JP2008544086A5 - - Google Patents

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Publication number
JP2008544086A5
JP2008544086A5 JP2008517394A JP2008517394A JP2008544086A5 JP 2008544086 A5 JP2008544086 A5 JP 2008544086A5 JP 2008517394 A JP2008517394 A JP 2008517394A JP 2008517394 A JP2008517394 A JP 2008517394A JP 2008544086 A5 JP2008544086 A5 JP 2008544086A5
Authority
JP
Japan
Prior art keywords
contact
contact means
manufactured
processing chamber
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008517394A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008544086A (ja
Filing date
Publication date
Priority claimed from DE102005030546A external-priority patent/DE102005030546A1/de
Application filed filed Critical
Publication of JP2008544086A publication Critical patent/JP2008544086A/ja
Publication of JP2008544086A5 publication Critical patent/JP2008544086A5/ja
Pending legal-status Critical Current

Links

JP2008517394A 2005-06-22 2006-06-20 平坦且つ平面的な物体を処理する装置 Pending JP2008544086A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005030546A DE102005030546A1 (de) 2005-06-22 2005-06-22 Einrichtung zur Behandlung von flachen und flächigen Gegenständen
PCT/EP2006/005892 WO2006136362A2 (de) 2005-06-22 2006-06-20 Einrichtung zur behandlung von flachen und flächigen gegenständen

Publications (2)

Publication Number Publication Date
JP2008544086A JP2008544086A (ja) 2008-12-04
JP2008544086A5 true JP2008544086A5 (enExample) 2009-08-06

Family

ID=36809626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008517394A Pending JP2008544086A (ja) 2005-06-22 2006-06-20 平坦且つ平面的な物体を処理する装置

Country Status (7)

Country Link
EP (1) EP1899507A2 (enExample)
JP (1) JP2008544086A (enExample)
KR (1) KR20080039841A (enExample)
CN (1) CN101203632A (enExample)
AT (1) AT10276U1 (enExample)
DE (1) DE102005030546A1 (enExample)
WO (1) WO2006136362A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009023768A1 (de) * 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
DE102009049565A1 (de) * 2009-10-09 2011-04-14 Gebr. Schmid Gmbh & Co. Verfahren und Anlage zur Metallisierung von Siliziumwafern
DE102009057463A1 (de) 2009-12-03 2011-06-09 Hübel, Egon Verfahren und Vorrichtung zum elektrischen Kontaktieren von Gut in Durchlaufanlagen
CN102808206B (zh) * 2012-05-04 2015-04-08 上海贺鸿电子有限公司 一种适用于片状和卷状产品水平电镀线的导电及辅助传动装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729390A (en) * 1967-11-24 1973-04-24 Du Pont Electrotinning process to prevent plating on the cathode contact roll
JPH01162798A (ja) * 1987-12-18 1989-06-27 Nkk Corp 電気めっき用コンダクターロールの付着金属除去装置
JP2543299Y2 (ja) * 1989-12-14 1997-08-06 富士重工業株式会社 ディーゼルエンジンの停止装置
EP0578699B1 (de) * 1991-04-12 1995-07-12 Siemens Aktiengesellschaft Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten
DE19628784A1 (de) * 1996-07-17 1998-01-22 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen

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