CN101291142B - 表面声波器件和双工器 - Google Patents
表面声波器件和双工器 Download PDFInfo
- Publication number
- CN101291142B CN101291142B CN2008100910779A CN200810091077A CN101291142B CN 101291142 B CN101291142 B CN 101291142B CN 2008100910779 A CN2008100910779 A CN 2008100910779A CN 200810091077 A CN200810091077 A CN 200810091077A CN 101291142 B CN101291142 B CN 101291142B
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- substrate
- acoustic wave
- surface acoustic
- wave device
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 102
- 229910052594 sapphire Inorganic materials 0.000 claims description 23
- 239000010980 sapphire Substances 0.000 claims description 23
- 230000000052 comparative effect Effects 0.000 description 16
- 230000000644 propagated effect Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007107329A JP4316632B2 (ja) | 2007-04-16 | 2007-04-16 | 弾性表面波装置及び分波器 |
JP2007-107329 | 2007-04-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101291142A CN101291142A (zh) | 2008-10-22 |
CN101291142B true CN101291142B (zh) | 2010-09-08 |
Family
ID=39543470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100910779A Active CN101291142B (zh) | 2007-04-16 | 2008-04-16 | 表面声波器件和双工器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7800464B2 (zh) |
EP (1) | EP1983647B1 (zh) |
JP (1) | JP4316632B2 (zh) |
KR (1) | KR100907393B1 (zh) |
CN (1) | CN101291142B (zh) |
TW (1) | TWI359563B (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9154107B2 (en) * | 2009-05-28 | 2015-10-06 | Northrop Grumman Systems Corporation | Lateral over-moded bulk acoustic resonators |
JP5678486B2 (ja) * | 2010-06-17 | 2015-03-04 | セイコーエプソン株式会社 | 弾性表面波共振子、弾性表面波発振器および電子機器 |
JP5588836B2 (ja) * | 2010-11-12 | 2014-09-10 | 太陽誘電株式会社 | 弾性波デバイス |
JP5976096B2 (ja) * | 2012-03-02 | 2016-08-23 | 太陽誘電株式会社 | 弾性波フィルタ |
EP3226286B1 (en) * | 2014-11-28 | 2019-08-28 | Kyocera Corporation | Saw device and method for manufacturing saw device |
JP6397352B2 (ja) * | 2015-02-19 | 2018-09-26 | 太陽誘電株式会社 | 弾性波デバイス |
US10574203B2 (en) | 2015-07-28 | 2020-02-25 | Qorvo Us, Inc. | Bonded wafers and surface acoustic wave devices using same |
JP6494462B2 (ja) * | 2015-07-29 | 2019-04-03 | 太陽誘電株式会社 | 弾性波デバイスおよびモジュール |
US10177734B2 (en) | 2015-08-25 | 2019-01-08 | Avago Technologies International Sales Pte. Limited | Surface acoustic wave (SAW) resonator |
US10090822B2 (en) * | 2015-08-25 | 2018-10-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Surface acoustic wave (SAW) resonator |
US10536133B2 (en) | 2016-04-22 | 2020-01-14 | Avago Technologies International Sales Pte. Limited | Composite surface acoustic wave (SAW) device with absorbing layer for suppression of spurious responses |
US10469056B2 (en) | 2015-08-25 | 2019-11-05 | Avago Technologies International Sales Pte. Limited | Acoustic filters integrated into single die |
US10020796B2 (en) * | 2015-08-25 | 2018-07-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Surface acoustic wave (SAW) resonator |
US10523178B2 (en) | 2015-08-25 | 2019-12-31 | Avago Technologies International Sales Pte. Limited | Surface acoustic wave (SAW) resonator |
US9991870B2 (en) | 2015-08-25 | 2018-06-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Surface acoustic wave (SAW) resonator |
US20180241374A1 (en) * | 2015-09-25 | 2018-08-23 | Avago Technologies General Ip (Singapore) Pte. Ltd | Acoustic wave resonator having antiresonant cavity |
US20180337657A1 (en) * | 2015-09-25 | 2018-11-22 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic wave resonator having antiresonant cavity |
US9369111B1 (en) | 2015-10-28 | 2016-06-14 | Resonant Inc. | Fabrication of surface acoustic wave filters having plate modes |
JP6635794B2 (ja) * | 2016-01-12 | 2020-01-29 | 太陽誘電株式会社 | 弾性波デバイス及びその製造方法 |
US10128814B2 (en) | 2016-01-28 | 2018-11-13 | Qorvo Us, Inc. | Guided surface acoustic wave device providing spurious mode rejection |
US10177735B2 (en) | 2016-02-29 | 2019-01-08 | Avago Technologies International Sales Pte. Limited | Surface acoustic wave (SAW) resonator |
KR102257664B1 (ko) * | 2016-09-20 | 2021-05-31 | 엔지케이 인슐레이터 엘티디 | 복합 기판, 그 제조법 및 전자 디바이스 |
JP6886264B2 (ja) * | 2016-09-21 | 2021-06-16 | 太陽誘電株式会社 | 弾性波デバイス並びに複合基板およびその製造方法 |
US10536131B2 (en) | 2017-06-20 | 2020-01-14 | Skyworks Solutions, Inc. | Surface acoustic wave device with thermally conductive layer |
