Classifications

• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
  • C25D5/02—Electroplating of selected surface areas
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
  • C25D17/005—Contacting devices
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D7/00—Electroplating characterised by the article coated
  • C25D7/06—Wires; Strips; Foils
  • C25D7/0614—Strips or foils
  • C25D7/0621—In horizontal cells
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/24—Reinforcing the conductive pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/24—Reinforcing the conductive pattern
  • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/15—Position of the PCB during processing
  • H05K2203/1509—Horizontally held PCB

Definitions

• the invention relates to a device for the treatment of objects, in particular an electroplating device for printed circuit boards. These can pass through a treatment chamber on a passageway, for which means of transport are provided by a treatment medium, such as an electrolyte solution. Furthermore, contacting means for electrical contacting and power supply from a power supply to the objects are provided.
• the invention has for its object to provide a device mentioned above, with the problems of the prior art can be avoided and in particular with less effort reliable contact and power supply to the objects to be treated can be ensured.
• a treatment medium for example , ,
• contact means for the electrical contacting of the objects are provided and there is a power supply from a corresponding power supply.
• the articles have two surfaces, for example a bottom and a top.
• the contacting means for the electrical contacting are provided on one side of the objects only on one surface, that is to say either only on the upper side or only on the lower side. There, the contact means abut the objects and establish the electrical contact and thus ensure the power supply. It is thus provided, for example, that on a left or a right side of the objects the contacting means are provided only on one surface or not on both sides opposite each other, in particular only on the underside.
• the contacting means are advantageously designed revolving or rotating. Particularly advantageous they are wheel or roller-like. Embodiments of such contacting means are known, for example, from DE 103 23 660 A1 and EP 819 781 A1, to which reference is hereby expressly made.
• contacting means are provided in the passage direction on the left side and on the right side of the objects, but only on one surface of the objects. Preferably, they are arranged on the same surface of the objects or lie against it. Particularly preferably, the contacting means bear against a surface of the objects in such a way that precipitation, such as, for example, metal flakes, can be released and dropped by gravity in the case of an electroplating apparatus with metal coating which forms on this surface or on the contacting means. If the objects are transported essentially horizontally, an arrangement of the contacting means on the underside of the articles offers itself here.
• a good electrical contacting and power supply when viewed in the direction of passage, a plurality of contacting means is provided and bears against the objects.
• a plurality of contacting means is provided and bears against the objects.
• rows of successive contact wheels or the like may be provided.
• counter-pressure means are arranged on the other surface of the objects.
• These counter-pressure means are advantageously also rad- or roller-like as well as the contacting.
• contact means and counter-pressure means do not grind on the surface of the objects along, but roll it. This prevents mechanical damage or the like. reliable.
• contacting means and counter-pressure means advantageously rotate at the same speed or at the same circumferential speed, so that a clean rolling takes place on the objects.
• the contacting means and / or the counterpressure means can be driven, in particular in coupling with the transport means. Alternatively, they can at least partially form or replace the means of transport or at least the task of the drive via means of transport, such as non-driven transport rollers or rollers.
• the contacting means may be made of metal, preferably copper, as well as the contact surfaces coming into contact with the objects.
• the counter-pressure means may consist of non-conductive material. In particular, they are made of plastic or at least coated on their surface with plastic. Thus they are not electrically active. As a result, for example, no metal deposits on a metal coating with an electroplating device.
• FIG. 1 In the single drawing figure 1 is shown schematically an electroplating device 11 with a treatment chamber 13, in which an electrolyte 14 is up to an upper liquid level.
• This electroplating device 11 corresponds to a conventional electroplating device, as described and illustrated, for example, in EP 819 781 A1, to which reference is hereby expressly made.
