CN111465194A - Reverse coating prevention device for cathode roller in horizontal coating production line of printed circuit board - Google Patents
Reverse coating prevention device for cathode roller in horizontal coating production line of printed circuit board Download PDFInfo
- Publication number
- CN111465194A CN111465194A CN201910925757.4A CN201910925757A CN111465194A CN 111465194 A CN111465194 A CN 111465194A CN 201910925757 A CN201910925757 A CN 201910925757A CN 111465194 A CN111465194 A CN 111465194A
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- China
- Prior art keywords
- coating
- cathode
- roll
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automation & Control Theory (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a device for preventing reverse coating from occurring on a cathode roller for coating a printed circuit board in a horizontal transfer type coating tank using a roll-to-roll process, wherein a grinding roller, a press roller and a cathode roller are respectively provided on an inlet side and an outlet side of a coating tank into which a chemical for coating the printed circuit board is introduced in a horizontal coating line for a printed circuit board in the roll-to-roll process, anodes are provided in the coating tank at predetermined intervals on an upper portion and a lower portion of the printed circuit board, the cathode roller is electrically connected to cathode terminals of a plurality of coating rectifiers to apply a constant current of a cathode to the printed circuit board, the anode is electrically connected to anode terminals of the plurality of coating rectifiers to apply a constant current of the anode to the printed circuit board, and a reverse coating prevention roller electrically connected to the cathode terminals of the reverse coating prevention rectifiers is in contact with an outer peripheral surface of the cathode roller, thereby preventing reverse coating from occurring on the surface of the cathode roll.
Description
Technical Field
The present invention relates to an apparatus for coating a coated Printed Circuit Board (PCB) in a horizontal coating line in a Roll-to-Roll process (Roll to Roll Processing), and more particularly, to an apparatus for preventing reverse coating from occurring in a cathode Roll for coating a printed circuit board in a horizontal transfer type coating tank using a Roll-to-Roll process.
Background
Generally, a plurality of processes are required to manufacture a Printed Circuit Board (PCB). Due to the trend toward the use of microcircuits on printed circuit boards, roll-to-roll processes based on thin sheets are mainly used. The roll-to-roll process refers to a process of manufacturing a plurality of flexible printed circuit boards.
Further, although the process of the roll-to-roll horizontal coating line has an advantage of transferring a printed circuit board having a large width and a thin plate, when coating is performed, an oxidizing Gas (O2 Gas) is generated in the Anode (Anode) and bubbles are generated in the Pump (Pump), thereby causing quality deviation between the upper surface and the lower surface of the printed circuit board. In contrast, in the roll-to-roll vertical coating line, a large-width and thin-plate printed circuit board is suspended by its own weight, and the lower portion of the printed circuit board cannot be supported by the thin-plate printed circuit board, and the transfer of the printed circuit board is hindered by a partial external force of a treatment chemical Spray (Spray) or a potting Bar (Flood Bar) applied to the front and rear surface portions of the printed circuit board.
Conventionally, in a process of coating a printed circuit board in a roll-to-roll horizontal coating line, a cathode roll is connected to a cathode (-) through a plurality of coating rectifiers, and the cathode roll is connected to an anode (+) through a plurality of coating rectifiers. In this case, after the coating is performed in the coating bath, a coating chemical adheres to the surface of the printed circuit board passing through the grinding roll and the press roll, and a reverse coating phenomenon occurs on the cathode roll due to a change in contact resistance with the printed circuit board while the cathode roll connected to the cathode (-) is rotated by the plurality of coating rectifiers. Therefore, when the reverse coating of the cathode roller is deepened, a trace is generated on the surface of the printed circuit board, which causes a defect of the printed circuit board, and the operation of removing the coating adhered to the surface of the cathode roller causes a problem of a decrease in the running rate.
