CN101331203B - 低施涂温度的热熔粘合剂 - Google Patents

低施涂温度的热熔粘合剂 Download PDF

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Publication number
CN101331203B
CN101331203B CN2006800470072A CN200680047007A CN101331203B CN 101331203 B CN101331203 B CN 101331203B CN 2006800470072 A CN2006800470072 A CN 2006800470072A CN 200680047007 A CN200680047007 A CN 200680047007A CN 101331203 B CN101331203 B CN 101331203B
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compsn
styrene
weight
substrate
resin
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Chinese (zh)
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CN101331203A (zh
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F·阿巴
C·莫雷尔-富里耶
N·E·萨乔特
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Bostik Inc
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Bostik Inc
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L15/00Chemical aspects of, or use of materials for, bandages, dressings or absorbent pads
    • A61L15/16Bandages, dressings or absorbent pads for physiological fluids such as urine or blood, e.g. sanitary towels, tampons
    • A61L15/42Use of materials characterised by their function or physical properties
    • A61L15/58Adhesives
    • A61L15/585Mixtures of macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02Vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Materials Engineering (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • Hematology (AREA)
  • Engineering & Computer Science (AREA)
  • Veterinary Medicine (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
  • Laminated Bodies (AREA)
CN2006800470072A 2005-10-14 2006-10-10 低施涂温度的热熔粘合剂 Active CN101331203B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/251,256 2005-10-14
US11/251,256 US20070088116A1 (en) 2005-10-14 2005-10-14 Low application temperature hot melt adhesive
PCT/US2006/039471 WO2007047232A1 (en) 2005-10-14 2006-10-10 Low application temperature hot melt adhesive

Publications (2)

Publication Number Publication Date
CN101331203A CN101331203A (zh) 2008-12-24
CN101331203B true CN101331203B (zh) 2012-04-25

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CN2006800470072A Active CN101331203B (zh) 2005-10-14 2006-10-10 低施涂温度的热熔粘合剂

Country Status (9)

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US (2) US20070088116A1 (enExample)
EP (1) EP1945728B1 (enExample)
JP (1) JP5339911B2 (enExample)
CN (1) CN101331203B (enExample)
AT (1) ATE533824T1 (enExample)
BR (1) BRPI0617276B8 (enExample)
CA (1) CA2625528C (enExample)
ES (1) ES2380505T3 (enExample)
WO (1) WO2007047232A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023065311A1 (en) * 2021-10-22 2023-04-27 Henkel Ag & Co. Kgaa Hot melt adhesive composition and use thereof

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US7838590B2 (en) * 2007-06-08 2010-11-23 Bostik, Inc. Hot melt adhesive based on styrene-ethylene-ethylene-propylene-styrene copolymer
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CN102666089B (zh) * 2009-12-22 2015-06-17 3M创新有限公司 经粘合的基底以及用于粘合基底的方法
JP5512417B2 (ja) * 2010-06-29 2014-06-04 ヘンケルジャパン株式会社 ホットメルト接着剤
CN101928535A (zh) * 2010-08-20 2010-12-29 沈阳天荣电缆材料有限公司 电缆半导电带的接头用热熔压敏胶及其制造方法
CN102030995B (zh) * 2010-09-21 2012-07-04 北京同仁堂股份有限公司 一种中药蜜丸包装蜡组合物
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WO2012147951A1 (ja) * 2011-04-27 2012-11-01 東洋インキScホールディングス株式会社 ホットメルト粘着剤、粘着フィルム、被覆物品および被覆物品の製造方法
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CN103694934B (zh) * 2013-12-09 2016-01-13 烟台德邦科技有限公司 一种热熔压敏胶及其制备方法
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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2023065311A1 (en) * 2021-10-22 2023-04-27 Henkel Ag & Co. Kgaa Hot melt adhesive composition and use thereof

Also Published As

Publication number Publication date
JP5339911B2 (ja) 2013-11-13
JP2009511713A (ja) 2009-03-19
CA2625528C (en) 2013-07-30
EP1945728B1 (en) 2011-11-16
BRPI0617276B1 (pt) 2017-02-07
US20070088116A1 (en) 2007-04-19
BRPI0617276A2 (pt) 2013-02-26
ES2380505T3 (es) 2012-05-14
CN101331203A (zh) 2008-12-24
US20090264580A1 (en) 2009-10-22
AU2006304041A1 (en) 2007-04-26
BRPI0617276B8 (pt) 2021-07-27
CA2625528A1 (en) 2007-04-26
EP1945728A1 (en) 2008-07-23
ATE533824T1 (de) 2011-12-15
WO2007047232A1 (en) 2007-04-26
US8129464B2 (en) 2012-03-06

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