EP0578699B1 - Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes - Google Patents

Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes Download PDF

Info

Publication number
EP0578699B1
EP0578699B1 EP92907748A EP92907748A EP0578699B1 EP 0578699 B1 EP0578699 B1 EP 0578699B1 EP 92907748 A EP92907748 A EP 92907748A EP 92907748 A EP92907748 A EP 92907748A EP 0578699 B1 EP0578699 B1 EP 0578699B1
Authority
EP
European Patent Office
Prior art keywords
contacting
electroplating apparatus
workpieces
wheels
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP92907748A
Other languages
German (de)
English (en)
Other versions
EP0578699A1 (fr
Inventor
Daniel Hosten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19924211253 external-priority patent/DE4211253A1/de
Application filed by Siemens AG filed Critical Siemens AG
Priority to EP92907748A priority Critical patent/EP0578699B1/fr
Priority claimed from PCT/DE1992/000288 external-priority patent/WO1992018669A1/fr
Publication of EP0578699A1 publication Critical patent/EP0578699A1/fr
Application granted granted Critical
Publication of EP0578699B1 publication Critical patent/EP0578699B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Definitions

  • Electroplating devices are known in which plate-shaped workpieces, such as. B. printed circuit boards, are transported in a horizontal pass through an electrolyte, the feed and the cathodic contacting of the workpieces passing through being arranged in pairs along one side of the conveying path in the electrolyte contacting wheels.
  • shields extending in the direction of passage are provided with sealing strips resting on the respective workpiece (DE-A-32 36 545).
  • the use of a shield cannot completely prevent the electrolyte from accessing the lateral contacting area of the workpieces and the contacting wheels.
  • spongy metal deposits occur in the contact area, a rapid deterioration of the rolling contacts and unfavorable layer thickness distributions of the electrodeposited layers or a strong scattering of the layer thickness.
  • the contacting wheels have to be removed again and again to remove the unwanted metal deposits, cleaned of the metal deposits and reassembled.
  • a galvanizing device for metal strips which are transported in a horizontal pass through an electrolyte, the feed being carried out by rollers arranged in pairs.
  • the level of the electrolyte is adjusted so that it lies slightly above the metal strips passing through.
  • the upper rolls are designed as contact rolls.
  • metallic shields are arranged parallel to the contact rolls, which are at a negative potential that is slightly lower than the negative potential of the contact rolls. This measure results in metal deposits on the shields, while metal deposits on the contact rollers are prevented.
  • the invention specified in claim 1 is based on the problem of ensuring reliable and maintenance-friendly cathodic contacting of the workpieces passing through in a galvanizing device for plate-shaped workpieces to be treated in a horizontal pass.
  • the invention is based on the finding that when using contacting members rotatably arranged in the electrolyte, such as contacting wheels, undesired metal deposits can be eliminated on the spot by the arrangement of an associated auxiliary cathode against which the contacting members are anodically connected.
  • the advantages achieved by the invention are, in particular, that undesired metal deposits on the contacting elements can be automatically removed again during the electroplating operation before the contacting of the workpieces is impaired and thus the layer thickness of the electrodeposited layers is scattered.
  • the embodiment according to claim 2 enables a particularly simple contacting of the workpieces which are guided through the electrolyte between the lower contacting wheels and the upper pressure rollers.
  • the paired arrangement of lower and upper contacting wheels results in a particularly efficient cathodic contacting of the workpieces passing through.
  • the cathode current is fed to both sides of the workpieces, so that a particularly uniform layer thickness distribution can be achieved in the galvanic metal deposition.
  • the development according to claim 5 with a contacting roller as the contacting member is particularly suitable for printed circuit boards in which no conductive tracks are to be produced by the galvanic metal deposition, but rather only plated-through holes.
  • the driven contacting members also take on the task of a transport device, so that the entire electroplating device is of a particularly simple construction.
  • a particularly efficient demetallization results if a lower auxiliary cathode is assigned to the lower contacting wheels. If lower and upper contacting wheels are used, then lower and upper auxiliary cathodes are assigned in a corresponding manner.
  • the embodiment according to claim 9 enables demetalization of the contacting elements in a particularly maintenance-friendly manner without simultaneous metal deposition on the associated auxiliary cathode. Removal and cleaning of the auxiliary cathode can thus be completely eliminated.
  • demetallization chambers are formed by shields arranged in the electrolyte, which enable optimal demetallization of the contacting elements without impairing the galvanic metal deposition on the workpieces.
  • the embodiment according to claim 11 enables a safe Guiding flexible workpieces, such auxiliary guides being particularly suitable for the inner layers of printed circuit boards.
  • the sealing of the corresponding shafts and the power supply to these shafts are considerably simplified with the horizontal arrangement of the contacting wheels.
  • the horizontal arrangement of the contacting wheels considerably simplifies the formation of demetallization chambers, shields and the like being at least largely dispensed with.
  • the embodiment according to claim 13 enables a further improvement in the cathodic contacting of the workpieces.
  • the friction that occurs between the contacting wheels and the workpieces always ensures shiny metallic surfaces in the contacting area.
  • the embodiment according to claim 14 enables particularly secure guidance of the workpieces passing through, so that, for example, flexible workpieces, such as the inner layers of printed circuit boards, can also be treated.
  • the guide wheels then form a main drive for the safe transport of the workpieces through the electrolyte.
  • the embodiment according to claim 16 enables a further simplification, in particular without upper contacting wheels.
  • the metal deposits on the auxiliary cathode arranged as a strip can be monitored particularly easily.
  • the embodiment according to claim 19 enables a one-sided arrangement of the drive of the contacting members. In addition to reducing the drive effort by 50%, this also creates space on the opposite side.
