JP2008544086A - Device for processing flat and planar objects - Google Patents

Abstract

The present invention relates to a plating device (11) for a circuit board (16) having a contact wheel (28) for electrical contact provided in a boundary region (19). The contact wheel (28) is in contact only with the lower surface (17) of the circuit board (16) in the boundary region (19). On the upper surface (18) of the circuit board (16), only a transport wheel and a counter pressure wheel (31) that ensures electrical contact are provided. By placing the contact wheel (28) only on the bottom surface, copper debris or similar that occurs in the coating of the circuit board can be easily dropped and removed.
[Selection] Figure 1

Description

  The present invention relates to an apparatus for processing an object, and more particularly to a plating apparatus for a printed circuit board. The printed circuit board can pass through a processing path through the processing chamber. For this purpose, there is a conveying means through a processing medium such as an electrolytic solution. There are also contact means for electrical contact and the supply of power from the power source to the object.

  The problem in the present invention is to provide the above-mentioned apparatus capable of avoiding the problems of the prior art, more specifically, guaranteeing reliable contact and power supply to the object to be processed with limited cost. There is to do.

  This problem is solved by a device having the features of claim 1. Advantageous and preferred extensions of the invention form the subject of further claims and are therefore detailed below. By express reference, the content of the claims is included as part of the content of the specification.

  A transport means is provided for transporting the object through the processing chamber, whereby the object passes through the aforementioned chamber, either continuously or stepwise. For example, in the case of a plating apparatus, the processing chamber contains a processing medium such as an electrolytic solution. There are also contact means for electrical contact with the object, and the corresponding power supply supplies power. The object has, for example, two surfaces such as a lower surface and an upper surface. According to the invention, in each case, contact means for electrical contact with one surface of the object is provided only on one surface, i.e. only on the upper surface or only on the lower surface. . The contact element is in intimate contact with the object at that location and provides the necessary electrical contact, so that a power supply is guaranteed. For example, the contact means are provided only on one surface, specifically on the lower surface, not on the left or right side of the object, depending on the manner in which they face each other.

  Therefore, according to the present invention, unlike the prior art, there is no contact from both sides to the object, and instead there is a form of electrical contact from only one. Within the framework of the present invention, it has been found that such a contact from only one side can achieve satisfactory results, for example, in the case of a plating device for circuit boards. Power supply to the other surface of the object is realized through a hole or an inter-surface connection existing on the circuit board.

  Since the present invention only requires half the contact means, it leads to a related saving in mechanical costs associated with the contact means. Furthermore, the problems that can occur with the contact means are reduced and, as a result, the required maintenance is also reduced, so that the machine uptime can be increased.

  The contact means is advantageously constructed in a revolving or rotary manner. These are particularly advantageously in the form of wheels or rollers. The configuration of such contact means is disclosed, for example, in German Patent Application No. 103 23 660 A1 (DE 103 23 660 A1) and European Patent Application No. 819 781 A1 (EP 819 781 A1), Please refer to these documents for details.

  For example, contact means can be provided on the left and right sides of the object, but only on one surface of the object when viewed in the direction of passage. Preferably, they are arranged or adhered on the same surface of the object. In a particularly preferred manner, the contact means may, for example, in the case of a plating device with a metal coating, deposits such as metal debris or flakes formed on said surface or contact means fall off by weight. It is in close contact with the surface of the object so that it can. If the object is transported substantially horizontally, it is appropriate to place the contact means on the lower surface of the object.

  For good electrical contact and power supply, it is advantageous to provide a plurality of contact means that are in close contact with the object when viewed in the direction of passage. For this purpose, for example, it is possible to have a row of continuous contact wheels or the like.

