser cutting method as is known, but via an out of focus laser beam with produce or " ejaculation " carrier layer opening, wherein, laser beam is without focusing on (as) habitually in the past, but carries out out of focus according to carrier layer A/F.

Especially, can find out the fact from an idea of the present invention, there is a width in the out of focus cross section of laser beam, and this width is selected according to the carrier layer A/F at the carrier layer apparent height place of laser approaching side, and not to focus on a given focus substantially, as the situation of known method.

According to basic concepts of the present invention, can advantageously reach the present invention, according to the carrier layer A/F that will produce, in the position of carrier layer, via one or (or) multiple laser pulses, to produce or " ejaculation " carrier layer opening, the cross sectional shape essence of this carrier layer opening meets the cross sectional shape of out of focus laser beam.The manufacture of one printing stencil so can be being easier to, more economically effectively realize with the mode of more free efficiency, due to needn't be along the carrier layer opening that will produce around, by the method cut vector layer opening consuming time that uses laser focusing bundle, but can be via one or more laser pulse to produce or " ejaculation " have width range from 20 μ m(microns) to 100 μ m(microns) carrier layer opening.Compared to known method, this can save suitable time quantum, and wherein, saving is not in low percentage range but can accelerates to manufacture printing stencils with 10 to 80 times.

At the carrier layer apparent height place of laser approaching side, what the cross-sectional width that produces out of focus laser beam was approximately slightly less than the carrier layer opening that will produce wants width (approximately 50% to 95%, depend on thickness and the material of carrier layer) be the most useful, because can causing the carrier layer opening producing, the thermal energy producing via laser beam is greater than the cross section that uses out of focus laser beam.

One first aspect of the present invention is proposed a kind of method that is used for printed patterns to be applied to for the manufacture of relevant technologies printing the printing stencil of substrate, and the method comprises the following steps: to supply a carrier layer for printing stencil; Supply one structure sheaf for printing stencil, this structure sheaf is positioned under this carrier layer, special one have exceed 5 μ m(microns) layer thickness; In this structure sheaf, produce one and extend or printing images opening extending longitudinally, it meets at least part of of this printed patterns; And the method for employing, in the carrier layer in this printing images open area, producing carrier layer opening, the method is that a printing auxiliary agent can be applied to substrate by these carrier layer openings and this printing images opening.

The method according to this invention, it is characterized by, one out of focus laser beam of the carrier layer A/F that foundation will produce is for generation of carrier layer opening, be, particularly, one laser beam without focus on essence position carrier layer apparent height place or position slightly on carrier layer surface or below a focus, method as is known, but essence is in the apparent height place of carrier layer out of focus, and particularly at the apparent height place of carrier layer, its cross-sectional width exceedes 10 μ m(microns), preferably exceed 20 μ m(microns).As aforementioned, the manufacture of one printing stencil so can be being easier to, more economically effectively realize with the mode of more free efficiency, due to needn't be along the carrier layer that will produce around, use the method cut vector layer opening consuming time of laser focusing bundle, but via one or more laser pulse to produce or " ejaculation " wider carrier layer opening.

One Laser Devices are preferably used in and produce carrier layer opening.These Laser Devices comprise a focusing arrangement, and are designed to laser pulse Emission Lasers bundle, and adjust laser beam via focusing arrangement, with according to the carrier layer A/F that will produce and at the apparent height place of carrier layer out of focus laser beam.Thus, can use the pulse laser device of emission pulse laser bundle and Laser Devices both, these Laser Devices comprise a lasing light emitter and transmitting one continuous laser beam, this continuous laser beam can be subject to an impact of periodically holding and/or closing shutter device, is particularly subject to the impact with high frequency Push And Release shutter device.

Laser beam preferably adopts a method to carry out out of focus, and the method is that the cross-sectional width of the laser beam at the apparent height place of carrier layer is had an appointment via approximately 50% to 95% of the carrier layer A/F of one or more laser pulse generation.As aforementioned, be preferably in the cross-sectional width size of out of focus laser beam at the carrier layer apparent height place on laser approaching side rough be smaller than the carrier layer opening that will produce want width (approximately 50% to 95%, depend on thickness and the material of carrier layer) because the thermal energy causing via laser beam may cause the carrier layer opening producing to be greater than the cross section of used out of focus laser beam.

The work that produces carrier layer opening preferably includes row that produce carrier layer opening, the carrier layer opening of these row is extending longitudinally at printing images opening, wherein, after producing a carrier layer opening, the position of laser beam is between two continuous lasers, move to a position of the carrier layer opening that will produce subsequently with respect to carrier layer, and longitudinal at printing images opening.This make its carrier layer can with the time effectively and straightforward procedure between carrier layer opening, form one and stablize net mould so that the position of laser, between two laser pulses, with respect to carrier layer, moves to next carrier layer opening that will produce from a carrier layer opening.

According to useful especially preferred exemplary specific embodiment, in the time producing other (respective) carrier layer opening of these row, the position of laser beam is positioned at a position of indivedual carrier layer openings, and indivedual carrier layer openings are preferably in this position, produce via one or more laser pulse, especially via best 1 or 2 to 10 laser pulse.According to this useful especially preferred exemplary specific embodiment, when indivedual carrier layer openings produce via one or more laser pulse, does not preferably move the position of laser beam.

Above-mentioned useful especially preferred exemplary specific embodiment based on concept be, without the edge guides laser beam of the carrier layer opening along producing, laser focusing bundle via each cuts other carrier layer opening, as is known laser cutting method from carrier layer.According to the present invention, carrier layer in the printing images open area of the structure sheaf by only laser beam being positioned to the carrier layer aperture position place that will produce is more properly provided, produce other carrier layer opening in each situation, be preferably in position that essence is identical via pulse laser beam one or also two to multiple laser pulses.The distance of carrier layer opening can be via the control of the pulse frequency of laser and/or supply rate at this.

The carrier layer opening producing also provides at above-mentioned useful especially preferred exemplary specific embodiment, with between two laser pulses, the position of the laser beam above carrier layer is directed into next carrier layer opening that will produce, forming next carrier layer opening that will produce with one or more laser pulse via subsequently.Before all carrier layer openings of row of the region generating two or more carrier layer opening of printing images opening, will repeat these steps.According to the method for this exemplary specific embodiment, so can be in the minimum time, the permutation with very simple and advantageous manner along longitudinal generation carrier layer opening of printing images opening.For this purpose, producing before carrier layer opening or whether providing afterwards structure sheaf dispensable, particularly producing before carrier layer opening or afterwards, whether structure sheaf is applied to this carrier layer or an intermediate layer.

