EP0578699B1 - Galvanisation device for plate-like workpieces, especially printed circuit boards - Google Patents
Galvanisation device for plate-like workpieces, especially printed circuit boards Download PDFInfo
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- EP0578699B1 EP0578699B1 EP92907748A EP92907748A EP0578699B1 EP 0578699 B1 EP0578699 B1 EP 0578699B1 EP 92907748 A EP92907748 A EP 92907748A EP 92907748 A EP92907748 A EP 92907748A EP 0578699 B1 EP0578699 B1 EP 0578699B1
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- contacting
- electroplating apparatus
- workpieces
- wheels
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- Electroplating devices are known in which plate-shaped workpieces, such as. B. printed circuit boards, are transported in a horizontal pass through an electrolyte, the feed and the cathodic contacting of the workpieces passing through being arranged in pairs along one side of the conveying path in the electrolyte contacting wheels.
- shields extending in the direction of passage are provided with sealing strips resting on the respective workpiece (DE-A-32 36 545).
- the use of a shield cannot completely prevent the electrolyte from accessing the lateral contacting area of the workpieces and the contacting wheels.
- spongy metal deposits occur in the contact area, a rapid deterioration of the rolling contacts and unfavorable layer thickness distributions of the electrodeposited layers or a strong scattering of the layer thickness.
- the contacting wheels have to be removed again and again to remove the unwanted metal deposits, cleaned of the metal deposits and reassembled.
- a galvanizing device for metal strips which are transported in a horizontal pass through an electrolyte, the feed being carried out by rollers arranged in pairs.
- the level of the electrolyte is adjusted so that it lies slightly above the metal strips passing through.
- the upper rolls are designed as contact rolls.
- metallic shields are arranged parallel to the contact rolls, which are at a negative potential that is slightly lower than the negative potential of the contact rolls. This measure results in metal deposits on the shields, while metal deposits on the contact rollers are prevented.
- the invention specified in claim 1 is based on the problem of ensuring reliable and maintenance-friendly cathodic contacting of the workpieces passing through in a galvanizing device for plate-shaped workpieces to be treated in a horizontal pass.
- the invention is based on the finding that when using contacting members rotatably arranged in the electrolyte, such as contacting wheels, undesired metal deposits can be eliminated on the spot by the arrangement of an associated auxiliary cathode against which the contacting members are anodically connected.
- the advantages achieved by the invention are, in particular, that undesired metal deposits on the contacting elements can be automatically removed again during the electroplating operation before the contacting of the workpieces is impaired and thus the layer thickness of the electrodeposited layers is scattered.
- the embodiment according to claim 2 enables a particularly simple contacting of the workpieces which are guided through the electrolyte between the lower contacting wheels and the upper pressure rollers.
- the paired arrangement of lower and upper contacting wheels results in a particularly efficient cathodic contacting of the workpieces passing through.
- the cathode current is fed to both sides of the workpieces, so that a particularly uniform layer thickness distribution can be achieved in the galvanic metal deposition.
- the development according to claim 5 with a contacting roller as the contacting member is particularly suitable for printed circuit boards in which no conductive tracks are to be produced by the galvanic metal deposition, but rather only plated-through holes.
- the driven contacting members also take on the task of a transport device, so that the entire electroplating device is of a particularly simple construction.
- a particularly efficient demetallization results if a lower auxiliary cathode is assigned to the lower contacting wheels. If lower and upper contacting wheels are used, then lower and upper auxiliary cathodes are assigned in a corresponding manner.
- the embodiment according to claim 9 enables demetalization of the contacting elements in a particularly maintenance-friendly manner without simultaneous metal deposition on the associated auxiliary cathode. Removal and cleaning of the auxiliary cathode can thus be completely eliminated.
- demetallization chambers are formed by shields arranged in the electrolyte, which enable optimal demetallization of the contacting elements without impairing the galvanic metal deposition on the workpieces.
- the embodiment according to claim 11 enables a safe Guiding flexible workpieces, such auxiliary guides being particularly suitable for the inner layers of printed circuit boards.
- the sealing of the corresponding shafts and the power supply to these shafts are considerably simplified with the horizontal arrangement of the contacting wheels.
- the horizontal arrangement of the contacting wheels considerably simplifies the formation of demetallization chambers, shields and the like being at least largely dispensed with.
- the embodiment according to claim 13 enables a further improvement in the cathodic contacting of the workpieces.
- the friction that occurs between the contacting wheels and the workpieces always ensures shiny metallic surfaces in the contacting area.
- the embodiment according to claim 14 enables particularly secure guidance of the workpieces passing through, so that, for example, flexible workpieces, such as the inner layers of printed circuit boards, can also be treated.
- the guide wheels then form a main drive for the safe transport of the workpieces through the electrolyte.
- the embodiment according to claim 16 enables a further simplification, in particular without upper contacting wheels.
- the metal deposits on the auxiliary cathode arranged as a strip can be monitored particularly easily.
- the embodiment according to claim 19 enables a one-sided arrangement of the drive of the contacting members. In addition to reducing the drive effort by 50%, this also creates space on the opposite side.
- the development according to claim 20 enables the cathode current to be supplied on one side of the electroplating device, the drive and the supply of the cathode current preferably being arranged on opposite sides of the electroplating device.
- the embodiment according to claim 22 enables particularly high current densities, since when a worm drive is viewed in the direction of passage of the workpieces, particularly short distances between the contacting elements or between the drive shafts can be achieved.
- the development according to claim 23 enables the guiding wheels arranged on the drive shafts to guide the continuous workpieces with little effort, so that, for example, flexible workpieces can also be treated like the inner layers of printed circuit boards.
- the embodiment according to claim 24 ensures a safe transmission of the cathode current through the copper round rod, while the titanium sheath offers reliable protection against corrosion.
- the electrical insulation from the electrolyte is achieved in a particularly simple manner by a shrink tube made of electrically insulating material.
- the contacting rollers enable reliable cathodic contacting of workpieces of different widths, while the cover screen shields the anode regions not directly opposite the workpieces and thus enables a uniform layer thickness distribution of the electrodeposited metal layers. Without this shielding, the protrusion of the anode on the adjacent side of the workpieces passing through would lead to higher current densities and thus to partially higher layer thicknesses of the electrodeposited metal layers.
- the embodiment according to claim 27 enables effective shielding of a lower anode and an upper anode by separate cover plates.
- the embodiment according to claim 28 enables a particularly simple adaptation of the cover panel to the respective width of the workpieces to be treated. According to claim 29, this adaptation can then be further simplified by a cover panel that can be moved transversely to the direction of passage.
- the embodiment according to claim 32 enables with little Effort to accommodate the contacting elements in the assigned demetallization chambers, the walls of which are also used to guide cover panels at the same time.
- the contacting members are composed of at least two roller segments, this enables a particularly simple and stable design of the assigned demetallization chamber.
- a cross bar of the assigned demetallization chamber can then be arranged between two roller segments.
- the development according to claim 38 ensures safe lateral guidance of the workpieces passing through with little effort.
- the covers of the end faces of the contacting wheels can be applied, for example, in the form of paint or by swirl sintering.
- the application of plate-shaped covers according to claim 39 is particularly stable and durable and can also be implemented with little effort.
- FIG. 1 shows a cross section through the left-hand area of a galvanizing device for printed circuit boards Lp, which are transported in a horizontal position and in a horizontal direction of passage by an electrolyte which cannot be identified in more detail.
- This electrolyte is accommodated in a container B1, of which two side wall parts Sw11 and Sw12, a lower end plate Au1 and an upper end plate Ao1, can be seen in FIG. 1 and arranged in layers and connected by screws Sb.
- the lower end plate Au1 which consists for example of titanium, forms a lower anode A1 together with spherical anode material Am.
- the anode material Am is copper balls.
- lower contacting members K1 designed as contacting wheels are provided, each of which is driven via a drive shaft Aw1, a worm wheel Sr1 arranged thereon and a worm Sch1 extending in the direction of passage.
- the drive shafts Aw1 of the lower contacting elements K1 are supported by bushings Bu1 and Bu2 in the side wall parts Sw11 and Sw12, the projecting ends of the drive shafts Aw1 carrying V-ring seals V.
- an upper pressure roller Ar is assigned to each lower contact element K1.
- These upper pressure rollers Ar which are provided with an elastic 0-ring 0 on their circumference, are arranged obliquely in order to ensure safe cathodic contacting and safe transport of the printed circuit boards Lp through the galvanizing device.
- the one against the lower contact organs K1 acting pressure of the pressure rollers Ar is generated in each case by a compression spring Df supported on the upper end plate Ao1 and a pressure piece Ds lying on the axis Ac of this pressure roller Ar.
- the axes Ac are arranged in recesses Ap of the side wall part Sw12, which enable the pressure rollers Ar to move upward to adapt to different thicknesses of the continuous printed circuit boards Lp. Accordingly, an upper shield Aso assigned to the upper pressure rollers Ar is also guided in corresponding slots Sz of the side wall part Sw12 so that it can move in the vertical direction.
- circuit boards Lp are cathodically contacted via the lower contacting members K1, their drive shafts Aw1 and carbon brushes Kb, which are connected to the negative pole of a galvanizing power source GS1.
- the positive pole of this electroplating current source Gs1 is connected to the lower end plate Au1 of the lower anode A1.
- This plate-shaped, for. B. made of stainless steel auxiliary cathodes H1 are connected to the negative pole of a demetallization power source ES1, the positive pole of which is connected to the lower contacting elements K1 via the carbon brushes Kb and the drive shafts Aw1.
- the lower contacting elements K1 are thus connected cathodically with respect to the lower anode A1 and anodically with respect to the associated auxiliary cathodes H1. Accordingly, copper is deposited on the lower contacting members K1 during the electroplating process, this undesirable copper deposit is electrolytically removed again in the demetallization chamber EK1 and is then deposited on the associated auxiliary cathode H1.
- the auxiliary cathodes H1 can then be removed from the demetallization chamber EK1 from time to time via covers D1 which are detachably attached to the side wall part Sw11 and the copper deposits can be removed.
- the decoupling of the lower contacting members K1, which is preferably carried out continuously, enables optimal cathodic contacting of the continuous printed circuit boards Lp, with no significant wear of the lower contacting members K1 being recorded.
- auxiliary guide Hf1 which consists of electrically insulating material and is placed on a lower contacting element K1, is indicated in FIG. 1 by dash-dotted lines.
- FIG. 2 shows the paired arrangement of lower contact elements K1 and upper pressure rollers Ar and the arrangement of auxiliary cathodes H1, which are each assigned to a lower contact element K1.
- Insulating pieces Is arranged between the individual contacting members K1 serve as additional shields which, in addition to the shields As1 already mentioned, separate the demetallization chamber EK1 from the rest of the galvanizing area.
- FIG. 3 shows a cross section corresponding to FIG. 1 through an entire electroplating device, in which the continuous printed circuit boards Lp are guided on both sides between the lower contacting members K1 and the upper pressure rollers Ar. It can be seen that separate electroplating current sources Gs1. On both sides of the continuous path and demetallization current sources ES1 are arranged. The current sources can also be divided into several separate current sources when viewed in the direction of flow. This enables an optimal regulation of the electroplating current during the passage of the printed circuit boards Lp.
- FIG. 4 shows a partial cross section through a second embodiment of an electroplating device according to the invention.
- printed circuit boards Lp are transported in a horizontal position and in the horizontal direction of passage through an electrolyte which is accommodated in a container labeled B2.
- the container B2 is formed by two layered side wall parts Sw21 and Sw22, a lower end plate Au2 and an upper end plate Ao2.
- the lower end plate Au2 together with spherical anode material Am forms a lower anode A21, while the upper end plate Ao2 carries an inert upper anode A22 via holder Ha.
- Lower contacting members K21 and upper contacting members K22 designed as contacting wheels are provided for the transport and for the cathodic contacting of the printed circuit boards Lp.
- the paired lower and upper contacting members K21 and K22 are both driven, the drive being provided via a worm gear Sch2 extending in the direction of travel, a worm wheel Sr21 arranged on the drive shaft Aw21 of the lower contacting member K21 and another on the drive shaft Aw22 of the upper contacting member K22 Wheel R is done.
- the upper contacting members K22 are arranged obliquely and are pressed resiliently against the lower contacting members K21 in a manner not shown in FIG. 4.
- the cathodic contacting of the printed circuit boards Lp takes place via the lower contacting members K21 and independently of this via the upper contact organs K22.
- the drive shafts Aw21 of the lower contacting members K21 are connected to the negative pole of a lower electroplating current source GS21 via carbon brushes (not shown in detail), the positive pole of which is connected to the lower anode A21 via a lower current rail SSu which extends in the direction of passage.
- the drive shafts Aw22 of the upper contacting members K22 are connected to the negative pole of an upper electroplating power source GS22 via carbon brushes (not shown in more detail), the positive pole of which is connected via an upper current rail Sso extending in the direction of passage, the upper connecting plate Ao2 and the holder Ha to the upper one Anode A22 is connected.
- a lower shielding metallization EK21 is formed by a lower shield As21, in which the lower contacting members K21 and the lower auxiliary cathodes H21 assigned to them are located.
- the upper auxiliary cathodes H21 which are fastened in detachable covers D21, are connected to the negative pole of a lower demetallization current source ES21, the positive pole of which is again connected to the drive shafts Aw21 of the lower contacting members K21 via the carbon brushes (not shown).
- an upper shielding chamber EK22 is formed by an upper shielding As22, in which the upper contacting elements K22 and the upper auxiliary cathodes H22 associated therewith are located.
- the upper auxiliary cathodes H22 fastened in detachable covers D22 are connected to the negative pole of an upper demetallization current source Es22, the positive pole of which is again connected to the drive shafts via the carbon brushes (not shown) Aw22 of the upper contact organs K22 are connected.
- auxiliary guides can be placed on the upper contacting members K22, as is indicated in FIG. 4 by an auxiliary guide Hf2.
- the materials in the exemplary embodiment shown in FIG. 4 are copper-coated with titanium for the lower and upper contacting members K21 and K22 with the associated drive shafts Aw21 and Aw22, as well as for the lower busbar Ssu and the upper busbar Sso.
- the lower end plate Au2 and the upper end plate Ao2 are made of titanium, while the inert upper anode A22 is made of platinized titanium.
- the auxiliary cathodes H21 and H22, which can be removed from the respective demetallization chambers EK21 and EK22, are preferably made of stainless steel.
- Parts to be electrically insulated, such as the shields As21 and As22 and the side wall parts Sw21 and Sw22, are made of PVC, for example.
- FIG. 5 shows a highly simplified schematic illustration of a third embodiment of an electroplating device according to the invention.
- the circuit boards Lp to be electroplated are moved here in the direction of passage Dr by an electrolyte which cannot be identified in more detail, the transport and the cahodic contacting being carried out by contacting members K3 driven in the direction of the pillar U.
- These contacting elements K3 are contacting rollers which consist of a copper-clad titanium tube and extend over the entire width of the continuous printed circuit boards Lp.
- the roller-shaped contacting elements K3 are immersed in a demetallization chamber EK3, which is formed by a U-shaped shield As3 and seals Ad lying on the contacting element K3.
- this demetallization chamber EK3 there is a plate-shaped auxiliary cathode H3, to which the contacting element K3 is connected anodically. Undesired metal deposits on the contacting element K3 are thus removed electrolytically again, a membrane M preventing the corresponding metal from being deposited on the auxiliary cathode H3.
- the membrane M is arranged between the contacting element K3 and the auxiliary cathode H3 and is designed as a so-called anion membrane, which is permeable to anions and impermeable to cations.
- Anodes A3 are arranged in the electrolyte on both sides of the demetallization chamber EK3, which anodes A3 are again formed here by spherical anode material Am.
- FIG. 6 shows a cross section through the left area, seen in the direction of passage, of an electroplating device for printed circuit boards Lp, which are transported in a horizontal position and in the horizontal direction of passage by an electrolyte which cannot be identified in more detail.
- This electrolyte is accommodated in a container B4, of which a left side wall Sw4 made of an electrically insulating plastic, a lower end plate Au4 and an upper end plate Ao4 can be seen in FIG.
- the lower end plate Au4 and the upper end plate Ao4 are made of titanium, for example.
- an upper anode basket Ak42 hangs under the upper end plate Ao4, which together with the spherical anode material Am located therein forms an upper anode A42.