US11206007B2 (en) * | 2017-10-23 | 2021-12-21 | Qorvo Us, Inc. | Quartz orientation for guided SAW devices |
FR3079667B1 (fr) * | 2018-03-28 | 2020-03-27 | Frec'n'sys | Dispositif d'onde acoustique de surface sur substrat composite |
WO2019226461A1 (en) | 2018-05-21 | 2019-11-28 | Skyworks Solutions, Inc. | Multi-layer piezoelectric substrate with heat dissipation |
US12082504B2 (en) * | 2018-09-06 | 2024-09-03 | Kyocera Corporation | Composite substrate, piezoelectric device, and method for manufacturing composite substrate |
US11171627B2 (en) * | 2018-10-01 | 2021-11-09 | Qorvo Us, Inc. | Wave apodization for guided SAW resonators |
CN113661654B (zh) * | 2019-04-08 | 2024-08-09 | 株式会社村田制作所 | 弹性波装置以及多工器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1159100A (zh) * | 1995-10-13 | 1997-09-10 | 富士通株式会社 | 利用压电衬底最佳切割角漏表面声波的表面声波器件 |
US20030151329A1 (en) * | 2001-10-12 | 2003-08-14 | Michio Kadota | Surface acoustic wave device |
CN1770628A (zh) * | 2004-11-02 | 2006-05-10 | 富士通媒体部品株式会社 | 双工器 |
CN1901368A (zh) * | 2005-07-21 | 2007-01-24 | Tdk株式会社 | 表面声波装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06164306A (ja) * | 1992-02-12 | 1994-06-10 | Kokusai Electric Co Ltd | 弾性表面波共振子 |
US5446330A (en) * | 1993-03-15 | 1995-08-29 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device having a lamination structure |
JP3979279B2 (ja) * | 2001-12-28 | 2007-09-19 | 株式会社村田製作所 | 弾性表面波装置 |
US6946772B2 (en) * | 2002-05-14 | 2005-09-20 | Tdk Corporation | Saw element, saw device and branching filter |
US7105980B2 (en) * | 2002-07-03 | 2006-09-12 | Sawtek, Inc. | Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics |
JP2004186868A (ja) * | 2002-12-02 | 2004-07-02 | Fujitsu Media Device Kk | 弾性表面波素子、それを有する送信フィルタ及び受信フィルタ、並びにそれらを有するデュプレクサ |
JP2004336503A (ja) * | 2003-05-09 | 2004-11-25 | Fujitsu Media Device Kk | 弾性表面波素子及びその製造方法 |
JP3774782B2 (ja) * | 2003-05-14 | 2006-05-17 | 富士通メディアデバイス株式会社 | 弾性表面波素子の製造方法 |
JP3950445B2 (ja) * | 2003-11-05 | 2007-08-01 | Tdk株式会社 | デュプレクサ |
JP3929983B2 (ja) | 2004-03-03 | 2007-06-13 | 富士通メディアデバイス株式会社 | 接合基板、弾性表面波素子および弾性表面波デバイス並びにその製造方法 |
JP4587732B2 (ja) * | 2004-07-28 | 2010-11-24 | 京セラ株式会社 | 弾性表面波装置 |
JP4657002B2 (ja) * | 2005-05-12 | 2011-03-23 | 信越化学工業株式会社 | 複合圧電基板 |
JP4264435B2 (ja) | 2005-10-17 | 2009-05-20 | ピアス販売株式会社 | デッキプレート接合用ドリルねじ |
JP4686342B2 (ja) * | 2005-11-30 | 2011-05-25 | 株式会社日立メディアエレクトロニクス | 弾性表面波装置及びこれを搭載した通信端末。 |
US7911111B2 (en) * | 2008-04-15 | 2011-03-22 | Ngk Insulators, Ltd. | Surface acoustic wave devices |
-
2007
- 2007-04-16 JP JP2007107329A patent/JP4316632B2/ja active Active
-
2008
- 2008-04-11 KR KR1020080033461A patent/KR100907393B1/ko active IP Right Grant
- 2008-04-15 EP EP08103546.1A patent/EP1983647B1/en active Active
- 2008-04-15 TW TW097113594A patent/TWI359563B/zh active
- 2008-04-16 US US12/103,814 patent/US7800464B2/en active Active
- 2008-04-16 CN CN2008100910779A patent/CN101291142B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1159100A (zh) * | 1995-10-13 | 1997-09-10 | 富士通株式会社 | 利用压电衬底最佳切割角漏表面声波的表面声波器件 |
US20030151329A1 (en) * | 2001-10-12 | 2003-08-14 | Michio Kadota | Surface acoustic wave device |
CN1770628A (zh) * | 2004-11-02 | 2006-05-10 | 富士通媒体部品株式会社 | 双工器 |
CN1901368A (zh) * | 2005-07-21 | 2007-01-24 | Tdk株式会社 | 表面声波装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4316632B2 (ja) | 2009-08-19 |
KR20080093370A (ko) | 2008-10-21 |
CN101291142A (zh) | 2008-10-22 |
US20080252394A1 (en) | 2008-10-16 |
US7800464B2 (en) | 2010-09-21 |
EP1983647A3 (en) | 2012-11-28 |
KR100907393B1 (ko) | 2009-07-10 |
TW200849816A (en) | 2008-12-16 |
TWI359563B (en) | 2012-03-01 |
EP1983647B1 (en) | 2018-12-19 |
JP2008270904A (ja) | 2008-11-06 |
EP1983647A2 (en) | 2008-10-22 |
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Owner name: TAIYO YUDEN CO., LTD. Free format text: FORMER OWNER: FUJITSU MEDIA DEVICES LTD Effective date: 20101202 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: KANAGAWA PREFECTURE, JAPAN TO: TOKYO, JAPAN |
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Effective date of registration: 20101202 Address after: Tokyo, Japan, Japan Patentee after: Taiyo Yuden Co., Ltd. Address before: Kanagawa Patentee before: Fujitsu Media Devices Ltd |