WO2013169015A1

WO2013169015A1 - Continuous plating apparatus

Info

Publication number: WO2013169015A1
Application number: PCT/KR2013/004051
Authority: WO
Inventors: 정광춘; 유명봉; 한영구; 온웅구
Original assignee: 주식회사 잉크테크
Priority date: 2012-05-10
Filing date: 2013-05-09
Publication date: 2013-11-14
Also published as: CN104271814B; KR101441532B1; KR20130126050A; TWI486489B; TW201404947A; CN104271814A

Abstract

The present invention relates to a continuous plating apparatus, and more particularly, to a continuous plating apparatus comprising: a frame; a driving roller on which an object to be plated, having a predetermined width and extending in one direction, is wound, wherein the driving roller rotates by means of power transmitted by rotating means, and the driving roller is installed in the frame; a slave roller installed in the frame and spaced apart from the driving roller such that the object to be plated gets caught at the slave roller; a cathode roller installed in the frame and disposed on the path between the driving roller and the slave roller, along which the object to be plated moves, wherein the cathode roller contacts the object to be plated so as to charge the object to be plated with electricity of a cathode; and an anode nozzle unit installed in the frame, which sprays a plating solution including a cation on the contact area between the cathode roller and the object to the plated.

Description

Continuous plating equipment

The present invention relates to a continuous plating apparatus, and more particularly, to a continuous plating apparatus capable of forming a plating layer by spraying a plating solution only on a target portion to be plated.

In general, when plating a thin plate-like product, such as a PCB substrate, a horizontal plating method for continuously plating the plated body is used. Such plating is a plating bath in which a plating solution is stored and an inlet and an outlet through which a plated body is inserted and discharged are formed, an insoluble anode, a transfer roller that allows the plated body to be transported horizontally through the plating bath, and is located in front of the plating bath. It is made of a plating apparatus including a negative electrode roller to charge the plated body with (-) electricity, and the guide roller for guiding the plated body to be smoothly transferred to the inlet and outlet of the plating bath.

On the other hand, the plating bath is inevitably leaked out through the inlet and outlet, the plating liquid is unnecessarily plated when the spilled plating liquid is buried in the negative electrode roller. As such, when the negative roller is plated, irregularities are generated in the drawing of the negative electrode roller, and scratches such as scratches are generated on the surface of the plated body, which causes product defects. In addition, since a large amount of plating liquid is required to perform plating and a plating bath capable of accommodating such plating liquid must also be enlarged, the entire plating apparatus has a large area.

In addition, the conventional technique is difficult to apply a high current, so the plating operation is performed for a long time with a low current, there is also a problem that the plating efficiency is lowered.

The present invention was created in order to solve the above-described problems, it is possible to form a plating layer by locally spraying the plating solution only on the portion requiring plating, thereby providing a continuous plating apparatus that maximizes the plating efficiency as well as miniaturization of the overall equipment. It aims to do it.

Continuous plating apparatus of the present invention for achieving the above object, the frame; A driving roller wound around the plated body extending in one direction while having a predetermined width and being rotated by receiving power by a rotating means; A driven roller installed on the frame, spaced apart from the driving roller, and wound around the plated body; A negative electrode roller installed on the frame and disposed between the driving roller and the driven roller on a moving path through which the plated body moves and contacting the plated body to charge cathode electricity to the plated body; And an anode nozzle unit installed in the frame and injecting a plating liquid containing anode ions into the contact portion between the cathode roller and the plated body.

In the continuous plating apparatus, the anode nozzle unit may include a plating liquid receiving space in which a plating liquid is filled, and a slot which communicates with the plating liquid receiving space and the outside and extends along the width direction of the plated body.

In the continuous plating apparatus, an acid resistant metal body may be disposed in the plating solution accommodation space to receive anode electricity from the outside to generate anode ions in the plating solution.

In the continuous plating apparatus, the anode nozzle unit, a nozzle spacing member may be disposed to change the distance between the slot from the contact portion of the cathode roll and the plated body.

In the continuous plating apparatus, the nozzle spacing member includes a long hole which is formed at a part of the anode nozzle part in contact with the frame and extends in one direction; And a fixing member which is movable in one direction along the long hole and is coupled to the anode nozzle part and the frame while passing through the long hole.

In the continuous plating apparatus, the cathode roller comprises a pair of tension holding rollers arranged to be in contact with the opposite surface of the plated body in contact with the negative roller and arranged in a zigzag form, the tension holding roller, the cathode The plated body in contact with the roller may be arranged to have a curved shape having a constant radius of curvature.

In the continuous plating apparatus, between the cathode roller and the anode nozzle portion, the plating liquid sprayed from the anode nozzle portion is prevented from coming into direct contact with the cathode roller and guides the contact portion between the cathode roller and the plated body. The partition may be arranged.

