CN101356640B - 电子部件安装板和用于制造这种板的方法 - Google Patents

电子部件安装板和用于制造这种板的方法 Download PDF

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Publication number
CN101356640B
CN101356640B CN200680044107XA CN200680044107A CN101356640B CN 101356640 B CN101356640 B CN 101356640B CN 200680044107X A CN200680044107X A CN 200680044107XA CN 200680044107 A CN200680044107 A CN 200680044107A CN 101356640 B CN101356640 B CN 101356640B
Authority
CN
China
Prior art keywords
frame
circuit board
board
heat
side electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200680044107XA
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English (en)
Chinese (zh)
Other versions
CN101356640A (zh
Inventor
松冈洋一
柳濑直哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matsuoka Yoichi
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of CN101356640A publication Critical patent/CN101356640A/zh
Application granted granted Critical
Publication of CN101356640B publication Critical patent/CN101356640B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN200680044107XA 2005-11-24 2006-11-22 电子部件安装板和用于制造这种板的方法 Expired - Fee Related CN101356640B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005339055 2005-11-24
JP339055/2005 2005-11-24
PCT/JP2006/323265 WO2007060966A1 (ja) 2005-11-24 2006-11-22 電子部品実装基板及び該基板の製造方法

Publications (2)

Publication Number Publication Date
CN101356640A CN101356640A (zh) 2009-01-28
CN101356640B true CN101356640B (zh) 2011-02-16

Family

ID=38067192

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680044107XA Expired - Fee Related CN101356640B (zh) 2005-11-24 2006-11-22 电子部件安装板和用于制造这种板的方法

Country Status (7)

Country Link
US (1) US20100002455A1 (enExample)
EP (1) EP1953818B1 (enExample)
JP (1) JP5074201B2 (enExample)
KR (1) KR101013308B1 (enExample)
CN (1) CN101356640B (enExample)
TW (1) TW200731576A (enExample)
WO (1) WO2007060966A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5275642B2 (ja) * 2008-02-12 2013-08-28 スタンレー電気株式会社 発光装置およびその製造方法
EP2315284A3 (en) * 2009-10-21 2013-03-27 Toshiba Lighting & Technology Corporation Light-Emitting apparatus and luminaire
JP5375630B2 (ja) * 2010-01-25 2013-12-25 大日本印刷株式会社 樹脂付リードフレームおよびその製造方法、ならびにｌｅｄ素子パッケージおよびその製造方法
DE102010031166A1 (de) * 2010-07-09 2012-01-12 Robert Bosch Gmbh Handleuchtgerät
US8796611B2 (en) * 2011-01-10 2014-08-05 Apple Inc. Sheet and block for enhancing proximity sensor performance
KR101852388B1 (ko) * 2011-04-28 2018-04-26 엘지이노텍 주식회사 발광 소자 패키지
CN102412352A (zh) * 2011-11-10 2012-04-11 杭州创元光电科技有限公司 用石墨烯制作的大功率led光源封装结构及其生产工艺
US9142747B2 (en) * 2011-11-17 2015-09-22 Lumens Co., Ltd. Light emitting device package and backlight unit comprising the same
AT14124U1 (de) * 2012-02-13 2015-04-15 Tridonic Jennersdorf Gmbh LED-Modul mit Flächenverguß
KR20130096094A (ko) * 2012-02-21 2013-08-29 엘지이노텍 주식회사 발광소자 패키지, 발광 소자 패키지 제조방법 및 이를 구비한 조명 시스템
JP2013201255A (ja) * 2012-03-23 2013-10-03 Toshiba Lighting & Technology Corp 配線基板装置、発光モジュール、照明装置および配線基板装置の製造方法
JP5981183B2 (ja) * 2012-03-23 2016-08-31 矢崎総業株式会社 表示装置
JP2013219071A (ja) * 2012-04-04 2013-10-24 Kyocera Corp 発光素子搭載用部品および発光装置
CN103470968A (zh) * 2012-06-08 2013-12-25 李文雄 大发光角度的发光二极管灯芯及包含该灯芯的照明装置
CN105493300B (zh) * 2013-08-16 2018-02-09 株式会社流明斯 板上芯片式发光元件封装及其制作方法
US11552220B2 (en) * 2018-02-26 2023-01-10 Kyocera Corporation Electronic component mounting package for mounting a light-emitting element, electronic device, and electronic module
JP7117379B2 (ja) * 2018-06-29 2022-08-12 京セラ株式会社 電子部品搭載用パッケージ及び電子モジュール
WO2021039825A1 (ja) * 2019-08-28 2021-03-04 京セラ株式会社 発光素子搭載用パッケージおよび発光装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3984166A (en) * 1975-05-07 1976-10-05 Burroughs Corporation Semiconductor device package having lead frame structure with integral spring contacts
JP3973340B2 (ja) * 1999-10-05 2007-09-12 Ｎｅｃエレクトロニクス株式会社 半導体装置、配線基板、及び、それらの製造方法
JP2001144333A (ja) * 1999-11-10 2001-05-25 Sharp Corp 発光装置とその製造方法
JP2004031744A (ja) * 2002-06-27 2004-01-29 Kyocera Corp 電子部品装置
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
JP3910517B2 (ja) * 2002-10-07 2007-04-25 シャープ株式会社 Ｌｅｄデバイス
EP1605524B1 (en) * 2003-03-18 2010-06-30 Sumitomo Electric Industries, Ltd. Light emitting element mounting member, and semiconductor device using the same
US6860620B2 (en) * 2003-05-09 2005-03-01 Agilent Technologies, Inc. Light unit having light emitting diodes
US6920046B2 (en) * 2003-06-25 2005-07-19 Eaton Corporation Dissipating heat in an array of circuit components
JP4085917B2 (ja) * 2003-07-16 2008-05-14 松下電工株式会社 高熱伝導性発光素子用回路部品及び高放熱モジュール
JP2005183531A (ja) * 2003-12-17 2005-07-07 Sharp Corp 半導体発光装置
KR100602847B1 (ko) * 2004-02-27 2006-07-19 럭스피아 주식회사 방열판이 장착된 인쇄회로기판과 이 회로기판을 이용한발광다이오드 패캐지 및 그 제조방법
US7109587B1 (en) * 2004-05-25 2006-09-19 National Semiconductor Corporation Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices

Also Published As

Publication number Publication date
JP5074201B2 (ja) 2012-11-14
EP1953818A4 (en) 2010-11-10
KR101013308B1 (ko) 2011-02-09
TW200731576A (en) 2007-08-16
WO2007060966A1 (ja) 2007-05-31
CN101356640A (zh) 2009-01-28
TWI326922B (enExample) 2010-07-01
KR20080077136A (ko) 2008-08-21
JPWO2007060966A1 (ja) 2009-05-07
EP1953818B1 (en) 2012-01-04
US20100002455A1 (en) 2010-01-07
EP1953818A1 (en) 2008-08-06

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: YOICHI MATSUOKA

Free format text: FORMER OWNER: SANYO ELECTRIC CO., LTD.

Effective date: 20120904

Free format text: FORMER OWNER: MATSUOKA YOICHI

Effective date: 20120904

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120904

Address after: Osaka Japan

Patentee after: Matsuoka Yoichi

Address before: Osaka Japan

Patentee before: Sanyo Electric Co., Ltd.

Patentee before: Song Gang

Patentee before: Yang Yi

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110216

Termination date: 20121122