CN101313388A - 用于化学机械抛光的摩擦减小辅助物 - Google Patents

用于化学机械抛光的摩擦减小辅助物 Download PDF

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Publication number
CN101313388A
CN101313388A CNA2006800437962A CN200680043796A CN101313388A CN 101313388 A CN101313388 A CN 101313388A CN A2006800437962 A CNA2006800437962 A CN A2006800437962A CN 200680043796 A CN200680043796 A CN 200680043796A CN 101313388 A CN101313388 A CN 101313388A
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CN
China
Prior art keywords
polishing
water
substrate
polishing system
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800437962A
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English (en)
Chinese (zh)
Inventor
凯文·J·莫根伯格
菲利普·W·卡特
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Cabot Corp
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Cabot Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Corp filed Critical Cabot Corp
Publication of CN101313388A publication Critical patent/CN101313388A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CNA2006800437962A 2005-11-22 2006-10-24 用于化学机械抛光的摩擦减小辅助物 Pending CN101313388A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/287,039 US20070117497A1 (en) 2005-11-22 2005-11-22 Friction reducing aid for CMP
US11/287,039 2005-11-22

Publications (1)

Publication Number Publication Date
CN101313388A true CN101313388A (zh) 2008-11-26

Family

ID=38054171

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800437962A Pending CN101313388A (zh) 2005-11-22 2006-10-24 用于化学机械抛光的摩擦减小辅助物

Country Status (6)

Country Link
US (1) US20070117497A1 (enExample)
JP (1) JP2009516928A (enExample)
KR (1) KR20080070675A (enExample)
CN (1) CN101313388A (enExample)
TW (1) TWI311091B (enExample)
WO (1) WO2007149113A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110358454A (zh) * 2019-07-20 2019-10-22 大连理工大学 一种通用化学机械抛光液
CN113423799A (zh) * 2019-10-03 2021-09-21 日产化学株式会社 用于消除激光标记周边的隆起的包含阳离子的研磨用组合物

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JP6622963B2 (ja) * 2013-01-04 2019-12-18 株式会社フジミインコーポレーテッド 合金材料の研磨方法及び合金材料の製造方法
WO2014132641A1 (ja) * 2013-02-28 2014-09-04 株式会社フジミインコーポレーテッド コバルト除去のための研磨スラリー
US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
CN103589344B (zh) * 2013-11-14 2015-06-10 上海新安纳电子科技有限公司 一种氧化铝抛光液的制备方法
JPWO2016043089A1 (ja) * 2014-09-16 2017-08-10 山口精研工業株式会社 サファイア基板用研磨剤組成物
KR102447178B1 (ko) 2015-09-01 2022-09-26 삼성전자주식회사 반도체 장치의 제조 방법
KR102642825B1 (ko) * 2016-02-16 2024-02-29 씨엠씨 머티리얼즈 엘엘씨 Ⅲ-v 족 물질의 연마 방법
US10253216B2 (en) * 2016-07-01 2019-04-09 Versum Materials Us, Llc Additives for barrier chemical mechanical planarization
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JP7071495B2 (ja) 2017-11-15 2022-05-19 サン－ゴバン セラミックス アンド プラスティクス，インコーポレイティド 材料除去操作を行うための組成物及びその形成方法
US11879094B2 (en) 2022-06-03 2024-01-23 Halliburton Energy Services, Inc. Enhancing friction reduction and protection of wellbore equipment during hydraulic fracturing

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110358454A (zh) * 2019-07-20 2019-10-22 大连理工大学 一种通用化学机械抛光液
CN113423799A (zh) * 2019-10-03 2021-09-21 日产化学株式会社 用于消除激光标记周边的隆起的包含阳离子的研磨用组合物

Also Published As

Publication number Publication date
KR20080070675A (ko) 2008-07-30
WO2007149113A3 (en) 2008-04-10
TW200734117A (en) 2007-09-16
US20070117497A1 (en) 2007-05-24
WO2007149113A2 (en) 2007-12-27
WO2007149113A9 (en) 2008-02-28
JP2009516928A (ja) 2009-04-23
TWI311091B (en) 2009-06-21

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