- the anode baskets Ak41 and Ak42 are made of expanded titanium, for example, while the anode material Am in the exemplary embodiment shown is copper balls.
- contacting elements K4 are provided, which are designed as horizontally aligned lower contacting wheels.
- the vertically aligned drive shafts Aw4 of the contacting elements K4 are mounted in the side wall Sw4 and are electrically insulated upwards and passed through the upper end plate Ao4.
- the drive of the drive shafts Aw4 is indicated in FIG. 2 by arrows Pf41, while the supply of the cathode current to the drive shaft Aw4 is indicated in FIG. 1 by an arrow Pf42.
- the contacting elements K4 can also be designed such that the thin edge region in which the printed circuit boards Lp rest resiliently presses upwards.
- Lower and upper guide wheels Fr41 and Fr42 arranged in pairs across the width of the printed circuit boards Lp are provided for the transport and safe guidance of the printed circuit boards Lp.
- the lower guide wheels Fr41 are spaced apart on a lower drive shaft Aw41, while the upper guide wheels Fr42 are spaced apart are arranged to each other on an upper drive shaft Aw42.
- An outer upper guide wheel Fr42 is assigned to a contacting element K4 in such a way that the circuit board Lp is pressed against this contacting element K4.
- the drive shafts Aw41 and Aw42 can be carried out via bevel gears or spur gears and a worm.
- the drive shafts Aw41 and Aw42 and the guide wheels Fr41 and Fr42 consist either of electrically insulating material or of metal with an electrically insulating sheathing.
- a demetallization chamber EK4 which extends in the direction of travel Dr (see FIG. 7) of the printed circuit boards Lp and is closed to the outside by a cover D4 in a liquid-tight manner.
- an auxiliary cathode H4 which is formed by a vertically oriented band, which also extends in the direction of passage Dr.
- the contacting members K4 are anodically connected, so that undesired copper deposits on the contacting members K4 in the demetallization chamber EK4 are continuously removed electrolytically and are then deposited on the auxiliary cathode H4.
- the band-shaped auxiliary cathode H4 can then be moved further in the direction of travel Dr if necessary.
- the auxiliary cathode H4 can, for example, be drawn off from a supply roll on one side and be taken up again from a corresponding roll on the other side.
- the contacting elements K4 are seen in the direction of passage Dr preferably arranged on both sides of the continuous circuit boards Lp.
- the cross section shown in FIG. 6 can be supplemented by a right-hand part of the electroplating device which is designed with mirror symmetry.
- FIG. 8 shows a cross section through an electroplating device for through-contacting and electroplating printed circuit boards Lp, which are transported in a horizontal position and in the horizontal direction of passage through an electrolyte which cannot be identified in more detail.
- This electrolyte is accommodated in a container B5, which is formed by a side wall Sw51 arranged on the left in the drawing, a side wall Sw52 arranged on the right, a lower end plate Au5 and an upper end plate Ao5.
- the side walls Sw51 and Sw52 consist of an electrically insulating plastic, such as. B. PVC, while the lower end plate Au5 and the upper end plate Ao5 are made of titanium, for example.
- anode basket Ak51 On the lower end plate Au5 there is a lower anode basket Ak51 which, together with the spherical anode material Am located therein, forms a lower anode A51.
- an upper anode basket Ak52 hangs under the upper end plate Ao5 and, together with the spherical anode material Am located therein, forms an upper anode A52.
- the anode baskets Ak51 and Ak52 are made of expanded titanium, for example, while the anode material Am in the exemplary embodiment shown is copper balls.
- Lower contacting members K51 and upper contacting members K52 are provided for the cathodic contacting of the printed circuit boards Lp, which are formed by lower and upper contacting wheels arranged in pairs on both sides of the continuous printed circuit boards Lp. As can be seen in FIG. 8, lower and upper contacting elements K51 and K52 each the lateral edge area of the continuous circuit boards Lp. Opposing lower contacting members K51 are arranged on a common lower drive shaft Aw51, which is formed by a titanium Ti-coated copper round rod Kr, the electrical insulation from the electrolyte being brought about by an outer shrink tube Ss made of PE or PTFE. Between the two lower contacting members K51 are on the lower drive shaft Aw51 spaced lower guide wheels Fr51, which consist for example of soft PVC.
- the left end of the lower drive shaft Aw51 in the cross section shown is passed through the side wall Sw51, so that the supply of the cathode current to the lower drive shaft Aw51, indicated by an arrow Pf51, can take place outside the galvanizing device.
- a worm wheel Sr5 is placed on the lower drive shaft Aw51, which is driven by a worm gear Sch5 extending in the direction of passage.
- Opposing upper contacting elements K52 are arranged on a common upper drive shaft Aw52, which is formed by a copper round rod Kr coated with titanium Ti, the electrical insulation from the electrolyte again being accomplished here by an outer shrink tube Ss made of PE or PTFE. Between the two upper contacting elements K52 there are upper guide wheels Fr52 which are arranged at a distance from one another on the upper drive shaft Aw52 and which form pairs of wheels with the lower guide wheels Fr51 and again consist, for example, of soft PVC. The left end of the upper drive shaft Aw52 in the cross section shown is passed through the side wall Sw51, so that here too the supply of the cathode current to the upper drive shaft Aw52 indicated by an arrow Pf52 is outside the galvanizing device can take place.
- a gear Zr5 is placed on the upper drive shaft Aw52, which is driven by the worm gear Sr5. It can be seen that this gear Zr5, the worm gear Sr5 and the worm Sch5 are accommodated in a recess Ap5 of the right side wall Sw52.
- Shields As51 and As52 made of electrically insulating material arranged parallel to the side walls Sw51 and Sw52 form, together with corresponding cutouts in the side walls, lower demetallization chambers EK51 and upper demetallization chambers EK52, in which the lower contacting members K51 and the upper contacting members K52 and lower auxiliary cathodes H51 or upper auxiliary cathodes H52 assigned to them.
- the lower and upper auxiliary cathodes H51 and H52 which are made, for example, of stainless steel, the lower and upper contacting elements K51 and K52 are anodically connected.
- Unwanted copper deposits on the lower and upper contacting elements K51 and K52 are thus continuously removed electrolytically in the lower and upper demetallization chambers EK51 and EK52. This ongoing demetallization ensures optimal cathodic contacting of the continuous printed circuit boards Lp.
- FIG. 9 shows a longitudinal section through an electroplating device for through-contacting and electroplating printed circuit boards Lp, which are transported in a horizontal position and in the horizontal direction of passage Dr by an electrolyte which cannot be identified in more detail.
- This electrolyte is accommodated in a container B6, of which a lower end plate Au6 and an upper end plate Ao6 can be seen in FIG.
- the end plates Au6 and Ao6 are made of titanium, for example.
- On The lower end plate Au6 has several lower anode baskets Ak61 which, together with the spherical anode material Am contained therein, form one under anode A61.
- upper anode baskets Ak62 which can be pulled out in the manner of a drawer in the transverse direction, hang in guides Fg under the upper end plate Ao6 and, together with the spherical anode material Am therein, form an upper anode A62.
- the anode baskets Ak61 and Ak62 are made of expanded titanium, for example, while the anode material Am in the illustrated embodiment is copper balls.
- Lower contacting elements K61 and upper contacting elements K62 are provided for the cathodic contacting of the printed circuit boards Lp and are formed by lower and upper contacting rollers arranged in pairs.
- the contacting elements K61 and K62 also simultaneously form a transport device for feeding the printed circuit boards Lp in the direction of passage Dr.
- Double arrows Pf6 indicate that the upper contacting elements K62 press resiliently against the lower contacting elements K61 and this also enables adaptation to different thicknesses of the continuous printed circuit boards Lp.
- the lower contacting elements K61 are arranged in U-shaped demetallization chambers EK61, in which there are also lower auxiliary cathodes H61.
- the upper contacting members K62 are arranged in U-shaped demetalization chambers EK62, in which there are also upper auxiliary cathodes H62.
- the lower and upper contacting elements K61 and K62 are anodically connected. Unwanted copper deposits on the lower and upper contacting elements K61 and K62 are thus continuously removed electrolytically in the lower and upper demetallization chambers EK61 and EK62. This ongoing demetallization ensures optimal cathodic contacting of the continuous printed circuit boards Lp.
- the lower contacting members K61 which are designed as contacting rollers, are composed of a plurality of roller segments Ws 61, viewed in the transverse direction Qr.
- the demetallization chambers EK61 can then be stiffened by transverse webs Qs61 between two adjacent roller segments Ws61.
- the upper contacting members K62 which can only be seen in FIG. 9, are correspondingly composed of roller segments Ws62, so that the upper demetalization chambers EK62 can be stiffened by crossbars Qs62.
- the width of the contacting elements K61 and K62 is matched to printed circuit boards Lp with a maximum width b60, the passage of which between the lower anode A61 and the upper anode A62 can be seen from FIG. If, according to FIG. 12, circuit boards Lp with a smaller width B61 are to be galvanized, their transport in the direction of passage Dr and their cathodic contacting between the lower and upper contacting members K61 and K62 pose no difficulties. So that these printed circuit boards Lp do not run away in the transverse direction Qr during the passage, auxiliary guides Hf6 are provided which, according to FIG. 9, are formed by lower and upper pressure wheels Ar61 and Ar62 arranged in pairs. Those indicated by crosses in FIG.
- Axes Ac61 and Ac62 of the lower and upper pressure wheels Ar61 and Ar62 are arranged at an angle to the transverse direction Qr, ie they are not exactly perpendicular to the plane of the drawing.
- This adjustment of the axes Ac61 and Ac62 in the direction of travel Dr by an angle of attack of, for example, 2 ° causes the pressure wheels Ar61 and Ar62 to exert a force acting outwards in the transverse direction Qr on the printed circuit boards Lp and thereby ensure reliable guidance of the continuous circuit boards Lp.
- cover panels AB61 and AB62 made of an electrically insulating material is matched to the width b61 of the circuit boards Lp running through here.
- these cover panels AB61 and AB62 are guided in the transverse grooves Qr in outer grooves N6 of the demetallization chambers EK61 and EK62.
- the adjustment of the width of the cover panels AB61 and AB62 can be accomplished, for example, by a bellows-shaped configuration or by an overlapping arrangement of several plates.
- Figures 13 to 15 show measures to prevent metal deposits on the end faces of contacting wheels and on the associated drive shafts.
- Corresponding contacting wheels can be used, for example, in the galvanizing devices shown in FIGS. 1, 4, 6 and 8.
- Figure 13 shows an upper contact wheel K72, which is placed on a drive shaft Aw72 and welded to it.
- a cover Abd720 is applied to the end face of the upper contacting wheel K72 facing away from the drive shaft Aw72, while an annular cover Abd721 is applied to the end face on the shaft side.
- the shaft-side cover Abd721 is connected in one piece to a hollow-cylindrical cover Abd 722 attached to the drive shaft Aw72.
- the cross-section of the upper contacting wheel K72 which is mushroom-shaped in cross section, projects beyond the remaining wheel area, so that the covers Abd720 and Abd721 can be pressed into the corresponding cylindrical projection.
- the outer end of the drive shaft Aw72 is provided with a threaded hole GB72, into which a contacting end piece KE72 is screwed.
- the KE72 contact end piece can thus be easily replaced after it has been worn out.
- the upper contact wheel K72, the drive shaft Aw72 and the contact end piece KE72 are made of corrosion-resistant titanium, while the covers Abd720, Abd721 and Abd722 are made of high-molecular polyethylene, which is characterized by its good sliding properties.
- the KE72 contact end piece is subjected to nitriding to reduce wear, forming a surface layer of titanium nitride (TiN).
- Figure 15 shows a lower contact wheel K71, which is placed on a drive shaft Aw71 and welded to it.
- a cover Abd710 is applied to the end face of the lower contacting wheel K71 facing away from the drive shaft Aw71, while an annular cover Abd711 is applied to the end face on the shaft side.
- a hollow cylindrical cover Abd712 is applied to the drive shaft Aw71, which has a guide collar Fb71 which projects beyond the lower contact wheel K71 in the radial direction and bears against the cover Abd711 in the axial direction.
- the guide collars Fb71 of the lower contacting wheels K71 enable the continuous circuit boards to be guided securely.
- the outer end of the drive shaft Aw71 is provided with a threaded hole Gb71 into which a contacting end piece KE71 is screwed.
- the lower contacting wheel K71, the drive shaft Aw71 and the contacting end piece KE71 are made of corrosion-resistant titanium, while the covers Abd710, Abd711 and Abd712 consist of high-molecular polyethylene.
- the surface layer of the KE71 contact end pieces consists of titanium nitride.
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Abstract
Description
Es sind Galvanisiereinrichtungen bekannt, bei welchen plattenförmige Werkstücke, wie z. B. Leiterplatten, im horizontalen Durchlauf durch einen Elektrolyten transportiert werden, wobei der Vorschub und die kathodische Kontaktierung der durchlaufenden Werkstücke durch paarweise entlang einer Seite des Förderweges im Elektrolyten angeordnete Kontaktierräder vorgenommen wird. Zum Schutz der Kontaktierräder vor dem Elektrolyten sind sich in Durchlaufrichtung erstreckende Abschirmungen mit an dem jeweiligen Werkstück anliegenden Dichtleisten vorgesehen (DE-A-32 36 545).Electroplating devices are known in which plate-shaped workpieces, such as. B. printed circuit boards, are transported in a horizontal pass through an electrolyte, the feed and the cathodic contacting of the workpieces passing through being arranged in pairs along one side of the conveying path in the electrolyte contacting wheels. To protect the contacting wheels from the electrolyte, shields extending in the direction of passage are provided with sealing strips resting on the respective workpiece (DE-A-32 36 545).
Bei der vorstehend geschilderten Galvanisiereinrichtung kann auch die Verwendung einer Abschirmung den Zutritt des Elektrolyten zum seitlichen Kontaktierungsbereich der Werkstücke und zu den Kontaktierrädern nicht vollständig verhindern. Als Folge dieser unvollständigen Abschirmung kommt es zu schwammigen Metallabscheidungen im Kontaktierbereich, zu einer rapiden Verschlechterung der Rollkontakte und zu ungünstigen Schichtdickenverteilungen der galvanisch abgeschiedenen Schichten bzw. zu einer starken Streuung der Schichtdicke. Außerdem müssen die Kontaktierräder zur Entfernung der unerwünschten Metallabscheidungen immer wieder ausgebaut, von den Metallabscheidungen gesäubert und erneut montiert werden.In the case of the electroplating device described above, the use of a shield cannot completely prevent the electrolyte from accessing the lateral contacting area of the workpieces and the contacting wheels. As a result of this incomplete shielding, spongy metal deposits occur in the contact area, a rapid deterioration of the rolling contacts and unfavorable layer thickness distributions of the electrodeposited layers or a strong scattering of the layer thickness. In addition, the contacting wheels have to be removed again and again to remove the unwanted metal deposits, cleaned of the metal deposits and reassembled.
Im Hinblick auf die geschilderten Nachteile einer Rollkontaktierung der Werkstücke wurde auch bereits vorgeschlagen, bei derartigen Galvanisiereinrichtungen als Kontaktier- und Transportmittel eine endlos umlaufende, angetriebene Reihe einzelner Klemmorgane vorzusehen, welche die Seitenränder der plattenförmigen Werkstücke festhalten und in der Transportrichtung bewegen. Zu Beginn und Ende des Transportweges durch den Elektrolyten sind hierbei Mittel erforderlich, die ein Erfassen der plattenförmigen Werkstücke durch die Klemmorgane bzw. das Freigeben der plattenförmigen Werkstücke durch die Klemmorgane bewirken. Bei dieser Lösung können unerwünschte Metallabscheidungen auf den endlos umlaufenden Klemmorganen außerhalb der Galvanisierzelle in einer separaten Entmetallisierungs-Kammer auf elektrolytischem Wege wieder abgetragen werden.With regard to the described disadvantages of rolling contacting of the workpieces, it has also already been proposed to use an endlessly rotating, driven means for such galvanizing devices as contacting and transporting means To provide a series of individual clamping members that hold the side edges of the plate-shaped workpieces and move in the transport direction. At the beginning and end of the transport path through the electrolyte, means are required which cause the plate-shaped workpieces to be gripped by the clamping elements or the plate-shaped workpieces to be released by the clamping elements. With this solution, undesired metal deposits on the endlessly rotating clamping elements outside the electroplating cell can be removed electrolytically in a separate demetallization chamber.
