CN100508121C - 用于涂层图形化的方法 - Google Patents
用于涂层图形化的方法 Download PDFInfo
- Publication number
- CN100508121C CN100508121C CNB2006800019266A CN200680001926A CN100508121C CN 100508121 C CN100508121 C CN 100508121C CN B2006800019266 A CNB2006800019266 A CN B2006800019266A CN 200680001926 A CN200680001926 A CN 200680001926A CN 100508121 C CN100508121 C CN 100508121C
- Authority
- CN
- China
- Prior art keywords
- coating
- substrate
- flat board
- printing object
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Abstract
Description
Claims (27)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20050070619 | 2005-08-02 | ||
KR1020050070619 | 2005-08-02 | ||
KR1020050074144 | 2005-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101103441A CN101103441A (zh) | 2008-01-09 |
CN100508121C true CN100508121C (zh) | 2009-07-01 |
Family
ID=39036778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006800019266A Active CN100508121C (zh) | 2005-08-02 | 2006-08-02 | 用于涂层图形化的方法 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100818490B1 (zh) |
CN (1) | CN100508121C (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102778715B (zh) * | 2012-05-11 | 2015-01-21 | 深圳市华星光电技术有限公司 | 彩色滤光片及其制作方法 |
JP2016203518A (ja) * | 2015-04-24 | 2016-12-08 | 株式会社Screenホールディングス | 平板状ブランケットおよび当該ブランケットを用いた転写方法 |
CN105538726A (zh) * | 2016-02-18 | 2016-05-04 | 苏州苏大维格光电科技股份有限公司 | 一种基于薄膜基底的三维成型装置及方法 |
CN106449431B (zh) * | 2016-11-18 | 2019-01-22 | 中国电子科技集团公司第四十一研究所 | 一种基板填充孔的整平装置及方法 |
KR20210080718A (ko) | 2019-12-20 | 2021-07-01 | 삼성전자주식회사 | 반도체 패키지 |
CN114261196B (zh) * | 2021-11-25 | 2023-06-16 | 重庆康佳光电技术研究院有限公司 | 印刷治具和连线印刷方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0148966B1 (ko) * | 1995-08-31 | 1998-12-15 | 배순훈 | 프린트 기판의 편차를 보상하는 칩마운트 시스템 및 그 제어방법 |
KR20030097735A (ko) | 2003-11-19 | 2003-12-31 | 엔엔디 주식회사 | 임프린팅 장치 및 임프린팅 기판지지장치 |
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2006
- 2006-08-02 CN CNB2006800019266A patent/CN100508121C/zh active Active
-
2007
- 2007-10-22 KR KR1020070106324A patent/KR100818490B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20070107648A (ko) | 2007-11-07 |
KR100818490B1 (ko) | 2008-04-02 |
CN101103441A (zh) | 2008-01-09 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201022 Address after: Gyeonggi Do Korea Paju Patentee after: Sko Korea Co.,Ltd. Address before: Seoul, South Kerean Patentee before: LG CHEM, Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220408 Address after: Gyeonggi Do Korea Paju Patentee after: Yimeitai Co.,Ltd. Address before: Pozhou City, Gyeonggi Province Patentee before: Sko Korea Co.,Ltd. |
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TR01 | Transfer of patent right | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20080109 Assignee: Jiangsu Xianke semiconductor new materials Co.,Ltd. Assignor: Yimeitai Co.,Ltd. Contract record no.: X2022990000548 Denomination of invention: Method for coating patterning Granted publication date: 20090701 License type: Exclusive License Record date: 20220824 |
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EE01 | Entry into force of recordation of patent licensing contract |