CN101236596B - 无线系统、半导体装置以及通讯装置 - Google Patents
无线系统、半导体装置以及通讯装置 Download PDFInfo
- Publication number
- CN101236596B CN101236596B CN2008100057771A CN200810005777A CN101236596B CN 101236596 B CN101236596 B CN 101236596B CN 2008100057771 A CN2008100057771 A CN 2008100057771A CN 200810005777 A CN200810005777 A CN 200810005777A CN 101236596 B CN101236596 B CN 101236596B
- Authority
- CN
- China
- Prior art keywords
- data
- deal
- majority
- semiconductor device
- communication device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Signal Processing (AREA)
- Hardware Redundancy (AREA)
- Dc Digital Transmission (AREA)
- Semiconductor Integrated Circuits (AREA)
- Detection And Prevention Of Errors In Transmission (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007024001 | 2007-02-02 | ||
| JP2007-024001 | 2007-02-02 | ||
| JP2007024001 | 2007-02-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101236596A CN101236596A (zh) | 2008-08-06 |
| CN101236596B true CN101236596B (zh) | 2013-04-24 |
Family
ID=39675695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100057771A Expired - Fee Related CN101236596B (zh) | 2007-02-02 | 2008-02-01 | 无线系统、半导体装置以及通讯装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8009050B2 (enExample) |
| JP (1) | JP5121479B2 (enExample) |
| KR (1) | KR101460979B1 (enExample) |
| CN (1) | CN101236596B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1956523B1 (en) * | 2007-02-02 | 2013-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Wireless identification system, semiconductor device, and communication device |
| JP5301299B2 (ja) * | 2008-01-31 | 2013-09-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR101611643B1 (ko) | 2008-10-01 | 2016-04-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US9563834B2 (en) * | 2013-04-10 | 2017-02-07 | Honeywell International, Inc. | High temperature tolerant RFID tag |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53120295A (en) * | 1977-03-30 | 1978-10-20 | Toshiba Corp | Subject discrimination device |
| JPS61211786A (ja) * | 1985-03-16 | 1986-09-19 | Hitachi Maxell Ltd | Icカ−ド |
| CA1268828A (en) | 1986-02-08 | 1990-05-08 | Yasuharu Yoshida | Multilevel modulator capable of producing a composite modulated signal comprising a quadrature amplitude modulated component and a phase modulated component |
| JPS63239576A (ja) * | 1987-03-27 | 1988-10-05 | Toshiba Corp | 携帯可能電子装置 |
| JPH02161585A (ja) * | 1988-12-15 | 1990-06-21 | Toppan Printing Co Ltd | 電子カードシステム |
| JPH066329A (ja) * | 1992-06-24 | 1994-01-14 | Nec Eng Ltd | 多数決判定回路 |
| JPH06332794A (ja) * | 1993-05-25 | 1994-12-02 | Hitachi Ltd | データ送出装置 |
| US5661470A (en) * | 1994-03-04 | 1997-08-26 | Karr; Gerald S. | Object recognition system |
| JP3694987B2 (ja) * | 1996-06-25 | 2005-09-14 | 石川島播磨重工業株式会社 | 三重系フォールトトレラントシステム |
| JP3568180B2 (ja) | 1997-06-12 | 2004-09-22 | 株式会社日立国際電気 | データ伝送装置 |
| JP3179060B2 (ja) | 1997-06-19 | 2001-06-25 | 株式会社東芝 | 情報データ多重化伝送システムとその多重化装置及び分離装置 |
| JP3542707B2 (ja) * | 1997-12-05 | 2004-07-14 | 富士通株式会社 | 電子現金金庫 |
| JP2000115804A (ja) * | 1998-09-22 | 2000-04-21 | Neucore Technol Inc | カード式半導体メモリ装置 |
| JP2000149194A (ja) | 1998-11-12 | 2000-05-30 | Toshiba Corp | 駐車管理システム |
| JP2001344213A (ja) | 2000-05-31 | 2001-12-14 | Hitachi Ltd | 生体認証システム |
| JP4269502B2 (ja) * | 2000-09-07 | 2009-05-27 | 三菱マテリアル株式会社 | データキャリア |
| JP2003067683A (ja) | 2001-08-30 | 2003-03-07 | Omron Corp | 生産ラインにおける認識システム |
| JP2003287587A (ja) * | 2002-03-27 | 2003-10-10 | Toshiba Corp | プラント保護計装装置 |
| US7973313B2 (en) | 2003-02-24 | 2011-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container |
| US7768405B2 (en) | 2003-12-12 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and manufacturing method thereof |
| KR101333278B1 (ko) * | 2004-03-09 | 2013-12-02 | 카운슬 오브 사이언티픽 앤드 인더스트리얼 리서치 | 시각적인 반사 스펙트럼 반응을 이용한 향상된 위조 화폐 검출기 |
| US7366465B2 (en) * | 2004-11-19 | 2008-04-29 | Sirit Technologies Inc. | Homodyne RFID receiver and method |
| US7209040B2 (en) | 2004-11-19 | 2007-04-24 | Sirit Technologies, Inc. | Homodyne RFID receiver and method |
| US7783581B2 (en) | 2005-01-05 | 2010-08-24 | Nec Corporation | Data learning system for identifying, learning apparatus, identifying apparatus and learning method |
| US20070002140A1 (en) * | 2005-05-03 | 2007-01-04 | Greg Benson | Trusted monitoring system and method |
| US7545276B2 (en) | 2005-09-13 | 2009-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| EP1850267B1 (en) | 2006-04-28 | 2011-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and position detecting method using the semiconductor device |
| EP1956523B1 (en) | 2007-02-02 | 2013-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Wireless identification system, semiconductor device, and communication device |
-
2008
- 2008-01-30 US US12/010,789 patent/US8009050B2/en not_active Expired - Fee Related
- 2008-02-01 KR KR1020080010503A patent/KR101460979B1/ko not_active Expired - Fee Related
- 2008-02-01 JP JP2008022212A patent/JP5121479B2/ja not_active Expired - Fee Related
- 2008-02-01 CN CN2008100057771A patent/CN101236596B/zh not_active Expired - Fee Related
Non-Patent Citations (2)
| Title |
|---|
| JP特开2003-67683A 2003.03.07 |
| JP特开2006-303912A 2006.11.02 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101236596A (zh) | 2008-08-06 |
| JP5121479B2 (ja) | 2013-01-16 |
| US8009050B2 (en) | 2011-08-30 |
| US20080186181A1 (en) | 2008-08-07 |
| KR101460979B1 (ko) | 2014-11-13 |
| JP2008210380A (ja) | 2008-09-11 |
| KR20080072568A (ko) | 2008-08-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20210201 |