Aus der US-A-3 729 390 ist eine Galvanisiereinrichtung für Metallbänder bekannt, die im horizontalen Durchlauf durch einen Elektrolyten transportiert werden, wobei der Vorschub durch paarweise angeordnete Walzen vorgenommen wird. Das Niveau des Elektrolyten wird dabei so eingestellt, daß es geringfügig über den durchlaufenden Metallbändern liegt. Zur kathodischen Kontaktierung der Metallbänder sind jeweils die oberen Walzen als Kontaktierwalzen ausgebildet. Oberhalb der durchlaufenden Metallbänder sind jeweils parallel zu den Kontaktierwalzen metallische Abschirmungen angeordnet, die auf einem negativen Potential liegen, das geringfügig niedriger ist als das negative Potential der Kontaktierwalzen. Durch diese Maßnahme erfolgen Metallabscheidungen auf den Abschirmungen, während Metallabscheidungen auf den Kontaktierwalzen verhindert werden.From US-A-3 729 390 a galvanizing device is known for metal strips which are transported in a horizontal pass through an electrolyte, the feed being carried out by rollers arranged in pairs. The level of the electrolyte is adjusted so that it lies slightly above the metal strips passing through. For the cathodic contacting of the metal strips, the upper rolls are designed as contact rolls. Above the continuous metal strips, metallic shields are arranged parallel to the contact rolls, which are at a negative potential that is slightly lower than the negative potential of the contact rolls. This measure results in metal deposits on the shields, while metal deposits on the contact rollers are prevented.
Aus "PATENT ABSTRACTS OF JAPAN", Vol. 13, Number 423 (C-638) (3771) September 30, 1989, ist eine ähnlich aufgebaute Galvanisiereinrichtung für Metallbänder bekannt, bei welcher Metallabscheidungen auf den Kontaktierwalzen von Zeit zu Zeit elektrolytisch wieder abgetragen werden. Dieser elektrolytische Abtrag erfolgt über entsprechend gepolte Elektroden, die in Längsrichtung der Kontaktierwalzen hin- und herbewegt werden.From "PATENT ABSTRACTS OF JAPAN", vol. 13, number 423 (C-638) (3771) September 30, 1989, a similarly constructed electroplating device for metal strips is known, in which metal deposits on the contact rollers are removed electrolytically from time to time . This electrolytic removal takes place via appropriately polarized electrodes, which run in the longitudinal direction of the contact rollers be moved back and forth.
Der im Anspruch 1 angegebenen Erfindung liegt das Problem zugrunde, bei einer Galvanisiereinrichtung für im horizontalen Durchlauf zu behandelnde plattenförmige Werkstücke mit einfachen Mitteln eine zuverlässige und wartungsfreundliche kathodische Kontaktierung der durchlaufenden Werkstücke zu gewährleisten.The invention specified in claim 1 is based on the problem of ensuring reliable and maintenance-friendly cathodic contacting of the workpieces passing through in a galvanizing device for plate-shaped workpieces to be treated in a horizontal pass.
Der Erfindung liegt die Erkenntnis zugrunde, daß bei der Verwendung von drehbar im Elektrolyten angeordneten Kontaktierorganen, wie Kontaktierrädern, unerwünschte Metallabscheidungen an Ort und Stelle durch die Anordnung einer zugeordneten Hilfskathode beseitigt werden können, gegenüber der die Kontaktierorgane anodisch geschaltet sind. Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß unerwünschte Metallabscheidungen auf den Kontaktierorganen während des Galvanisierbetriebes selbsttätig laufend wieder entfernt werden können, bevor es zu einer Beeinträchtigung der Kontaktierung der Werkstücke und damit zu einer Streuung der Schichtdicke der galvanisch abgeschiedenen Schichten kommt.The invention is based on the finding that when using contacting members rotatably arranged in the electrolyte, such as contacting wheels, undesired metal deposits can be eliminated on the spot by the arrangement of an associated auxiliary cathode against which the contacting members are anodically connected. The advantages achieved by the invention are, in particular, that undesired metal deposits on the contacting elements can be automatically removed again during the electroplating operation before the contacting of the workpieces is impaired and thus the layer thickness of the electrodeposited layers is scattered.
Vorteilhafte Ausgestaltungen der Erfindung sind in den Ansprüchen 2 bis 42 angegeben.Advantageous embodiments of the invention are specified in claims 2 to 42.
Die Ausgestaltung nach Anspruch 2 ermöglicht eine besonders einfach aufgebaute Kontaktierung der Werkstücke, die zwischen unteren Kontaktierrädern und oberen Andruckrollen durch den Elektrolyten geführt werden.The embodiment according to claim 2 enables a particularly simple contacting of the workpieces which are guided through the electrolyte between the lower contacting wheels and the upper pressure rollers.
Bei der Ausgestaltung nach Anspruch 3 ergibt sich durch die paarweise Anordnung von unteren und oberen Kontaktierrädern eine besonders effiziente kathodische Kontaktierung der durchlaufenden Werkstücke.In the embodiment according to
Bei der Ausgestaltung gemäß Anspruch 4 wird der Kathodenstrom beiden Seiten der Werkstücke zugeführt, so daß bei der galvanischen Metallabscheidung eine besonders gleichmäßige Schichtdickenverteilung erzielt werden kann.In the embodiment according to
Die Weiterbildung gemäß Anspruch 5 mit einer Kontaktierwalze als Kontaktierorgan ist insbesondere für Leiterplatten geeignet, bei welchen durch die galvanische Metallabscheidung keine Leiterbahnen, sondern nur Durchkontaktierungen erzeugt werden sollen.The development according to
Bei der Ausgestaltung gemäß Anspruch 6 übernehmen die angetriebenen Kontaktierorgane auch die Aufgabe einer Transporteinrichtung, so daß sich ein besonders einfacher Aufbau der gesamten Galvanisiereinrichtung ergibt.In the embodiment according to
Gemäß Anspruch 7 ergibt sich eine besonders effiziente Entmetallisierung, wenn unteren Kontaktierrädern eine untere Hilfskathode zugeordnet ist. Bei Verwendung von unteren und oberen Kontaktierrädern sind diesen dann in entsprechender Weise gemäß Anspruch 8 untere bzw. obere Hilfskathoden zugeordnet.According to claim 7, a particularly efficient demetallization results if a lower auxiliary cathode is assigned to the lower contacting wheels. If lower and upper contacting wheels are used, then lower and upper auxiliary cathodes are assigned in a corresponding manner.
Die Ausgestaltung gemäß Anspruch 9 ermöglicht in besonders wartungsfreundlicher Weise eine Entmetallisierung der Kontaktierorgane ohne gleichzeitige Metallabscheidung auf der zugeordneten Hilfskathode. Eine Entfernung und Reinigung der Hilfskathode kann damit völlig entfallen.The embodiment according to claim 9 enables demetalization of the contacting elements in a particularly maintenance-friendly manner without simultaneous metal deposition on the associated auxiliary cathode. Removal and cleaning of the auxiliary cathode can thus be completely eliminated.
Gemäß Anspruch 10 werden durch im Elektrolyten angeordnete Abschirmungen Entmetallisierungs-Kammern gebildet, welche eine optimale Entmetallisierung der Kontaktierorgane ohne Beeinträchtigung der galvanischen Metallabscheidung auf den Werkstücken ermöglichen.According to claim 10, demetallization chambers are formed by shields arranged in the electrolyte, which enable optimal demetallization of the contacting elements without impairing the galvanic metal deposition on the workpieces.
Die Ausgestaltung gemäß Anspruch 11 ermöglicht eine sichere Führung flexibler Werkstücke, wobei derartige Hilfsführungen insbesondere für die Innenlagen von Leiterplatten geeignet sind.The embodiment according to
Bei der Ausgestaltung gemäß Anspruch 12 wird mit der horizontalen Anordnung der Kontaktierräder die Abdichtung der entsprechenden Wellen und die Stromzufuhr zu diesen Wellen wesentlich vereinfacht. Außerdem wird durch die horizontale Anordnung der Kontaktierräder die Bildung von Entmetallisierungs-Kammern wesentlich vereinfacht, wobei Abschirmungen und dgl. zumindest weitgehend entfallen können.In the embodiment according to claim 12, the sealing of the corresponding shafts and the power supply to these shafts are considerably simplified with the horizontal arrangement of the contacting wheels. In addition, the horizontal arrangement of the contacting wheels considerably simplifies the formation of demetallization chambers, shields and the like being at least largely dispensed with.
Die Ausgestaltung nach Anspruch 13 ermöglicht eine weitere Verbesserung der kathodischen Kontaktierung der Werkstücke. Bei den angetriebenen, horizontal ausgerichteten Kontaktierrädern sorgt die zwischen den Kontaktierrädern und den Werkstücken auftretende Reibung stets für metallisch blanke Flächen im Kontaktierbereich.The embodiment according to claim 13 enables a further improvement in the cathodic contacting of the workpieces. In the case of the driven, horizontally aligned contacting wheels, the friction that occurs between the contacting wheels and the workpieces always ensures shiny metallic surfaces in the contacting area.
Die Ausgestaltung nach Anspruch 14 ermöglicht eine besonders sichere Führung der durchlaufenden Werkstücke, so daß beispielsweise auch flexible Werkstücke, wie die Innenlagen von Leiterplatten, behandelt werden können.The embodiment according to claim 14 enables particularly secure guidance of the workpieces passing through, so that, for example, flexible workpieces, such as the inner layers of printed circuit boards, can also be treated.
Bei der Ausgestaltung nach Anspruch 15 bilden die Führungsräder dann einen Hauptantrieb für den sicheren Transport der Werkstücke durch den Elektrolyten.In the embodiment according to claim 15, the guide wheels then form a main drive for the safe transport of the workpieces through the electrolyte.
Die Ausgestaltung nach Anspruch 16 ermöglicht eine weitere Vereinfachung, wobei insbesondere auf obere Kontaktierräder verzichtet wird.The embodiment according to claim 16 enables a further simplification, in particular without upper contacting wheels.
Bei der Weiterbildung nach Anspruch 17 können die Metallniederschläge auf der als Band angeordneten Hilfskathode besonders einfach überwacht werden.In the development according to claim 17, the metal deposits on the auxiliary cathode arranged as a strip can be monitored particularly easily.
Bei der Ausgestaltung gemäß Anspruch 18 werden durch die gemeinsamen unteren und oberen Antriebswellen im Hinblick auf die Zufuhr des Kathodenstroms, auf den Antrieb der Kontaktierorgane und auf die Führung der Werkstücke gleich eine Reihe von baulichen Vereinfachungen ermöglicht wird.In the embodiment according to claim 18, a number of structural simplifications are made possible by the common lower and upper drive shafts with regard to the supply of the cathode current, the drive of the contacting members and the guidance of the workpieces.
Die Ausgestaltung nach Anspruch 19 ermöglicht eine einseitige Anordnung des Antriebs der Kontaktierorgane. Neben der Reduzierung des Aufwands für den Antrieb um 50 % wird hierdurch auch noch auf der gegenüberliegenden Seite Platz geschaffen. Die Weiterbildung nach Anspruch 20 ermöglicht eine Zufuhr des Kathodenstroms auf der einen Seite der Galvanisiereinrichtung, wobei gemäß Anspruch 21 der Antrieb und die Zufuhr des Kathodenstroms vorzugsweise auf gegenüberliegenden Seiten der Galvanisiereinrichtung angeordnet sind.The embodiment according to claim 19 enables a one-sided arrangement of the drive of the contacting members. In addition to reducing the drive effort by 50%, this also creates space on the opposite side. The development according to
Die Ausgestaltung nach Anspruch 22 ermöglicht besonders hohe Stromdichten, da bei einem Schneckenantrieb in Durchlaufrichtung der Werkstücke gesehen besonders kurze Abstände zwischen den Kontaktierorganen bzw. zwischen den Antriebswellen realisiert werden können.The embodiment according to
Die Weiterbildung nach Anspruch 23 ermöglicht durch die auf den Antriebswellen angeordneten Führungsräder mit geringem Aufwand eine sichere Führung der durchlaufenden Werkstücke, so daß beispielsweise auch flexible Werkstücke wie die Innenlagen von Leiterplatten behandelt werden können.The development according to claim 23 enables the guiding wheels arranged on the drive shafts to guide the continuous workpieces with little effort, so that, for example, flexible workpieces can also be treated like the inner layers of printed circuit boards.
Die Ausgestaltung nach Anspruch 24 gewährleistet durch den Kupferrundstab eine sichere Übertragung des Kathodenstroms, während die Titanummantelung einen sicheren Schutz gegen Korrosion bietet. Gemäß Anspruch 25 wird die elektrische Isolierung gegenüber dem Elektrolyten dabei auf besonders einfache Weise durch einen Schrumpfschlauch aus elektrisch isolierendem Material erreicht.The embodiment according to claim 24 ensures a safe transmission of the cathode current through the copper round rod, while the titanium sheath offers reliable protection against corrosion. According to claim 25, the electrical insulation from the electrolyte is achieved in a particularly simple manner by a shrink tube made of electrically insulating material.
Die mit der Ausgestaltung gemäß Anspruch 26 erzielten Vorteile bestehen insbesondere darin, daß die Kontaktierwalzen eine sichere kathodische Kontaktierung unterschiedlich breiter Werkstücke ermöglichen, während die Abdeck-Blende die nicht den Werkstücken unmittelbar gegenüberliegenden Anodenbereiche abschirmt und damit eine gleichmäßige Schichtdickenverteilung der galvanisch abgeschiedenen Metallschichten ermöglicht. Ohne diese Abschirmung würde der Überstand der Anode auf der benachbarten Seite der durchlaufenden Werkstücke zu höheren Stromdichten und damit zu partiell höheren Schichtdicken der galvanisch abgeschiedenen Metallschichten führen.The advantages achieved with the embodiment according to claim 26 consist in particular in that the contacting rollers enable reliable cathodic contacting of workpieces of different widths, while the cover screen shields the anode regions not directly opposite the workpieces and thus enables a uniform layer thickness distribution of the electrodeposited metal layers. Without this shielding, the protrusion of the anode on the adjacent side of the workpieces passing through would lead to higher current densities and thus to partially higher layer thicknesses of the electrodeposited metal layers.
Die Ausgestaltung nach Anspruch 27 ermöglicht eine effektive Abschirmung einer unteren Anode und einer oberen Anode durch separate Abdeck-Blenden.The embodiment according to claim 27 enables effective shielding of a lower anode and an upper anode by separate cover plates.
Die Ausgestaltung nach Anspruch 28 ermöglicht eine besonders einfache Anpassung der Abdeck-Blende an die jeweilige Breite der zu behandelnden Werkstücke. Gemäß Anspruch 29 kann dann diese Anpassung durch eine quer zur Durchlaufrichtung verschiebbare Abdeck-Blende noch weiter vereinfacht werden.The embodiment according to claim 28 enables a particularly simple adaptation of the cover panel to the respective width of the workpieces to be treated. According to claim 29, this adaptation can then be further simplified by a cover panel that can be moved transversely to the direction of passage.
Die Weiterbildung nach Anspruch 30 gewährleistet eine sichere Führung von Werkstücken geringerer Breite. Gemäß Anspruch 31 kann diese sichere Führung der durchlaufenden Werkstücke durch paarweise angeordnete untere und obere Andruckräder, deren Achsen zur Querrichtung schräg angestellt sind, auf besonders einfache Weise realisiert werden.The development according to claim 30 ensures secure guidance of workpieces of smaller width. According to claim 31, this safe guidance of the continuous workpieces can be realized in a particularly simple manner by means of lower and upper pressure wheels arranged in pairs, the axes of which are inclined to the transverse direction.
Die Ausgestaltung nach Anspruch 32 ermöglicht mit geringem Aufwand die Unterbringung der Kontaktierorgane in den zugeordneten Entmetallisierungs-Kammern, deren Wandungen gleichzeitig auch noch zur Führung von Abdeck-Blenden herangezogen werden.The embodiment according to claim 32 enables with little Effort to accommodate the contacting elements in the assigned demetallization chambers, the walls of which are also used to guide cover panels at the same time.