  • the development according to claim 20 enables the cathode current to be supplied on one side of the electroplating device, the drive and the supply of the cathode current preferably being arranged on opposite sides of the electroplating device.
  • the embodiment according to claim 22 enables particularly high current densities, since when a worm drive is viewed in the direction of passage of the workpieces, particularly short distances between the contacting elements or between the drive shafts can be achieved.
  • the development according to claim 23 enables the guiding wheels arranged on the drive shafts to guide the continuous workpieces with little effort, so that, for example, flexible workpieces can also be treated like the inner layers of printed circuit boards.
  • the embodiment according to claim 24 ensures a safe transmission of the cathode current through the copper round rod, while the titanium sheath offers reliable protection against corrosion.
  • the electrical insulation from the electrolyte is achieved in a particularly simple manner by a shrink tube made of electrically insulating material.
  • the contacting rollers enable reliable cathodic contacting of workpieces of different widths, while the cover screen shields the anode regions not directly opposite the workpieces and thus enables a uniform layer thickness distribution of the electrodeposited metal layers. Without this shielding, the protrusion of the anode on the adjacent side of the workpieces passing through would lead to higher current densities and thus to partially higher layer thicknesses of the electrodeposited metal layers.
  • the embodiment according to claim 27 enables effective shielding of a lower anode and an upper anode by separate cover plates.
  • the embodiment according to claim 28 enables a particularly simple adaptation of the cover panel to the respective width of the workpieces to be treated. According to claim 29, this adaptation can then be further simplified by a cover panel that can be moved transversely to the direction of passage.
  • the embodiment according to claim 32 enables with little Effort to accommodate the contacting elements in the assigned demetallization chambers, the walls of which are also used to guide cover panels at the same time.
  • the contacting members are composed of at least two roller segments, this enables a particularly simple and stable design of the assigned demetallization chamber.
  • a cross bar of the assigned demetallization chamber can then be arranged between two roller segments.
  • the development according to claim 38 ensures safe lateral guidance of the workpieces passing through with little effort.
  • the covers of the end faces of the contacting wheels can be applied, for example, in the form of paint or by swirl sintering.
  • the application of plate-shaped covers according to claim 39 is particularly stable and durable and can also be implemented with little effort.
  • FIG. 1 shows a cross section through the left-hand area of a galvanizing device for printed circuit boards Lp, which are transported in a horizontal position and in a horizontal direction of passage by an electrolyte which cannot be identified in more detail.
  • This electrolyte is accommodated in a container B1, of which two side wall parts Sw11 and Sw12, a lower end plate Au1 and an upper end plate Ao1, can be seen in FIG. 1 and arranged in layers and connected by screws Sb.
  • the lower end plate Au1 which consists for example of titanium, forms a lower anode A1 together with spherical anode material Am.
  • the anode material Am is copper balls.
  • lower contacting members K1 designed as contacting wheels are provided, each of which is driven via a drive shaft Aw1, a worm wheel Sr1 arranged thereon and a worm Sch1 extending in the direction of passage.
  • the drive shafts Aw1 of the lower contacting elements K1 are supported by bushings Bu1 and Bu2 in the side wall parts Sw11 and Sw12, the projecting ends of the drive shafts Aw1 carrying V-ring seals V.
  • an upper pressure roller Ar is assigned to each lower contact element K1.
  • These upper pressure rollers Ar which are provided with an elastic 0-ring 0 on their circumference, are arranged obliquely in order to ensure safe cathodic contacting and safe transport of the printed circuit boards Lp through the galvanizing device.
  • the one against the lower contact organs K1 acting pressure of the pressure rollers Ar is generated in each case by a compression spring Df supported on the upper end plate Ao1 and a pressure piece Ds lying on the axis Ac of this pressure roller Ar.
  • the axes Ac are arranged in recesses Ap of the side wall part Sw12, which enable the pressure rollers Ar to move upward to adapt to different thicknesses of the continuous printed circuit boards Lp. Accordingly, an upper shield Aso assigned to the upper pressure rollers Ar is also guided in corresponding slots Sz of the side wall part Sw12 so that it can move in the vertical direction.
  • circuit boards Lp are cathodically contacted via the lower contacting members K1, their drive shafts Aw1 and carbon brushes Kb, which are connected to the negative pole of a galvanizing power source GS1.
  • the positive pole of this electroplating current source Gs1 is connected to the lower end plate Au1 of the lower anode A1.
  • This plate-shaped, for. B. made of stainless steel auxiliary cathodes H1 are connected to the negative pole of a demetallization power source ES1, the positive pole of which is connected to the lower contacting elements K1 via the carbon brushes Kb and the drive shafts Aw1.
  • the lower contacting elements K1 are thus connected cathodically with respect to the lower anode A1 and anodically with respect to the associated auxiliary cathodes H1. Accordingly, copper is deposited on the lower contacting members K1 during the electroplating process, this undesirable copper deposit is electrolytically removed again in the demetallization chamber EK1 and is then deposited on the associated auxiliary cathode H1.
  • the auxiliary cathodes H1 can then be removed from the demetallization chamber EK1 from time to time via covers D1 which are detachably attached to the side wall part Sw11 and the copper deposits can be removed.
  • the decoupling of the lower contacting members K1, which is preferably carried out continuously, enables optimal cathodic contacting of the continuous printed circuit boards Lp, with no significant wear of the lower contacting members K1 being recorded.
  • auxiliary guide Hf1 which consists of electrically insulating material and is placed on a lower contacting element K1, is indicated in FIG. 1 by dash-dotted lines.
  • FIG. 2 shows the paired arrangement of lower contact elements K1 and upper pressure rollers Ar and the arrangement of auxiliary cathodes H1, which are each assigned to a lower contact element K1.
  • Insulating pieces Is arranged between the individual contacting members K1 serve as additional shields which, in addition to the shields As1 already mentioned, separate the demetallization chamber EK1 from the rest of the galvanizing area.