As a prior art related to the present invention, patent document 1 discloses a reverse coating prevention device for preventing a conductive roller reverse coating phenomenon of a coating bath, including: an upper magnetic part located at each terminal of the conductive roller; a lower magnetic part located at each terminal of a support roller arranged at the lower part of the conductive roller and opposite to the upper magnetic part; first bearing blocks respectively located between the upper magnetic part and the terminal of the conductive roller for rotating the upper magnetic part at the terminal of the conductive roller; and second bearing blocks respectively located between the lower magnetic part and the terminal of the support roller for rotating the lower magnetic part at the terminal of the support roller, wherein the upper magnetic part and the lower magnetic part apply pressure to the conductive roller and the support roller due to the mutual attraction force, and the upper magnetic part and the lower magnetic part maintain an opposite state even if the conductive roller and the support roller rotate.
Documents of the prior art
Patent document
Patent document 0001: korean granted patent publication No. 10-1563926 (published 10 month and 28 days 2015)
Disclosure of Invention
The present invention has been made to solve the above problems, and an object of the present invention is to prevent reverse coating from occurring in a cathode roller while a printed circuit board is coated in a predetermined coating state by passing through a coating bath.
In order to achieve the above object, the present invention provides a reverse coating prevention device for a cathode roll in a horizontal coating line for a printed circuit board in a roll-to-roll process, wherein a grinding roll, a press roll and a cathode roll are respectively provided on an inlet side and an outlet side of a coating bath into which a chemical for coating the printed circuit board is introduced, anodes are provided at upper and lower portions of the printed circuit board with a predetermined interval therebetween in the coating bath, the cathode roll is electrically connected to cathode terminals (-) of a plurality of coating rectifiers to apply a constant current of a cathode (-) to the printed circuit board, the anode is electrically connected to anode terminals (+) of the plurality of coating rectifiers to apply a constant current of the anode (+) to the printed circuit board, and the reverse coating prevention roll electrically connected to the cathode terminals (-) of the reverse coating prevention rectifiers is in contact with an outer peripheral surface of the cathode roll, thereby preventing reverse coating from occurring on the surface of the cathode roll.
In the present invention, the reverse coating prevention roller is made of a material having a Conductivity (Conductivity) higher than that of the cathode roller and a Resistance (Resistance) lower than that of the cathode roller, and can form a high potential difference.
The cathode roll may be made of stainless steel (SUS), and the reverse-coating prevention roll may be made of copper (Cu).
According to the present invention, reverse coating is prevented from occurring at a cathode roller in contact with a printed circuit board by a reverse coating prevention roller in contact with the cathode roller, thereby improving the quality of the printed circuit board and reducing the production cost.
Drawings
Fig. 1 is a diagram showing a general roll-to-roll system.
Fig. 2 is a schematic diagram of a reverse coating prevention device for a cathode roll in a horizontal coating line for a printed circuit board in a roll-to-roll process according to an embodiment of the present invention.
Fig. 3a and 3b are schematic diagrams for comparing the case where the reverse coating prevention device of the cathode roll is applied to the horizontal coating line of the printed circuit board in the roll-to-roll process according to the present invention.
Detailed Description
Hereinafter, a reverse coating prevention apparatus for a cathode roll in a horizontal coating line for a printed circuit board in a roll-to-roll process according to the present invention will be described in detail with reference to the accompanying drawings.
In fig. 1, as an example of a roll-to-roll system, a thin or wide printed circuit board wound on an unwinder (UNCOI L ER) is wound around a winder (reoi L ER) through Acid treatment (Acid), first painting (painting #1), second painting (painting #2), third painting (painting #3), fourth painting (painting #4), washing (W/Rinse), and drying (Dry) processes.
In fig. 2, a plurality of rollers D, a press roller S, a cathode roller 3, a plurality of auxiliary rollers, and the like are provided on the inlet side and the outlet side of a coating tank 1 into which a chemical for coating a printed circuit board 5 is introduced. Further, an anode 2 is provided inside the coating tank 1 at a predetermined interval between the upper and lower portions of the printed circuit board 5. Further, a plurality of coating tanks 1 may be provided in a horizontal coating line for coating the printed circuit board 5.