Compared to known laser cutting method, so can with advantageous particularly and more the time efficient and also economical and effective method at the whole region generating carrier layer opening of the prolongation printing images opening of structure sheaf.Only have one or in rare situation, when carrier layer very thick, need two to produce other carrier layer opening approximately 0.9 to 3kHz frequency to multiple short laser pulses, or according to the type of laser using, and by between two laser pulses, with respect to laser beam position with mobile vehicle layer, so all the time can be with minimum time these row at the region generating carrier layer opening of printing images opening.

According in the method for above-mentioned useful especially exemplary specific embodiment, the shape of indivedual carrier layer openings is mainly to be predetermined (especially by the cross sectional shape of the laser beam of the At The Height in carrier layer, at the cross sectional shape of the laser at the carrier layer apparent height place of laser approaching side), because individual other carrier layer opening is by the position in carrier layer, produce or " ejaculation " via indivedual laser pulses, and without along carrier layer opening around, cut by the laser beam of guiding a focusing.

In the situation of the circular out of focus laser beam of an essence, individual other carrier layer opening essence like this produces with circular, fashion, for example, and when carrier layer is not with respect to focusing arrangement and/or laser beam and when mobile.When applying laser pulse, if carrier layer moves, be circular in end and the prolongation carrier layer opening that has shape to meet slot shape forms according to mobile, that is, form the carrier layer opening of slot shape.The width essence of carrier layer opening determined by the out of focus sectional dimension of the laser beam on carrier layer surface, and wherein, one may produce because quoting thermal energy conventionally compared with wide carrier layer opening.For example,, due to radiant heat energy sidepiece at the most, therefore without the position that changes laser beam, once thering are 20 μ m(microns) the laser cross section of width can produce one and have nearly 25 μ m(microns) the carrier layer opening of width.

Because when being increased in the cross section of the out of focus laser beam in carrier layer, the energy density of laser beam can reduce with absolute value aspect, therefore restriction can be via one or the upper size of the carrier layer opening reached of some minority laser pulse.But, can reach nearly 300 μ m(microns in practical application area) carrier layer opening diameter, and especially at 20 μ m(microns) to 800 μ m(microns) known carrier layer thickness be possible, only use a laser pulse to have lower than 20 μ m(microns in generation with the frequency 0.9 to 3kHz) to approximately 150 μ m(microns) the carrier layer opening of scope diameter.This meets (for example) for being printed on approximately 20 to 100 μ m(microns) the general width of the printing images opening of the fingertip of the front contact of solar cell in scope, therefore, printing images opening is relevant therewith for it, with in the region of printing images opening, use other laser pulse to be formed on the single-row carrier layer opening producing in each situation.

In order to improve the stability of template, indivedual net moulds can be stayed two carrier layer between carrier layer opening at this.According to demand, the width of net mould can be subject to following impact: the time between two laser pulses (is, for example,, from the cycle T of any pulsed operation factor of pulse laser and 50% pulsed operation factor of the poor or cycle T half of pulse duration τ or the reciprocal value of doubled frequency); And between two laser pulses, the supply rate of the carrier layer of locating with respect to laser beam.

Compared to known laser cutting method, the method of above-mentioned particularly useful specific embodiment causes more net moulds for a prolongation printing images opening, due to, in comparison with the height producing from known laser cutting method extend or rectangle carrier layer opening to produce carrier layer opening, when in the time that laser beam essence does not move, for the reason of relevant treatment, the length summary of carrier layer opening meets carrier layer A/F (for example, the situation of or oval carrier layer opening circular in essence).Even if net Mould Breadth degree is obviously reduced to approximately 10 μ m(microns) to 20 μ m(microns), so can reach identical stability or stability even quite preferably.In the situation of known laser cutting method, known laser cutting method needs at least 30 μ m(microns) or larger net Mould Breadth degree.Substantially, meet the just good stability of sufficient to guarantee of thickness of carrier layer for net Mould Breadth degree essence.

Compared to printing screen and printing stencil, wherein, carrier layer opening forms via a known laser cutting method, owing to reducing the minimizing net modulus order with increasing printing images open area extending longitudinally of carrier layer opening, also obviously suitably improve scraper characteristic, due to scraper during printing treatment more uniformity place because the cause of more close net mould, and can not stumble the edge of carrier layer opening.Therefore,, after using for several times, also can obviously reduce the wearing and tearing of template and the scraper that uses.

The net modulus order of this increase printing images open area surprisingly, does not cause printing images to worsen, and this printing screen from using with narrow mesh width can be known, and just can expect in the time starting.But, adopt an advantageous particularly mode still can obtain good printing images, due in order to process relevant reason, at the net mould partial melting laser approaching side of carrier layer and/or the sidepiece of structure sheaf, particularly at approximately 10 μ m(microns) to 20 μ m(microns) the situation of net Mould Breadth degree, so reduce relevant highly extension.

The printing paste of quoting can collect under the net mould of melting well, and in the whole length of printing images opening, produces a clean printing images.Especially, surprisingly, although have a large amount of net moulds in the whole region of printing images opening, still can reach the uniformity height of printing auxiliary agent.This fingertip for the front contact of printing solar cell is profitable especially, because can reach suitable fingertip height in the whole region of fingertip, therefore can keep little fingertip resistance, because the cause of high consistency length-width ratio.If the fingertip of the front contact of printing solar cell, so, compared to printing images and the printing stencil of printing screen, can obviously improve printing images, wherein, carrier layer opening forms via known laser cutting method.

Should still want number by reducing carrier layer opening to reduce the net modulus order in the printing images open area of structure sheaf, and increase the extend longitudinally of carrier layer opening simultaneously, still can provide the good time to save via the method according to this invention.For this purpose, one substitute but also useful especially exemplary specific embodiment will be described below.

Substituting, useful especially exemplary specific embodiment, about the difference of above-mentioned exemplary specific embodiment is, between the laser pulse at laser beam, also moving during laser pulse and not only with respect to the position of the laser beam of carrier layer.