Sind die Kontaktierorgane gemäß Anspruch 33 in Querrichtung gesehen aus mindestens zwei Walzensegmenten zusammengesetzt, so wird hierdurch eine besonders einfache und stabile Ausführung der zugeordneten Entmetallisierungs-Kammer ermöglicht. Insbesondere kann dann gemäß Anspruch 34 jeweils zwischen zwei Walzensegmenten ein Quersteg der zugeordneten Entmetallisierungs-Kammer angeordnet werden.If, in the transverse direction, the contacting members are composed of at least two roller segments, this enables a particularly simple and stable design of the assigned demetallization chamber. In particular, a cross bar of the assigned demetallization chamber can then be arranged between two roller segments.
Die mit der Ausgestaltung gemäß Anspruch 35 erzielten Vorteile bestehen insbesondere darin, daß die mit geringem Aufwand auf die Stirnseiten der Kontaktierräder aufgebrachten Abdeckungen einerseits die kathodische Kontaktierung der durchlaufenden Werkstücke nicht beeinträchtigen und andererseits unerwünschte Metallniederschläge auf den Stirnseiten mit Sicherheit verhindern.The advantages achieved with the configuration according to claim 35 consist in particular in that the covers which are applied to the end faces of the contacting wheels with little effort on the one hand do not impair the cathodic contacting of the workpieces passing through and on the other hand reliably prevent undesirable metal deposits on the end faces.
Die Weiterbildung nach Anspruch 36 bietet einen sicheren Schutz beider Stirnseiten eines Kontaktierrades vor unerwünschten Metallniederschlägen. Durch die Ausgestaltung nach Anspruch 37 kann dieser Schutz dann auch auf die Antriebswellen der Kontaktierräder ausgedehnt werden.The development according to claim 36 offers reliable protection of both end faces of a contact wheel against undesirable metal precipitation. This protection can then be extended to the drive shafts of the contacting wheels by the configuration according to claim 37.
Die Weiterbildung nach Anspruch 38 gewährleistet mit geringem Aufwand eine sichere seitliche Führung der durchlaufenden Werkstücke.The development according to claim 38 ensures safe lateral guidance of the workpieces passing through with little effort.
Die Abdeckungen der Stirnseiten der Kontaktierräder können beispielsweise in Form von Farbe oder durch Wirbelsintern aufgebracht werden. Die Aufbringung plattenförmiger Abdeckungen gemäß Anspruch 39 ist jedoch besonders stabil und dauerhaft und außerdem mit geringem Aufwand realisierbar.The covers of the end faces of the contacting wheels can be applied, for example, in the form of paint or by swirl sintering. The application of plate-shaped covers according to claim 39, however, is particularly stable and durable and can also be implemented with little effort.
Die Weiterbildung nach Anspruch 40 bietet die Möglichkeit, an den Stirnseiten zusätzliche Abschirmungen anliegen zu lassen, da sich insbesondere hochmolekulares Polyethylen durch seine guten Gleiteigenschaften auszeichnet.The development according to claim 40 offers the possibility of having additional shields applied to the end faces, since high molecular weight polyethylene in particular is distinguished by its good sliding properties.
Die Ausgestaltung nach den Ansprüchen 41 und 42 gewährleistet eine hohe Korrosionsbeständigkeit der Kontaktierräder bzw. der Antriebswellen der Kontaktierräder.The design according to
Ausführungsbeispiele der Erfindung sind in der Zeichnung dargestellt und werden im folgenden näher beschrieben.Embodiments of the invention are shown in the drawing and are described in more detail below.
Es zeigen:
- Figur 1 einen teilweisen Querschnitt durch eine Galvanisiereinrichtung zum Durchkontaktieren und Galvanisieren von Leiterplatten mit dem Grundprinzip der elektrolytischen Entmetallisierung von Kontaktierrädern,
- Figur 2 einen teilweisen Längsschnitt durch die Galvanisiereinrichtung gemäß Fig. 1 im Bereich der Kontaktierräder und der zugeordneten Hilfskathoden,
Figur 3 eine entsprechend den Fig. 1 und 2 aufgebaute Galvanisiereinrichtung mit einer beidseitigen Kontaktierung der durchlaufenden Leiterplatten,Figur 4 einen teilweisen Querschnitt durch eine zweite Ausführungsform einer erfindungsgemäßen Galvanisiereinrichtung, bei welcher paarweise angeordnete untere und obere Kontaktierräder verwendet werden undFigur 5 eine dritte Ausführungsform einer erfindungsgemäßen Galvanisiereinrichtung, bei welcher die kathodische Kontaktierung der Werkstücke über Kontaktierwalzen erfolgt.Figur 6 einen teilweisen Querschnitt durch eine vierte Ausführungsform einer erfindungsgemäßen Galvanisiereinrichtung, bei welcher horizontal angeordnete untere Kontaktierräder verwendet werden,- Figur 7 eine Draufsicht auf den Kontaktierbereich von Kontaktierorganen und durchlaufender Leiterplatte der in
Figur 6 dargestellten Galvanisiereinrichtung, - Figur 8 einen Querschnitt durch eine fünfte Ausführungsform einer erfindungsgemäßen Galvanisiereinrichtung,
- Figur 9 einen Längsschnitt durch eine sechste Ausführungsform einer erfindungsgemäßen Galvanisiereinrichtung zum Durchkontaktieren und Galvanisieren von Leiterplatten unterschiedlicher Breite,
- Figur 10 eine aus mehreren Walzensegmenten zusammengesetzte Kontaktierwalze der in Figur 9 dargestellten Galvanisiereinrichtung,
Figur 11 den Durchlauf einer Leiterplatte maximaler Breite zwischen einer unteren und einer oberen Anode der in Fig. 9 dargestellten Galvanisiereinrichtung,- Figur 12 den Durchlauf einer Leiterplatte geringerer Breite zwischen einer unteren und einer oberen Anode der in Fig. 9 dargestellten Galvanisiereinrichtung,
- Figur 13 einen halbseitigen Längsschnitt durch ein oberes Kontaktierrad und dessen Antriebswelle,
- Figur 14 im Detail einen Längsschnitt durch den Umfangsbereich des in Figur 13 dargestellten Kontaktierrades und
- Figur 15 einen halbseitigen Längsschnitt durch ein unteres Kontaktierrad und dessen Antriebswelle.
- FIG. 1 shows a partial cross section through a galvanizing device for through-contacting and galvanizing printed circuit boards with the basic principle of electrolytic demetallization of contacting wheels,
- FIG. 2 shows a partial longitudinal section through the electroplating device according to FIG. 1 in the region of the contacting wheels and the associated auxiliary cathodes,
- 3 shows a galvanizing device constructed in accordance with FIGS. 1 and 2 with contacting of the continuous printed circuit boards on both sides,
- Figure 4 is a partial cross section through a second embodiment of an electroplating device according to the invention, in which paired lower and upper contacting wheels are used and
- Figure 5 shows a third embodiment of an electroplating device according to the invention, in which the cathodic contacting of the workpieces takes place via contacting rollers.
- FIG. 6 shows a partial cross section through a fourth embodiment of an electroplating device according to the invention, in which horizontally arranged lower contact wheels are used,
- FIG. 7 shows a top view of the contacting area of contacting members and continuous circuit board of the galvanizing device shown in FIG. 6,
- FIG. 8 shows a cross section through a fifth embodiment of an electroplating device according to the invention,
- FIG. 9 shows a longitudinal section through a sixth embodiment of an electroplating device according to the invention for through-plating and electroplating printed circuit boards of different widths,
- FIG. 10 shows a contacting roller composed of a plurality of roller segments of the galvanizing device shown in FIG. 9,
- 11 shows the passage of a printed circuit board of maximum width between a lower and an upper anode of the electroplating device shown in FIG. 9,
- 12 shows the passage of a printed circuit board of smaller width between a lower and an upper anode of the electroplating device shown in FIG. 9,
- FIG. 13 shows a half-sided longitudinal section through an upper contact wheel and its drive shaft,
- FIG. 14 shows in detail a longitudinal section through the peripheral region of the contacting wheel shown in FIG. 13 and
- 15 shows a half-sided longitudinal section through a lower contact wheel and its drive shaft.
Figur 1 zeigt einen Querschnitt durch den in Durchlaufrichtung gesehen linken Bereich einer Galvanisiereinrichtung für Leiterplatten Lp, die in horizontaler Lage und in horizontaler Durchlaufrichtung durch einen nicht näher erkennbaren Elektrolyten transportiert werden. Die Unterbringung dieses Elektrolyten erfolgt in einem Behälter B1, von welchem in Fig. 1 zwei schichtförmig angeordnete und durch Schrauben Sb miteinander verbundene Seitenwandteile Sw11 und Sw12, eine untere Abschlußplatte Au1 und eine obere Abschlußplatte Ao1 zu erkennen sind. Die untere Abschlußplatte Au1, die beispielsweise aus Titan besteht, bildet zusammen mit kugelförmigem Anodenmaterial Am eine untere Anode A1. Im dargestellten Ausführungsbeispiel handelt es sich bei dem Anodenmaterial Am um Kupferkugeln.FIG. 1 shows a cross section through the left-hand area of a galvanizing device for printed circuit boards Lp, which are transported in a horizontal position and in a horizontal direction of passage by an electrolyte which cannot be identified in more detail. This electrolyte is accommodated in a container B1, of which two side wall parts Sw11 and Sw12, a lower end plate Au1 and an upper end plate Ao1, can be seen in FIG. 1 and arranged in layers and connected by screws Sb. The lower end plate Au1, which consists for example of titanium, forms a lower anode A1 together with spherical anode material Am. In the illustrated embodiment, the anode material Am is copper balls.
Für den Transport und für die kathodische Kontaktierung der Leiterplatten Lp sind als Kontaktierräder ausgebildete untere Kontaktierorgane K1 vorgesehen, die jeweils über eine Antriebswelle Aw1, ein darauf angeordnetes Schneckenrad Sr1 und eine sich in Durchlaufrichtung erstreckende Schnecke Sch1 angetrieben sind. Die Antriebswellen Aw1 der unteren Kontaktierorgane K1 sind über Büchsen Bu1 und Bu2 in den Seitenwandteilen Sw11 und Sw12 gelagert, wobei die nach außen überstehenden Enden der Antriebswellen Aw1 V-Ringabdichtungen V tragen. Wie es insbesondere aus Fig. 2 ersichtlich ist, ist jedem unteren Kontaktierorgan K1 eine obere Andruckrolle Ar zugeordnet. Diese an ihrem Umfang mit einem elastischen 0-Ring 0 versehenen oberen Andruckrollen Ar sind schräg angeordnet, um hierdurch eine sichere kathodische Kontaktierung und einen sicheren Transport der Leiterplatten Lp durch die Galvanisiereinrichtung zu gewährleisten. Der gegen die unteren Kontaktierorgane K1 wirkende Druck der Andruckrollen Ar wird jeweils durch eine an der oberen Abschlußplatte Ao1 abgestützte Druckfeder Df und ein an der Achse Ac dieser Andruckrolle Ar anliegendes Druckstück Ds erzeugt. Die Achsen Ac sind in Aussparungen Ap des Seitenwandteiles Sw12 angeordnet, die eine Bewegung der Andruckrollen Ar nach oben zur Anpassung an verschiedene Stärken der durchlaufenden Leiterplatten Lp ermöglichen. Dementsprechend ist auch eine den oberen Andruckrollen Ar zugeordnete obere Abschirmung Aso in vertikaler Richtung beweglich in entsprechenden Schlitzen Sz des Seitenwandteils Sw12 geführt.For the transport and for the cathodic contacting of the printed circuit boards Lp, lower contacting members K1 designed as contacting wheels are provided, each of which is driven via a drive shaft Aw1, a worm wheel Sr1 arranged thereon and a worm Sch1 extending in the direction of passage. The drive shafts Aw1 of the lower contacting elements K1 are supported by bushings Bu1 and Bu2 in the side wall parts Sw11 and Sw12, the projecting ends of the drive shafts Aw1 carrying V-ring seals V. As can be seen in particular from FIG. 2, an upper pressure roller Ar is assigned to each lower contact element K1. These upper pressure rollers Ar, which are provided with an elastic 0-
Die kathodische Kontaktierung der Leiterplatten Lp erfolgt über die unteren Kontaktierorgane K1, deren Antriebswellen Aw1 und Kohlebürsten Kb, die mit dem Minuspol einer Galvanisier-Stromquelle GS1 verbunden sind. Der Pluspol dieser Galvanisier-Stromquelle Gs1 ist mit der unteren Abschlußplatte Au1 der unteren Anode A1 verbunden.The circuit boards Lp are cathodically contacted via the lower contacting members K1, their drive shafts Aw1 and carbon brushes Kb, which are connected to the negative pole of a galvanizing power source GS1. The positive pole of this electroplating current source Gs1 is connected to the lower end plate Au1 of the lower anode A1.
Eine parallel zum Seitenwandteil Sw2 angeordnete Abschirmung As1 aus elektrisch isolierendem Material bildet im Bereich des Seitenwandteils Sw12 eine Entmetallisierungs-Kammer EK1, in welcher sich die unteren Kontaktierorgane K1 und jeweils unterhalb davon angeordnete Hilfskathoden H1 befinden. Diese plattenförmigen, z. B. aus rostfreiem Edelstahl bestehenden Hilfskathoden H1 sind an den Minuspol einer Entmetallisierungs-Stromquelle ES1 angeschlossen, deren Pluspol über die Kohlebürsten Kb und die Antriebswellen Aw1 mit den unteren Kontaktierorganen K1 verbunden ist.A shield As1 made of electrically insulating material, which is arranged parallel to the side wall part Sw2, forms a demetallization chamber EK1 in the region of the side wall part Sw12, in which the lower contacting elements K1 and auxiliary cathodes H1 arranged below it are located. This plate-shaped, for. B. made of stainless steel auxiliary cathodes H1 are connected to the negative pole of a demetallization power source ES1, the positive pole of which is connected to the lower contacting elements K1 via the carbon brushes Kb and the drive shafts Aw1.
Die unteren Kontaktierorgane K1 sind somit gegenüber der unteren Anode A1 kathodisch und gegenüber den zugeordneten Hilfskathoden H1 anodisch geschaltet. Dementsprechend wird auf den unteren Kontaktierorganen K1 beim Galvanisiervorgang Kupfer abgeschieden, wobei dieser unerwünschte Kupferniederschlag in der Entmetallisierungs-Kammer EK1 elektrolytisch wieder abgetragen wird und sich dann auf den zugeordneten Hilfskathoden H1 niederschlagt. Die Hilfskathoden H1 können dann von Zeit zu Zeit über lösbar am Seitenwandteil Sw11 befestigte Deckel D1 aus der Entmetallisierungs-Kammer EK1 entnommen und von den Kupferniederschlägen befreit werden. Die vorzugsweise laufend vorgenommene Entkupferung der unteren Kontaktierorgane K1 ermöglicht eine optimale kathodische Kontaktierung der durchlaufenden Leiterplatten Lp, wobei kein nennenswerter Verschleiß der unteren Kontaktierorgane K1 zu verzeichnen ist.The lower contacting elements K1 are thus connected cathodically with respect to the lower anode A1 and anodically with respect to the associated auxiliary cathodes H1. Accordingly, copper is deposited on the lower contacting members K1 during the electroplating process, this undesirable copper deposit is electrolytically removed again in the demetallization chamber EK1 and is then deposited on the associated auxiliary cathode H1. The auxiliary cathodes H1 can then be removed from the demetallization chamber EK1 from time to time via covers D1 which are detachably attached to the side wall part Sw11 and the copper deposits can be removed. The decoupling of the lower contacting members K1, which is preferably carried out continuously, enables optimal cathodic contacting of the continuous printed circuit boards Lp, with no significant wear of the lower contacting members K1 being recorded.
In Figur 1 ist durch strichpunktierte Linien eine Hilfsfuhrung Hf1 angedeutet, die aus elektrisch isolierendem Material besteht und auf ein unteres Kontaktierorgan K1 aufgesetzt wird. Diese den unteren Kontaktierorganen K1 zugeordneten Hilfsführungen Hf1 ermöglichen eine sichere Führung von flexiblen Werkstücken, insbesondere beim Galvanisieren der Innenlagen von Leiterplatten.An auxiliary guide Hf1, which consists of electrically insulating material and is placed on a lower contacting element K1, is indicated in FIG. 1 by dash-dotted lines. These auxiliary guides Hf1, which are assigned to the lower contacting members K1, enable reliable guidance of flexible workpieces, in particular when electroplating the inner layers of printed circuit boards.
