CN101297206A - 一种用于在探测系统中改进定位的方法和设备 - Google Patents

一种用于在探测系统中改进定位的方法和设备 Download PDF

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Publication number
CN101297206A
CN101297206A CNA2006800400582A CN200680040058A CN101297206A CN 101297206 A CN101297206 A CN 101297206A CN A2006800400582 A CNA2006800400582 A CN A2006800400582A CN 200680040058 A CN200680040058 A CN 200680040058A CN 101297206 A CN101297206 A CN 101297206A
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CN
China
Prior art keywords
sensor
component
contact
control system
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800400582A
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English (en)
Chinese (zh)
Inventor
U·纳亚克
张晓兰
G·阿斯马罗姆
M·杰达
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Electroglas Inc
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Electroglas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroglas Inc filed Critical Electroglas Inc
Publication of CN101297206A publication Critical patent/CN101297206A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
CNA2006800400582A 2006-01-18 2006-10-30 一种用于在探测系统中改进定位的方法和设备 Pending CN101297206A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/335,367 US7368929B2 (en) 2006-01-18 2006-01-18 Methods and apparatuses for improved positioning in a probing system
US11/335,367 2006-01-18

Publications (1)

Publication Number Publication Date
CN101297206A true CN101297206A (zh) 2008-10-29

Family

ID=38016442

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800400582A Pending CN101297206A (zh) 2006-01-18 2006-10-30 一种用于在探测系统中改进定位的方法和设备

Country Status (6)

Country Link
US (2) US7368929B2 (https=)
JP (1) JP2009524238A (https=)
KR (1) KR101347767B1 (https=)
CN (1) CN101297206A (https=)
TW (1) TWI418819B (https=)
WO (1) WO2007084206A1 (https=)

Cited By (2)

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CN106574942A (zh) * 2014-07-24 2017-04-19 核科学股份有限公司 用于对电荷储存器件进行测试的测量仪器
CN118837711A (zh) * 2024-06-17 2024-10-25 赛诺威盛科技(北京)股份有限公司 一种用于ct探测器ad转换板的检测方法、装置及系统

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US9207276B2 (en) * 2009-01-17 2015-12-08 Disco Corporation Method and apparatus for testing a semiconductor wafer
JP4886800B2 (ja) * 2009-02-26 2012-02-29 インターナショナル・ビジネス・マシーンズ・コーポレーション プローブカード、プローブカードの製造方法、プローバ装置
US8269514B2 (en) * 2009-08-25 2012-09-18 Formfactor, Inc. Method and apparatus for multilayer support substrate
WO2011062312A1 (ko) * 2009-11-23 2011-05-26 주식회사 쎄믹스 터치패드를 이용한 웨이퍼 프로버
US8519729B2 (en) 2010-02-10 2013-08-27 Sunpower Corporation Chucks for supporting solar cell in hot spot testing
JP5529605B2 (ja) * 2010-03-26 2014-06-25 東京エレクトロン株式会社 ウエハチャックの傾き補正方法及びプローブ装置
DE102011102791A1 (de) * 2011-05-27 2012-11-29 Feinmetall Gmbh Federkontaktstiftanordnung
US8963567B2 (en) 2011-10-31 2015-02-24 International Business Machines Corporation Pressure sensing and control for semiconductor wafer probing
US8875979B2 (en) * 2012-05-04 2014-11-04 Asm Technology Singapore Pte. Ltd. Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck
JP2014109531A (ja) * 2012-12-04 2014-06-12 Toshiba Corp 半導体検査装置および半導体検査方法
KR101415984B1 (ko) * 2013-05-16 2014-07-09 (주)에이젯 반도체 소자 테스트용 핸들러장치의 디바이스 컨택 제어방법
JP6280459B2 (ja) * 2014-06-27 2018-02-14 株式会社ディスコ テープ拡張装置
US10481177B2 (en) * 2014-11-26 2019-11-19 Tokyo Seimitsu Co. Ltd. Wafer inspection method
CN104391139A (zh) * 2014-12-08 2015-03-04 大族激光科技产业集团股份有限公司 一种测试探针压力监控的方法及装置
US10363646B2 (en) * 2016-05-05 2019-07-30 Caterpillar Inc. Manufacturing fixture system and associated process having a rest pad force sensor with closed loop feedback
TWI676031B (zh) * 2018-09-06 2019-11-01 致茂電子股份有限公司 滑移式電子元件測試裝置
US12188978B2 (en) * 2019-02-21 2025-01-07 Vuereal Inc. Probe structure for micro device inspection
TWI777740B (zh) * 2021-08-23 2022-09-11 鴻勁精密股份有限公司 校正裝置、校正方法及其應用之作業機

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US5197076A (en) * 1991-11-15 1993-03-23 Davis James G Temperature stabilizable laser apparatus
US5517128A (en) * 1993-01-05 1996-05-14 Sentech Instruments Gmbh Method and arrangement for charge carrier profiling in semiconductor structure by means of AFM scanning
US6140828A (en) 1997-05-08 2000-10-31 Tokyo Electron Limited Prober and probe method
US6111421A (en) * 1997-10-20 2000-08-29 Tokyo Electron Limited Probe method and apparatus for inspecting an object
JP3407192B2 (ja) * 1998-12-31 2003-05-19 株式会社ダイトー テストハンドの制御方法及び計測制御システム
US6690284B2 (en) 1998-12-31 2004-02-10 Daito Corporation Method of controlling IC handler and control system using the same
JP2000260852A (ja) * 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
JP2001110857A (ja) 1999-10-06 2001-04-20 Tokyo Electron Ltd プローブ方法及びプローブ装置
JP4218816B2 (ja) 2000-02-15 2009-02-04 東京エレクトロン株式会社 針荷重測定方法、検査方法及び検査装置
JP2001358204A (ja) 2000-06-15 2001-12-26 Tokyo Electron Ltd 検査ステージ
JP2002075827A (ja) 2000-08-29 2002-03-15 Nikon Corp Ｘ線投影露光装置およびｘ線投影露光方法および半導体デバイス
CA2476389A1 (en) * 2002-03-22 2003-10-09 Electro Scientific Industries, Inc. Test probe alignment apparatus
US7049577B2 (en) 2002-09-30 2006-05-23 Teradyne, Inc. Semiconductor handler interface auto alignment
JP2004152916A (ja) 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法
KR20050084304A (ko) * 2002-12-16 2005-08-26 코닌클리케 필립스 일렉트로닉스 엔.브이. 높은 위치 정밀도로 물체를 처리하는 장치
JP2005072143A (ja) 2003-08-21 2005-03-17 Tokyo Seimitsu Co Ltd プローブ装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106574942A (zh) * 2014-07-24 2017-04-19 核科学股份有限公司 用于对电荷储存器件进行测试的测量仪器
CN118837711A (zh) * 2024-06-17 2024-10-25 赛诺威盛科技(北京)股份有限公司 一种用于ct探测器ad转换板的检测方法、装置及系统
CN118837711B (zh) * 2024-06-17 2025-06-27 赛诺威盛科技(北京)股份有限公司 一种用于ct探测器ad转换板的检测方法、装置及系统

Also Published As

Publication number Publication date
TWI418819B (zh) 2013-12-11
US7368929B2 (en) 2008-05-06
US20080150565A1 (en) 2008-06-26
KR20080093408A (ko) 2008-10-21
US7852097B2 (en) 2010-12-14
TW200736633A (en) 2007-10-01
WO2007084206A1 (en) 2007-07-26
US20070164762A1 (en) 2007-07-19
JP2009524238A (ja) 2009-06-25
KR101347767B1 (ko) 2014-01-10

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