  • FIG. 3 shows a cross section corresponding to FIG. 1 through an entire electroplating device, in which the continuous printed circuit boards Lp are guided on both sides between the lower contacting members K1 and the upper pressure rollers Ar. It can be seen that separate electroplating current sources Gs1. On both sides of the continuous path and demetallization current sources ES1 are arranged. The current sources can also be divided into several separate current sources when viewed in the direction of flow. This enables an optimal regulation of the electroplating current during the passage of the printed circuit boards Lp.
  • FIG. 4 shows a partial cross section through a second embodiment of an electroplating device according to the invention.
  • printed circuit boards Lp are transported in a horizontal position and in the horizontal direction of passage through an electrolyte which is accommodated in a container labeled B2.
  • the container B2 is formed by two layered side wall parts Sw21 and Sw22, a lower end plate Au2 and an upper end plate Ao2.
  • the lower end plate Au2 together with spherical anode material Am forms a lower anode A21, while the upper end plate Ao2 carries an inert upper anode A22 via holder Ha.
  • Lower contacting members K21 and upper contacting members K22 designed as contacting wheels are provided for the transport and for the cathodic contacting of the printed circuit boards Lp.
  • the paired lower and upper contacting members K21 and K22 are both driven, the drive being provided via a worm gear Sch2 extending in the direction of travel, a worm wheel Sr21 arranged on the drive shaft Aw21 of the lower contacting member K21 and another on the drive shaft Aw22 of the upper contacting member K22 Wheel R is done.
  • the upper contacting members K22 are arranged obliquely and are pressed resiliently against the lower contacting members K21 in a manner not shown in FIG. 4.
  • the cathodic contacting of the printed circuit boards Lp takes place via the lower contacting members K21 and independently of this via the upper contact organs K22.
  • the drive shafts Aw21 of the lower contacting members K21 are connected to the negative pole of a lower electroplating current source GS21 via carbon brushes (not shown in detail), the positive pole of which is connected to the lower anode A21 via a lower current rail SSu which extends in the direction of passage.
  • the drive shafts Aw22 of the upper contacting members K22 are connected to the negative pole of an upper electroplating power source GS22 via carbon brushes (not shown in more detail), the positive pole of which is connected via an upper current rail Sso extending in the direction of passage, the upper connecting plate Ao2 and the holder Ha to the upper one Anode A22 is connected.
  • a lower shielding metallization EK21 is formed by a lower shield As21, in which the lower contacting members K21 and the lower auxiliary cathodes H21 assigned to them are located.
  • the upper auxiliary cathodes H21 which are fastened in detachable covers D21, are connected to the negative pole of a lower demetallization current source ES21, the positive pole of which is again connected to the drive shafts Aw21 of the lower contacting members K21 via the carbon brushes (not shown).
  • an upper shielding chamber EK22 is formed by an upper shielding As22, in which the upper contacting elements K22 and the upper auxiliary cathodes H22 associated therewith are located.
  • the upper auxiliary cathodes H22 fastened in detachable covers D22 are connected to the negative pole of an upper demetallization current source Es22, the positive pole of which is again connected to the drive shafts via the carbon brushes (not shown) Aw22 of the upper contact organs K22 are connected.
  • auxiliary guides can be placed on the upper contacting members K22, as is indicated in FIG. 4 by an auxiliary guide Hf2.
  • the materials in the exemplary embodiment shown in FIG. 4 are copper-coated with titanium for the lower and upper contacting members K21 and K22 with the associated drive shafts Aw21 and Aw22, as well as for the lower busbar Ssu and the upper busbar Sso.
  • the lower end plate Au2 and the upper end plate Ao2 are made of titanium, while the inert upper anode A22 is made of platinized titanium.
  • the auxiliary cathodes H21 and H22, which can be removed from the respective demetallization chambers EK21 and EK22, are preferably made of stainless steel.
  • Parts to be electrically insulated, such as the shields As21 and As22 and the side wall parts Sw21 and Sw22, are made of PVC, for example.
  • FIG. 5 shows a highly simplified schematic illustration of a third embodiment of an electroplating device according to the invention.
  • the circuit boards Lp to be electroplated are moved here in the direction of passage Dr by an electrolyte which cannot be identified in more detail, the transport and the cahodic contacting being carried out by contacting members K3 driven in the direction of the pillar U.
  • These contacting elements K3 are contacting rollers which consist of a copper-clad titanium tube and extend over the entire width of the continuous printed circuit boards Lp.
  • the roller-shaped contacting elements K3 are immersed in a demetallization chamber EK3, which is formed by a U-shaped shield As3 and seals Ad lying on the contacting element K3.
  • this demetallization chamber EK3 there is a plate-shaped auxiliary cathode H3, to which the contacting element K3 is connected anodically. Undesired metal deposits on the contacting element K3 are thus removed electrolytically again, a membrane M preventing the corresponding metal from being deposited on the auxiliary cathode H3.
  • the membrane M is arranged between the contacting element K3 and the auxiliary cathode H3 and is designed as a so-called anion membrane, which is permeable to anions and impermeable to cations.
  • Anodes A3 are arranged in the electrolyte on both sides of the demetallization chamber EK3, which anodes A3 are again formed here by spherical anode material Am.
  • FIG. 6 shows a cross section through the left area, seen in the direction of passage, of an electroplating device for printed circuit boards Lp, which are transported in a horizontal position and in the horizontal direction of passage by an electrolyte which cannot be identified in more detail.
  • This electrolyte is accommodated in a container B4, of which a left side wall Sw4 made of an electrically insulating plastic, a lower end plate Au4 and an upper end plate Ao4 can be seen in FIG.
  • the lower end plate Au4 and the upper end plate Ao4 are made of titanium, for example.
  • an upper anode basket Ak42 hangs under the upper end plate Ao4, which together with the spherical anode material Am located therein forms an upper anode A42.
  • the anode baskets Ak41 and Ak42 are made of expanded titanium, for example, while the anode material Am in the exemplary embodiment shown is copper balls.
