CN101308885A - High power LED lens encapsulation process - Google Patents
High power LED lens encapsulation process Download PDFInfo
- Publication number
- CN101308885A CN101308885A CNA2007100222810A CN200710022281A CN101308885A CN 101308885 A CN101308885 A CN 101308885A CN A2007100222810 A CNA2007100222810 A CN A2007100222810A CN 200710022281 A CN200710022281 A CN 200710022281A CN 101308885 A CN101308885 A CN 101308885A
- Authority
- CN
- China
- Prior art keywords
- lens
- luminescent wafer
- power led
- led
- high power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to high-power LED lens encasing technique. Air bladders exist in encased lenses of LED light sources that are generally known, which affects light emission. The technique of the invention is characterized in that the lens of an initially encased LED is arranged on a baking rack with the convex surface facing downward and is baked under certain temperature for a certain period of time, thus realizing no air bladders in the lens. The technique of the invention is advanced and is convenient to operate and has no air bladders and good light emission.
Description
Technical field
The present invention relates to a kind of high power LED lens encapsulation process, be applicable to the problem that occurs bubble in the lens packages process that solves.
Background technology
LED (light-emitting diode, light-EmittingDiodc) be the luminescent device that a class can directly be converted into electric energy visible light and radiant energy, it is low to have operating voltage, and power consumption is little, the luminous efficiency height, luminescence response is short, photochromic pure, sound construction, shock resistance, stable performance, good characteristic such as in light weight, volume is little.Be acknowledged as the first-selection of following light source.But the encapsulation of traditional high-power LED lens is easy to generate bubble, influences bright dipping.Thereby people wish to have a kind of new packaging technology that can overcome above-mentioned shortcoming to come out.
Summary of the invention
In order to solve the problem that occurs bubble in the lens packages process, the invention provides a kind of high power LED lens encapsulation process.
To achieve these goals, the present invention solve the scheme of its technical problem be by
(1) sunk part of concave lens surface and the space segment of luminescent wafer bracing frame are filled with AB glue, (2) the AB glue in lens and the luminescent wafer support is vacuumized, (3) will be through the concave lens surface and the involutory sealing of luminescent wafer support of step (2), and all fit to concave lens surface gradually with the luminescent wafer support from one side of concave lens surface, obtain preliminary encapsulated LED, (4) will place downwards on the baking support through rapid (3) preliminary encapsulated LED lens convex surface, and the step of baking a period of time is formed under 130 ℃ environment.
Advantage such as the present invention has that the technology advanced person advances, easy to operate, no bubble, bright dipping are effective.
Embodiment
The present invention is applied among the led light source manufacturing of 1W, to be fixed on the support through the luminescent wafer after the PROCESS FOR TREATMENT such as coating, promptly make the luminescent wafer support, evagination one side of lens indent through certain technology making, in the space segment of above-mentioned luminescent wafer support and concave lens surface, fill with AB glue, vacuumize annotating the glue that advances then, then will fit with the luminescent wafer support on one side with the concave surface of the lens of AB glue, all fit to the concave surface of lens and the opposite on the luminescent wafer support gradually, form preliminary packaged great power LED.The convex surface of the lens of preliminary packaged great power LED is placed in downwards on the baking rack, and baking is 1 hour in 130 ℃ environment, promptly obtains high-power LED light source after the cooling.Because lens even residual a small amount of gas in the AB glue is also arranged in the bottom of luminescent wafer support, and do not influenced bright dipping, have promptly been realized no bubble lens packages bottom in the bake process.
Claims (1)
1. high power LED lens encapsulation process, it is by (1) sunk part of concave lens surface and the space segment of luminescent wafer bracing frame to be filled with AB glue, (2) the AB glue in lens and the luminescent wafer support is vacuumized, (3) will be through the concave lens surface and the involutory sealing of luminescent wafer support of step 2, and all fit to concave lens surface gradually with the luminescent wafer support from one side of concave lens surface, obtain preliminary encapsulated LED, (4) will place downwards on the baking support through rapid (3) preliminary encapsulated LED lens convex surface, and the step of baking a period of time is formed under 130 ℃ environment, it is characterized in that step (4) promptly (4) will place downwards on the baking support through rapid 3 preliminary encapsulated LED lens convex surfaces, and under 130 ℃ environment, toast a period of time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100222810A CN101308885A (en) | 2007-05-14 | 2007-05-14 | High power LED lens encapsulation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100222810A CN101308885A (en) | 2007-05-14 | 2007-05-14 | High power LED lens encapsulation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101308885A true CN101308885A (en) | 2008-11-19 |
Family
ID=40125196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100222810A Pending CN101308885A (en) | 2007-05-14 | 2007-05-14 | High power LED lens encapsulation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101308885A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102109621A (en) * | 2009-12-25 | 2011-06-29 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing lens |
| CN103131190A (en) * | 2013-02-05 | 2013-06-05 | 广州市爱易迪新材料科技有限公司 | Double-component self-molding lens silica gel for light-emitting diode (LED) package and package process of double-component self-molding lens silica gel |
-
2007
- 2007-05-14 CN CNA2007100222810A patent/CN101308885A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102109621A (en) * | 2009-12-25 | 2011-06-29 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing lens |
| CN102109621B (en) * | 2009-12-25 | 2013-09-18 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing lens |
| CN103131190A (en) * | 2013-02-05 | 2013-06-05 | 广州市爱易迪新材料科技有限公司 | Double-component self-molding lens silica gel for light-emitting diode (LED) package and package process of double-component self-molding lens silica gel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5710603B2 (en) | Light emitting device | |
| CN205028924U (en) | LED light source | |
| CN101308885A (en) | High power LED lens encapsulation process | |
| CN207529973U (en) | Quantum dot LED component, backlight lamp bar and backlight module | |
| CN201918426U (en) | High-power LED | |
| CN202839589U (en) | Soaking plate, LED chip packaging structure based on soaking plate and chip support thereof | |
| CN202094167U (en) | Illumination-level LED (light emitting diode) | |
| CN202195331U (en) | Light-emitting diode (LED) light string structure | |
| CN103855280A (en) | LED wafer-level packaging method | |
| CN106374017A (en) | Packaging process for LED lens | |
| CN201956347U (en) | High-power LED (light-emitting diode) | |
| CN201112404Y (en) | White light LED package structure | |
| CN203746897U (en) | Led | |
| CN104332533A (en) | LED lens packaging process | |
| CN202231060U (en) | High-efficiency white light emitting diode (LED) package employing transparent ceramic support | |
| TWI237411B (en) | Process and structure for packaging LED's | |
| CN205828418U (en) | LED encapsulation structure | |
| CN205383575U (en) | LED lamp | |
| CN203103340U (en) | Packaging structure of blue LED matching with electrostatic spraying fluorescent cover | |
| CN202948968U (en) | White light light-emitting diode (LED) device | |
| CN203273353U (en) | Wide-angle ceramic LED bulb | |
| CN202834933U (en) | Light-Emitting Diode (LED) support lamp | |
| CN205069686U (en) | LED punctiform formula COB module | |
| CN103594599B (en) | A kind of SMD LED device of high reliability high brightness | |
| CN203118989U (en) | Junction temperature controllable efficient light emitting diode (LED) package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20081119 |