CN101203632A - 用于加工平坦的和平面式物体的装置 - Google Patents

用于加工平坦的和平面式物体的装置 Download PDF

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Publication number
CN101203632A
CN101203632A CNA2006800224449A CN200680022444A CN101203632A CN 101203632 A CN101203632 A CN 101203632A CN A2006800224449 A CNA2006800224449 A CN A2006800224449A CN 200680022444 A CN200680022444 A CN 200680022444A CN 101203632 A CN101203632 A CN 101203632A
Authority
CN
China
Prior art keywords
contact
printed circuit
circuit board
contact mechanism
aforementioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800224449A
Other languages
English (en)
Chinese (zh)
Inventor
W·A·莫勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gebrueder Schmid GmbH and Co
Original Assignee
Gebrueder Schmid GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebrueder Schmid GmbH and Co filed Critical Gebrueder Schmid GmbH and Co
Publication of CN101203632A publication Critical patent/CN101203632A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CNA2006800224449A 2005-06-22 2006-06-20 用于加工平坦的和平面式物体的装置 Pending CN101203632A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005030546A DE102005030546A1 (de) 2005-06-22 2005-06-22 Einrichtung zur Behandlung von flachen und flächigen Gegenständen
DE102005030546.6 2005-06-22

Publications (1)

Publication Number Publication Date
CN101203632A true CN101203632A (zh) 2008-06-18

Family

ID=36809626

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800224449A Pending CN101203632A (zh) 2005-06-22 2006-06-20 用于加工平坦的和平面式物体的装置

Country Status (7)

Country Link
EP (1) EP1899507A2 (enExample)
JP (1) JP2008544086A (enExample)
KR (1) KR20080039841A (enExample)
CN (1) CN101203632A (enExample)
AT (1) AT10276U1 (enExample)
DE (1) DE102005030546A1 (enExample)
WO (1) WO2006136362A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102695821A (zh) * 2009-10-09 2012-09-26 吉布尔·施密德有限责任公司 用于制造金属化的半导体衬底的方法和设备
CN102808206A (zh) * 2012-05-04 2012-12-05 上海贺鸿电子有限公司 一种适用于片状和卷状产品水平电镀线的导电及辅助传动装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
DE102009023768A1 (de) * 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
DE102009057463A1 (de) 2009-12-03 2011-06-09 Hübel, Egon Verfahren und Vorrichtung zum elektrischen Kontaktieren von Gut in Durchlaufanlagen

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729390A (en) * 1967-11-24 1973-04-24 Du Pont Electrotinning process to prevent plating on the cathode contact roll
JPH01162798A (ja) * 1987-12-18 1989-06-27 Nkk Corp 電気めっき用コンダクターロールの付着金属除去装置
JP2543299Y2 (ja) * 1989-12-14 1997-08-06 富士重工業株式会社 ディーゼルエンジンの停止装置
EP0578699B1 (de) * 1991-04-12 1995-07-12 Siemens Aktiengesellschaft Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten
DE19628784A1 (de) * 1996-07-17 1998-01-22 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102695821A (zh) * 2009-10-09 2012-09-26 吉布尔·施密德有限责任公司 用于制造金属化的半导体衬底的方法和设备
CN102695821B (zh) * 2009-10-09 2016-04-13 吉布尔·施密德有限责任公司 用于制造金属化的半导体衬底的方法和设备
CN102808206A (zh) * 2012-05-04 2012-12-05 上海贺鸿电子有限公司 一种适用于片状和卷状产品水平电镀线的导电及辅助传动装置
CN102808206B (zh) * 2012-05-04 2015-04-08 上海贺鸿电子有限公司 一种适用于片状和卷状产品水平电镀线的导电及辅助传动装置

Also Published As

Publication number Publication date
JP2008544086A (ja) 2008-12-04
KR20080039841A (ko) 2008-05-07
WO2006136362A3 (de) 2008-02-28
WO2006136362A2 (de) 2006-12-28
AT10276U1 (de) 2008-12-15
EP1899507A2 (de) 2008-03-19
DE102005030546A1 (de) 2007-01-04

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20080618