Figur 2 zeigt die paarweise Anordnung von unteren Kontaktierorganen K1 und oberen Andruckrollen Ar sowie die Anordnung der Hilfskathoden H1, die jeweils einem unteren Kontaktierorgan K1 zugeordnet sind. Zwischen den einzelnen Kontaktierorganen K1 angeordnete Isolierstücke Is dienen als zusätzliche Abschirmungen, die neben den bereits erwähnten Abschirmungen As1 die Entmetallisierungs-Kammer EK1 vom übrigen Galvanisierbereich trennen.FIG. 2 shows the paired arrangement of lower contact elements K1 and upper pressure rollers Ar and the arrangement of auxiliary cathodes H1, which are each assigned to a lower contact element K1. Insulating pieces Is arranged between the individual contacting members K1 serve as additional shields which, in addition to the shields As1 already mentioned, separate the demetallization chamber EK1 from the rest of the galvanizing area.
Figur 3 zeigt einen der Figur 1 entsprechenden Querschnitt durch eine gesamte Galvanisiereinrichtung, in welcher die durchlaufenden Leiterplatten Lp beidseitig zwischen den unteren Kontaktierorganen K1 und den oberen Andruckrollen Ar geführt sind. Es ist zu erkennen, daß auf beiden Seiten der Durchlaufbahn separate Galvanisier-Stromquellen Gs1 und Entmetallisierungs-Stromquellen ES1 angeordnet sind. Auch in Durchlaufrichtung gesehen können die Stromquellen in mehrere separate Stromquellen unterteilt werden. Hierdurch wird eine optimale Regelung des Galvanisierstroms während des Durchlaufens der Leiterplatten Lp ermöglicht.FIG. 3 shows a cross section corresponding to FIG. 1 through an entire electroplating device, in which the continuous printed circuit boards Lp are guided on both sides between the lower contacting members K1 and the upper pressure rollers Ar. It can be seen that separate electroplating current sources Gs1. On both sides of the continuous path and demetallization current sources ES1 are arranged. The current sources can also be divided into several separate current sources when viewed in the direction of flow. This enables an optimal regulation of the electroplating current during the passage of the printed circuit boards Lp.
Figur 4 zeigt einen teilweisen Querschnitt durch eine zweite Ausführungsform einer erfindungsgemäßen Galvanisiereinrichtung. Auch bei dieser zweiten Ausführungsform werden Leiterplatten Lp in horizontaler Lage und in horizontaler Durchlaufrichtung durch einen Elektrolyten transportiert, der in einem mit B2 bezeichneten Behälter untergebracht ist. Der Behälter B2 wird durch zwei schichtförmig angeordnete Seitenwandteile Sw21 und Sw22, eine untere Abschlußplatte Au2 und eine obere Abschlußplatte Ao2 gebildet. Die untere Abschlußplatte Au2 bildet zusammen mit kugelförmigem Anodenmaterial Am eine untere Anode A21, während die obere Abschlußplatte Ao2 über Halter Ha eine inerte obere Anode A22 trägt.FIG. 4 shows a partial cross section through a second embodiment of an electroplating device according to the invention. In this second embodiment as well, printed circuit boards Lp are transported in a horizontal position and in the horizontal direction of passage through an electrolyte which is accommodated in a container labeled B2. The container B2 is formed by two layered side wall parts Sw21 and Sw22, a lower end plate Au2 and an upper end plate Ao2. The lower end plate Au2 together with spherical anode material Am forms a lower anode A21, while the upper end plate Ao2 carries an inert upper anode A22 via holder Ha.
Für den Transport und für die kathodische Kontaktierung der Leiterplatten Lp sind als Kontaktierräder ausgebildete untere Kontaktierorgane K21 und obere Kontaktierorgane K22 vorgesehen. Die paarweise angeordneten unteren und oberen Kontaktierorgane K21 und K22 sind beide angetrieben, wobei der Antrieb über eine sich in Durchlaufrichtung erstreckende Schnecke Sch2, ein auf der Antriebswelle Aw21 des unteren Kontaktierorgans K21 angeordnetes Schneckenrad Sr21 und ein weiteres auf der Antriebswelle Aw22 des oberen Kontaktierorgans K22 angeordnetes Rad R erfolgt. Die oberen Kontaktierorgane K22 sind schräg angeordnet und auf in Figur 4 nicht näher dargestellte Weise federnd gegen die unteren Kontaktierorgane K21 gedrückt.Lower contacting members K21 and upper contacting members K22 designed as contacting wheels are provided for the transport and for the cathodic contacting of the printed circuit boards Lp. The paired lower and upper contacting members K21 and K22 are both driven, the drive being provided via a worm gear Sch2 extending in the direction of travel, a worm wheel Sr21 arranged on the drive shaft Aw21 of the lower contacting member K21 and another on the drive shaft Aw22 of the upper contacting member K22 Wheel R is done. The upper contacting members K22 are arranged obliquely and are pressed resiliently against the lower contacting members K21 in a manner not shown in FIG. 4.
Die kathodische Kontaktierung der Leiterplatten Lp erfolgt über die unteren Kontaktierorgane K21 und unabhängig davon über die oberen Kontaktierorgane K22. Hierzu sind die Antriebswellen Aw21 der unteren Kontaktierorgane K21 über nicht näher dargestellte Kohlebürsten an den Minuspol einer unteren Galvanisier-Stromquelle GS21 angeschlossen, deren Pluspol über eine sich in Durchlaufrichtung erstreckende untere Stromschiene SSu an die untere Anode A21 angeschlossen ist. In entsprechender Weise sind die Antriebswellen Aw22 der oberen Kontaktierorgane K22 über nicht näher dargestellte Kohlebürsten an den Minuspol einer oberen Galvanisier-Stromquelle GS22 angeschlossen, deren Pluspol über eine sich in Durchlaufrichtung erstreckende obere Stromschiene Sso, die obere Anschlußplatte Ao2 und die Halter Ha an die obere Anode A22 angeschlossen ist.The cathodic contacting of the printed circuit boards Lp takes place via the lower contacting members K21 and independently of this via the upper contact organs K22. For this purpose, the drive shafts Aw21 of the lower contacting members K21 are connected to the negative pole of a lower electroplating current source GS21 via carbon brushes (not shown in detail), the positive pole of which is connected to the lower anode A21 via a lower current rail SSu which extends in the direction of passage. In a corresponding manner, the drive shafts Aw22 of the upper contacting members K22 are connected to the negative pole of an upper electroplating power source GS22 via carbon brushes (not shown in more detail), the positive pole of which is connected via an upper current rail Sso extending in the direction of passage, the upper connecting plate Ao2 and the holder Ha to the upper one Anode A22 is connected.
Für die Befreiung der unteren Kontaktierorgane K21 von unerwünschten Metallniederschlägen ist durch eine untere Abschirmung As21 eine untere Entmetallisierungs-Kammer EK21 gebildet, in welcher sich die unteren Kontaktierorgane K21 und diesen zugeordnete untere Hilfskathoden H21 befinden. Die in lösbaren Deckeln D21 befestigten oberen Hilfskathoden H21 sind an den Minuspol einer unteren Entmetallisierungs-Stromquelle ES21 angeschlossen, deren Pluspol wieder über die nicht näher dargestellten Kohlebürsten an die Antriebswellen Aw21 der unteren Kontaktierorgane K21 angeschlossen sind.In order to free the lower contacting members K21 from undesired metal deposits, a lower shielding metallization EK21 is formed by a lower shield As21, in which the lower contacting members K21 and the lower auxiliary cathodes H21 assigned to them are located. The upper auxiliary cathodes H21, which are fastened in detachable covers D21, are connected to the negative pole of a lower demetallization current source ES21, the positive pole of which is again connected to the drive shafts Aw21 of the lower contacting members K21 via the carbon brushes (not shown).
Für die Befreiung der oberen Kontaktierorgane K22 von unerwünschten Metallniederschlägen ist durch eine obere Abschirmung As22 eine obere Entmetallisierungs-Kammer EK22 gebildet, in welcher sich die oberen Kontaktierorgane K22 und diesen zugeordnete obere Hilfskathoden H22 befinden. Die in lösbaren Deckeln D22 befestigten oberen Hilfskathoden H22 sind an den Minuspol einer oberen Entmetallisierungs-Stromquelle Es22 angeschlossen, deren Pluspol wieder über die nicht näher dargestellten Kohlebürsten an die Antriebswellen Aw22 der oberen Kontaktierorgane K22 angeschlossen sind.To free the upper contacting elements K22 from undesired metal deposits, an upper shielding chamber EK22 is formed by an upper shielding As22, in which the upper contacting elements K22 and the upper auxiliary cathodes H22 associated therewith are located. The upper auxiliary cathodes H22 fastened in detachable covers D22 are connected to the negative pole of an upper demetallization current source Es22, the positive pole of which is again connected to the drive shafts via the carbon brushes (not shown) Aw22 of the upper contact organs K22 are connected.
Beim Galvanisieren von flexiblen Werkstücken, insbesondere beim Galvanisieren der Innenlagen von Leiterplatten können auf die oberen Kontaktierorgane K22 Hilfsführungen aufgesetzt werden, sowie es in Figur 4 durch eine Hilfsführung Hf2 angedeutet ist.When electroplating flexible workpieces, in particular when electroplating the inner layers of printed circuit boards, auxiliary guides can be placed on the upper contacting members K22, as is indicated in FIG. 4 by an auxiliary guide Hf2.
Als Materialien bei dem in Figur 4 dargestellten Ausführungsbeispiel sind für die unteren und oberen Kontaktierorgane K21 und K22 mit den zugeordneten Antriebswellen Aw21 bzw. Aw22 sowie für die untere Stromschiene Ssu und die obere Stromschiene Sso mit Titan ummanteltes Kupfer zu nennen. Die untere Abschlußplatte Au2 und die obere Abschlußplate Ao2 bestehen aus Titan, während die inerte obere Anode A22 aus platiniertem Titan besteht. Die zum Reinigen aus den jeweiligen Entmetallisierungs-Kammern EK21 und EK22 entnehmbaren Hilfskathoden H21 und H22 bestehen vorzugsweise aus rostfreiem Edelstahl. Elektrisch isoliert auszubildende Teile wie die Abschirmungen As21 und As22 und die Seitenwandteile Sw21 und Sw22 bestehen beispielsweise aus PVC.The materials in the exemplary embodiment shown in FIG. 4 are copper-coated with titanium for the lower and upper contacting members K21 and K22 with the associated drive shafts Aw21 and Aw22, as well as for the lower busbar Ssu and the upper busbar Sso. The lower end plate Au2 and the upper end plate Ao2 are made of titanium, while the inert upper anode A22 is made of platinized titanium. The auxiliary cathodes H21 and H22, which can be removed from the respective demetallization chambers EK21 and EK22, are preferably made of stainless steel. Parts to be electrically insulated, such as the shields As21 and As22 and the side wall parts Sw21 and Sw22, are made of PVC, for example.
Figur 5 zeigt in stark vereinfachter schematischer Darstellung eine dritte Ausführungsform einer erfindungsgemäßen Galvanisiereinrichtung. Die zu galvanisierenden Leiterplatten Lp werden hier in Durchlaufrichtung Dr durch einen nicht näher erkennbaren Elektrolyten bewegt, wobei der Transport und die kahodische Kontaktierung durch in Richtung des Pfeilers U angetriebene Kontaktierorgane K3 vorgenommen wird. Bei diesen Kontaktierorganen K3 handelt es sich um Kontaktierwalzen, die aus einem kupferummantelten Titanrohr bestehen und sich über die gesamte Breite der durchlaufenden Leiterplatten Lp erstrecken. Die walzenförmigen Kontaktierorgane K3 tauchen in eine Entmetallisierungs-Kammer EK3 ein, die durch eine U-förmige Abschirmung As3 und am Kontaktierorgan K3 anliegende Abdichtungen Ad gebildet ist. In dieser Entmetallisierungs-Kammer EK3 befindet sich eine plattenförmige Hilfskathode H3, gegenüber welcher das Kontaktierorgan K3 anodisch geschaltet ist. Unerwünschte Metallniederschläge auf dem Kontaktierorgan K3 werden somit elektrolytisch wieder abgetragen, wobei eine Membran M einen Niederschlag des entsprechenden Metalls auf der Hilfskathode H3 verhindert. Die Membran M ist zu diesem Zweck zwischen dem Kontaktierorgan K3 und der Hilfskathode H3 angeordnet und als sog. Anion-Membran ausgebildet, die für Anionen durchlässig und für Kationen undurchlässig ist. Bei einer wirksamen Entmetallisierung des Kontaktierorgans K3 kann in diesem Fall somit auf eine Reinigung der Hilfskathode H3 völlig verzichtet werden.FIG. 5 shows a highly simplified schematic illustration of a third embodiment of an electroplating device according to the invention. The circuit boards Lp to be electroplated are moved here in the direction of passage Dr by an electrolyte which cannot be identified in more detail, the transport and the cahodic contacting being carried out by contacting members K3 driven in the direction of the pillar U. These contacting elements K3 are contacting rollers which consist of a copper-clad titanium tube and extend over the entire width of the continuous printed circuit boards Lp. The roller-shaped contacting elements K3 are immersed in a demetallization chamber EK3, which is formed by a U-shaped shield As3 and seals Ad lying on the contacting element K3. In this demetallization chamber EK3 there is a plate-shaped auxiliary cathode H3, to which the contacting element K3 is connected anodically. Undesired metal deposits on the contacting element K3 are thus removed electrolytically again, a membrane M preventing the corresponding metal from being deposited on the auxiliary cathode H3. For this purpose, the membrane M is arranged between the contacting element K3 and the auxiliary cathode H3 and is designed as a so-called anion membrane, which is permeable to anions and impermeable to cations. With effective de-metallization of the contacting element K3, cleaning of the auxiliary cathode H3 can thus be dispensed with completely.
Zu beiden Seiten der Entmetallisierungs-Kammer EK3 sind in dem Elektrolyten Anoden A3 angeordnet, die auch hier wieder durch kugelförmiges Anodenmaterial Am gebildet sind.Anodes A3 are arranged in the electrolyte on both sides of the demetallization chamber EK3, which anodes A3 are again formed here by spherical anode material Am.
Bei den vorstehend geschilderten Ausführungsbeispielen wurden insbesondere die für die erfindungsgemäße Entmetallisierung der umlaufenden Kontaktierorgane wesentlichen Merkmale ausführlich geschildert, während andere Merkmale, wie z. B. die Bewegung des Elektrolyten, nicht erwähnt wurden. Diese Elektrolytbewegung und andere Merkmale gehen beispielsweise aus der EP-A-0 254 962 oder der EP-A-0 276 725 hervor.In the exemplary embodiments described above, the features essential for the demetallization of the rotating contacting members according to the invention were described in detail, while other features, such as. B. the movement of the electrolyte were not mentioned. This electrolyte movement and other features are evident, for example, from EP-A-0 254 962 or EP-A-0 276 725.
Figur 6 zeigt einen Querschnitt durch den in Durchlaufrichtung gesehen linken Bereich einer Galvanisiereinrichtung für Leiterplatten Lp, die in horizontaler Lage und in horizontale Durchlaufrichtung durch einen nicht näher erkennbaren Elektrolyten transportiert werden. Die Unterbringung dieses Elektrolyten erfolgt in einem Behälter B4, von welchem in Figur 1 eine linke Seitenwand Sw4 aus einem elektrisch isolierenden Kunststoff, eine untere Abschlußplatte Au4 und eine obere Abschlußplatte Ao4 zu erkennen sind. Die untere Abschlußplatte Au4 und die obere Abschlußplatte Ao4 bestehen beispielsweise aus Titan. Auf der unteren Abschlußplatte Au4 steht ein unterer Anodenkorb Ak41, der zusammen mit dem darin befindlichen kugelförmigen Anodenmaterial Am eine untere Anode A41 bildet. In entsprechender Weise hängt unter der oberen Abschlußplatte Ao4 ein oberer Anodenkorb Ak42, der zusammen mit dem darin befindlichen kugelförmigen Anodenmaterial Am eine obere Anode A42 bildet. Die Anodenkörbe Ak41 und Ak42 bestehen beispielsweise aus Titan-Streckmetall, während es sich bei dem Anodenmaterial Am im dargestellten Ausführungsbeispiel um Kupferkugeln handelt.FIG. 6 shows a cross section through the left area, seen in the direction of passage, of an electroplating device for printed circuit boards Lp, which are transported in a horizontal position and in the horizontal direction of passage by an electrolyte which cannot be identified in more detail. This electrolyte is accommodated in a container B4, of which a left side wall Sw4 made of an electrically insulating plastic, a lower end plate Au4 and an upper end plate Ao4 can be seen in FIG. The lower end plate Au4 and the upper end plate Ao4 are made of titanium, for example. On the lower end plate Au4 there is a lower anode basket Ak41, which together with the spherical anode material Am contained therein forms a lower anode A41. In a corresponding manner, an upper anode basket Ak42 hangs under the upper end plate Ao4, which together with the spherical anode material Am located therein forms an upper anode A42. The anode baskets Ak41 and Ak42 are made of expanded titanium, for example, while the anode material Am in the exemplary embodiment shown is copper balls.