In the continuous plating apparatus, a tensioning roller may be disposed between the driven roller and the driving roller by pressing the plated body to contact the plated body to apply tension to the plated body.

In the continuous plating apparatus, the tensioning roller may be arranged with position adjusting means for varying the tension by being positioned so that the radius of curvature of the contacted object is increased or decreased.

In the continuous plating apparatus according to the present invention, since the plating layer is formed while partially spraying the plating liquid on a desired portion by the nozzle spray type, the plating operation can be easily performed with a smaller amount of the plating liquid, and the overall size of the equipment is smaller. It has the advantage of maximizing space efficiency.

In addition, the continuous plating apparatus according to the present invention can also prevent the pit due to hydrogen embrittlement generated in a large amount, it is possible to apply a high current compared to the prior art, it is possible to exhibit a high plating efficiency in a shorter time have.

1 is a view showing a continuous plating apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of the anode nozzle unit as one component of the continuous plating apparatus of FIG. 1. FIG.

3 is a sectional view taken along the line III-III of FIG. 2;

4 to 6 are views showing the operation of the continuous plating apparatus of FIG.

Hereinafter, a continuous plating apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

The continuous plating apparatus 10 according to the embodiment of the present invention is to form a predetermined plating layer on the surface of the plated body 90 extending in one direction while having a predetermined width. The plating layer can be continuously formed on the surface. Specifically, the plating layer is formed on the plated body 90 (a flexible or rigid substrate) by a printing method.

The continuous plating apparatus 10 includes a frame 20, a driving roller 30, a driven roller 40, a cathode roller 50, an anode nozzle portion 60, a tension holding roller 70, and a tension applying roller ( 80).

The frame 20 forms a body of the continuous plating apparatus 10, and has a casing 21 having a substantially rectangular cross section, a partition wall 22 partitioning a plurality of spaces inside the casing 21, The upper plate 23 is disposed above the casing 21 and includes a driving roller 30, a driven roller 40, a negative roller 50, and an anode nozzle unit 60. At this time, the rotation means (not shown) for providing a rotational force to the drive roller 30 and the power transmission means for transmitting the rotational force by the rotation means to the drive roller 30 in the frame 20 (not shown) Is included). In addition, a supply pump (not shown) for supplying a plating liquid to the anode nozzle unit 60 is disposed inside the frame 20, and the supply pump (not shown) is located outside the frame 20. A plating tank 24 connected by the anode nozzle unit 60 and the plating liquid supply pipe 91 may be disposed.

The driving roller 30 is a roller that is wound around the plated body 90 extending in one direction while having a predetermined width and is rotated by receiving power by a rotating means. The drive roller 30 performs a function of transferring the plated body 90 so that the plating layer can be continuously formed on the plated body 90. The driving roller 30 may be vertically placed with respect to the upper plate 23 of the frame 20.

The driven roller 40 is disposed perpendicular to the top plate 23 of the frame 20 and is spaced apart from the driving roller 30 by a predetermined distance. The plated body 90 is wound around the outer circumferential surface of the driven roller 40, and as the driven roller 30 rotates, the driven roller 40 rotates together so that the plated body 90 can move on a constant path. Make sure

The negative electrode roller 50 is installed on the frame 20, and is disposed between the drive roller 30 and the driven roller 40, and is mounted on the frame 20. The negative electrode roller 50 is disposed on a moving path through which the plated body 90 moves and contacts the surface of the plated body 90 to charge the plated body 90 with the negative electricity. Specifically, the negative electrode roller 50 grounded on the pattern of the plated body 90 is configured to charge the cathode electricity on the pattern of the plated body 90. Between the cathode roller 50 and the anode nozzle unit 60 prevents the plating liquid injected from the anode nozzle unit 60 from directly contacting the cathode roller 50 to minimize current loss. The partition 51 is disposed. The partition 51 allows the plating liquid to be guided to a desired position (for example, the contact portion of the negative electrode roller 50 and the plated body 90 or the periphery thereof). The partition walls 51 are vertically arranged with respect to the upper plate 23 of the frame 20, and are designed to cover most of the cathode rollers 50 when viewed from the anode nozzle unit 60.

The anode nozzle unit 60 is installed in the frame 20, and includes a cathode ion in a contact portion (eg, a ground region) or an adjacent portion of the cathode roller 50 and the plated body 90. It is to spray the plating solution. The anode nozzle unit 60 is vertically arranged with respect to the upper plate 23 of the frame 20, and specifically, a nozzle lower plate 61 detachably fixed to the frame 20 and the nozzle lower plate ( And a positive electrode nozzle 63 coupled to the side plate 62 and vertically arranged with respect to the nozzle lower plate 61.