• circuit board 16 In the treatment chamber 13 or in the electrolyte 14 is a flat circuit board 16 with a bottom 17 and a top 18. It can be seen that the circuit board 16 is transported lying, with direction in the plane of drawing. Furthermore, it has a right edge region 19. Due to the truncated representation of the left edge region of the circuit board 16 is not shown. Essentially, however, the entire figure 1 is to be understood that on the left side, not shown, the mirror image training can be present on the right side.
• the printed circuit board 16 rests on lower transport wheels 20, which are driven by a lower transport shaft 21 for transporting the printed circuit board through the treatment chamber 13.
• At the upper side 18 of the printed circuit board 16 are upper transport wheels 20 on an upper transport shaft 22.
• the transport shafts are each provided with a lower drive 24 and an upper drive 26 and thereby move the circuit board 16 through the treatment chamber 13.
• contact wheel 28 At the lower transport shaft 21 is also a contact wheel 28, which has slightly protruding contact segments 29 in the central region.
• Contact wheel 28 and contact segments 29 advantageously consist essentially of copper. In particular, they can be designed , ,
• the contact wheel 28 and the contact segments 29 are located on the underside 17 of the circuit board 16, in the right edge region 19th
• the contact wheel 28 Opposite the contact wheel 28, at the top 18 of the circuit board 16, is a counter-pressure wheel 31 having a slightly raised central tread 32. Similar to an opposing contact wheel in the prior art, the counter pressure wheel 31 provides good contact wheel 28 engagement with the circuit board However, the counterpressure wheel 31 is for example made of plastic or is in any case not electrically conductive and does not serve to supply power to the circuit board 16. Thus, at least in this edge region 19 of the circuit board 16, the lower contact wheel 28 is the only one Contacting the printed circuit board 16. In particular 16 contact wheels similar to the contact wheel 28 are provided along the entire right side of the circuit board 16 exclusively on the underside 17 of the circuit board. At a left side of the printed circuit board 16, not shown, 17 similar further contact wheels may also be provided on the bottom.
• the lower contact wheel 28 is connected to an electrical connection 25 to a lower voltage source 34 and an upper voltage source 35.
• These voltage sources 34 and 35 are further connected to their positive pole with anodes 37, which are provided above and below the circuit board 16, advantageously numerous and as transverse rods or the like ..
• a direct electrical contact with the underside 17 of the printed circuit board 16 is generated by the contact wheel 28 during operation of the electroplating device 11 in all cases.
• a copper coating in any case, starting with the bottom 17 of the circuit board 16.
• About existing on the circuit board 16 holes, openings or the like.
• a copper layer and thus an electrical contact to the top 18 of the circuit board 16 is formed.
• this top 18 is also electrically contacted and also coated with copper.
• a contact wheel can be made simpler if the aforementioned copper bauble is easily removable. In particular, then a training of copper or copper surfaces. Otherwise usual expensive platinum coatings can be omitted, which can reduce the production costs and above all the production costs.
• Another advantage of the invention is that, for example, in the case of an aforementioned copper coating, so-called copper flakes, which precipitate out of the electrolyte, accumulate on the contact wheel or a corresponding contacting agent.
• this bauble can be easily solved and removed by simply falling down. at , ,
• an overhead contact wheel of a known electroplating device is often the problem that such a flicker just can not fall down and thus accumulate in large quantities or may be pressed by an overhead contact wheel or overhead transport wheels on the circuit board or soiling or Damage caused. This existing especially with overhead contact wheels problems can be avoided with the invention. Previous solutions with a flushing of such copper baubles are considerably more expensive and can be saved.

Landscapes

• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Electrochemistry (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Electroplating Methods And Accessories (AREA)
• Manufacturing Of Printed Wiring (AREA)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

Country Status (7)

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Family Cites Families (6)

• 2005
  • 2005-06-22 DE DE102005030546A patent/DE102005030546A1/de not_active Withdrawn
• 2006
  • 2006-06-20 JP JP2008517394A patent/JP2008544086A/ja active Pending
  • 2006-06-20 WO PCT/EP2006/005892 patent/WO2006136362A2/de not_active Ceased
  • 2006-06-20 EP EP06754450A patent/EP1899507A2/de not_active Withdrawn
  • 2006-06-20 AT AT0900406U patent/AT10276U1/de not_active IP Right Cessation
  • 2006-06-20 CN CNA2006800224449A patent/CN101203632A/zh active Pending
  • 2006-06-20 KR KR1020077029685A patent/KR20080039841A/ko not_active Withdrawn

Non-Patent Citations (1)

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