Für die kathodische Kontaktierung der Leiterplatten Lp sind Kontaktierorgane K4 vorgesehen, die als horizontal ausgerichtete untere Kontaktierräder ausgebildet sind. Die vertikal ausgerichteten Antriebswellen Aw4 der Kontaktierorgane K4 sind in der Seitenwand Sw4 gelagert und nach oben elektrisch isoliert durch die obere Abschlußplatte Ao4 hindurchgeführt. Der Antrieb der Antriebswellen Aw4 ist in Figur 2 durch Pfeile Pf41 angedeutet, während die Zufuhr des Kathodenstroms zur Antriebswelle Aw4 in Figur 1 durch einen Pfeil Pf42 angedeutet ist. Die Kontaktierorgane K4 können auch so ausgebildet sein, daß der dünne Randbereich, in dem die Leiterplatten Lp aufliegen, federnd nach oben drückt.For the cathodic contacting of the printed circuit boards Lp, contacting elements K4 are provided, which are designed as horizontally aligned lower contacting wheels. The vertically aligned drive shafts Aw4 of the contacting elements K4 are mounted in the side wall Sw4 and are electrically insulated upwards and passed through the upper end plate Ao4. The drive of the drive shafts Aw4 is indicated in FIG. 2 by arrows Pf41, while the supply of the cathode current to the drive shaft Aw4 is indicated in FIG. 1 by an arrow Pf42. The contacting elements K4 can also be designed such that the thin edge region in which the printed circuit boards Lp rest resiliently presses upwards.
Für den Transport und für die sichere Führung der Leiterplatten Lp sind über die Breite der Leiterplatten Lp paarweise angeordnete untere und obere Führungsräder Fr41 und Fr42 vorgesehen. Die unteren Führungsräder Fr41 sind im Abstand zueinander auf einer unteren Antriebswelle Aw41 angeordnet, während die oberen Führungsräder Fr42 im Abstand zueinander auf einer oberen Antriebswelle Aw42 angeordnet sind. Dabei ist jeweils ein äußeres oberes Führungsrad Fr42 einem Kontaktierorgan K4 derart zugeordnet, daß die Leiterplatte Lp gegen dieses Kontaktierorgan K4 gedrückt wird. Der in der Zeichnung nicht näher dargestellte Antrieb der Antriebswellen Aw41 und Aw42 kann über Kegelräder oder über stirnverzahnte Räder und eine Schnecke vorgenommen werden. Die Antriebswellen Aw41 und Aw42 und die Führungsräder Fr41 und Fr42 bestehen entweder aus elektrisch isolierendem Material oder aus Metall mit einer elektrisch isolierenden Ummantelung.Lower and upper guide wheels Fr41 and Fr42 arranged in pairs across the width of the printed circuit boards Lp are provided for the transport and safe guidance of the printed circuit boards Lp. The lower guide wheels Fr41 are spaced apart on a lower drive shaft Aw41, while the upper guide wheels Fr42 are spaced apart are arranged to each other on an upper drive shaft Aw42. An outer upper guide wheel Fr42 is assigned to a contacting element K4 in such a way that the circuit board Lp is pressed against this contacting element K4. The drive shafts Aw41 and Aw42, not shown in the drawing, can be carried out via bevel gears or spur gears and a worm. The drive shafts Aw41 and Aw42 and the guide wheels Fr41 and Fr42 consist either of electrically insulating material or of metal with an electrically insulating sheathing.
Bei dem in Figur 6 dargestellten Querschnitt befindet sich links neben dem Kontaktierorgan K4 eine Entmetallisierungs-Kammer EK4, die sich in Durchlaufrichtung Dr (vgl. Figur 7) der Leiterplatten Lp erstreckt und nach außen durch einen Deckel D4 flüssigkeitsdicht verschlossen ist. Innerhalb der Entmetallisierungs-Kammer EK befindet sich eine eine Hilfskathode H4, die durch ein vertikal ausgerichtetes und sich ebenfalls in Durchlaufrichtung Dr erstreckendes Band gebildet ist. Gegenüber dieser beispielsweise aus rostfreiem Eelstahl bestehenden Hilfskathode H4 sind die Kontaktierorgane K4 anodisch geschaltet, so daß unerwünschte Kupferniederschläge auf den Kontaktierorganen K4 in der Entmetallisierungs-Kammer EK4 ständig elektrolytisch wieder abgetragen werden und sich dann auf der Hilfskathode H4 niederschlagen. Durch Beobachtung der Metallniederschläge auf der Hilfskathode H4 kann dann die bandförmige Hilfskathode H4 im Bedarfsfall in Durchlaufrichtung Dr weiterbewegt werden. In Durchlaufrichtung Dr gesehen, kann die Hilfskathode H4 beispielsweise auf einer Seite von einer Vorratsrolle abgezogen und auf der anderen Seite von einer entsprechenden Rolle wieder aufgenommen werden.In the cross section shown in FIG. 6, to the left of the contacting element K4 there is a demetallization chamber EK4, which extends in the direction of travel Dr (see FIG. 7) of the printed circuit boards Lp and is closed to the outside by a cover D4 in a liquid-tight manner. Within the demetallization chamber EK is an auxiliary cathode H4, which is formed by a vertically oriented band, which also extends in the direction of passage Dr. Compared to this auxiliary cathode H4, which is made, for example, of stainless steel, the contacting members K4 are anodically connected, so that undesired copper deposits on the contacting members K4 in the demetallization chamber EK4 are continuously removed electrolytically and are then deposited on the auxiliary cathode H4. By observing the metal deposits on the auxiliary cathode H4, the band-shaped auxiliary cathode H4 can then be moved further in the direction of travel Dr if necessary. When viewed in the direction of passage Dr, the auxiliary cathode H4 can, for example, be drawn off from a supply roll on one side and be taken up again from a corresponding roll on the other side.
Die Kontaktierorgane K4 sind in Durchlaufrichtung Dr gesehen vorzugsweise auf beiden Seiten der durchlaufenden Leiterplatten Lp angeordnet. In diesem Fall kann der in Figur 6 dargestellte Querschnitt durch einen spiegelsymmetrisch dazu ausgebildeten rechten Teil der Galvanisiereinrichtung ergänzt werden.The contacting elements K4 are seen in the direction of passage Dr preferably arranged on both sides of the continuous circuit boards Lp. In this case, the cross section shown in FIG. 6 can be supplemented by a right-hand part of the electroplating device which is designed with mirror symmetry.
Figur 8 zeigt einen Querschnitt durch eine Galvanisiereinrichtung zum Durchkontaktieren und Galvanisieren von Leiterplatten Lp, die in horizontaler Lage und in horizontaler Durchlaufrichtung durch einen nicht näher erkennbaren Elektrolyten transportiert werden. Die Unterbringung dieses Elektrolyten erfolgt in einem Behälter B5, welche durch eine in der Zeichnung links angeordnete Seitenwand Sw51, eine rechts angeordnete Seitenwand Sw52, eine untere Abschlußplatte Au5 und eine obere Abschlußplatte Ao5 gebildet ist. Die Seitenwände Sw51 und Sw52 bestehen aus einem elektrisch isolierenden Kunststoff, wie z. B. PVC, während die untere Abschlußplatte Au5 und die obere Abschlußplatte Ao5 beispielsweise aus Titan bestehen. Auf der unteren Abschlußplatte Au5 steht ein unterer Anodenkorb Ak51, der zusammen mit dem darin befindlichen kugelförmigen Anodenmaterial Am eine untere Anode A51 bildet. In entsprechender Weise hängt unter der oberen Abschlußplatte Ao5 ein oberer Anodenkorb Ak52, der zusammen mit dem darin befindlichen kugelförmigen Anodenmaterial Am eine obere Anode A52 bildet. Die Anodenkörbe Ak51 und Ak52 bestehen beispielsweise aus Titan-Streckmetall, während es sich bei dem Anodenmaterial Am im dargestellten Ausführungsbeispiel um Kupferkugeln handelt.FIG. 8 shows a cross section through an electroplating device for through-contacting and electroplating printed circuit boards Lp, which are transported in a horizontal position and in the horizontal direction of passage through an electrolyte which cannot be identified in more detail. This electrolyte is accommodated in a container B5, which is formed by a side wall Sw51 arranged on the left in the drawing, a side wall Sw52 arranged on the right, a lower end plate Au5 and an upper end plate Ao5. The side walls Sw51 and Sw52 consist of an electrically insulating plastic, such as. B. PVC, while the lower end plate Au5 and the upper end plate Ao5 are made of titanium, for example. On the lower end plate Au5 there is a lower anode basket Ak51 which, together with the spherical anode material Am located therein, forms a lower anode A51. In a corresponding manner, an upper anode basket Ak52 hangs under the upper end plate Ao5 and, together with the spherical anode material Am located therein, forms an upper anode A52. The anode baskets Ak51 and Ak52 are made of expanded titanium, for example, while the anode material Am in the exemplary embodiment shown is copper balls.
Für die kathodische Kontaktierung der Leiterplatten Lp sind untere Kontaktierorgane K51 und obere Kontaktierorgane K52 vorgesehen, die durch zu beiden Seiten der durchlaufenden Leiterplatten Lp paarweise angeordnete untere und obere Kontaktierräder gebildet sind. Wie in Figur 8 zu erkennen ist, ergreifen einander zugeordnete untere und obere Kontaktierorgane K51 und K52 jeweils den seitlichen Randbereich der durchlaufenden Leiterplatten Lp. Einander gegenüberliegende untere Kontaktierorgane K51 sind auf einer gemeinsamen unteren Antriebswelle Aw51 angeordnet, die durch einen mit Titan Ti ummantelten Kupferrundstab Kr gebildet ist, wobei die elektrische Isolierung gegenüber dem Elektrolyten durch einen äußeren Schrumpfschlauch Ss aus PE oder PTFE bewerkstelligt wird. Zwischen den beiden unteren Kontaktierorganen K51 befinden sich auf der unteren Antriebswelle Aw51 im Abstand zueinander angeordnete untere Führungsräder Fr51, die beispielsweise aus weichem PVC bestehen. Das im dargestellten Querschnitt linke Ende der unteren Antriebswelle Aw51 ist durch die Seitenwand Sw51 hindurchgeführt, so daß die durch einen Pfeil Pf51 angedeutete Zufuhr des Kathodenstroms zur unteren Antriebswelle Aw51 außerhalb der Galvanisiereinrichtung erfolgen kann. Auf der gegenüberliegenden Seite ist auf die untere Antriebswelle Aw51 ein Schneckenrad Sr5 aufgesetzt, welches über eine sich in Durchlaufrichtung erstreckende Schnecke Sch5 angetrieben wird.Lower contacting members K51 and upper contacting members K52 are provided for the cathodic contacting of the printed circuit boards Lp, which are formed by lower and upper contacting wheels arranged in pairs on both sides of the continuous printed circuit boards Lp. As can be seen in FIG. 8, lower and upper contacting elements K51 and K52 each the lateral edge area of the continuous circuit boards Lp. Opposing lower contacting members K51 are arranged on a common lower drive shaft Aw51, which is formed by a titanium Ti-coated copper round rod Kr, the electrical insulation from the electrolyte being brought about by an outer shrink tube Ss made of PE or PTFE. Between the two lower contacting members K51 are on the lower drive shaft Aw51 spaced lower guide wheels Fr51, which consist for example of soft PVC. The left end of the lower drive shaft Aw51 in the cross section shown is passed through the side wall Sw51, so that the supply of the cathode current to the lower drive shaft Aw51, indicated by an arrow Pf51, can take place outside the galvanizing device. On the opposite side, a worm wheel Sr5 is placed on the lower drive shaft Aw51, which is driven by a worm gear Sch5 extending in the direction of passage.
Einander gegenüberliegende obere Kontaktierorgane K52 sind auf einer gemeinsamen oberen Antriebswelle Aw52 angeordnet, die durch einen mit Titan Ti ummantelten Kupferrundstab Kr gebildet ist, wobei die elektrische Isolierung gegenüber dem Elektrolyten auch hier wieder durch einen äußeren Schrumpfschlauch Ss aus PE oder PTFE bewerkstelligt wird. Zwischen den beiden oberen Kontaktierorganen K52 befinden sich auf der oberen Antriebswelle Aw52 im Abstand zueinander angeordnete obere Führungsräder Fr52, die mit den unteren Führungsrädern Fr51 Räderpaare bilden und beispielsweise wieder aus weichem PVC bestehen. Das im dargestellten Querschnitt linke Ende der oberen Antriebswelle Aw52 ist durch die Seitenwand Sw51 hindurchgeführt, so daß auch hier die durch einen Pfeil Pf52 angedeutete Zufuhr des Kathodenstroms zur oberen Antriebswelle Aw52 außerhalb der Galvanisiereinrichtung erfolgen kann. Auf der gegenüberliegenden Seite ist auf die obere Antriebswelle Aw52 ein Zahnrad Zr5 aufgesetzt, welches von dem Schneckenrad Sr5 angetrieben wird. Es ist zu erkennen, daß dieses Zahnrad Zr5, das Schneckenrad Sr5 und die Schnecke Sch5 in einer Aussparung Ap5 der rechten Seitenwand Sw52 untergebracht sind.Opposing upper contacting elements K52 are arranged on a common upper drive shaft Aw52, which is formed by a copper round rod Kr coated with titanium Ti, the electrical insulation from the electrolyte again being accomplished here by an outer shrink tube Ss made of PE or PTFE. Between the two upper contacting elements K52 there are upper guide wheels Fr52 which are arranged at a distance from one another on the upper drive shaft Aw52 and which form pairs of wheels with the lower guide wheels Fr51 and again consist, for example, of soft PVC. The left end of the upper drive shaft Aw52 in the cross section shown is passed through the side wall Sw51, so that here too the supply of the cathode current to the upper drive shaft Aw52 indicated by an arrow Pf52 is outside the galvanizing device can take place. On the opposite side, a gear Zr5 is placed on the upper drive shaft Aw52, which is driven by the worm gear Sr5. It can be seen that this gear Zr5, the worm gear Sr5 and the worm Sch5 are accommodated in a recess Ap5 of the right side wall Sw52.
Parallel zu den Seitenwänden Sw51 und Sw52 angeordnete Abschirmungen As51 und As52 aus elektrisch isolierendem Material bilden zusammen mit entsprechenden Aussparungen der Seitenwände untere Entmetallisierungs-Kammern EK51 bzw. obere Entmetallisierungs-Kammern EK52, in welchen sich die unteren Kontaktierorgane K51 bzw. die oberen Kontaktierorgane K52 sowie diesen zugeordnete untere Hilfskathoden H51 bzw. obere Hilfskathoden H52 befinden. Gegenüber diesen unteren bzw. oberen Hilfskathoden H51 bzw. H52, die beispielsweise aus rostfreiem Edelstahl bestehen, sind die unteren bzw. oberen Kontaktierorgane K51 bzw. K52 anodisch geschaltet. Unerwünschte Kupferniederschläge auf den unteren bzw. oberen Kontaktierorganen K51 bzw. K52 werden somit in den unteren bzw. oberen Entmetallisierungs-Kammern EK51 bzw. EK52 ständig elektrolytisch wieder abgetragen. Durch diese laufende Entmetallisierung wird eine optimale kathodische Kontaktierung der durchlaufenden Leiterplatten Lp gewährleistet.Shields As51 and As52 made of electrically insulating material arranged parallel to the side walls Sw51 and Sw52 form, together with corresponding cutouts in the side walls, lower demetallization chambers EK51 and upper demetallization chambers EK52, in which the lower contacting members K51 and the upper contacting members K52 and lower auxiliary cathodes H51 or upper auxiliary cathodes H52 assigned to them. In relation to these lower and upper auxiliary cathodes H51 and H52, which are made, for example, of stainless steel, the lower and upper contacting elements K51 and K52 are anodically connected. Unwanted copper deposits on the lower and upper contacting elements K51 and K52 are thus continuously removed electrolytically in the lower and upper demetallization chambers EK51 and EK52. This ongoing demetallization ensures optimal cathodic contacting of the continuous printed circuit boards Lp.