The cathode rolls 3 provided on the inlet side and/or the outlet side of the coating tank 1 are electrically connected to the cathode terminals (-) of the plurality of coating rectifiers 10 and 11 to apply a constant current of the cathode (-) to the printed circuit board 5, and the anodes 2 provided on the upper and lower portions of the printed circuit board 5 transferred in the coating tank 1 are electrically connected to the anode terminals (+) of the plurality of coating rectifiers 10 and 11 to apply a constant current of the anode (+) to the printed circuit board 5.
In this case, in fig. 3a, after the coating is performed in the coating tank 1, a coating chemical adheres to the surface of the printed circuit board 5 passing through the grinding roll D and the press roll S, and a trace P1 of reverse coating occurs in the cathode roll 3 due to a change in contact resistance with the printed circuit board 5 while the cathode roll 3 connected to the plurality of coating rectifiers 10 and 11 rotates. Therefore, when the reverse coating of the cathode roller 3 is deepened, the trace P2 is generated on the surface of the printed circuit board 5, and thus a defect of the printed circuit board 5 is generated, and an unnecessary work such as removal of the coating adhered to the surface of the cathode roller 3 is generated.
In the present invention, each cathode roller 3 is in contact with the reverse coating prevention roller 21. The reverse coating prevention rollers 21 are electrically connected to the cathode terminal (-) of the reverse coating prevention rectifier 20. The reverse coating prevention roller 21 is made of a material having a Conductivity (Conductivity) higher than that of the cathode roller 3 and a Resistance (Resistance) lower than that of the cathode roller 3. The reverse coating prevention roller 21 has a Voltage higher than the Voltage (Voltage) of the cathode roller 3. That is, a high potential difference is formed between the reverse coating prevention roller 21 and the cathode roller 3. Further, when the material of the cathode roller 3 is Stainless steel (SUS), Copper (Copper) is preferably used for the reverse-coating prevention roller 21, but not limited thereto. Therefore, the reverse-coating prevention roller 21, which is in contact with each cathode roller 3, has a low resistance to copper (Cu) ions and a high potential difference.
In fig. 3b, in the printed circuit board 5 transferred after being coated through the coating bath 1, the reverse coating prevention roller 21, which is in contact with the cathode roller 3 by the cathode (-) current applied to the cathode roller 3, has a higher conductivity than the cathode roller 3 and a lower resistance than the cathode roller 3, and a higher voltage is formed, so that reverse coating occurs in the reverse coating prevention roller 21. Therefore, the reverse-coating prevention roller 21 prevents reverse coating from occurring at the cathode roller 3 that is in direct contact with the printed circuit board 5, thereby preventing a trace P2 based on reverse coating from remaining on the printed circuit board 5.
Thus, the reverse coating prevention device of the cathode roller in the horizontal coating line of the printed circuit board in the roll-to-roll process of the invention enables the reverse coating which is inevitably generated to be generated on the reverse coating prevention roller, thereby improving the quality of the printed circuit board.
In the above description, the present invention has been shown and described with respect to the specific embodiments, but those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the spirit and scope of the present invention.
Claims (3)
1. A reverse coating prevention device for a cathode roller in a horizontal coating line of a printed circuit board in a roll-to-roll process, wherein a plurality of grinding rollers, a plurality of press rollers and a plurality of cathode rollers are respectively arranged at an inlet side and an outlet side of a coating tank into which a chemical for coating the printed circuit board is injected, anodes are arranged at an upper portion and a lower portion of the printed circuit board in the coating tank with a predetermined interval therebetween, and the horizontal coating line of the printed circuit board in the roll-to-roll process is characterized in that,
the cathode roller is electrically connected with the cathode terminals (-) of a plurality of coating rectifiers, thereby applying a constant current of the cathode (-) to the printed circuit board,
the anode is electrically connected to anode terminals (+) of a plurality of coating rectifiers, so that a constant current of the anode (+) is applied to the printed circuit board,
the reverse coating prevention roller electrically connected to the cathode terminal (-) of the reverse coating prevention rectifier is in contact with the outer peripheral surface of the cathode roller, thereby preventing the reverse coating from occurring on the surface of the cathode roller.
