AT10276U1 - Einrichtung zur behandlung von flachen und flächigen gegenständen - Google Patents
Einrichtung zur behandlung von flachen und flächigen gegenständen Download PDFInfo
- Publication number
- AT10276U1 AT10276U1 AT0900406U AT90042006U AT10276U1 AT 10276 U1 AT10276 U1 AT 10276U1 AT 0900406 U AT0900406 U AT 0900406U AT 90042006 U AT90042006 U AT 90042006U AT 10276 U1 AT10276 U1 AT 10276U1
- Authority
- AT
- Austria
- Prior art keywords
- objects
- contacting
- contact
- wheel
- copper
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000009713 electroplating Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000003792 electrolyte Substances 0.000 claims description 4
- 241000093804 Berzelia galpinii Species 0.000 claims description 3
- 239000008151 electrolyte solution Substances 0.000 claims description 3
- 239000012811 non-conductive material Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000011010 flushing procedure Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000002244 precipitate Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005030546A DE102005030546A1 (de) | 2005-06-22 | 2005-06-22 | Einrichtung zur Behandlung von flachen und flächigen Gegenständen |
| PCT/EP2006/005892 WO2006136362A2 (de) | 2005-06-22 | 2006-06-20 | Einrichtung zur behandlung von flachen und flächigen gegenständen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AT10276U1 true AT10276U1 (de) | 2008-12-15 |
Family
ID=36809626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT0900406U AT10276U1 (de) | 2005-06-22 | 2006-06-20 | Einrichtung zur behandlung von flachen und flächigen gegenständen |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1899507A2 (enExample) |
| JP (1) | JP2008544086A (enExample) |
| KR (1) | KR20080039841A (enExample) |
| CN (1) | CN101203632A (enExample) |
| AT (1) | AT10276U1 (enExample) |
| DE (1) | DE102005030546A1 (enExample) |
| WO (1) | WO2006136362A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009023768A1 (de) * | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen |
| DE102009023763A1 (de) | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten |
| DE102009049565A1 (de) * | 2009-10-09 | 2011-04-14 | Gebr. Schmid Gmbh & Co. | Verfahren und Anlage zur Metallisierung von Siliziumwafern |
| DE102009057463A1 (de) | 2009-12-03 | 2011-06-09 | Hübel, Egon | Verfahren und Vorrichtung zum elektrischen Kontaktieren von Gut in Durchlaufanlagen |
| CN102808206B (zh) * | 2012-05-04 | 2015-04-08 | 上海贺鸿电子有限公司 | 一种适用于片状和卷状产品水平电镀线的导电及辅助传动装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3729390A (en) * | 1967-11-24 | 1973-04-24 | Du Pont | Electrotinning process to prevent plating on the cathode contact roll |
| JPH01162798A (ja) * | 1987-12-18 | 1989-06-27 | Nkk Corp | 電気めっき用コンダクターロールの付着金属除去装置 |
| JP2543299Y2 (ja) * | 1989-12-14 | 1997-08-06 | 富士重工業株式会社 | ディーゼルエンジンの停止装置 |
| EP0578699B1 (de) * | 1991-04-12 | 1995-07-12 | Siemens Aktiengesellschaft | Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten |
| DE19628784A1 (de) * | 1996-07-17 | 1998-01-22 | Schmid Gmbh & Co Geb | Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten |
| DE19717512C3 (de) * | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen |
-
2005
- 2005-06-22 DE DE102005030546A patent/DE102005030546A1/de not_active Withdrawn
-
2006
- 2006-06-20 JP JP2008517394A patent/JP2008544086A/ja active Pending
- 2006-06-20 WO PCT/EP2006/005892 patent/WO2006136362A2/de not_active Ceased
- 2006-06-20 EP EP06754450A patent/EP1899507A2/de not_active Withdrawn
- 2006-06-20 AT AT0900406U patent/AT10276U1/de not_active IP Right Cessation
- 2006-06-20 CN CNA2006800224449A patent/CN101203632A/zh active Pending
- 2006-06-20 KR KR1020077029685A patent/KR20080039841A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080039841A (ko) | 2008-05-07 |
| CN101203632A (zh) | 2008-06-18 |
| WO2006136362A3 (de) | 2008-02-28 |
| JP2008544086A (ja) | 2008-12-04 |
| DE102005030546A1 (de) | 2007-01-04 |
| WO2006136362A2 (de) | 2006-12-28 |
| EP1899507A2 (de) | 2008-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3624481C2 (enExample) | ||
| WO2010130444A1 (de) | Verfahren, behandlungsstation und anlage zum behandeln von flächigem behandlungsgut | |
| AT516668B1 (de) | Vorrichtung und Verfahren zur Behandlung von flachem zu behandelndem Material | |
| WO2001081657A2 (de) | Elastisches kontakelement | |
| WO2013160160A2 (de) | Verfahren und vorrichtung zum elektrolytischen abscheiden eines abscheidemetalls auf einem werkstück | |
| DE10206660C1 (de) | Vorrichtung und Verfahren zum Transport von flachem Behandlungsgut in Durchlaufanlagen | |
| DE102008022282A1 (de) | Einrichtung und Verfahren zur Behandlung von Silizium-Wafern oder flachen Gegenständen | |
| AT10276U1 (de) | Einrichtung zur behandlung von flachen und flächigen gegenständen | |
| DE10154884A1 (de) | Verfahren und Vorrichtung zum Transport von flexiblem Flachmaterial, insbesondere Leiterplatten | |
| DE102012202715B4 (de) | Vakuumprozessanlage mit einer Einrichtung zur Druckseparation | |
| CH680726A5 (en) | Cleaning device for surface of conveyor belts - has interchangeable brush rollers for different cleaning actions | |
| DD202462A5 (de) | Galvanisiereinrichtung | |
| DE4413149A1 (de) | Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten | |
| DE4123985C2 (de) | Vorrichtung zur elektrolytischen Behandlung von Leiterplatten, insbesondere zur elektrolytischen Beschichtung mit Kupfer | |
| DE2166212C3 (de) | Scharnierbandförderer für Metallspäne. Ausscheidung aus: 2100932 | |
| DE20304601U1 (de) | Vorrichtung zum Transport von flexiblem Flachmaterial, insbesondere Leiterplatten | |
| DE1596988A1 (de) | Vorrichtung und Verfahren zum Herstellen von Spiegeln | |
| DD206942A1 (de) | Elektrischer filter | |
| EP2132354B1 (de) | Verfahren und vorrichtung zur behandlung bandförmigen substrates in einer vakuumbeschichtungsanlage | |
| DE4324536C2 (de) | Verteileinrichtung | |
| DE102004025827B3 (de) | Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen | |
| WO1998007903A1 (de) | Vorrichtung zum galvanisieren von elektronischen leiterplatten oder dergleichen | |
| DE69803098T2 (de) | Anordnung zur galvanischen beschichtung auf vorbeitransportierten metallblechen, insbesondere für leiterplatten, durch schliessen eines elektrischen stromkreises zwischen den blechen und einem flüssigen reaktant- produkt | |
| DE102013100805B4 (de) | Nasschemische Behandlungsanlage zum elektrochemischen Beschichten von flachen Substraten | |
| DE20112319U1 (de) | Walzenanordnung für eine Elektroplattiervorrichtung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM01 | Lapse because of not paying annual fees |
Effective date: 20120630 |