JP2008544086A5 - - Google Patents
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- Publication number
- JP2008544086A5 JP2008544086A5 JP2008517394A JP2008517394A JP2008544086A5 JP 2008544086 A5 JP2008544086 A5 JP 2008544086A5 JP 2008517394 A JP2008517394 A JP 2008517394A JP 2008517394 A JP2008517394 A JP 2008517394A JP 2008544086 A5 JP2008544086 A5 JP 2008544086A5
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contact means
- manufactured
- processing chamber
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000003792 electrolyte Substances 0.000 claims 1
Claims (8)
前記接触手段(28、29)は、前記物体(16)の2つの表面(17、18)又は側面のうちの1つの上にのみ配置されており、且つ、その場所において前記物体に密着して電気的に接触し、前記接触手段(28、29)は、循環方式又はロータリー方式で構成され、ホイール又はローラーからなり、更に、前記接触手段(28、29)は、通過方向から見たとき、前記物体(16)の左側のみ又は右側(19)のみに提供されていることを特徴とする鍍金装置。 Conveying means (20, 21, 22) for conveying a flat and planar object (16) through a processing chamber equipped with a processing medium such as an electrolyte (14), and electrical contacts and power sources (34, 35) In a plating device (11) for processing said object on a passage path (20) through a processing chamber (13) having contact means (28, 29) for supplying power to said object from ,
The contact means (28, 29) is arranged only on one of the two surfaces (17, 18) or side surfaces of the object (16) and is in close contact with the object at that location. Electrically contacting, the contact means (28, 29) is constituted by a circulation system or a rotary system, and consists of a wheel or a roller. A plating apparatus provided only on the left side or only on the right side (19) of the object (16).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005030546A DE102005030546A1 (en) | 2005-06-22 | 2005-06-22 | Device for the treatment of flat and flat objects |
PCT/EP2006/005892 WO2006136362A2 (en) | 2005-06-22 | 2006-06-20 | Device for treatment of surfaces and planar objects |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008544086A JP2008544086A (en) | 2008-12-04 |
JP2008544086A5 true JP2008544086A5 (en) | 2009-08-06 |
Family
ID=36809626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008517394A Pending JP2008544086A (en) | 2005-06-22 | 2006-06-20 | Device for processing flat and planar objects |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1899507A2 (en) |
JP (1) | JP2008544086A (en) |
KR (1) | KR20080039841A (en) |
CN (1) | CN101203632A (en) |
AT (1) | AT10276U1 (en) |
DE (1) | DE102005030546A1 (en) |
WO (1) | WO2006136362A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009023768A1 (en) * | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Method and device for controlling electrochemical surface processes |
DE102009023763A1 (en) | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Method and device for the electrolytic treatment of high-resistance layers |
DE102009049565A1 (en) * | 2009-10-09 | 2011-04-14 | Gebr. Schmid Gmbh & Co. | Process and plant for the metallization of silicon wafers |
DE102009057463A1 (en) | 2009-12-03 | 2011-06-09 | Hübel, Egon | Method for electrochemical treatment of goods as section, comprises conveying the goods in transport direction with mutual distance as a gap through continuous flow system by means of rotating or moving transport and/or contact means |
CN102808206B (en) * | 2012-05-04 | 2015-04-08 | 上海贺鸿电子有限公司 | Conductive and auxiliary driving device applicable to horizontal electroplating line for flaky and rolled products |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3729390A (en) * | 1967-11-24 | 1973-04-24 | Du Pont | Electrotinning process to prevent plating on the cathode contact roll |
JPH01162798A (en) * | 1987-12-18 | 1989-06-27 | Nkk Corp | Method for removing metal sticking to conductor roll for electroplating |
JP2543299Y2 (en) * | 1989-12-14 | 1997-08-06 | 富士重工業株式会社 | Diesel engine stop device |
EP0578699B1 (en) * | 1991-04-12 | 1995-07-12 | Siemens Aktiengesellschaft | Galvanisation device for plate-like workpieces, especially printed circuit boards |
DE19628784A1 (en) * | 1996-07-17 | 1998-01-22 | Schmid Gmbh & Co Geb | Device for treating objects, in particular electroplating device for printed circuit boards |
DE19717512C3 (en) * | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Device for electroplating circuit boards under constant conditions in continuous systems |
-
2005
- 2005-06-22 DE DE102005030546A patent/DE102005030546A1/en not_active Withdrawn
-
2006
- 2006-06-20 WO PCT/EP2006/005892 patent/WO2006136362A2/en active Application Filing
- 2006-06-20 EP EP06754450A patent/EP1899507A2/en not_active Withdrawn
- 2006-06-20 AT AT0900406U patent/AT10276U1/en not_active IP Right Cessation
- 2006-06-20 JP JP2008517394A patent/JP2008544086A/en active Pending
- 2006-06-20 KR KR1020077029685A patent/KR20080039841A/en not_active Application Discontinuation
- 2006-06-20 CN CNA2006800224449A patent/CN101203632A/en active Pending
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