CN101243209B - 使用复制的图案化外形和自组装单层的微加工 - Google Patents

使用复制的图案化外形和自组装单层的微加工 Download PDF

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Publication number
CN101243209B
CN101243209B CN200680029400.9A CN200680029400A CN101243209B CN 101243209 B CN101243209 B CN 101243209B CN 200680029400 A CN200680029400 A CN 200680029400A CN 101243209 B CN101243209 B CN 101243209B
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CN
China
Prior art keywords
metal
substrate
nanostructured
nanostructured surface
patterned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200680029400.9A
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English (en)
Chinese (zh)
Other versions
CN101243209A (zh
Inventor
庆·P·阮
马修·H·弗雷
张海燕
张俊颖
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
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Publication of CN101243209A publication Critical patent/CN101243209A/zh
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Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN200680029400.9A 2005-08-10 2006-07-31 使用复制的图案化外形和自组装单层的微加工 Expired - Fee Related CN101243209B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/200,551 2005-08-10
US11/200,551 US7871670B2 (en) 2005-08-10 2005-08-10 Microfabrication using replicated patterned topography and self-assembled monolayers
PCT/US2006/029848 WO2007021527A2 (en) 2005-08-10 2006-07-31 Microfabrication using replciated patterned topography and self-assembled monolayers

Publications (2)

Publication Number Publication Date
CN101243209A CN101243209A (zh) 2008-08-13
CN101243209B true CN101243209B (zh) 2016-03-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680029400.9A Expired - Fee Related CN101243209B (zh) 2005-08-10 2006-07-31 使用复制的图案化外形和自组装单层的微加工

Country Status (5)

Country Link
US (1) US7871670B2 (enExample)
EP (1) EP1922436A2 (enExample)
JP (1) JP5199089B2 (enExample)
CN (1) CN101243209B (enExample)
WO (1) WO2007021527A2 (enExample)

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US20080095988A1 (en) * 2006-10-18 2008-04-24 3M Innovative Properties Company Methods of patterning a deposit metal on a polymeric substrate
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US7968804B2 (en) 2006-12-20 2011-06-28 3M Innovative Properties Company Methods of patterning a deposit metal on a substrate
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US8187906B2 (en) * 2008-02-28 2012-05-29 Sunlight Photonics Inc. Method for fabricating composite substances for thin film electro-optical devices
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US20100089441A1 (en) * 2008-10-09 2010-04-15 Sunlight Photonics Inc. Method and apparatus for manufacturing thin-film photovoltaic devices
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US8980656B2 (en) * 2009-10-21 2015-03-17 The Board Of Trustees Of The University Of Illinois Method of forming an array of high aspect ratio semiconductor nanostructures
US9202954B2 (en) * 2010-03-03 2015-12-01 Q1 Nanosystems Corporation Nanostructure and photovoltaic cell implementing same
FR2972298B1 (fr) * 2011-03-04 2015-07-31 Commissariat Energie Atomique Procede de metallisation de surfaces texturees
US10131086B2 (en) 2011-06-30 2018-11-20 University Of Virginia Patent Foundation Micro-structure and nano-structure replication methods and article of manufacture
US9082911B2 (en) 2013-01-28 2015-07-14 Q1 Nanosystems Corporation Three-dimensional metamaterial device with photovoltaic bristles
US9954126B2 (en) 2013-03-14 2018-04-24 Q1 Nanosystems Corporation Three-dimensional photovoltaic devices including cavity-containing cores and methods of manufacture
US20140264998A1 (en) 2013-03-14 2014-09-18 Q1 Nanosystems Corporation Methods for manufacturing three-dimensional metamaterial devices with photovoltaic bristles
US20160273112A1 (en) * 2013-03-27 2016-09-22 Atotech Deutschland Gmbh Electroless copper plating solution
US9445502B2 (en) 2013-05-30 2016-09-13 Nanchang O-Film Tech Co., Ltd. Flexible circuit connecting device
CN103295671B (zh) * 2013-05-30 2016-08-10 南昌欧菲光科技有限公司 透明导电膜
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TWM537383U (zh) * 2016-10-26 2017-02-21 啓碁科技股份有限公司 屏蔽罩
TWI739984B (zh) * 2017-01-31 2021-09-21 美商應用材料股份有限公司 就圖案化應用進行選擇性沉積之方案
JP7224978B2 (ja) * 2019-03-15 2023-02-20 マクセル株式会社 メッキ部品の製造方法及び基材の成形に用いられる金型
US20220244635A1 (en) * 2019-05-29 2022-08-04 B.G. Negev Technologies & Applications Ltd., At Ben-Gurion University A method for imprinting micropatterns on a substrate of a chalcogenide glass
CN110357614B (zh) * 2019-07-25 2021-12-10 哈尔滨理工大学 一种室温顺电-铁电可调的陶瓷材料及其制备方法
CN114132062A (zh) * 2020-09-03 2022-03-04 苏州苏大维格科技集团股份有限公司 一种微纳米潜影防伪器件及其制备方法与版辊

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Also Published As

Publication number Publication date
US7871670B2 (en) 2011-01-18
JP2009504910A (ja) 2009-02-05
US20070036951A1 (en) 2007-02-15
WO2007021527A2 (en) 2007-02-22
JP5199089B2 (ja) 2013-05-15
WO2007021527A3 (en) 2007-12-21
CN101243209A (zh) 2008-08-13
EP1922436A2 (en) 2008-05-21

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Granted publication date: 20160323

Termination date: 20170731