  For good electrical contact, it is advantageous to provide a counter-pressure means on the other surface of the object, especially in a precisely opposed manner. This ensures good and constant contact of the contact means on the object. The back pressure means is also advantageously in the form of a wheel or a roller, like the contact means. Also, as a result of the wheel or roller-like structure, in particular, the contact means and the counter pressure means can be rotated to prevent wear along the surface of the object. As a result, mechanical damage or the like is reliably prevented. For this purpose, it is advantageous that the contact means and the counter pressure means rotate at the same speed and at the same circumferential speed so as to rotate cleanly on the object. The contact means and / or the counter pressure means can be driven, particularly in a state of being coupled to the conveying means. Alternatively, they can also at least partially form or replace the conveying means, or at least the function of the drive device via conveying means such as a non-driven conveying roll or roller, for example. Can be at least partially formed or substituted.

  The contact means can be manufactured from a metal, preferably copper, in the same way as the contact surface that adheres to the object. The back pressure means can be manufactured from a non-conductive material. It is produced in particular from plastic so that it is electrically inert, or at least its surface is coated with plastic. As a result, for example, metal is not deposited in the case of metal coating by a plating apparatus.

  These and further features will be apparent with reference to the appended claims, specification, and accompanying drawings, wherein individual features may be found in one embodiment of the invention and in other fields. It can be implemented alone, or in multiple forms in subcombinations, and can represent an advantageous and independently protectable structure that claims protection in this specification. The subdivisions and subtitles into individual sections of this application do not limit the general validity of the contents described in each.

  FIG. 1, the only drawing, schematically shows a plating apparatus 11 having a processing chamber 13 containing an electrolyte solution 14 to the upper liquid level. This plating apparatus 11 corresponds to standard plating apparatuses such as those described and illustrated in European Patent Application No. 819 781 A1 (EP 819 781 A1). Please refer.

  A flat printed circuit board 16 having a lower surface 17 and an upper surface 18 is disposed in the processing chamber 13 or the electrolytic solution 14. It should be understood that the circuit board 16 is conveyed horizontally in the plane of the drawing. It also comprises a right end region 19. In this sectional view, the left end region of the circuit board 16 is not shown. However, it should be understood that the same structure corresponding to the right side can exist on the left side (not shown) in FIG.

  The circuit board 16 is disposed on the lower conveyance wheel 20, and these lower conveyance wheels are driven by the lower conveyance shaft 21 to convey the circuit board through the processing chamber 13. The upper conveyance wheel 20 on the upper conveyance shaft 22 is disposed on the upper surface 18 of the circuit board 16. These transport shafts are provided with a lower drive device 24 and an upper drive device 26 in each case, so that the circuit board 16 moves through the processing chamber 13.

  A contact wheel 28 is also arranged on the lower conveying shaft 21 and comprises a slightly projecting contact segment 29 in its central region. The contact wheel 28 and the contact segment 29 are advantageously made essentially from copper. These can in particular be constructed in the manner described in German Patent Application No. 103 23 660 A1 (DE 103 23 660 A1) and / or European Patent No. 819 781 (EP 819 781). Refer to these documents for details. The contact wheel 28 or the contact segment 29 is in close contact with the lower surface 17 of the circuit board 16, specifically, in the right end region 19.

  On the upper surface 18 of the circuit board 16, a counter pressure wheel 31 is provided having a slightly raised central working surface 32 in opposition to the contact wheel 28. As in the case of the prior art with further contact wheels facing each other, the counter pressure wheel 31 ensures good adhesion of the contact wheel 28 to the circuit board 16 or its lower surface 17. However, the counter pressure wheel 31 is made of, for example, plastic, or is non-conductive anyway, and is not used to supply power to the circuit board 16. Thus, at least in the aforementioned end region 19 of the circuit board 16, the lower contact wheel 28 represents the only contact with the circuit board 16. A contact wheel similar to the contact wheel 28 is provided only on the lower surface 17 of the circuit board 16 along the entire right side of the circuit board 16. A similar further contact wheel can also be provided on the lower surface 17 on the left side of the circuit board 16 (not shown).