Figur 9 zeigt einen Längsschnitt durch eine Galvanisiereinrichtung zum Durchkontaktieren und Galvanisieren von Leiterplatten Lp, die in horizontaler Lage und in horizontaler Durchlaufrichtung Dr durch einen nicht näher erkennbaren Elektrolyten transportiert werden. Die Unterbringung dieses Elektrolyten erfolgt in einem Behälter B6, von welchem in Figur 1 eine untere Abschlußplatte Au6 und eine obere Abschlußplatte Ao6 zu erkennen sind. Die Abschlußplatten Au6 und Ao6 bestehen beispielsweise aus Titan. Auf der unteren Abschlußplatte Au6 stehen mehrere untere Anodenkörbe Ak61, die zusammen mit dem darin befindlichen kugelförmigen Anodenmaterial Am eine unter Anode A61 bilden. In entsprechender Weise hängen in Führungen Fg unter der oberen Abschlußplatte Ao6 mehrere nach Art einer Schublade in Querrichtung ausziehbare obere Anodenkörbe Ak62, die zusammen mit dem darin befindlichen kugelförmigen Anodenmaterial Am eine obere Anode A62 bilden. Die Anodenkörbe Ak61 und Ak62 bestehen beispielsweise aus Titan-Streckmetall, während es sich bei dem Anodenmaterial Am im dargestellten Ausführungsbeispiel um Kupferkugeln handelt.FIG. 9 shows a longitudinal section through an electroplating device for through-contacting and electroplating printed circuit boards Lp, which are transported in a horizontal position and in the horizontal direction of passage Dr by an electrolyte which cannot be identified in more detail. This electrolyte is accommodated in a container B6, of which a lower end plate Au6 and an upper end plate Ao6 can be seen in FIG. The end plates Au6 and Ao6 are made of titanium, for example. On The lower end plate Au6 has several lower anode baskets Ak61 which, together with the spherical anode material Am contained therein, form one under anode A61. Correspondingly, several upper anode baskets Ak62, which can be pulled out in the manner of a drawer in the transverse direction, hang in guides Fg under the upper end plate Ao6 and, together with the spherical anode material Am therein, form an upper anode A62. The anode baskets Ak61 and Ak62 are made of expanded titanium, for example, while the anode material Am in the illustrated embodiment is copper balls.
Für die kathodische Kontaktierung der Leiterplatten Lp sind untere Kontaktierorgane K61 und obere Kontaktierorgane K62 vorgesehen, die durch paarweise angeordnete untere und obere Kontaktierwalzen gebildet sind. Die Kontaktierorgane K61 und K62 bilden auch gleichzeitig eine Transporteinrichtung für den Vorschub der Leiterplatten Lp in Durchlaufrichtung Dr. Die beispielsweise über in Figur 9 nicht näher erkennbare Kegelräder angetriebenen Antriebswellen Aw61 und Aw62 der unteren Kontaktierorgane K61 bzw. Kontaktierorgane K62 sind seitlich aus dem Behälter B6 herausgeführt, so daß hier die Zufuhr des Kathodenstroms beispielsweise über Kohlebürsten vorgenommen werden kann. Durch Doppelpfeile Pf6 ist angedeutet, daß die oberen Kontaktierorgane K62 federnd gegen die unteren Kontaktierorgane K61 drücken und hierdurch auch eine Anpassung an verschiedene Stärken der durchlaufenden Leiterplatten Lp ermöglicht wird.Lower contacting elements K61 and upper contacting elements K62 are provided for the cathodic contacting of the printed circuit boards Lp and are formed by lower and upper contacting rollers arranged in pairs. The contacting elements K61 and K62 also simultaneously form a transport device for feeding the printed circuit boards Lp in the direction of passage Dr. The drive shafts Aw61 and Aw62 of the lower contacting members K61 or contacting members K62, which are driven, for example, by bevel gears, which are not shown in detail in FIG. Double arrows Pf6 indicate that the upper contacting elements K62 press resiliently against the lower contacting elements K61 and this also enables adaptation to different thicknesses of the continuous printed circuit boards Lp.
Die unteren Kontaktierorgane K61 sind in U-förmigen Entmetallisierungs-Kammern EK61 angeordnet, in welchen sich zusätzlich noch untere Hilfskathoden H61 befinden. In entsprechender Weise sind die oberen Kontaktierorgane K62 in U-förmigen Entmetallisierungs-Kammern EK62 angeordnet, in welchen sich zusätzlich noch obere Hilfskathoden H62 befinden. Gegenüber den unteren bzw. oberen Hilfskathoden H61 bzw. H62, die beispielsweise aus rostfreiem Edelstahl bestehen, sind die unteren bzw. oberen Kontaktierorgane K61 bzw. K62 anodisch geschaltet. Unerwünschte Kupferniederschläge auf den unteren bzw. oberen Kontaktierorganen K61 bzw. K62 werden somit in den unteren bzw. oberen Entmetallisierungs-Kammern EK61 bzw. EK62 ständig elektrolytisch wieder abgetragen. Durch diese laufende Entmetallisierung wird eine optimale kathodische Kontaktierung der durchlaufenden Leiterplatten Lp gewährleistet.The lower contacting elements K61 are arranged in U-shaped demetallization chambers EK61, in which there are also lower auxiliary cathodes H61. Correspondingly, the upper contacting members K62 are arranged in U-shaped demetalization chambers EK62, in which there are also upper auxiliary cathodes H62. Compared to the lower and upper auxiliary cathodes H61 and H62, which are made of stainless steel, for example, the lower and upper contacting elements K61 and K62 are anodically connected. Unwanted copper deposits on the lower and upper contacting elements K61 and K62 are thus continuously removed electrolytically in the lower and upper demetallization chambers EK61 and EK62. This ongoing demetallization ensures optimal cathodic contacting of the continuous printed circuit boards Lp.
Aus Figur 9 in Verbindung mit Figur 10 ist ersichtlich, daß die als Kontaktierwalzen ausgebildeten unteren Kontaktierorgane K61 in Querrichtung Qr gesehen aus mehreren Walzensegmenten Ws 61 zusammengesetzt sind. Hierdurch können dann jeweils zwischen zwei benachbarten Walzensegmenten Ws61 die Entmetallisierungs-Kammern EK61 durch Querstege Qs61 versteift werden. Die nur aus Figur 9 ersichtlichen oberen Kontaktierorgane K62 sind in entsprechender Weise aus Walzensegmenten Ws62 zusammengesetzt, so daß die oberen Entmetallisierungs-Kammern EK62 durch Querstege Qs62 versteift werden können.It can be seen from FIG. 9 in conjunction with FIG. 10 that the lower contacting members K61, which are designed as contacting rollers, are composed of a plurality of
Die Breite der Kontaktierorgane K61 und K62 ist auf Leiterplatten Lp mit einer maximalen Breite b60 angestimmt, deren Durchlauf zwischen der unteren Anode A61 und der oberen Anode A62 aus Figur 11 ersichtlich ist. Sollen gemäß Figur 12 Leiterplatten Lp mit einer geringeren Breite B61 galvanisiert werden, so bereitet deren Transport in Durchlaufrichtung Dr und deren kathodische Kontaktierung zwischen den unteren und oberen Kontaktierorganen K61 und K62 keinerlei Schwierigkeiten. Damit diese Leiterplatten Lp beim Durchlauf nicht in Querrichtung Qr weglaufen, sind Hilfsführungen Hf6 vorgesehen, die gemäß Figur 9 durch paarweise angeordnete untere und obere Andruckräder Ar61 bzw. Ar62 gebildet sind. Die in Figur 9 durch Kreuze angedeuteten Achsen Ac61 und Ac62 der unteren und oberen Andruckräder Ar61 bzw. Ar62 sind zur Querrichtung Qr schräg angeordnet, d. h. sie verlaufen nicht exakt senkrecht zur Zeichnungsebene. Diese Anstellung der Achsen Ac61 und Ac62 in Durchlaufrichtung Dr um Anstellwinkel von beispielsweise 2° bewirkt, daß die Andruckräder Ar61 und Ar62 eine in Querrichtung Qr nach außen wirkende Kraft auf die Leiterplatten Lp ausüben und dadurch eine sicher Führung der durchlaufenden Leiterplatten Lp gewährleisten.The width of the contacting elements K61 and K62 is matched to printed circuit boards Lp with a maximum width b60, the passage of which between the lower anode A61 and the upper anode A62 can be seen from FIG. If, according to FIG. 12, circuit boards Lp with a smaller width B61 are to be galvanized, their transport in the direction of passage Dr and their cathodic contacting between the lower and upper contacting members K61 and K62 pose no difficulties. So that these printed circuit boards Lp do not run away in the transverse direction Qr during the passage, auxiliary guides Hf6 are provided which, according to FIG. 9, are formed by lower and upper pressure wheels Ar61 and Ar62 arranged in pairs. Those indicated by crosses in FIG. 9 Axes Ac61 and Ac62 of the lower and upper pressure wheels Ar61 and Ar62 are arranged at an angle to the transverse direction Qr, ie they are not exactly perpendicular to the plane of the drawing. This adjustment of the axes Ac61 and Ac62 in the direction of travel Dr by an angle of attack of, for example, 2 ° causes the pressure wheels Ar61 and Ar62 to exert a force acting outwards in the transverse direction Qr on the printed circuit boards Lp and thereby ensure reliable guidance of the continuous circuit boards Lp.
Aus Figur 9 in Verbindung mit Figur 12 ist ersichtlich, daß beim Durchlauf von Leiterplatten Lp geringerer Breite sich ein seitlicher Überstand der Anoden A61 und A62 ergibt. Dieser Überstand würde ohne zusätzliche Maßnahmen bei dem in der Darstellung gemäß Figur 12 rechten Bereich der durchlaufenden Leiterplatten Lp zu höheren Stromdichten und damit zu größeren Schichtdicken der galvanisch abgeschiedenen Metallschichten führen. Um dieses zu verhindern und gleichmäßige Schichtdicken auch bei Leiterplatten Lp geringerer Breite zu gewährleisten, wird der seitliche Überstand der unteren Anode A61 durch eine untere Abdeck-Blende Ab61 abgeschirmt, während der seitliche Überstand der oberen Anode A62 durch eine obere Abdeck-Blende AB62 abgeschirmt wird. Die aus Figur 12 ersichtliche Breite b63 der aus einem elektrisch isolierenden Werkstoff bestehenden Abdeck-Blenden AB61 und AB62 ist auf die Breite b61 der hier durchlaufenden Leiterplatten Lp abgestimmt. Um eine flexible Anpassung der Abdeck-Blenden AB61 und AB62 an verschiedene Leiterplattenbreiten zu ermöglichen, sind diese Abdeck-Blenden AB61 und AB62 gemäß Figur 9 in äußeren Nuten N6 der Entmetallisierungs-Kammern EK61 bzw. EK62 in Querrichtung Qr verschiebbar geführt. Die aus der Zeichnung nicht ersichtliche Einstellung der Breite der Abdeck-Blenden AB61 und AB62 kann beispielsweise durch eine balgförmige Ausbildung oder durch eine überlappende Anordnung mehrerer Platten bewerkstelligt werden.From FIG. 9 in conjunction with FIG. 12 it can be seen that when PCBs Lp of smaller width pass through, there is a lateral projection of the anodes A61 and A62. This protrusion would lead to higher current densities and thus to greater layer thicknesses of the electrodeposited metal layers without additional measures in the right area of the continuous circuit boards Lp in the illustration according to FIG. 12. To prevent this and to ensure uniform layer thicknesses even with printed circuit boards Lp of smaller width, the lateral protrusion of the lower anode A61 is shielded by a lower cover plate Ab61, while the lateral protrusion of the upper anode A62 is shielded by an upper cover plate AB62 . The width b63 shown in FIG. 12 of the cover panels AB61 and AB62 made of an electrically insulating material is matched to the width b61 of the circuit boards Lp running through here. In order to allow flexible adaptation of the cover panels AB61 and AB62 to different printed circuit board widths, these cover panels AB61 and AB62 are guided in the transverse grooves Qr in outer grooves N6 of the demetallization chambers EK61 and EK62. The adjustment of the width of the cover panels AB61 and AB62, which cannot be seen from the drawing, can be accomplished, for example, by a bellows-shaped configuration or by an overlapping arrangement of several plates.
Die Figuren 13 bis 15 zeigen Maßnahmen zur Verhinderung von Metallabscheidungen auf den Stirnflächen von Kontaktierrädern und auf den zugeordneten Antriebswellen. Entsprechende Kontaktierräder können beispielsweise bei den in den Figuren 1, 4, 6 und 8 dargestellten Galvanisiereinrichtungen eingesetzt werden.Figures 13 to 15 show measures to prevent metal deposits on the end faces of contacting wheels and on the associated drive shafts. Corresponding contacting wheels can be used, for example, in the galvanizing devices shown in FIGS. 1, 4, 6 and 8.
Figur 13 zeigt ein oberes Kontaktierrad K72, das auf eine Antriebswelle Aw72 aufgesetzt und mit dieser verschweißt ist. Auf die von der Antriebswelle Aw72 abgewandte Stirnseite des oberen Kontaktierrades K72 ist eine Abdeckung Abd720 aufgebracht, während auf die wellenseitige Stirnseite eine ringförmige Abdeckung Abd721 aufgebracht ist. Die wellenseitige Abdeckung Abd721 ist mit einer auf die Antriebswelle Aw72 aufgebrachten hohlzylindrischen Abdeckung Abd 722 einstückig verbunden. Gemäß Figur 14 steht der im Querschnitt pilzförmige Umfangsbereich des oberen Kontaktierrades K72 über den restlichen Radbereich über, so daß die Abdeckungen Abd720 und Abd721 in den entsprechenden zylindrischen Überstand eingepreßt werden können.Figure 13 shows an upper contact wheel K72, which is placed on a drive shaft Aw72 and welded to it. A cover Abd720 is applied to the end face of the upper contacting wheel K72 facing away from the drive shaft Aw72, while an annular cover Abd721 is applied to the end face on the shaft side. The shaft-side cover Abd721 is connected in one piece to a hollow-cylindrical cover Abd 722 attached to the drive shaft Aw72. According to FIG. 14, the cross-section of the upper contacting wheel K72, which is mushroom-shaped in cross section, projects beyond the remaining wheel area, so that the covers Abd720 and Abd721 can be pressed into the corresponding cylindrical projection.
Gemäß Figur 13 ist das äußere Ende der Antriebswelle Aw72 mit einer Gewindebohrung GB72 versehen, in welche ein Kontaktier-Endstück KE72 eingeschraubt wird. Das Kontaktier-Endstück KE72 kann somit nach einem entsprechenden Verschleiß leicht ausgetauscht werden.According to FIG. 13, the outer end of the drive shaft Aw72 is provided with a threaded hole GB72, into which a contacting end piece KE72 is screwed. The KE72 contact end piece can thus be easily replaced after it has been worn out.
Das obere Kontaktierrad K72, die Antriebswelle Aw72 und das Kontaktier-Endstück KE72 bestehen aus korrosionsbeständigem Titan, während die Abdeckungen Abd720, Abd721 und Abd722 aus hochmolekularem Polyethylen bestehen, das sich durch seine guten Gleiteigenschaften auszeichnet. Das Kontaktier-Endstück KE72 wird zur Verschleißreduzierung einer Nitrierhärtung unterzogen, wobei sich eine Oberflächenschicht aus Titannitrid (TiN) bildet.The upper contact wheel K72, the drive shaft Aw72 and the contact end piece KE72 are made of corrosion-resistant titanium, while the covers Abd720, Abd721 and Abd722 are made of high-molecular polyethylene, which is characterized by its good sliding properties. The KE72 contact end piece is subjected to nitriding to reduce wear, forming a surface layer of titanium nitride (TiN).