In the time producing an other carrier layer opening of these row, the position of laser beam is preferably positioned at a primary importance of indivedual carrier layer openings that will produce at this, and at an impulse duration, by the position of laser beam is moved to a second place from the primary importance of indivedual carrier layer openings, produce other carrier layer opening via a laser pulse.During the position of laser beam is preferably in a laser pulse, longitudinal at printing images opening, move to the second place from the primary importance of indivedual carrier layer openings.Therefore, it is not the carrier layer opening that cross sectional shape meets one of out of focus lasing aperture shape and be formed at carrier layer surface, but there is the carrier layer opening of a slot shape, and its end have the shape that the cross sectional shape of out of focus laser beam causes (for example, have out of focus laser beam circular cross-section semi-circular ends or there is the half elliptic end of the oval cross section of out of focus laser beam).

The pulse duration that moves to the supply rate of the second place and/or the laser pulse of laser beam from the primary importance of the carrier layer opening that will produce with respect to the laser beam position of carrier layer is preferably selected according to the length of the carrier layer opening that will produce.

No matter specific embodiment, preferably also comprises a set-up procedure according to the method for the first aspect, in order to the focusing arrangement via Laser Devices, be adjusted at cross sectional shape and/or the size of the out of focus laser beam at the apparent height place of carrier layer.At this, preferably according to the width of printing images opening, the cross-sectional width of laser beam is laterally adjusted to the apparent height of carrier layer, with longitudinal printed aligned image opening.Describe as front, this advantageously affects size and/or the shape of the carrier layer opening producing according to demand.

Especially,, by adjusting the focusing arrangement of Laser Devices, the width of carrier layer opening can be through being adapted to the width of printing images opening of structure sheaf.The focusing arrangement that laser beam preferably has an essence circular cross-section via the apparent height place in carrier layer carries out out of focus.According to a substituting preferred exemplary specific embodiment, laser beam carries out out of focus via the apparent height place in carrier layer via the focusing arrangement with an essence elliptic cross-section.The oval main shaft of carrier layer opening this best lateral alignment (particularly vertical) in printing images opening longitudinally.Therefore, can favourablely provide the more result formats of uniformity net mould, especially, because the elliptical shape cause of carrier layer opening, therefore provide more uniformity width at the transverse direction of printing images opening.

In addition, the method preferably includes a set-up procedure, in order to adjust with next or several parameter: ON/OFF (ON/OFF) ratio of the pulse duration of the frequency of pulse laser beam and/or cycle, laser pulse, the work period of pulse laser beam, pulse laser beam.When carrier layer moves with respect to the focusing arrangement of Laser Devices, this allows according to the supply rate of adjusting, the net Mould Breadth degree between the adjacent carrier layer opening for example, producing with () impact and/or adjustment.Thus, these parameters are got depending on each other, and other parameters determine by both that adjust these parameters conventionally.

Between two the continuous laser pulses in the middle of two adjacent carrier layer openings of these row of carrier layer opening of the position of laser beam, move with respect to carrier layer, a net mould is preferably formed in carrier layer.When describing above, so can advantageously increase the stability of printing stencil, particularly in the situation that highly extends printing images opening, this stability is necessary for the fingertip of the front contact of for example printing solar cell.

A position that moves to the carrier layer opening that will produce subsequently when the position of laser beam with respect to carrier layer from a position of the carrier layer opening that produces, supply rate is preferably selected according to a predetermined net Mould Breadth degree.A position that moves to the carrier layer opening that will produce subsequently when the position of laser beam with respect to carrier layer from a position of the carrier layer opening that produces, supply rate is also preferably selected according to the cross-sectional width of the out of focus laser beam at longitudinal carrier layer A/F of printing images opening or the apparent height place based in carrier layer.

Move to this position of the carrier layer opening that will produce subsequently from this position of the carrier layer opening that produces with respect to carrier layer when the position of laser, supply rate preferably selected especially less or essence equals (BL+SB)/(T-τ), wherein, BL is illustrated in longitudinal carrier layer A/F of printing images opening, and (this is applicable to when producing carrier layer opening, the specific embodiment that does not move the position of laser beam; Working as generation carrier layer opening, the situation of the method that also move the position of laser beam, BL should select according to the cross-sectional width of out of focus laser, wherein, but, BL should select slightly larger), SB represents predetermined net Mould Breadth degree, T is the cycle of pulse laser beam, and τ is the pulse duration of laser pulse.Therefore, carrier layer advantageously in the period between two laser pulses (for example, known T-τ), at least to meet the carrier layer A/F of printing images opening in longitudinally and the distance of predetermined net Mould Breadth degree summation, with respect to the focusing arrangement of Laser Devices and move, to leave the net mould of a preset width in carrier layer.

Move with respect to carrier layer when the position of laser beam, focusing arrangement preferably moves.Or (or in addition), when the focusing arrangement of Laser Devices moves with respect to carrier layer, it is movable carrier layer also.Thus, when carrier layer opening produces or " ejaculation " in the each situation that uses a laser pulse, when producing row of carrier layer opening, can realize continuously movement.Or, when meet the distance moving of both summations of the carrier layer A/F of printing images opening in longitudinally and two interpulse predetermined net Mould Breadth degree with essence, while being listed as to produce one of carrier layer opening, also can realize by step mobile, to be parked in the position of next carrier layer opening that will produce, until produced carrier layer opening after the predetermined quantity of one or more laser pulse, then meet at the printing images opening carrier layer A/F in longitudinally and the distance of both summations of predetermined net Mould Breadth degree that will produce next carrier layer aperture position with essence, again between two continuous impulses, move.

The material of carrier layer preferably comprises metal, particularly stainless steel or nickel and/or plastic material.

Structure sheaf preferably comprises a photosensitive material, particularly an emulsion or a film.Thus, produce printing images opening and preferably include the following step: use the printing images of printed patterns to expose this structure sheaf, via the electromagnetic radiation line of a predetermined wavelength or a predetermined wavelength range, particularly via infrared ray, visible ray and/or ultraviolet; And the photosensitive material of this structure sheaf that develops.

Structure sheaf is preferably directly applied to this carrier layer or an intermediate layer, and this intermediate layer is applied between this carrier layer and this structure sheaf.

The work that produces carrier layer opening preferably also comprises at least one another secondary series that produces carrier layer opening, and it is extending longitudinally printing images opening, and is parallel to this first row of carrier layer opening.At this, when producing an other carrier layer opening of this secondary series, a focusing arrangement of these Laser Devices preferably can be positioned on a position of indivedual carrier layer openings, and indivedual carrier layer opening preferably produces via one or more laser pulse in this position.Produce a carrier layer opening between two continuous laser pulses after, the focusing arrangement of Laser Devices is preferably with respect to carrier layer, and extend printing images opening longitudinally, move to this position of the carrier layer opening that will produce subsequently from this position of the carrier layer opening that produces.