The anode nozzle 63 is a plating solution movement path 631 disposed on one side and connected from an upper end to a lower portion, and a plating solution connection path extending horizontally from the plating liquid movement path 631 and disposed at regular intervals in the vertical direction. 632, a plating liquid containing space 633 disposed on the other side and filled with a plating liquid, and a slot 634 communicating with the plating liquid containing space 633 and the outside. A plating liquid supply pipe 91 for supplying a plating liquid may be connected to an upper end of the plating liquid movement path 631, and the plating liquid supplied from the plating liquid supply pipe 91 may be transferred to the plating liquid receiving space 633 through the plating liquid connection path 632. Is sent. On the other hand, in the plating liquid receiving space 633, an acid resistant metal body 635 which receives anode electricity from the outside to generate anode ions in the plating liquid is disposed. The acid resistant metal body 635 is disposed in the vertical direction at regular intervals, and the acid resistant metal body 635 is configured to generate positive ion in the plating liquid while penetrating the plating liquid. In this case, as the acid resistant metal used, platinum-based metal compounds such as platinum, palladium, iridium, and ruthenium may be adopted, but the present invention is not limited thereto, and any acid may be used as long as it can easily generate positive ions in the plating solution.

The slot 634 extends in a vertical direction with a fine spacing, specifically, in the width direction of the plated body 90, and is configured to allow the plating liquid to be injected to the outside through the slot 634. At this time, the interval s of the slot 634 may be within 0.1 mm ~ 2.5mm, 0.2 ~ 2.0 mmm, preferably 0.3 ~ 1.5 mm.

The side plate 62 serves to fix the anode nozzle 63 to the nozzle lower plate 61, and may be bolted to the anode nozzle 63. The nozzle lower plate 61 is detachably coupled to the frame 20, and specifically, a long hole 101 extending in one direction is formed. The nozzle lower plate 61 is fixed to the frame 20 through a fixing member 102 such as a bolt. On the other hand, in one embodiment of the present invention, the long hole 101 and the fixing member 102 performs a function as a nozzle spacing adjusting member 100. In detail, the nozzle gap adjusting member 100 may change the distance between the cathode roll and the slot 634 from the contact portion between the plated body 90 and the fixing member 102. It is movable in one direction along the long hole 101, and is coupled to the anode nozzle unit 60 and the frame 20 while passing through the long hole 101.

The tension maintaining roller 70 is disposed to contact the opposite surface of the plated body 90 to which the negative electrode roller 50 is in contact, and is arranged to cross the negative roller 50 in a zigzag form. At this time, the tension maintaining roller 70 is arranged so that the pair is arranged spaced apart at a predetermined interval. The tension holding roller 70 is disposed close to the negative electrode roller 50 so that the plated body 90 in contact with the negative electrode roller 50 has a constant radius of curvature so that the plated body 90 is fixed. Under the tension to pass through the cathode roller 50. The tension holding roller 70 is to maintain the natural tension of the plated layer passing through the negative roller 50, the tension holding roller 70 is always a constant pressure while the plated body 90 is the negative roller (50) is made contactable. Accordingly, the cathode electricity can be stably charged on the surface of the plated body 90.

The tensioning roller 80 is disposed between the driven roller 40 and the driving roller 30 to press and contact the plated body 90, thereby applying tension to the plated body 90. will be. The tensioning roller 80 is positioned to increase or decrease the radius of curvature of the plated body 90 in contact so that the tension on the plated body 90 can be changed as necessary.

In order to enable the position adjustment of the tensioning roller 80, the long hole 81 provided in the nozzle lower plate 61 and the long hole 81 are fitted into the long hole 81, and the tensioning roller 80 is connected to the frame. It may include a fastening bolt 82 to be coupled to the (20).

Continuous plating apparatus 10 according to an embodiment of the present invention has the following effects.

First, the plated body 90 is wound around the driving roller 30, the driven roller 40, and the negative electrode roller 50, and then the negative electrode is applied to the negative roller 50 side so that the plated body 90 is applied. The negative electrode is charged in the pattern of. In addition, the positive electrode is applied to the acid resistant metal body 635 disposed in the plating liquid containing space 633 of the positive electrode nozzle unit 60 so that the positive electrode ions are included in the plating liquid disposed in the plating liquid containing space 633.