Figur 15 zeigt ein unteres Kontaktierrad K71, das auf eine Antriebswelle Aw71 aufgesetzt und mit dieser verschweißt ist. Auf die von der Antriebswelle Aw71 abgewandte Stirnseite des unteren Kontaktierrades K71 ist eine Abdeckung Abd710 aufgebracht, während auf die wellenseitige Stirnseite eine ringförmige Abdeckung Abd711 aufgebracht ist.Figure 15 shows a lower contact wheel K71, which is placed on a drive shaft Aw71 and welded to it. A cover Abd710 is applied to the end face of the lower contacting wheel K71 facing away from the drive shaft Aw71, while an annular cover Abd711 is applied to the end face on the shaft side.
Auf die Antriebswelle Aw71 ist eine hohlzylindrische Abdeckung Abd712 aufgebracht, die einen Führungsbund Fb71 besitzt, der in radialer Richtung über das untere Kontaktierrad K71 übersteht und in axialer Richtung an der Abdeckung Abd711 anliegt. Die Führungsbunde Fb71 der unteren Kontaktierräder K71 ermöglichen eine sichere Führung der durchlaufenden Leiterplatten.A hollow cylindrical cover Abd712 is applied to the drive shaft Aw71, which has a guide collar Fb71 which projects beyond the lower contact wheel K71 in the radial direction and bears against the cover Abd711 in the axial direction. The guide collars Fb71 of the lower contacting wheels K71 enable the continuous circuit boards to be guided securely.
Das äußere Ende der Antriebswelle Aw71 ist mit einer Gewindebohrung Gb71 versehen, in welche ein Kontaktier-Endstück KE71 eingeschraubt wird.The outer end of the drive shaft Aw71 is provided with a threaded hole Gb71 into which a contacting end piece KE71 is screwed.
Das untere Kontaktierrad K71, die Antriebswelle Aw71 und das Kontaktier-Endstück KE71 bestehen aus korrosionsbeständigem Titan, während die Abdeckungen Abd710, Abd711 und Abd712 aus hochmolekularem Polyethylen bestehen. Die Oberflächenschicht der Kontaktier-Endstücke KE71 besteht aus Titannitrid.The lower contacting wheel K71, the drive shaft Aw71 and the contacting end piece KE71 are made of corrosion-resistant titanium, while the covers Abd710, Abd711 and Abd712 consist of high-molecular polyethylene. The surface layer of the KE71 contact end pieces consists of titanium nitride.
Claims (42)
- Electroplating apparatus for plate-like workpieces, in particular printed circuit boards (Lp), to be treated while being conveyed horizontally and having at least one anode (A1; A21, A22; A3) disposed in the electrolyte and having rotatably disposed contacting devices (K1; K21, K22; K3) for the cathodic contacting of the workpieces being conveyed, characterized in that the contacting devices (K1; K21, K22; K3) are anodically connected in relation to at least one auxiliary cathode (H1; H21, H22; H3) disposed in the electrolyte.
- Electroplating apparatus according to Claim 1, characterized in that the contacting devices (K1) are formed by lower contacting wheels with which an upper pressure roller (Ar) is associated in each case.
- Electroplating apparatus according to Claim 1, characterized in that the contacting devices are formed by lower and upper contacting wheels disposed in pairs.
- Electroplating apparatus according to any of the preceding claims, characterized in that the contacting devices (K1; K21, K22) are disposed on both sides of the workpieces being conveyed horizontally.
- Electroplating apparatus according to Claim 1, characterized in that the contacting devices (K3) are formed by contacting rollers extending over the entire width of the workpieces being conveyed.
- Electroplating apparatus according to any of the preceding claims, characterized in that at least some contacting devices (K1; K21, K22; K3) are driven for the conveyance of the workpieces through the electrolyte.
- Electroplating apparatus according to Claim 2, characterized in that at least one lower auxiliary cathode (H1) is associated with the contacting devices (K1) formed by lower contacting wheels.
- Electroplating apparatus according to Claim 3, characterized in that at least one lower auxiliary cathode (H21) is associated with the contacting devices (K21) formed by lower contacting wheels, and in that at least one upper auxiliary cathode (H22) is associated with the contacting devices (K22) formed by upper contacting wheels.
- Electroplating apparatus according to any of the preceding claims, characterized in that a membrane (M) which is permeable to anions and impermeable to cations is disposed between a contacting device (K3) and the associated auxiliary cathode (H3).
- Electroplating apparatus according to any of the preceding claims, characterized in that demetallization chambers (EK1; EK21, EK22; EK3) in which at least one contacting device (K1; K21, K22; K3) and at least one auxiliary cathode (H1; H21, H22; H3) are disposed in each case are formed by shields (As1; As21, As22; As3) disposed in the electrolyte.
- Electroplating apparatus according to any of the preceding claims, characterized in that auxiliary guides (Hf1, Hf2) for flexible workpieces are mounted on the contacting devices (K1; K21).
- Electroplating apparatus according to Claim 1, characterized in that the contacting devices (K4) are formed by horizontally disposed contacting wheels.
- Electroplating apparatus according to Claim 12, characterized in that the contacting devices (K4) are driven.
- Electroplating apparatus according to Claim 12 or 13, characterized in that vertically aligned guide wheels (Fr41, Fr42) are disposed over the width of the workpieces being conveyed viewed from above and below the workpieces.
- Electroplating apparatus according to Claim 14, characterized in that the guide wheels (Fr41, Fr42) are driven for the conveyance of the workpieces through the electrolyte.
- Electroplating apparatus according to Claim 14 or 15, characterized in that the contacting devices (K4) are formed by horizontally disposed lower contacting wheels with which an upper guide wheel (Fr42) is associated in each case.
- Electroplating apparatus according to any of Claims 12 to 16, characterized in that the auxiliary cathode (H4) is formed by a vertically aligned strip which extends on the outside of the contacting devices (K4) in the direction of conveyance (Dr) of the workpieces.
- Electroplating apparatus according to Claim 1, characterized in that the contacting devices (K51, K52) are formed by lower and upper contacting wheels disposed in pairs on both sides of the workpieces being conveyed, mutually associated lower contacting wheels being disposed on a common lower drive shaft (Aw51) and mutually associated upper contacting wheels being disposed on a common upper drive shaft (Aw52).
- Electroplating apparatus according to Claim 18, characterized in that the lower drive shaft (Aw51) and the upper drive shaft (Aw52), viewed in the direction of conveyance of the workpieces, are only driven on one side.
- Electroplating apparatus according to Claim 18 or 19, characterized in that mutually associated lower contacting wheels are connected in an electrically conducting manner by the common lower drive shaft (Aw51) and mutually associated upper contacting wheels are connected in an electrically conducting manner by the common upper drive shaft (Aw52), in that the lower drive shaft (Aw51) and the upper drive shaft (Aw52) are electrically insulated from the electrolyte, and in that, viewed in the direction of conveyance of the workpieces, the cathode current is supplied only on one side of the drive shafts (Aw51, Aw52).
- Electroplating apparatus according to Claims 19 and 20, characterized in that, viewed in the direction of conveyance of the workpieces, the drive shafts (Aw51, Aw52) are driven on one side, and in that the cathode current is supplied on the oppositely situated side.
- Electroplating apparatus according to Claims 19, 20 or 21, characterized in that the drive shafts (Aw51, Aw52) are driven by means of a worm extending in the direction of conveyance of the workpieces.
- Electroplating apparatus according to any of Claims 18 to 22, characterized in that lower and upper guide wheels (Fr51, Fr52) mutually associated in pairs are disposed on the lower drive shaft (Aw51) and the upper drive shaft (Aw52).
- Electroplating apparatus according to any of Claims 20 to 23, characterized in that the drive shafts (Aw51, Aw52) are formed by a round copper rod (Kr) sheathed with titanium (Ti).
- Electroplating apparatus according to Claim 24, characterized in that a shrinkable sleeve (Ss) composed of electrically insulating material is applied to the drive shafts (Aw51, Aw52).
- Electroplating apparatus according to Claim 1, characterized in that the contacting devices (K61, K62) are formed by contacting rollers matched to the maximum width (b60) of the workpieces to be treated, and in that, when workpieces of smaller width (b61) are being conveyed, the regions, projecting laterally beyond the workpieces, of the anode (A61, A62) are shielded by at least one masking panel (AB61, AB62).
- Electroplating apparatus according to Claim 26, characterized in that a lower masking panel (AB61) is associated with a lower anode (A61), and in that an upper masking panel (AB62) is associated with an upper anode (A62).
- Electroplating apparatus according to Claim 26 or 27, characterized in that the width (b63) of the masking panel (AB61, AB62) is adjustable.
- Electroplating apparatus according to any of Claims 26 to 28, characterized in that the masking panel (AB61, AB62) is disposed so as to be displaceable transversely to the direction of conveyance (Dr).
- Electroplating apparatus according to any of Claims 26 to 29, characterized in that at least one auxiliary guide (Hf6) is associated with the workpieces being conveyed.
- Electroplating apparatus according to Claim 30, characterized in that the auxiliary guide (Hf6) is formed by lower and upper pressure wheels (Ar61, Ar62) which are disposed in pairs and whose axes (Ac61, Ac62) are set at an angle to the transverse direction (Qr).
- Electroplating apparatus according to any of Claims 26 to 31, characterized in that the contacting devices (K61, K62) are disposed in U-shaped demetallization chambers (EK61, EK62) in whose walls grooves (N6) are provided for guiding masking panels (AB61, AB62).
- Electroplating apparatus according to any of Claims 26 to 32, characterized in that, viewed in the transverse direction (Qr), the contacting devices (K61, K62) are made up of at least two roller segments (Ws61, Ws62).
- Electroplating apparatus according to Claims 32 and 33, characterized in that a crossbar (Qs61, Qs62) of the associated demetallization chamber (EK61, EK62) extends in each case between two roller segments (Ws61, Ws62).
- Electroplating apparatus according to any of Claims 2 to 4, characterized in that maskings (Abd710, Abd711, Abd720, Abd721) composed of electrically insulating material are applied to the end faces of the contacting wheels (K71, K72) for the purpose of shielding from the electrolyte.
- Electroplating apparatus according to Claim 35, characterized in that the maskings (Abd710, Abd711, Abd720, Abd721) are applied to both end faces of the contacting wheels (K71, K72).
- Electroplating apparatus according to Claim 35 or 36, characterized in that maskings (Abd712, Abd722) composed of electrically insulating material are also applied to the drive shafts (Aw71, Aw72) of the contacting wheels (K71, K72).
- Electroplating apparatus according to Claim 37, characterized in that guide collars (Fb71) for the lateral guidance of the workpieces being conveyed are applied to the maskings (Abd711) of the drive shafts (Aw71) of the lower contacting wheels (K71).
- Electroplating apparatus according to any of Claims 35 to 38, characterized in that plate-like maskings (Abd710, Abd711, Abd720, Abd721) are applied to the end faces of the contacting wheels (K71, K72).
- Electroplating apparatus according to any of Claims 35 to 39, characterized by maskings (Abd710, Abd711, Abd712, Abd720, Abd721, Abd722) composed of polyethylene.
- Electroplating apparatus according to any of Claims 35 to 40, characterized by contacting wheels (K71, K72) composed of titanium.
- Electroplating apparatus according to any of Claims 35 to 41, characterized in that the drive shafts (Aw71, Aw72) of the contacting wheels (K71, K72) comprise titanium.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP92907748A EP0578699B1 (en) | 1991-04-12 | 1992-04-09 | Galvanisation device for plate-like workpieces, especially printed circuit boards |
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP91105887 | 1991-04-12 | ||
EP91105887 | 1991-04-12 | ||
DE4131377 | 1991-09-20 | ||
DE4131379 | 1991-09-20 | ||
DE4131377 | 1991-09-20 | ||
DE4131379 | 1991-09-20 | ||
DE4132144 | 1991-09-26 | ||
DE4132144 | 1991-09-26 | ||
DE19924211253 DE4211253A1 (en) | 1992-04-03 | 1992-04-03 | Electroplating appts. for plate-like parts esp. PCB |
DE4211253 | 1992-04-03 | ||
EP92907748A EP0578699B1 (en) | 1991-04-12 | 1992-04-09 | Galvanisation device for plate-like workpieces, especially printed circuit boards |
PCT/DE1992/000288 WO1992018669A1 (en) | 1991-04-12 | 1992-04-09 | Galvanisation device for plate-like workpieces, especially printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0578699A1 EP0578699A1 (en) | 1994-01-19 |
EP0578699B1 true EP0578699B1 (en) | 1995-07-12 |
Family
ID=27544625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP92907748A Expired - Lifetime EP0578699B1 (en) | 1991-04-12 | 1992-04-09 | Galvanisation device for plate-like workpieces, especially printed circuit boards |
Country Status (1)
Country | Link |
---|---|
EP (1) | EP0578699B1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10349392B3 (en) * | 2003-10-21 | 2004-12-23 | Höllmüller Maschinenbau GmbH | Demetallizing contact devices in galvanizing plants used in production of circuit boards or foils comprises chemically etching auxiliary electrode during electrolytic metallization and simultaneously demetallizing |
DE102004025827B3 (en) * | 2004-05-24 | 2005-06-30 | Höllmüller Maschinenbau GmbH | Electrical contacting device for circuit board or conductor foil passed through electrolytic cell using contacts alternating with transport rollers along each side edge |
WO2006136362A2 (en) * | 2005-06-22 | 2006-12-28 | Gebr. Schmid Gmbh & Co. | Device for treatment of surfaces and planar objects |
DE102007055338A1 (en) | 2007-11-19 | 2009-05-28 | Rena Sondermaschinen Gmbh | Apparatus and method for the electrical contacting of goods in electrolytic continuous installations |
DE102009023767A1 (en) | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Device and method for the electrical contacting of goods in electroplating plants |
DE102009057466A1 (en) | 2009-12-03 | 2011-06-09 | Hübel, Egon, Dipl.-Ing. (FH) | Device and method for the electrical contacting of items to be treated in galvanizing plants |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19736352C1 (en) | 1997-08-21 | 1998-12-10 | Atotech Deutschland Gmbh | Apparatus for contacting flat items in continuous galvanising installations |
EP0950729A3 (en) * | 1998-03-23 | 2006-05-10 | Höllmüller Maschinenbau GmbH | Galvanisation device for plate-like workpieces, especially printed circuit boards |
-
1992
- 1992-04-09 EP EP92907748A patent/EP0578699B1/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10349392B3 (en) * | 2003-10-21 | 2004-12-23 | Höllmüller Maschinenbau GmbH | Demetallizing contact devices in galvanizing plants used in production of circuit boards or foils comprises chemically etching auxiliary electrode during electrolytic metallization and simultaneously demetallizing |
DE102004025827B3 (en) * | 2004-05-24 | 2005-06-30 | Höllmüller Maschinenbau GmbH | Electrical contacting device for circuit board or conductor foil passed through electrolytic cell using contacts alternating with transport rollers along each side edge |
WO2006136362A2 (en) * | 2005-06-22 | 2006-12-28 | Gebr. Schmid Gmbh & Co. | Device for treatment of surfaces and planar objects |
WO2006136362A3 (en) * | 2005-06-22 | 2008-02-28 | Schmid Gmbh & Co Geb | Device for treatment of surfaces and planar objects |
JP2008544086A (en) * | 2005-06-22 | 2008-12-04 | ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー | Device for processing flat and planar objects |
DE102007055338A1 (en) | 2007-11-19 | 2009-05-28 | Rena Sondermaschinen Gmbh | Apparatus and method for the electrical contacting of goods in electrolytic continuous installations |
DE102009023767A1 (en) | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Device and method for the electrical contacting of goods in electroplating plants |
DE102009057466A1 (en) | 2009-12-03 | 2011-06-09 | Hübel, Egon, Dipl.-Ing. (FH) | Device and method for the electrical contacting of items to be treated in galvanizing plants |
Also Published As
Publication number | Publication date |
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EP0578699A1 (en) | 1994-01-19 |
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