  • contacting elements K4 are provided, which are designed as horizontally aligned lower contacting wheels.
  • the vertically aligned drive shafts Aw4 of the contacting elements K4 are mounted in the side wall Sw4 and are electrically insulated upwards and passed through the upper end plate Ao4.
  • the drive of the drive shafts Aw4 is indicated in FIG. 2 by arrows Pf41, while the supply of the cathode current to the drive shaft Aw4 is indicated in FIG. 1 by an arrow Pf42.
  • the contacting elements K4 can also be designed such that the thin edge region in which the printed circuit boards Lp rest resiliently presses upwards.
  • Lower and upper guide wheels Fr41 and Fr42 arranged in pairs across the width of the printed circuit boards Lp are provided for the transport and safe guidance of the printed circuit boards Lp.
  • the lower guide wheels Fr41 are spaced apart on a lower drive shaft Aw41, while the upper guide wheels Fr42 are spaced apart are arranged to each other on an upper drive shaft Aw42.
  • An outer upper guide wheel Fr42 is assigned to a contacting element K4 in such a way that the circuit board Lp is pressed against this contacting element K4.
  • the drive shafts Aw41 and Aw42 can be carried out via bevel gears or spur gears and a worm.
  • the drive shafts Aw41 and Aw42 and the guide wheels Fr41 and Fr42 consist either of electrically insulating material or of metal with an electrically insulating sheathing.
  • a demetallization chamber EK4 which extends in the direction of travel Dr (see FIG. 7) of the printed circuit boards Lp and is closed to the outside by a cover D4 in a liquid-tight manner.
  • an auxiliary cathode H4 which is formed by a vertically oriented band, which also extends in the direction of passage Dr.
  • the contacting members K4 are anodically connected, so that undesired copper deposits on the contacting members K4 in the demetallization chamber EK4 are continuously removed electrolytically and are then deposited on the auxiliary cathode H4.
  • the band-shaped auxiliary cathode H4 can then be moved further in the direction of travel Dr if necessary.
  • the auxiliary cathode H4 can, for example, be drawn off from a supply roll on one side and be taken up again from a corresponding roll on the other side.
  • the contacting elements K4 are seen in the direction of passage Dr preferably arranged on both sides of the continuous circuit boards Lp.
  • the cross section shown in FIG. 6 can be supplemented by a right-hand part of the electroplating device which is designed with mirror symmetry.
  • FIG. 8 shows a cross section through an electroplating device for through-contacting and electroplating printed circuit boards Lp, which are transported in a horizontal position and in the horizontal direction of passage through an electrolyte which cannot be identified in more detail.
  • This electrolyte is accommodated in a container B5, which is formed by a side wall Sw51 arranged on the left in the drawing, a side wall Sw52 arranged on the right, a lower end plate Au5 and an upper end plate Ao5.
  • the side walls Sw51 and Sw52 consist of an electrically insulating plastic, such as. B. PVC, while the lower end plate Au5 and the upper end plate Ao5 are made of titanium, for example.
  • anode basket Ak51 On the lower end plate Au5 there is a lower anode basket Ak51 which, together with the spherical anode material Am located therein, forms a lower anode A51.
  • an upper anode basket Ak52 hangs under the upper end plate Ao5 and, together with the spherical anode material Am located therein, forms an upper anode A52.
  • the anode baskets Ak51 and Ak52 are made of expanded titanium, for example, while the anode material Am in the exemplary embodiment shown is copper balls.
  • Lower contacting members K51 and upper contacting members K52 are provided for the cathodic contacting of the printed circuit boards Lp, which are formed by lower and upper contacting wheels arranged in pairs on both sides of the continuous printed circuit boards Lp. As can be seen in FIG. 8, lower and upper contacting elements K51 and K52 each the lateral edge area of the continuous circuit boards Lp. Opposing lower contacting members K51 are arranged on a common lower drive shaft Aw51, which is formed by a titanium Ti-coated copper round rod Kr, the electrical insulation from the electrolyte being brought about by an outer shrink tube Ss made of PE or PTFE. Between the two lower contacting members K51 are on the lower drive shaft Aw51 spaced lower guide wheels Fr51, which consist for example of soft PVC.
  • the left end of the lower drive shaft Aw51 in the cross section shown is passed through the side wall Sw51, so that the supply of the cathode current to the lower drive shaft Aw51, indicated by an arrow Pf51, can take place outside the galvanizing device.
  • a worm wheel Sr5 is placed on the lower drive shaft Aw51, which is driven by a worm gear Sch5 extending in the direction of passage.
  • Opposing upper contacting elements K52 are arranged on a common upper drive shaft Aw52, which is formed by a copper round rod Kr coated with titanium Ti, the electrical insulation from the electrolyte again being accomplished here by an outer shrink tube Ss made of PE or PTFE. Between the two upper contacting elements K52 there are upper guide wheels Fr52 which are arranged at a distance from one another on the upper drive shaft Aw52 and which form pairs of wheels with the lower guide wheels Fr51 and again consist, for example, of soft PVC. The left end of the upper drive shaft Aw52 in the cross section shown is passed through the side wall Sw51, so that here too the supply of the cathode current to the upper drive shaft Aw52 indicated by an arrow Pf52 is outside the galvanizing device can take place.
  • a gear Zr5 is placed on the upper drive shaft Aw52, which is driven by the worm gear Sr5. It can be seen that this gear Zr5, the worm gear Sr5 and the worm Sch5 are accommodated in a recess Ap5 of the right side wall Sw52.
  • Shields As51 and As52 made of electrically insulating material arranged parallel to the side walls Sw51 and Sw52 form, together with corresponding cutouts in the side walls, lower demetallization chambers EK51 and upper demetallization chambers EK52, in which the lower contacting members K51 and the upper contacting members K52 and lower auxiliary cathodes H51 or upper auxiliary cathodes H52 assigned to them.
  • the lower and upper auxiliary cathodes H51 and H52 which are made, for example, of stainless steel, the lower and upper contacting elements K51 and K52 are anodically connected.
  • Unwanted copper deposits on the lower and upper contacting elements K51 and K52 are thus continuously removed electrolytically in the lower and upper demetallization chambers EK51 and EK52. This ongoing demetallization ensures optimal cathodic contacting of the continuous printed circuit boards Lp.
  • FIG. 9 shows a longitudinal section through an electroplating device for through-contacting and electroplating printed circuit boards Lp, which are transported in a horizontal position and in the horizontal direction of passage Dr by an electrolyte which cannot be identified in more detail.