Subsequently, as shown in FIG. 4, the plating liquid 90 is moved from the anode nozzle unit 60 while the plated body 90 is moved while the drive roller 30 is rotated. Spray towards. Specifically, when a new plating liquid is supplied into the plating liquid containing space 633, the plating liquid disposed in the plating liquid containing space 633 is ejected to the outside through the slot 634, and the ejected liquid is avoided in a state in which positive ion is contained. The plating liquid is sprayed on the contact portion between the plated body 90 and the negative electrode roller 50. The sprayed plating solution 1 makes a predetermined electroplating layer on the pattern of the plated body 90 while contacting the pattern of the plated body 90 to which the cathode electricity is charged. In this case, the injected plating liquid may be prevented from being directly injected to the negative electrode roller 50 by the partition wall 51 and may be induced to be injected into the contact point of the negative electrode roller 50 and the plated body 90 or an adjacent portion thereof. It is configured to be.

On the other hand, when the distance between the slit and the plated body 90 is required as necessary, as shown in FIG. 5, the nozzle spacing can be adjusted using the nozzle spacing member. To this end, after first calculating the required nozzle interval, the fixing member 102 fixed to the frame 20 is released to place the anode nozzle part 60 in the required position, and then the fixing member 102 is fixed again. Can be easily performed. At this time, the fixing member 102 is moved in one direction through the long hole 101 formed in the anode nozzle unit 60 and configured to be coupled to the frame 20 again after moving relative to the required distance along the long hole 101. do.

In addition, when the tension of the plated body 90 is required as necessary, as shown in FIG. 6, the position of the tensioning roller 80 is changed, and thus the necessary tension is applied to the plated body 90. You can do that. Specifically, when it is necessary to relax the tension somewhat, by moving the tensioning roller 80 to the upper side (based on the drawing shown in Figure 6) of the plated body 90 in contact with the tensioning roller 80 This reduces the radius of curvature.

Since the continuous plating apparatus according to an embodiment of the present invention forms a plating layer while partially spraying a plating solution on a desired portion by a nozzle spray type, plating can be easily performed with a smaller amount of plating liquid, and the overall equipment is provided. Since the size of is smaller, the efficiency of the space can be maximized.

In addition, the continuous plating apparatus according to the present invention has an advantage of minimizing unnecessary contact of the plating liquid directly with the cathode roller by disposing the partition wall, thereby reducing current loss.

In addition, the continuous plating apparatus according to the present invention has an advantage in that the plating can be performed by setting desired conditions because the nozzle spacing can be adjusted as necessary.

In addition, the continuous plating apparatus according to the present invention can control the tension of the plated body by using a tensioning roller, so that it is possible to perform a good driving and the contact point between the plated body and the cathode roller can be formed to an appropriate degree. have.

The continuous nozzle apparatus according to the present invention is not limited thereto, and may be modified in various forms, and the scope of such modifications ranges from the claims to the reasonable interpretation.

Claims

frame;

A driving roller wound around the plated body extending in one direction while having a predetermined width and being rotated by receiving power by a rotating means;

A driven roller installed on the frame, spaced apart from the driving roller, and wound around the plated body;

A negative electrode roller installed on the frame and disposed between the driving roller and the driven roller on a moving path through which the plated body moves and contacting the plated body to charge cathode electricity to the plated body; And

And an anode nozzle unit installed in the frame and for injecting a plating liquid containing anode ions into a contact portion between the cathode roller and the plated body.
The method of claim 1,

The anode nozzle unit,

And a slot extending in the width direction of the plated body, the plating liquid containing space filled with a plating liquid, and the plating liquid containing space communicating with the outside.
The method of claim 2,

And the acid resistant metal body disposed in the plating liquid receiving space to generate anode ions in the plating liquid.
The method of claim 2,

The anode nozzle unit,

And a nozzle gap adjusting member arranged so that the distance between the slot from the contact portion of the cathode roll and the plated body can be changed.
The method of claim 4, wherein

The nozzle spacing member,

A long hole formed in a part of the anode nozzle part in contact with the frame and extending in one direction; And

A movable plating apparatus comprising: a fixing member which is movable in one direction along the long hole and is coupled to the anode nozzle part and the frame while passing through the long hole.
The method of claim 1,

It includes a pair of tension maintaining rollers disposed so as to be in contact with the opposite side of the plated body in contact with the negative electrode rollers are arranged in a cross-zigzag form with the negative electrode roller,

The tension holding roller is a continuous plating apparatus, characterized in that the plated body in contact with the cathode roller is arranged so that the curved shape having a constant radius of curvature.
The method of claim 1,

A partition wall is disposed between the cathode roller and the anode nozzle part to prevent the plating liquid sprayed from the anode nozzle part from directly contacting the cathode roller and to contact the contact portion between the cathode roller and the plated body. Continuous plating apparatus made with.
The method of claim 1,

And a tensioning roller for tensioning the plated body by pressing the plated body and contacting the driven roller with the driven roller.
The method of claim 8,

The tensioning roller is a continuous plating apparatus, characterized in that the positioning means for varying the tension is arranged by being positioned so that the radius of curvature of the plated body to be contacted increases or decreases.