In each situation, one carrier layer opening of first row preferably adopts a carrier layer opening of overlapping this at least one another secondary series of a method, the method is, each carrier layer opening is producing from the printing stencil of manufacture of two or more carrier layer openings of at least two row, wherein, a net mould is preferably formed between the adjacent carrier layer opening of printing images opening in longitudinally.Benefit is, even there is the wider carrier layer opening (being the cross section with enough energy densities) of the laser effective cross-section width being wider than in carrier layer by two or multiple row of the carrier layer opening of generation essence configured in parallel, and produce with the simple and time effective means of the method according to this invention, wherein, the carrier layer opening (these openings are adjacent in the transverse direction of printing images opening) of the different lines of configuration parallel to each other is overlapping, so in each situation, in the printing stencil completing, form a wider carrier layer opening, wherein, individual other net mould again printing images opening longitudinally in form between adjacent carrier layer opening.

One second aspect of the present invention proposes that a kind of relevant technologies printing is for being applied to printed patterns the printing stencil of substrate, this printing stencil is based on producing according to the method for above-mentioned the first aspect, wherein, printing stencil comprises: a carrier layer for this printing stencil; And the structure sheaf for this printing stencil, this structure sheaf is positioned under this carrier layer.About the benefit of printing stencil, please refer to above together with the benefit described in the method according to this invention and preferred specific embodiment thereof.

According to the present invention, structure sheaf has a prolongation printing images opening in structure sheaf, this prolongation printing images opening in structure sheaf corresponding printed patterns at least partly, and this carrier layer comprises one or multiple row of carrier layer opening in the region of printing images opening, these one or multiple row be extending longitudinally at printing images opening.But, in comparison with the carrier layer opening producing according to known laser cutting method, these carrier layer openings are not to produce with essence rectangular mode, but have the circular edge processing according to the effective cross-section of laser.It selectively has the longitudinal width of horizontal printing images opening, and this width summary meets the longitudinal length of printing images opening; Or, it forms with two or more carrier layer opening overlapping in the longitudinal transverse direction of printing images opening, these openings have the circular edge processing according to the effective cross-section of laser, and (or) there is the longitudinal width of a horizontal printing images opening, this width summary meets the length longitudinal at printing images opening.

The carrier layer opening of one row preferably forms with an essence circular, fashion.Or the carrier layer opening of row preferably forms in the oval mode of an essence.At this, the oval main shaft of carrier layer opening of row be lateral alignment (vertical especially) in printing images opening longitudinally.Or the carrier layer opening of row has an essence slot shape, be that it is extend but have circular end, its essence can be semicircle or half elliptic.

The material of carrier layer preferably comprises metal, particularly stainless steel or nickel and/or plastic material.Structure sheaf preferably comprises a photosensitive material, particularly an emulsion or a film.

Structure sheaf is preferably directly applied to carrier layer or an intermediate layer, and this intermediate layer is applied between carrier layer and structure sheaf.

In the region of printing images opening, carrier layer preferably has accurate row of the carrier layer opening of row, and these row are extending longitudinally at printing images opening, wherein, one not net mould be preferably formed between adjacent carrier layer opening.Individual other net mould the pick of is melted in the sidepiece in the face of structure sheaf, so, compared to the height of carrier layer, has the height of a reduction.As aforementioned, this can, according to the present invention, by reaching be used as the use of laser approaching side in the face of the carrier layer sidepiece of structure sheaf, be to touch the carrier layer sidepiece in the face of structure sheaf when laser beam, and carry fast, this difference in height of wanting just can be because fuel factor produces.

According to a further useful specific embodiment, the carrier layer opening of one first row and the carrier layer opening of at least one another secondary series are overlapping in the each situation that adopts this method, the method is, to be formed by two or more carrier layer opening of at least two row at each carrier layer opening of printing stencil, wherein, other net mould is formed in the longitudinal of printing images opening, between adjacent carrier layer opening.

Put it briefly, a kind of manufacture method for printing stencil can be provided according to the present invention, wherein, indivedual carrier layer openings are by applying each situation of one or more laser pulse in a position, in the region of printing images opening, produce or " ejaculations " in carrier layer for printing stencil, compared to carrier layer opening known via high order focusing laser beam the manufacture method from the cutting of carrier layer circumference, the method can with more simply, more efficient mode, and time effective means reach.

Owing to can being obviously reduced on expensive laser cutting device and producing carrier layer opening especially, therefore manufacturing when printing stencil, this more represents and improve cost benefit on certain degree through time efficiency of improving.In addition, for the reason of relevant treatment, one printing stencil constructed in accordance comprises about printing screen and the also structural improvement of printing stencil, wherein, carrier laser opening is knownly to cut from carrier layer circumference via a high order focusing laser beam, owing to reaching the suitable stability of carrier layer and the scraper characteristic through improving improved, and still can obtain good printing images, the particularly fingertip of contact before printing solar cell.

Preferred application field about printing stencil according to the present invention is as follows especially: thick film application, printing conductive slurry, printed resistor slurry, printing heat electrocondution slurry or glutinous agent, glutinous agent, silicones, acryl, slurry and emulsion, it has quite high clayey (meeting wet film thickness), non-conductive slurry and emulsion.

Brief description of the drawings

Fig. 1 shows the top view of the known solar cell of prior art.

Fig. 2 A shows the top view of the known printing screen part of prior art, and Fig. 2 B shows the cross section of the printing screen part of the known Fig. 2 B of prior art.

Fig. 3 A shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening is knownly to cut from carrier layer circumference via high order focusing layer light beam.Fig. 3 B shows along the schematic section of the tangent line A-A of Fig. 3 A.

Fig. 4 A shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening is based on producing according to the method for one first exemplary specific embodiment of the present invention.Fig. 4 B shows along the schematic section of the tangent line A-A of Fig. 4 A.

Fig. 5 A to 5D illustrates according to the step of the method for an exemplary specific embodiment of the present invention.

Fig. 6 shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening is based on producing according to the method for one second exemplary specific embodiment of the present invention.

Fig. 7 shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening is based on producing according to the method for of the present invention 1 the 3rd exemplary specific embodiment.

Fig. 8 shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening is based on producing according to the method for of the present invention 1 the 4th exemplary specific embodiment.