  • This electrolyte is accommodated in a container B6, of which a lower end plate Au6 and an upper end plate Ao6 can be seen in FIG.
  • the end plates Au6 and Ao6 are made of titanium, for example.
  • On The lower end plate Au6 has several lower anode baskets Ak61 which, together with the spherical anode material Am contained therein, form one under anode A61.
  • upper anode baskets Ak62 which can be pulled out in the manner of a drawer in the transverse direction, hang in guides Fg under the upper end plate Ao6 and, together with the spherical anode material Am therein, form an upper anode A62.
  • the anode baskets Ak61 and Ak62 are made of expanded titanium, for example, while the anode material Am in the illustrated embodiment is copper balls.
  • Lower contacting elements K61 and upper contacting elements K62 are provided for the cathodic contacting of the printed circuit boards Lp and are formed by lower and upper contacting rollers arranged in pairs.
  • the contacting elements K61 and K62 also simultaneously form a transport device for feeding the printed circuit boards Lp in the direction of passage Dr.
  • Double arrows Pf6 indicate that the upper contacting elements K62 press resiliently against the lower contacting elements K61 and this also enables adaptation to different thicknesses of the continuous printed circuit boards Lp.
  • the lower contacting elements K61 are arranged in U-shaped demetallization chambers EK61, in which there are also lower auxiliary cathodes H61.
  • the upper contacting members K62 are arranged in U-shaped demetalization chambers EK62, in which there are also upper auxiliary cathodes H62.
  • the lower and upper contacting elements K61 and K62 are anodically connected. Unwanted copper deposits on the lower and upper contacting elements K61 and K62 are thus continuously removed electrolytically in the lower and upper demetallization chambers EK61 and EK62. This ongoing demetallization ensures optimal cathodic contacting of the continuous printed circuit boards Lp.
  • the lower contacting members K61 which are designed as contacting rollers, are composed of a plurality of roller segments Ws 61, viewed in the transverse direction Qr.
  • the demetallization chambers EK61 can then be stiffened by transverse webs Qs61 between two adjacent roller segments Ws61.
  • the upper contacting members K62 which can only be seen in FIG. 9, are correspondingly composed of roller segments Ws62, so that the upper demetalization chambers EK62 can be stiffened by crossbars Qs62.
  • the width of the contacting elements K61 and K62 is matched to printed circuit boards Lp with a maximum width b60, the passage of which between the lower anode A61 and the upper anode A62 can be seen from FIG. If, according to FIG. 12, circuit boards Lp with a smaller width B61 are to be galvanized, their transport in the direction of passage Dr and their cathodic contacting between the lower and upper contacting members K61 and K62 pose no difficulties. So that these printed circuit boards Lp do not run away in the transverse direction Qr during the passage, auxiliary guides Hf6 are provided which, according to FIG. 9, are formed by lower and upper pressure wheels Ar61 and Ar62 arranged in pairs. Those indicated by crosses in FIG.
  • Axes Ac61 and Ac62 of the lower and upper pressure wheels Ar61 and Ar62 are arranged at an angle to the transverse direction Qr, ie they are not exactly perpendicular to the plane of the drawing.
  • This adjustment of the axes Ac61 and Ac62 in the direction of travel Dr by an angle of attack of, for example, 2 ° causes the pressure wheels Ar61 and Ar62 to exert a force acting outwards in the transverse direction Qr on the printed circuit boards Lp and thereby ensure reliable guidance of the continuous circuit boards Lp.
  • cover panels AB61 and AB62 made of an electrically insulating material is matched to the width b61 of the circuit boards Lp running through here.
  • these cover panels AB61 and AB62 are guided in the transverse grooves Qr in outer grooves N6 of the demetallization chambers EK61 and EK62.
  • the adjustment of the width of the cover panels AB61 and AB62 can be accomplished, for example, by a bellows-shaped configuration or by an overlapping arrangement of several plates.
  • Figures 13 to 15 show measures to prevent metal deposits on the end faces of contacting wheels and on the associated drive shafts.
  • Corresponding contacting wheels can be used, for example, in the galvanizing devices shown in FIGS. 1, 4, 6 and 8.
  • Figure 13 shows an upper contact wheel K72, which is placed on a drive shaft Aw72 and welded to it.
  • a cover Abd720 is applied to the end face of the upper contacting wheel K72 facing away from the drive shaft Aw72, while an annular cover Abd721 is applied to the end face on the shaft side.
  • the shaft-side cover Abd721 is connected in one piece to a hollow-cylindrical cover Abd 722 attached to the drive shaft Aw72.
  • the cross-section of the upper contacting wheel K72 which is mushroom-shaped in cross section, projects beyond the remaining wheel area, so that the covers Abd720 and Abd721 can be pressed into the corresponding cylindrical projection.
  • the outer end of the drive shaft Aw72 is provided with a threaded hole GB72, into which a contacting end piece KE72 is screwed.
  • the KE72 contact end piece can thus be easily replaced after it has been worn out.
  • the upper contact wheel K72, the drive shaft Aw72 and the contact end piece KE72 are made of corrosion-resistant titanium, while the covers Abd720, Abd721 and Abd722 are made of high-molecular polyethylene, which is characterized by its good sliding properties.
  • the KE72 contact end piece is subjected to nitriding to reduce wear, forming a surface layer of titanium nitride (TiN).
  • Figure 15 shows a lower contact wheel K71, which is placed on a drive shaft Aw71 and welded to it.
  • a cover Abd710 is applied to the end face of the lower contacting wheel K71 facing away from the drive shaft Aw71, while an annular cover Abd711 is applied to the end face on the shaft side.
  • a hollow cylindrical cover Abd712 is applied to the drive shaft Aw71, which has a guide collar Fb71 which projects beyond the lower contact wheel K71 in the radial direction and bears against the cover Abd711 in the axial direction.
  • the guide collars Fb71 of the lower contacting wheels K71 enable the continuous circuit boards to be guided securely.
  • the outer end of the drive shaft Aw71 is provided with a threaded hole Gb71 into which a contacting end piece KE71 is screwed.
  • the lower contacting wheel K71, the drive shaft Aw71 and the contacting end piece KE71 are made of corrosion-resistant titanium, while the covers Abd710, Abd711 and Abd712 consist of high-molecular polyethylene.
  • the surface layer of the KE71 contact end pieces consists of titanium nitride.