2. The reverse coating prevention device for a cathode roll in a horizontal coating line of a printed circuit board in a roll-to-roll process according to claim 1, wherein the reverse coating prevention roll is made of a material having a higher conductivity than the cathode roll and a lower resistance than the cathode roll, and has a high potential difference.
3. The reverse coating prevention device for a cathode roll in a horizontal coating line of a printed circuit board in a roll-to-roll process according to claim 1 or 2, wherein the cathode roll is made of stainless steel and the reverse coating prevention roll is made of copper.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0007324 | 2019-01-21 | ||
| KR1020190007324A KR101993769B1 (en) | 2019-01-21 | 2019-01-21 | Apparatus for Preventing Reverse Plating of Cathode Roller In Horizontal Coating Line Printed Circuit Board of Roll to Roll Processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111465194A true CN111465194A (en) | 2020-07-28 |
| CN111465194B CN111465194B (en) | 2023-04-28 |
Family
ID=67255227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910925757.4A Active CN111465194B (en) | 2019-01-21 | 2019-09-27 | Reverse coating preventing device for cathode roller in horizontal coating production line of printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101993769B1 (en) |
| CN (1) | CN111465194B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110791786B (en) * | 2019-11-22 | 2020-11-17 | 深圳市金辉展电子有限公司 | Electroplating solution adding and spraying device for electroplating PCB |
| CN114411207B (en) * | 2021-12-27 | 2022-08-12 | 西安泰金工业电化学技术有限公司 | Cathode roller convenient to replace and low in cost |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4978431A (en) * | 1989-08-07 | 1990-12-18 | Eltech Systems Corporation | Continuous electroplating of conductive foams |
| CN202047165U (en) * | 2011-04-21 | 2011-11-23 | 佛冈建滔实业有限公司 | Cathode roll conducting device |
| WO2013169015A1 (en) * | 2012-05-10 | 2013-11-14 | 주식회사 잉크테크 | Continuous plating apparatus |
| KR20140143496A (en) * | 2013-06-07 | 2014-12-17 | 정재윤 | Electroplating apparatus for board |
| JP2015081374A (en) * | 2013-10-23 | 2015-04-27 | 住友金属鉱山株式会社 | Method and device for double side film deposition, and production method of resin film with metal base layer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000024785A (en) * | 1998-10-01 | 2000-05-06 | 이구택 | Apparatus for preventing plating of conductive roll |
| JP2008255482A (en) * | 2007-03-13 | 2008-10-23 | Mitsubishi Materials Corp | Power feed mechanism |
| KR101563926B1 (en) | 2013-12-24 | 2015-10-28 | 주식회사 포스코 | Apparatus for preventing conducting roller from conplating |
| KR101603503B1 (en) * | 2015-03-09 | 2016-03-15 | 김종학 | Apparatus for Plating using Flood Box in Perpendicular Type coating Printed Circuit Board of Roll to Roll Processing |
-
2019
- 2019-01-21 KR KR1020190007324A patent/KR101993769B1/en active IP Right Grant
- 2019-09-27 CN CN201910925757.4A patent/CN111465194B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4978431A (en) * | 1989-08-07 | 1990-12-18 | Eltech Systems Corporation | Continuous electroplating of conductive foams |
| CN202047165U (en) * | 2011-04-21 | 2011-11-23 | 佛冈建滔实业有限公司 | Cathode roll conducting device |
| WO2013169015A1 (en) * | 2012-05-10 | 2013-11-14 | 주식회사 잉크테크 | Continuous plating apparatus |
| KR20140143496A (en) * | 2013-06-07 | 2014-12-17 | 정재윤 | Electroplating apparatus for board |
| JP2015081374A (en) * | 2013-10-23 | 2015-04-27 | 住友金属鉱山株式会社 | Method and device for double side film deposition, and production method of resin film with metal base layer |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101993769B1 (en) | 2019-07-01 |
| CN111465194B (en) | 2023-04-28 |
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