  For electrical contact, the lower contact wheel 28 is connected to an electrical terminal 25 for the lower voltage source 34 and the upper voltage source 35. These voltage sources 34 and 35 are connected by their positive electrodes to anodes 37 located at the top and bottom of the circuit board 16, which are in the form of laterally extending rods or the like. Advantageously, there are several things. Electric power necessary for plating the surface of the circuit board 16 is generated via the electrolytic solution 14 by the contact wheel 28 and the anode 37.

  As described above, during the operation of the plating apparatus 11, the contact wheel 28 always ensures direct electrical contact on the lower surface 17 of the circuit board 16. As a result, for example, the coating of copper on the lower surface 17 of the circuit board 16 starts. By utilizing holes or openings on the circuit board 16, a copper coating is formed on the upper surface 18 of the circuit board 16, thus making electrical contact to the upper surface 18. As a result, the above-mentioned upper surface 18 is also electrically contacted and coated with copper by plating.

  Thus, the electrical contact via the contact wheel 28 on the lower surface 17 of the circuit board 16 is sufficient for plating or coating on both sides thereof, and therefore is in direct contact with the upper surface 18. do not have to. Therefore, it is possible to halve the number of contact means, in particular those located on the top of the circuit board, when compared with known plating devices.

  If the aforementioned copper debris can be easily removed, a relatively simple structure can be imparted to the contact wheel. Specifically, in this case, a structure made from copper or having a copper surface is sufficient. A standard expensive platinum coating is not required, which can reduce manufacturing effort and, in particular, costs.

  A further advantage of the present invention is, for example, in the case of the aforementioned copper coating, that so-called copper debris separated from the electrolyte is deposited on the contact wheel or corresponding contact means. In the case of a contact wheel that is in close contact from below the circuit board, the aforementioned debris can be easily peeled off and removed, and as a result, they will easily fall. In the case of the top-contacting contact wheel of the known plating device, such debris does not fall, and thus is accumulated in large quantities and, in certain circumstances, is firmly fixed by the top-contacting contact wheel or the transport wheel on the circuit board. There are often problems of being pressurized or causing contamination or damage. According to the present invention, it is possible to avoid a problem that particularly occurs in such an upper contact wheel. Known solutions associated with such copper debris cleaning are much more complex and can be saved by doing so.

It is the schematic of a plating apparatus.

Claims (9)

A transport means (20, 21, 22) for transporting an object through a processing chamber equipped with a processing medium such as an electrolyte (14); electrical contact and power from the power source (34, 35) to the object; A device for processing said flat and planar object on the passage path (20) through a processing chamber (13) having contact means (28, 29) for supply, in particular a circuit board ( 16) In the plating apparatus (11) for
The contact means is arranged only on one of the two surfaces (17, 18) or the side surfaces of the object (16), and is in close contact with the object and in electrical contact therewith. A device characterized by comprising.   2. Device according to claim 1, characterized in that the contact means (28, 29) are configured in a revolving or rotary manner, preferably in the form of a wheel or a roller.   When viewed in the passing direction, contact means (28, 29) are provided on the left and right sides (19) of the object (16), preferably the contact means on both sides of the surface are The case is provided only on the upper surface (18) or in each case only on the lower surface (17), in particular only on the lower surface. The apparatus according to 1 or 2.   A number of contact means (28, 29) are preferably provided continuously along a large part of the length of the processing chamber (13). The device according to item.   The back pressure means (31, 32) is in each case on the other planar surface of the object (16) facing the contact means (28, 29) and particularly accurately 5. A device according to any one of claims 1 to 4, characterized in that it is provided in an opposed state, preferably the counter pressure means also comprises a wheel or roller-like structure.   6. Device according to claim 5, characterized in that the back pressure means (31, 32) are made of a non-conductive material, in particular plastic.   The device according to claim 5 or 6, characterized in that the contact means (28, 29) and the counter pressure means (31, 32) are all driven at the same circumferential speed.   The contact means (28) is made of copper, and the contact surface (29) of the contact means in close contact with the object (16) is also made of copper. The apparatus as described in any one of -7.   The device according to claim 1, wherein the object (16) is conveyed and contacted horizontally in the passage path (20).

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