CN101208454A - 晶片处理系统及制造晶片的方法 - Google Patents

晶片处理系统及制造晶片的方法 Download PDF

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Publication number
CN101208454A
CN101208454A CNA2005800395984A CN200580039598A CN101208454A CN 101208454 A CN101208454 A CN 101208454A CN A2005800395984 A CNA2005800395984 A CN A2005800395984A CN 200580039598 A CN200580039598 A CN 200580039598A CN 101208454 A CN101208454 A CN 101208454A
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CN
China
Prior art keywords
chamber
wafer
row
treatment
process according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800395984A
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English (en)
Chinese (zh)
Inventor
凯文·P·费尔贝恩
哈里·蓬内坎蒂
克里斯托弗·莱恩
罗伯特·爱德华·韦斯
伊恩·拉奇福特
特里·布卢克
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Intevac Inc
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Intevac Inc
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Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Publication of CN101208454A publication Critical patent/CN101208454A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
CNA2005800395984A 2004-11-18 2005-10-31 晶片处理系统及制造晶片的方法 Pending CN101208454A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/991,722 US20060102078A1 (en) 2004-11-18 2004-11-18 Wafer fab
US10/991,722 2004-11-18

Publications (1)

Publication Number Publication Date
CN101208454A true CN101208454A (zh) 2008-06-25

Family

ID=36384826

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005800395984A Pending CN101208454A (zh) 2004-11-18 2005-10-31 晶片处理系统及制造晶片的方法

Country Status (6)

Country Link
US (1) US20060102078A1 (enExample)
EP (1) EP1815041A4 (enExample)
JP (1) JP2008520837A (enExample)
CN (1) CN101208454A (enExample)
TW (1) TWI300964B (enExample)
WO (1) WO2006055236A2 (enExample)

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CN102422390A (zh) * 2009-03-16 2012-04-18 奥塔装置公司 气相沉积反应器系统及其方法
CN103531508A (zh) * 2013-10-17 2014-01-22 深圳市华星光电技术有限公司 基板运输设备及运输方法
CN103681363A (zh) * 2012-09-17 2014-03-26 Psk有限公司 串行线性热处理器排列
CN106784394A (zh) * 2013-12-30 2017-05-31 Sfa工程股份有限公司 用于附着玻璃与掩模的设备及方法、以及用于装载基板的系统及方法
CN112048698A (zh) * 2017-02-09 2020-12-08 应用材料公司 用于真空处理设在基板上的薄膜晶体管沟道的方法、薄膜晶体管和用于真空处理基板的设备
CN117230423A (zh) * 2022-06-08 2023-12-15 凌嘉科技股份有限公司 并列式镀膜设备及多层膜的镀膜方法

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JP5611718B2 (ja) * 2009-08-27 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
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CN102422390A (zh) * 2009-03-16 2012-04-18 奥塔装置公司 气相沉积反应器系统及其方法
CN102422390B (zh) * 2009-03-16 2015-05-13 奥塔装置公司 气相沉积反应器系统及其方法
CN103681363A (zh) * 2012-09-17 2014-03-26 Psk有限公司 串行线性热处理器排列
CN103681363B (zh) * 2012-09-17 2016-12-07 Psk有限公司 串行线性热处理器排列
CN103531508A (zh) * 2013-10-17 2014-01-22 深圳市华星光电技术有限公司 基板运输设备及运输方法
WO2015054952A1 (zh) * 2013-10-17 2015-04-23 深圳市华星光电技术有限公司 基板运输设备及运输方法
CN103531508B (zh) * 2013-10-17 2016-05-18 深圳市华星光电技术有限公司 基板运输设备及运输方法
CN106784394A (zh) * 2013-12-30 2017-05-31 Sfa工程股份有限公司 用于附着玻璃与掩模的设备及方法、以及用于装载基板的系统及方法
CN106784394B (zh) * 2013-12-30 2018-10-09 Sfa工程股份有限公司 用于附着玻璃与掩模的设备及方法、以及用于装载基板的系统及方法
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CN112048698B (zh) * 2017-02-09 2023-07-28 应用材料公司 用于真空处理设在基板上的薄膜晶体管沟道的方法、薄膜晶体管和用于真空处理基板的设备
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