Fig. 9 shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening is based on producing according to the method for of the present invention 1 the 5th exemplary specific embodiment.

Figure 10 shows to use via example making progress according to the time waveform of a pulse laser of the method for an exemplary specific embodiment of the present invention.

Detailed description of the invention

Various exemplary specific embodiment of the present invention is to be described with reference to the drawings below.In the drawings, same or similar element uses identical reference symbol to represent.But, the present invention is not confined to the design feature of describing, but also comprise the feature modification of described exemplary specific embodiment, with the combination of various exemplary specific embodiment features in independent claims item category.

Fig. 1 shows the top view of the known solar cell 100 of prior art via example.Solar cell 100 comprises an essence rectangular light sensitive semiconductor photovoltaic substrate layer, below will be referred to as substrate 1, the front side of this substrate comprises a front contact, this front contact has two (or also having multiple) electricity to lead bus 102, extend parallel to each other, be used for dissipating electric flux and connection solar cell 100 to other solar cells, so that a solar module to be provided.Multiple fingertips 101 also extend parallel to each other but laterally to bus 102, these multiple fingertips provide an element of being used as perpendicular to the front contact of bus 102.Once light is incident on bus 102, these multiple fingertips just conduct the electric energy producing at substrate 1.In order to want to have the low-resistance high-energy source efficiency of conducting path solar cell and while alap one to cover, fingertip 101 should have maximum possible length-width ratio, and its whole length at fingertip 101 is uniformity, is larger height and minimum widith.

Fig. 2 A shows the top view of known printing screen 200 parts of prior art via example, and Fig. 2 B shields the sectional view of 200 parts via the printing of the known Fig. 2 B of example demonstration prior art.Printing screen 200 comprises a photoemulsion layer 201, and it has a printing images opening 203, for printing contact, front side.Photoemulsion layer utilizes a mesh 202 to be stablized, and this mesh is for quoting at photoemulsion layer 201.This is disadvantageous especially, because mesh 202 also fills up the free printing zone of printing images opening, and in the time of printing contact, front side, so just, cause the inconsistent impression of pasting, particularly, in the region of the mesh node of mesh 202, be especially configured in the fringe region of application lines (printing images opening 203) when the mesh node of mesh 202.

Fig. 3 A shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening is known to be cut from carrier layer circumference via a laser focusing bundle.Fig. 3 B shows along the schematic diagram of the tangent line A-A of Fig. 3 A.

Fig. 3 A shows via example the top view that presents a printing stencil from the sidepiece of structure sheaf 22 especially, and wherein, printing stencil is for producing via a known laser cutting method.Carrier layer opening 21a is the edge along the carrier layer opening 21 that will produce, and cuts from carrier layer 21a via laser focusing.In the region of the prolongation printing images opening 22a of structure sheaf 22, three essence rectangle carrier layer opening 21a are formed on carrier layer 21, and it all utilizes a net mould 21b to be separated from each other.

At this, for cut vector layer opening 21a, laser beam is first placed on a corner, for example, at the position of Fig. 3 A P1, and after opening the shutter device of Laser Devices, then be directed to along the edge of carrier layer opening 21a at position P2, P3 and the P4 in other corners respectively, and then home position P1 until carrier layer opening 21a cut from carrier layer 21 completely.After closing the shutter device of Laser Devices, laser focusing bundle can import the region of next carrier layer opening 21a that will produce, with this next carrier layer opening 21a that will produce in carrier layer 21 outsides earnestly.

Fig. 4 A shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening 21a is based on producing according to the method for one first exemplary specific embodiment of the present invention.Fig. 4 B shows along the schematic section of the tangent line A-A of Fig. 4 A.

One extends continuously rectangle printing images opening 22a(for example for the fingertip of the front contact of printing solar cell) be formed on structure sheaf 22.Carrier layer 21 on be arranged in structure sheaf 22, row of round carrier layer opening 21a are the region generating at printing images opening 22a, therebetween, the net mould 21b of each is formed on carrier layer 21.The diameter of carrier layer opening 21a is adjusted the width of printing images opening 22a at the transverse direction of printing images opening 22a, and/or at Fig. 4 A, essence meets the width of printing images opening 22a.

In order to print the fingertip of front contact of a solar cell printing, size can reality for example adopt a method design, the method is, the diameter range of the width of printing images opening 22a and/or carrier layer opening 21a is from approximately 20 to 100 μ m(microns), and the net Mould Breadth degree of the net mould 21b measurement of the thin middle section of net mould (for example) scope is from 10 μ m(microns) to 50 μ m(microns) or preferably from approximately 15 μ m(microns) to 30 μ m(microns).

Utilizing can be from lower than approximately 30 μ m(micron in the unexpected effect of the height reduction of the partial melting of laser approaching side) net Mould Breadth degree find out, especially from approximately 20 μ m(microns), as shown in the net mould 21b of Fig. 4 B.For example, for stability reason, this narrow net Mould Breadth degree cannot use known laser cutting method to reach, as shown in Figure 3A.Utilize partial melting will to cause favourable effect in the height reduction of the net mould 21b of laser approaching side, be, one printing paste can goodly collect in the net mould 21b below of substrate 1 sidepiece that will print, and provides and may improve uniformity printing images in the whole length of printing images opening.

Support according to the present invention layer opening be via one or more laser pulse of out of focus laser beam position P1, P2 ... PN produces.For this purpose, carrier layer 21 and Laser Devices are longitudinal printing images opening 22a region, move to the arrow of position PN(referring to Fig. 4 A relative to each other from position P1).When carrier layer opening 21a produces via each laser pulse, the method can realize (especially very the situation of short laser pulse) continuously at this, or when carrier layer opening 21a is via each generation of one or more laser pulse, also preferably adopt as the step generation with reference to figure 5A to 5D below.In two situations, for example, move to adjacent position (for example P2) from a position (P1) and particularly between individual two laser pulses, realize.

