CN101346045A - 电路板清洁装置 - Google Patents
电路板清洁装置 Download PDFInfo
- Publication number
- CN101346045A CN101346045A CNA2007100760391A CN200710076039A CN101346045A CN 101346045 A CN101346045 A CN 101346045A CN A2007100760391 A CNA2007100760391 A CN A2007100760391A CN 200710076039 A CN200710076039 A CN 200710076039A CN 101346045 A CN101346045 A CN 101346045A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- cleaning device
- holding parts
- cleaning roller
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 82
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000000428 dust Substances 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 238000009954 braiding Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract 1
- 239000002585 base Substances 0.000 description 16
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000011538 cleaning material Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 229910001095 light aluminium alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cleaning In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710076039A CN101346045B (zh) | 2007-07-13 | 2007-07-13 | 电路板清洁装置 |
US11/967,006 US8332984B2 (en) | 2007-07-13 | 2007-12-29 | Cleaning apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710076039A CN101346045B (zh) | 2007-07-13 | 2007-07-13 | 电路板清洁装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101346045A true CN101346045A (zh) | 2009-01-14 |
CN101346045B CN101346045B (zh) | 2010-05-26 |
Family
ID=40247902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710076039A Expired - Fee Related CN101346045B (zh) | 2007-07-13 | 2007-07-13 | 电路板清洁装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8332984B2 (zh) |
CN (1) | CN101346045B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103451668A (zh) * | 2013-08-07 | 2013-12-18 | 无锡市恒通石油机械有限公司 | 一种用于酸洗工件的滚轮架 |
CN104227768A (zh) * | 2013-06-11 | 2014-12-24 | 达兴材料股份有限公司 | 去除胶体的方法及系统 |
CN105344640A (zh) * | 2015-11-20 | 2016-02-24 | 苏州光韵达光电科技有限公司 | 一种bga基板的清洗设备 |
CN105921465A (zh) * | 2016-06-22 | 2016-09-07 | 京东方科技集团股份有限公司 | 清胶装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM366424U (en) * | 2009-05-14 | 2009-10-11 | Micro Star Int Co Ltd | Clean device for cleaning goldfinger |
JP5535687B2 (ja) * | 2010-03-01 | 2014-07-02 | 株式会社荏原製作所 | 基板洗浄方法及び基板洗浄装置 |
CN102672297B (zh) * | 2011-03-11 | 2015-03-04 | 华晴国际有限公司 | 应用于表面粘着锡膏印刷装置的水基溶液自动清洗方法 |
CN111426283B (zh) * | 2020-04-14 | 2022-12-06 | 昆山金智汇坤建筑科技有限公司 | 一种用于建筑现场测量的激光扫描设备 |
CN111940351A (zh) * | 2020-09-01 | 2020-11-17 | 晋中学院 | 一种3d打印设备金属粉末清理装置 |
CN112547595B (zh) * | 2020-12-10 | 2022-01-28 | 青岛融合光电科技有限公司 | 一种显示器生产用玻璃清洗装置 |
CN112642759B (zh) * | 2020-12-15 | 2022-01-28 | 山西信息规划设计院有限公司 | 一种基于环保理念通信塔体表面清洁设备 |
CN113430587A (zh) * | 2021-07-07 | 2021-09-24 | 江西鑫铂瑞科技有限公司 | 一种可提高阴极辊浸液面积的生箔机 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07211677A (ja) * | 1993-11-30 | 1995-08-11 | M Setetsuku Kk | 基板のスクラビング方法とその装置 |
US5868857A (en) * | 1996-12-30 | 1999-02-09 | Intel Corporation | Rotating belt wafer edge cleaning apparatus |
TW545321U (en) | 2002-04-11 | 2003-08-01 | Ren-Shiuan Yang | Coating grinding machine for optical disc |
CN2587130Y (zh) * | 2002-11-19 | 2003-11-19 | 义仓精机股份有限公司 | 电路板清洁机上的清洁滚轮机构 |
US8608858B2 (en) | 2004-09-28 | 2013-12-17 | Ebara Corporation | Substrate cleaning apparatus and method for determining timing of replacement of cleaning member |
TW200809936A (en) * | 2006-06-05 | 2008-02-16 | Applied Materials Inc | Methods and apparatus for supporting a substrate in a horizontal orientation during cleaning |
-
2007
- 2007-07-13 CN CN200710076039A patent/CN101346045B/zh not_active Expired - Fee Related
- 2007-12-29 US US11/967,006 patent/US8332984B2/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104227768A (zh) * | 2013-06-11 | 2014-12-24 | 达兴材料股份有限公司 | 去除胶体的方法及系统 |
CN103451668A (zh) * | 2013-08-07 | 2013-12-18 | 无锡市恒通石油机械有限公司 | 一种用于酸洗工件的滚轮架 |
CN105344640A (zh) * | 2015-11-20 | 2016-02-24 | 苏州光韵达光电科技有限公司 | 一种bga基板的清洗设备 |
CN105344640B (zh) * | 2015-11-20 | 2017-06-30 | 苏州光韵达光电科技有限公司 | 一种bga基板的清洗设备 |
CN105921465A (zh) * | 2016-06-22 | 2016-09-07 | 京东方科技集团股份有限公司 | 清胶装置 |
Also Published As
Publication number | Publication date |
---|---|
US8332984B2 (en) | 2012-12-18 |
US20090014031A1 (en) | 2009-01-15 |
CN101346045B (zh) | 2010-05-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100526 Termination date: 20130713 |