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

Les pièces à galvaniser sont transportées selon une trajectoire horizontale par un électrolyte dans lequel est disposée au moins une anode (A1). Le contact cathodique des pièces en leur déplacement est réalisé par des organes de contact (K1) montés pivotants, par exemple par des roues de contact. Les dépôts métalliques indésirables sur les organes de contact (K1) sont éliminés électrolytiquement, selon la présente invention. A cet effet, les organes de contact (K1) sont mis en contact anodique relativement à au moins une cathode auxiliaire (H1) disposée dans l'électrolyte et il se forme alors, de préférence au moyen d'une protection (As1), une chambre de démétallisation (EK1) dans laquelle se trouvent les organes de contact (K1) et l'électrode auxiliaire (H1).

Claims (42)

  1. Dispositif de dépôt par électrolyse pour des pièces en forme de plaques notamment des plaquettes à circuits imprimés (Lp), devant être traitées alors qu'elles sont déplacées horizontalement, comportant au moins une anode (A1; A21,A22; A3), disposée dans l'électrolyte et des organes de contact (K1;K21,K22;K3), montés tournants et destinés à établir un contact cathodique avec les pièces en déplacement, caractérisé par le fait que les organes de contact (K1;K21,K22;K3) sont montées en anode par rapport à au moins une cathode auxiliaire (H1;H21,H22;H3) disposée dans l'électrolyte.
  2. Dispositif de dépôt par électrolyse suivant la revendication 1, caractérisé par le fait que les organes de contact (K) sont formés par des roues inférieures de contact, auxquelles est associé respectivement un galet presseur supérieur (Ar).
  3. Dispositif de dépôt par électrolyse suivant la revendication 1, caractérisé par le fait que les organes de contact sont formés par des roues de contact supérieures et inférieures, disposées par couples.
  4. Dispositif de dépôt par électrolyse suivant l'une des revendications précédentes, caractérisé par le fait que les organes de contact (K1;K21,K22) sont disposés des deux côtés des pièces qui se déplacent horizontalement.
  5. Dispositif de dépôt par électrolyse suivant la revendication 1, caractérisé par le fait que les organes de contact (K3) sont formés par des cylindres de contact, qui s'étendent sur toute la largeur des pièces en déplacement.
  6. Dispositif de dépôt par électrolyse suivant l'une des revendications précédentes, caractérisé par le fait qu'au moins quelques organes de contact (K1;K21,K22;K3) sont entraînés dans l'électrolyte pour le transport des pièces.
  7. Dispositif de dépôt par électrolyse suivant la revendication 2, caractérisé par le fait qu'au moins une cathode auxiliaire inférieure (H1) est associée aux organes de contact (K1) formés par des roues de contact inférieures.
  8. Dispositif de dépôt par électrolyse suivant la revendication 3, caractérisé par le fait qu'au moins une cathode auxiliaire inférieure (H21) est associée aux organes de contact (K21) formés par des roues inférieures de contact, et qu'au moins une cathode auxiliaire supérieure (H22) est associée aux organes de contact (K22) formés par des roues de contact supérieures.
  9. Dispositif de dépôt par électrolyse suivant l'une des revendications précédentes, caractérisé par le fait qu'une membrane (M), perméable aux anions et imperméable aux cations, est disposée entre un organe de contact (K3) et la cathode auxiliaire associée (H3).
  10. Dispositif de dépôt par électrolyse suivant l'une des revendications précédentes, caractérisé par le fait que des blindages (As1; As21,As22; As3) disposés dans l'électrolyte délimitent des chambres de démétallisation (EK1; EK21,EK22; EK3), dans lesquelles sont disposés respectivement au moins un organe de contact (K1; K21,K22; K3) et au moins une cathode auxiliaire (H1;H21,H22;H3).
  11. Dispositif de dépôt par électrolyse suivant l'une des revendications précédentes, caractérisé par le fait que des guides auxiliaires (Hf1, Hf2) pour des pièces flexibles sont disposés sur les organes de contact (K1;K21).
  12. Dispositif de dépôt par électrolyse suivant la revendication 1, caractérisé par le fait que les organes de contact (K4) sont formés par des roues de contact disposées horizontalement.
  13. Dispositif de dépôt par électrolyse suivant la revendication 12, caractérisé par le fait que les organes de contact (K3) sont entraînés.
  14. Dispositif de dépôt par électrolyse suivant la revendication 12 ou 13, caractérisé par le fait que des roues de guidage (Fr41, Fr42) orientées verticalement sont disposées au-dessus et au-dessous des pièces, sur toute la largeur des pièces en déplacement.
  15. Dispositif de dépôt par électrolyse suivant la revendication 14, caractérisé par le fait que les roues de guidage (Fr41, Fr42) sont entraînées pour le transport des pièces à usiner dans l'électrolyte.
  16. Dispositif de dépôt par électrolyse suivant la revendication 14 ou 15, caractérisé par le fait que les organes de contact (K4) sont formés par des roues de contact inférieures disposées horizontalement et auxquelles est associée respectivement une roue supérieure de guidage (Fr42).
  17. Dispositif de dépôt par électrolyse suivant l'une des revendications 12 à 16, caractérisé par le fait que la cathode auxiliaire (H4) est formée par une bande qui est orientée verticalement et qui s'étend sur la face extérieure des organes de contact (K4), dans la direction de déplacement (Dr) des pièces.
  18. Dispositif de dépôt par électrolyse suivant la revendication 1, caractérisé par le fait que les organes de contact (K51, K52) sont formés par des roues de contact supérieures et inférieures disposées par couples des deux côtés des pièces en déplacement, les roues de contact inférieures, associées entre elles, étant montées sur un arbre inférieur commun d'entraînement (Aw51), tandis que des roues supérieures de contact, associées entre elles, sont montées sur un arbre supérieur commun d'entraînement (Aw52).
  19. Dispositif de dépôt par électrolyse suivant la revendication 18, caractérisé par le fait que l'arbre inférieur d'entraînement (Aw51) et l'arbre supérieur d'entraînement (Aw52) sont entraînés uniquement d'un côté lorsque l'on considère le sens de déplacement des pièces.
  20. Dispositif de dépôt par électrolyse suivant la revendication 18 ou 19, caractérisé par le fait que des roues inférieures de contact, associées entre elles, sont reliées entre elles d'une manière électriquement conductrice par l'arbre inférieur commun d'entraînement (Aw51) et que les roues supérieures de contact, associées entre elles, sont reliées entre elles d'une manière électriquement conductrice par l'arbre supérieur commun d'entraînement (Aw52), que l'arbre inférieur d'entraînement (Aw51) et l'arbre supérieur d'entraînement (Aw52) sont électriquement isolés vis-à-vis de l'électrolyte et que le courant cathodique n'est envoyé, lorsqu'on regarde dans la direction de déplacement des pièces, que d'un côté des arbres d'entraînement (Aw51, Aw52).