Fig. 5 A to 5D illustrates according to the step of the method for an exemplary specific embodiment of the present invention.According to Fig. 5 A, Laser Devices 10 comprise a lasing light emitter 11 and a focusing arrangement 12, and this focusing arrangement comprises a focusing optical, and these Laser Devices are positioned over the P1 place, position of the one first carrier layer opening 21 that will produce in carrier layer 21.Laser beam alignment carrier layer 21, and via the focusing optical of focusing arrangement 12, apparent height or in carrier layer 21 out of focus, make to comprise a laser cross section QL, its size depend on the carrier layer opening 21a that will produce preliminary dimension QT(preliminary dimension QT approximately 50% to approximately 90%).In the region of laser cross section QL, laser beam has an energy density, and this energy density, via one or more laser pulse of predetermined quantity n, is enough to produce a carrier layer opening according to relying carrier thickness.Laser cross section QL should select to be slightly less than preliminary dimension QT conventionally at this, and because the thermal energy in carrier layer is side-irradiation and produces a carrier layer opening, the cross section of this carrier layer opening is greater than the cross section QL of out of focus laser beam.

After Laser Devices 10 being placed on to position P1, launching before the laser pulse of predetermined quantity n, Laser Devices 10 can remain on P1 place, position in a scheduled time slot, be, meet n doubly to a scheduled time slot of cycle T or the n times of inverse value to the pulse laser frequency of Laser Devices 10 (being preferably in laser pulse duration for accurately, is n=1).Then, carrier layer opening 21a produces or " ejaculation " at P1 place, position, and as Fig. 5 B, signal shows.After n laser pulse, Laser Devices 10 move to the P2 place, position of next carrier layer opening 21a that will produce with respect to carrier layer 21, and are placed on position P2, and as Fig. 5 C, signal shows.Movement is at n and between (n+1) individual laser pulse, realizes subsequently.But, generally speaking, no matter whether Laser Devices 10, focusing arrangement 12 and/or carrier layer 21 be actual mobile, not essential to the present invention.

After Laser Devices 10 being placed on to P2 place, position, at the laser pulse of launching predetermined quantity m (preferably, wherein m=n, especially preferably m=1) before, Laser Devices 10 can be stayed P2 place, position in a scheduled time slot, are doubly to cycle T or m times to a scheduled time slot of the inverse value of the pulse laser frequency of Laser Devices 10 according to m.Then, carrier layer opening 21a produces or " ejaculation " at the P2 place, position that signal shows as Fig. 5 D.Thus, as aforementioned, utilize the partial melting laser approaching side in carrier layer 21, the special and advantageous effects of the height reduction of net mould 21b occurs in net Mould Breadth degree lower than approximately 30 μ m(microns), especially at approximately 20 μ m(microns) with less, as aforementioned.After m laser pulse, Laser Devices 10 are for moving to the position of next carrier layer opening 21a that will produce with respect to carrier layer 21, and reach carrier layer opening 21 these row rearmost position PN and produce before the last carrier layer opening of these row, repeat these steps.

Fig. 6 shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening 21a is based on producing according to the method for one second exemplary specific embodiment of the present invention.Thus, about being according to the difference of the exemplary specific embodiment of Fig. 4 A and 4B, carrier layer opening 21a is not circular but oval.This can be in carrier layer via not being circular but oval-shaped focusing arrangement 12, utilize the cross section QT of out of focus laser and reach; Or due to the speed of (penetrating and wearing) during cutting, this result also obtains automatically in the direction of the supply especially.

Prolongation one continuously,, rectangle printing images opening 22a(are for example for printing the fingertip of front contact of a solar cell) be formed on structure sheaf 22.In the region of printing images opening 22a, row of oval carrier layer opening 21a are that the carrier layer 21 on be positioned at structure sheaf 22 produces, and the net mould 21b of each is formed between these openings of carrier layer 21.The main shaft of oval carrier layer opening 21a be lateral alignment printing images opening 22a longitudinally, and at the transverse direction of printing images opening 22a, through adjusting the width of printing images opening 22a, or at Fig. 6, essence meets the width of printing images opening 22a.

In order to print the fingertip of front contact of a solar cell, size can reality for example with such as following generation: the main axis length scope of the width of printing images opening 22a or oval carrier layer opening 21a is from approximately 25 to 80 μ m(microns) and net Mould Breadth degree (for example, summary is measured at the thin middle section of the net mould) scope of net mould (21b) from 5 μ m(microns) to 20 μ m(microns) or preferably from approximately 10 μ m(microns) to 15 μ m(microns).The advantageous effects of the height reduction of above-mentioned net mould (21b) also can be by from being less than about 30 μ m(microns) (especially about 20 μ m(microns)) the partial melting laser approaching side of net Mould Breadth degree occur.

According to this exemplary specific embodiment, by oval-shaped wider main shaft lateral alignment printing images opening 22a longitudinally can be produced to wider carrier layer opening 21a.In extra and advantageous particularly method, in longitudinal situation of main shaft lateral alignment printing images opening 22a, because oval-shaped cause can be used at the transverse direction width that more uniformity is extended and form net mould 21b.

Fig. 7 shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening 21a is based on producing according to the method for the 3rd exemplary specific embodiment of the present invention.At this, about being according to the difference of the exemplary specific embodiment of Fig. 4 A and 4B, carrier layer opening 21a is not circular, but form in each situation of round carrier layer opening, these round carrier layer openings adopt a row configuration, these row extend laterally to the longitudinal and overlapping of printing images opening, to form a single carrier layer opening 21a.This can similar Fig. 4 A and 4B, according to the processing procedure of Fig. 5 A to 5D, according to shape and depend on the size of the laser cross section QT of out of focus laser, reach by row that first produce circle (also can be ellipse at another exemplary specific embodiment) carrier layer opening (it is extending longitudinally printing images opening 22a's), wherein, focus device moves to position P1N with respect to carrier layer from position P11, and then, similarly, be created in another row of the carrier layer opening of the parallel longitudinal extension of printing images opening 22a, be, via a for example secondary series from P21Zhi position, position P2N, one the 3rd row from P31Zhi position, position P3N, with the 4th row from P41Zhi position, position P4N.

According to this exemplary specific embodiment, even can produce the width that wider carrier layer opening 21a and its width can obviously be greater than laser cross section QT, as shown in Figure 7.At this, meanwhile, from being less than about 30 μ m(microns) net Mould Breadth degree, especially at approximately 20 μ m(microns), can find out the advantageous effects of the height reduction of above-mentioned net mould 21b by partial melting laser approaching side.If opening is very large, for the cause of intensity, the net mould extending in parallel between P21 and P31 can provide respectively to P2N and P3N.

Fig. 8 shows the schematic construction layer side top view of a printing stencil part, and wherein, carrier layer opening 21a is based on producing according to the method for of the present invention 1 the 4th exemplary specific embodiment.At this, carrier layer opening 21a produces via a laser pulse in each situation, and wherein, the laser cross section of out of focus laser beam is chosen to be for example circular.As shown in Fig. 4 A to 5D, compared to according to the method for the first exemplary specific embodiment of the present invention, the position of out of focus laser beam but also can move during laser pulse, be when the printing images opening 22a of structure sheaf 22 longitudinally, to produce carrier layer opening 21a, make so that produce to there is a slot shape but not the carrier layer opening of round carrier layer opening 21a with respect to carrier layer 21.One slot is an elongated pore, and the cross section of this slot is to form by a prolongation is rectangular-shaped, at its vertical end, each situation be half circular boundary (for example, as the semicircle at Fig. 8, if or the elliptic cross-section of selected out of focus laser, also can be semiellipse).

Especially, Laser Devices 10 first move to the position P1 of the first carrier layer opening.During a laser pulse of pulse laser, the position of out of focus laser beam is (at this exemplary specific embodiment, its out of focus cross section is selected for example for circular) move to second place P2 from the primary importance P1 of carrier layer opening, wherein, supply rate pulse duration of the selected coincidence pulse laser of this essence, and position P1 and P2 between the quotient of distance.But, the length of the carrier layer opening 21 then producing is greater than distance between position P1 and P2, because the cross section of out of focus laser beam (referring to Fig. 8).Similar above-mentioned exemplary specific embodiment, the position of laser beam, between two laser pulses, moves to the position P3 of the carrier layer opening 21a that will produce subsequently from the second place P2 of carrier layer opening.Being attained at before the position PN of printing images open end, repeat these steps.About this exemplary specific embodiment, its capable of regulating oval-shaped laser cross section and non-circular laser cross section part, or also can produce carrier layer opening other row, the carrier layer opening of the carrier layer superposition of end gap first row of these row, to provide even wider carrier layer opening.

Fig. 9 shows the schematic construction layer side top view of a printing stencil part, and wherein, these carrier layer openings are based on producing according to the method for the 5th exemplary specific embodiment basis of the present invention.Carrier layer opening 21a is in this case avette or oval, and wherein, carrier layer opening 21a's is longitudinally extending longitudinally at printing images opening 22.For example, this can be by the time not yet closing laser pulse, and template is mobile reaching, is in the time producing carrier layer opening 21a, by " fuzzy ".

Figure 10 shows that via example being applicable to use is making progress according to the time waveform of a pulse laser of the method for an exemplary specific embodiment of the present invention.Thus, no matter whether use a pulse laser beam or no use one continuous laser beam, it is unrelated to the invention, and it,, by periodicity Push And Release shutter, forms via a mechanical shutter devices " pulse ".According to the pulse frequency of laser, laser pulse is for periodically occurring according to cycle T, and as shown in figure 10, and each has a pulse duration τ.Following mutual pass can obtain.This cycle is equivalent to frequency values and obtains reciprocally, and the work period is that τ/T and ON/OFF (ON/OFF) are than being τ/(T-τ).

In a word, according to the invention provides a kind of manufacture method for printing stencil, wherein, indivedual carrier layer openings are in each situation, by applying one or more laser pulse in a position, and produce or " injection molding " in the carrier layer of the printing stencil of printing images open area.Compared to carrier layer opening known via a high order focusing laser beam manufacture method from carrier layer circumference cutting, this manufacture method can easier and more efficient realization, and has suitable time benefit.Owing to can obviously reducing the work that particularly produces carrier layer opening on expensive laser cutting device, so the extra expression of the time efficiency of improving quite improves the cost efficiency of manufacturing printing stencil.In addition, for the relevant reason of processing procedure, a printing stencil constructed in accordance shows the structural improvement about printing screen and printing stencil, wherein, carrier layer opening be known via a high order focusing laser beam from carrier layer circumference cutting, owing to quite improving the stability of carrier layer, and the scraper characteristic being improved, simultaneously still can reach good printing images, particularly, when the fingertip of the front contact of printing solar cell.

Claims

1. for the method for the manufacture of printed patterns being applied to the printing stencil of the technical printing of substrate, comprising:

Supply one carrier layer for described printing stencil (21);

Supply one structure sheaf for described printing stencil (22); Described structure sheaf is positioned at the below of described carrier layer (21);

In described structure sheaf (22), produce a printing images opening (22a), described printing images opening is extending longitudinally, and corresponding at least a portion of described printed patterns (101,102); And

According to the width of the carrier layer opening (21a) that will produce, in the described carrier layer (21) in described printing images opening (22a) region, produce described carrier layer opening (21a) via an out of focus laser beam, a printing auxiliary agent is applied to substrate (1) by described carrier layer opening (21a) and described printing images opening (22a).

2. method according to claim 1, is characterized by,

One Laser Devices (10), for generation of described carrier layer opening (21a), described Laser Devices comprise a focusing arrangement (12), and be designed to laser pulse Emission Lasers bundle, and adjust laser beam via described focusing arrangement (12), make laser beam out of focus with the width according to the described carrier layer opening (21a) that will produce at the apparent height place of described carrier layer (21).

3. method according to claim 1 and 2, it is characterized by, described laser beam is for adopting a method to carry out out of focus, described method is, at the At The Height on the described surface of described carrier layer (21), the width in the cross section of described laser beam be about the described carrier layer opening (21a) that will produce via one or more laser pulses width 50% to 95%.

4. according to the method described in any one in aforementioned claim, it is characterized by, the work that produces described carrier layer opening comprises row that produce described carrier layer opening (21a), described the extending longitudinally of described printing images opening (22a) that be listed in, wherein, producing described carrier layer opening (21a) afterwards, the position of described laser beam is between two continuous laser pulses, with respect to described carrier layer (21), and described printing images opening (22a) longitudinally, move to a position (P2 of the described carrier layer opening (21a) that will produce subsequently; PN).

5. method according to claim 4, is characterized by, and in order to produce indivedual carrier layer openings (21a) of described row, the position of described laser beam is positioned at a position (P1 of described indivedual carrier layer openings (21a); P2; PN), and described indivedual carrier layer openings (21a) produce via one or more laser pulses in described position.

6. method according to claim 5, is characterized by, and in the time producing described indivedual carrier layer openings (21a) via one or more laser pulses, the position essence of described laser beam does not move.