  21. Dispositif de dépôt par électrolyse suivant les revendications 19 et 20, caractérisé par le fait que les arbres d'entraînement (Aw51, Aw52) sont entraînés d'un côté, lorsqu'on regarde dans la direction de déplacement des pièces, et que le courant cathodique est envoyé du côté opposé.
  22. Dispositif de dépôt par électrolyse suivant les revendications 19, 20 ou 21, caractérisé par le fait que les arbres d'entraînement (Aw51, Aw52) sont entraînés par l'intermédiaire d'une vis sans fin, qui s'étend dans la direction de déplacement des pièces.
  23. Dispositif de dépôt par électrolyse suivant l'une des revendications 18 à 22, caractérisé par le fait que des roues de guidage supérieures et inférieures (Fr51, Fr52), associées entre elles par couples, sont montées sur l'arbre inférieur d'entraînement (Aw51) et sur l'arbre supérieur d'entraînement (Aw52).
  24. Dispositif de dépôt par électrolyse suivant l'une des revendications 20 à 23, caractérisé par le fait que les arbres d'entraînement (Aw51, Aw52) sont formés d'une tige cylindrique en cuivre (Kr) gainée de titane (Ti).
  25. Dispositif de dépôt par électrolyse suivant la revendication 24, caractérisé par le fait qu'un tuyau rétractable (Ss) en un matériau électriquement isolant est emmanché sur les arbres d'entraînement (Aw51, Aw52).
  26. Dispositif de dépôt par électrolyse suivant la revendication 1, caractérisé par le fait que les organes de contact (K61,K62) sont formés de cylindres de contact, qui sont réglés sur la largeur maximale (b60) des pièces à traiter et que, lors du passage de pièces ayant une largeur inférieure (b61), les zones de l'anode (A61,A62), qui font saillie latéralement au-delà des pièces, sont protégés par au moins un écran de recouvrement (AB61, AB62).
  27. Dispositif de dépôt par électrolyse suivant la revendication 26, caractérisé par le fait qu'un écran inférieur de recouvrement (AB61) est associé à une anode, inférieure (A61) et qu'un écran supérieur de recouvrement (AB62) est associé à une anode supérieure (A62).
  28. Dispositif de dépôt par électrolyse suivant la revendication 26 ou 27, caractérisé par le fait que la largeur (b63) de l'écran de recouvrement (AB61, AB62) est réglable.
  29. Dispositif de dépôt par électrolyse suivant l'une des revendications 26 à 28, caractérisé par le fait que l'écran de recouvrement (AB61, AB62) est monté mobile transversalement à la direction de déplacement (Dr).
  30. Dispositif de dépôt par électrolyse suivant l'une des revendications 26 à 29, caractérisé par le fait qu'au moins un guidage auxiliaire (Hf6) est associé aux pièces en déplacement.
  31. Dispositif de dépôt par électrolyse suivant la revendication 30, caractérisé par le fait que le guidage auxiliaire (Hf6) est formé de roues presseuses inférieures et supérieures (Ar61, Ar62) qui sont montées par couples et dont les axes (Ac61, Ac62) sont disposés obliquement par rapport à la direction transversale (Qr).
  32. Dispositif de dépôt par électrolyse suivant la revendication 26 à 31, caractérisé par le fait que les organes de contact (K61, K62) sont disposés dans des chambres de démétallisation (EK61, EK62) en forme de U, dans les parois desquelles sont aménagées des rainures (N6) servant à guider des écrans de recouvrement (AB61, AB62).
  33. Dispositif de dépôt par électrolyse suivant l'une des revendications 26 à 32, caractérisé par le fait que les organes de contact (K61, K62) sont composés, lorsqu'on regarde dans la direction transversale (Qr), d'au moins deux segments de cylindres (Ws61, Ws62).
  34. Dispositif de dépôt par électrolyse suivant les revendications 32 et 33, caractérisé par le fait qu'une traverse (Qf61, Qf62) de la chambre associée de démétallisation (EK61, EK62) s'étend respectivement entre deux segments de cylindre (Ws61, Ws62).
  35. Dispositif de dépôt par électrolyse suivant l'une des revendications 2 à 4, caractérisé par le fait que des caches (Abd710, Abd711, Abd720, Abd721) en un matériau électriquement isolant sont appliqués sur les faces frontales des roues de contact (K71, K72) de manière à protéger de l'électrolyte.
  36. Dispositif de dépôt par électrolyse suivant la revendication 35, caractérisé par le fait que les caches (Abd710, Abd711, Abd720, Abd721) sont appliqués sur les deux faces frontales des roues de contact (K71, K72).
  37. Dispositif de dépôt par électrolyse suivant la revendication 35 ou 36, caractérisé par le fait que des caches (Abd712, Abd722) en un matériau électriquement isolant sont appliqués sur les arbres d'entraînement (Aw71, Aw72) des roues de contact (K71, K72).
  38. Dispositif de dépôt par électrolyse suivant la revendication 37, caractérisé par le fait que sur les caches (Abd711) des arbres d'entraînement (Aw71) de roues inférieures de contact (K61) sont prévus des collets de guidage (Fb71) destinés à guider latéralement les pièces en déplacement.
  39. Dispositif de dépôt par électrolyse suivant l'une des revendications 35 à 38, caractérisé par le fait que des caches en forme de plaques (Abd710, Abd711, Abd720, Abd721) sont appliqués sur les faces frontales des roues de contact (K71, K72).
  40. Dispositif de dépôt par électrolyse suivant l'une des revendications 35 à 39, caractérisé par des caches (Abd710, Abd711, Abd712, Abd720, Abd721, Abd722) en polyéthylène.
  41. Dispositif de dépôt par électrolyse suivant l'une des revendications 35 à 40, caractérisé par des roues de contact (K71, K72) en titane.
  42. Dispositif de dépôt par électrolyse suivant l'une des revendications 35 à 41, caractérisé par le fait que les arbres d'entraînement (Aw71, Aw72) des roues de contact (K71, K72) sont en titane.
EP92907748A 1991-04-12 1992-04-09 Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes Expired - Lifetime EP0578699B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP92907748A EP0578699B1 (fr) 1991-04-12 1992-04-09 Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
EP91105887 1991-04-12
EP91105887 1991-04-12
DE4131377 1991-09-20
DE4131377 1991-09-20
DE4131379 1991-09-20
DE4131379 1991-09-20
DE4132144 1991-09-26
DE4132144 1991-09-26
DE4211253 1992-04-03
DE19924211253 DE4211253A1 (de) 1992-04-03 1992-04-03 Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten
PCT/DE1992/000288 WO1992018669A1 (fr) 1991-04-12 1992-04-09 Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes
EP92907748A EP0578699B1 (fr) 1991-04-12 1992-04-09 Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes

Publications (2)

Publication Number Publication Date
EP0578699A1 EP0578699A1 (fr) 1994-01-19
EP0578699B1 true EP0578699B1 (fr) 1995-07-12

Family

ID=27544625

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92907748A Expired - Lifetime EP0578699B1 (fr) 1991-04-12 1992-04-09 Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes

Country Status (1)

Country Link
EP (1) EP0578699B1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10349392B3 (de) * 2003-10-21 2004-12-23 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Entmetallisieren von Kontaktmitteln in elektrolytischen Anlagen
DE102004025827B3 (de) * 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen
WO2006136362A2 (fr) * 2005-06-22 2006-12-28 Gebr. Schmid Gmbh & Co. Dispositif de traitement d'objets plats et minces
DE102007055338A1 (de) 2007-11-19 2009-05-28 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum elektrischen Kontaktieren von Gut in elektrolytischen Durchlaufanlagen
DE102009023767A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Vorrichtung und Verfahren zum elektrischen Kontaktieren von Gut in Galvanisieranlagen
DE102009057466A1 (de) 2009-12-03 2011-06-09 Hübel, Egon, Dipl.-Ing. (FH) Vorrichtung und Verfahren zum elektrischen Kontaktieren von Behandlungsgut in Galvanisieranlagen

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19736352C1 (de) 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
EP0950729A3 (fr) * 1998-03-23 2006-05-10 Höllmüller Maschinenbau GmbH Instalation de galvanisation pour pieces en forme de plaques, en particulier des plaquettes de circuits imprimés

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10349392B3 (de) * 2003-10-21 2004-12-23 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Entmetallisieren von Kontaktmitteln in elektrolytischen Anlagen
DE102004025827B3 (de) * 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen
WO2006136362A2 (fr) * 2005-06-22 2006-12-28 Gebr. Schmid Gmbh & Co. Dispositif de traitement d'objets plats et minces
WO2006136362A3 (fr) * 2005-06-22 2008-02-28 Schmid Gmbh & Co Geb Dispositif de traitement d'objets plats et minces
JP2008544086A (ja) * 2005-06-22 2008-12-04 ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー 平坦且つ平面的な物体を処理する装置
DE102007055338A1 (de) 2007-11-19 2009-05-28 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum elektrischen Kontaktieren von Gut in elektrolytischen Durchlaufanlagen
DE102009023767A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Vorrichtung und Verfahren zum elektrischen Kontaktieren von Gut in Galvanisieranlagen
DE102009057466A1 (de) 2009-12-03 2011-06-09 Hübel, Egon, Dipl.-Ing. (FH) Vorrichtung und Verfahren zum elektrischen Kontaktieren von Behandlungsgut in Galvanisieranlagen

Also Published As

Publication number Publication date
EP0578699A1 (fr) 1994-01-19

Similar Documents

Publication Publication Date Title
DE19717512C2 (de) Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
DE1621184C3 (de) Vorrichtung zum einseitigen Galvanisieren von Metallbändern
EP1007766B1 (fr) Dispositif et procede pour egaliser l'epaisseur de couches metalliques au niveau des points de mise en contact electriques sur un produit a traiter
DE4324330A1 (de) Verfahren zum elektrolytischen Behandeln von insbesondere flachem Behandlungsgut, sowie Anordnung, insbesondere zur Durchführung des Verfahrens
DE4418278C1 (de) Elektrolytisches Verfahren zur Leiterplattenbehandlung in horizontalen Durchlaufanlagen
DE4402596A1 (de) Elektrolytisches Verfahren in horizontalen Durchlaufanlagen und Vorrichtung zur Durchführung desselben
EP0578699B1 (fr) Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes
WO2013160160A2 (fr) Procédé et dispositif de dépôt électrolytique de métal sur une pièce
EP0668374A1 (fr) Procédé d'électrodéposition sur une ou deux faces d'une feuille mince en polymère revêtue d'une couche conductrice
DE2944852C2 (fr)
DE102012110284B3 (de) Sputterbeschichtungseinrichtung und Vakuumbeschichtungsanlage
EP0875605B1 (fr) Dispositif pour le revêtement métallique des bandes par voie électrogalvanique
EP0677599B1 (fr) Dispositif de traitement d'articles en particulier de revêtement par électrodéposition de plaques de circuits
WO1992018669A1 (fr) Installation de galvanisation pour pieces en forme de plaques, en particulier pour des plaquettes de circuits imprimes
WO1998049375A2 (fr) Dispositif pour le traitement electrolytique d'articles sous forme de plaquettes, et procede de protection electrique de zones marginales de tels articles lors du traitement electrolytique
EP0361029B1 (fr) Appareil pour le revêtement électrolytique de pièces en forme de plaque, notamment de cartes de circuits imprimés
DE19633797B4 (de) Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
WO2005028718A2 (fr) Systeme d'alimentation en courant dans un dispositif de traitement electrochimique
DE10065643C2 (de) Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut
WO1994003655B1 (fr) Procede et dispositif de traitement electrolytique d'articles particulierement plats
DE4417551A1 (de) Elektrolytisches Verfahren zum präzisen Behandeln von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens
DE4301742C2 (de) Vorrichtung zum Galvanisieren plattenförmiger Gegenstände, insbesondere von elektronischen Leiterplatten
DE60302560T2 (de) Durchlaufmetallisierungsanlage und verfahren zum elektrolytischen metallisieren von werkstücken
DE102004025827B3 (de) Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen
DE3206457C2 (fr)

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19931005

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH DE FR GB IT LI NL SE

17Q First examination report despatched

Effective date: 19941024

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH DE FR GB IT LI NL SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 19950712

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRE;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.SCRIBED TIME-LIMIT

Effective date: 19950712

Ref country code: GB

Effective date: 19950712

Ref country code: FR

Effective date: 19950712

Ref country code: BE

Effective date: 19950712

REF Corresponds to:

Ref document number: 125001

Country of ref document: AT

Date of ref document: 19950715

Kind code of ref document: T

REF Corresponds to:

Ref document number: 59202882

Country of ref document: DE

Date of ref document: 19950817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Effective date: 19951012

EN Fr: translation not filed
NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
GBV Gb: ep patent (uk) treated as always having been void in accordance with gb section 77(7)/1977 [no translation filed]

Effective date: 19950712

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Effective date: 19960409

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Effective date: 19960430

Ref country code: CH

Effective date: 19960430

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20100628

Year of fee payment: 19

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111101

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 59202882

Country of ref document: DE

Effective date: 20111101