7. method according to claim 4, is characterized by, and in order to produce an other carrier layer opening (21a) of described row, the position of described laser beam is positioned at a primary importance (P1 of described indivedual carrier layer openings (21a); P2; PN), and described indivedual carrier layer openings (21a) are during a laser pulse of described primary importance to second place from described indivedual carrier layer openings (21a), produce via a laser pulse by the position of mobile described laser beam.

8. method according to claim 7, it is characterized by, the position of described laser beam be described printing images opening (22a) longitudinally, move during a laser pulse of the described second place in the described primary importance from described indivedual carrier layer openings (21a).

9. according to the method described in claim 7 or 8, it is characterized by, the position of described laser beam, with respect to described carrier layer (21), the described pulse duration that moves to the described supply rate of the described second place and/or the described laser pulse of described laser beam from the described primary importance of the described carrier layer opening (21a) that will produce is to select according to the described length of the described carrier layer opening (21a) that will produce.

10. according to the method described in any one in aforementioned claim, it is characterized by, via a focusing arrangement (12) of described Laser Devices (10), be adjusted at shape and/or the size in the cross section of the described out of focus laser beam at the apparent height place of described carrier layer.

11. methods according to claim 10, it is characterized by, the width of the described out of focus lasing aperture at the apparent height place of described carrier layer (21) is laterally adjusted to the longitudinal of described printing images opening (22a), the described described width of adjusting according to described printing images opening (22a).

12. according to the method described in claim 10 or 11, it is characterized by, and described laser beam is out of focus, and making has an essence circular cross-section at the apparent height place of described carrier layer (21).

13. according to the method described in claim 10 or 11, it is characterized by, and described laser beam is out of focus, and making has an essence elliptic cross-section at the apparent height place of described carrier layer (21).

14. methods according to claim 13, is characterized by, the oval main shaft in described laser cross section be lateral alignment in described printing images opening (22a) longitudinally.

15. according to the method described in any one in aforementioned claim, it is characterized by, adjust following one or more parameter: the ON/OFF ratio of the pulse duration of the frequency of described pulse laser beam or cycle, described laser pulse, the work period of described laser beam, described pulse laser beam.

16. according to the method described in any one in aforementioned claim, it is characterized by, when the position of laser beam with respect to described carrier layer (21) in the time moving between two adjacent carrier layer openings (21a) of the described row of carrier layer opening between two continuous laser pulses, a net mould (21b) is formed on described carrier layer (21).

17. methods according to claim 16, it is characterized by, described laser beam position moves to the position of a carrier layer opening (21a) that will produce from the position of the carrier layer opening (21a) of a generation described supply rate with respect to described carrier layer (21) is extra selected according to the width of a predetermined net mould.

18. methods according to claim 17, it is characterized by, the position of described laser beam moves to the position of a carrier layer opening (21a) that will produce subsequently from the position of the carrier layer opening (21a) of a generation described supply rate with respect to described carrier layer (21) be described printing images opening (22a) longitudinally, extra selected according to the described width of described carrier layer opening (21a).

19. methods according to claim 18, it is characterized by, the focusing arrangement of described Laser Devices moves to the position of a carrier layer opening (21a) that will produce subsequently from the carrier layer opening (21a) of a generation described supply rate with respect to described carrier layer (21) is smaller than or essence equals (BL+SB)/(T-τ) for selected, wherein, BL be illustrated in described printing images opening (22a) longitudinally in the width of described carrier layer opening (21a), SB represents described predetermined net Mould Breadth degree, T is the cycle of pulse laser beam, and τ is the pulse duration of described laser pulse.

20. according to the method described in any one in aforementioned claim, it is characterized by, in the time that move with respect to described carrier layer (21) position of described laser beam, a focusing arrangement (12) of described Laser Devices (10) and/or described carrier layer (21) just moves.

21. according to the method described in any one in claim 4 to 20, it is characterized by, the work that produces described carrier layer opening (21a) comprises at least one another secondary series that produces carrier layer opening (21a), described secondary series is extending longitudinally described printing images opening, and is parallel to the described first row of described carrier layer opening (21a).

22. methods according to claim 21, it is characterized by, in each situation, one carrier layer opening of described first row adopts a carrier layer opening of overlapping described at least one another secondary series of a method, described method is, each carrier layer opening (21a) is the printing stencil that is formed on described generation from two or more carrier layer openings of described at least two row, wherein, a net mould (21b) be formed on described printing images opening (22a) longitudinally between adjacent carrier layer opening (21a).

23. 1 kinds for the printing stencil for printed patterns being applied to the technical printing of substrate, and described printing stencil is to produce according to the method described in any one in aforementioned claim, comprising:

One carrier layer for described printing stencil (21);

One structure sheaf for described printing stencil (22), described structure sheaf is positioned at the below of described carrier layer (21);

Wherein, described structure sheaf (22) has a prolongation printing images opening (22a), and described printing images opening is in described structure sheaf (22), corresponding at least a portion of described printed patterns (101,102); And

Wherein, in the region of described printing images opening (22a), described carrier layer (21) comprises one or multiple row of carrier layer opening (21a), and it is extending longitudinally described printing images opening (22a).

24. printing stencils according to claim 23, is characterized by, and the described carrier layer opening (21a) of row adopts an essence circular, fashion to form.

25. printing stencils according to claim 23, is characterized by, and the described carrier layer opening (21a) of row adopts the oval mode of an essence to form.

26. printing stencils according to claim 25, is characterized by, the described oval main shaft lateral alignment of described carrier layer opening (21a) of row, particularly perpendicular to described printing images opening (22a) longitudinally.

27. printing stencils according to claim 23, is characterized by, and the described carrier layer opening (21a) of row has the shape of an essence slot.

28. according to the printing stencil described in any one in claim 23 to 27, it is characterized by, described carrier layer (21) has accurate row of carrier layer opening (21a), described row are extending longitudinally at the described printing images opening (22a) in the region of described printing images opening (22a), wherein, one not net mould (21b) be formed between adjacent carrier layer opening (21a), described net mould is that partial melting is at described structure sheaf sidepiece, so, compared to the thickness of described carrier layer (21), highly reduction.

29. according to the printing stencil described in any one in claim 23 to 28, it is characterized by, in each situation, one carrier layer opening (21a) of one first row is for adopting a carrier layer opening (21a) of overlapping at least one another secondary series of a method, described method is, each carrier layer opening (21a) is formed on described printing stencil from two or more carrier layer opening (21a) of described at least two row, wherein, one not net mould (21b) be formed on described printing images opening (22a) longitudinally between adjacent carrier layer opening (21a).