CN107761144A - A kind of continuous electroplating apparatus of band cup LED lead frame - Google Patents

A kind of continuous electroplating apparatus of band cup LED lead frame Download PDF

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Publication number
CN107761144A
CN107761144A CN201711071036.9A CN201711071036A CN107761144A CN 107761144 A CN107761144 A CN 107761144A CN 201711071036 A CN201711071036 A CN 201711071036A CN 107761144 A CN107761144 A CN 107761144A
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CN
China
Prior art keywords
lead frame
liquid
led lead
cup
cup led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711071036.9A
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Chinese (zh)
Inventor
郑康定
张继桉
郑康良
冯小龙
金琦峰
杨亚鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NINGBO KANGQIANG ELECTRONICS CO Ltd
Original Assignee
NINGBO KANGQIANG ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NINGBO KANGQIANG ELECTRONICS CO Ltd filed Critical NINGBO KANGQIANG ELECTRONICS CO Ltd
Priority to CN201711071036.9A priority Critical patent/CN107761144A/en
Publication of CN107761144A publication Critical patent/CN107761144A/en
Pending legal-status Critical Current

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Abstract

A kind of continuous electroplating apparatus of band cup LED lead frame, including electric bath groove and for suspension strap cup LED lead frame and the continuous transmission device that makes it into electric bath groove, it is characterised in that:Liquid-jet device, the rim of a cup position of the nozzle alignment band cup LED lead frame of the liquid-jet device are additionally provided with the electric bath groove.It is preferable that the continuous electroplating apparatus with cup LED lead frame is not easy formation bubble, electroplating effect in rim of a cup.

Description

A kind of continuous electroplating apparatus of band cup LED lead frame
Technical field
The present invention relates to the electroplating technology with cup LED lead frame, and in particular to a kind of band cup LED lead frame Continuous electroplating apparatus.
Background technology
Plating is exactly to be formed back workpiece to be plated as negative electrode, coated metal as anode by electroplating liquid medicine and power supply Road, the reaction of coating is deposited on workpiece to be plated, and continuous electroplating is continuously to be driven and reached using transmission parts The continuous electroplating of workpiece to be plated is handled.
Authorization Notice No. is that CN103046086 Chinese invention patent discloses a kind of continuous electroplating apparatus, and its structure is such as Shown in Fig. 1, Fig. 2, including ring steel belt 1a and the electric bath groove below ring steel belt 1a, the electric bath groove include Electroplate liquid pilot trench 2a and electroplate liquid female groove 3a;Multiple workpiece suspensions to be plated are below the ring steel belt 1a, the ring steel belt Workpiece to be plated enters in electroplate liquid pilot trench 2a when 1a is run carries out electroplating processes by electroplate liquid 5a;Due to electroplate liquid pilot trench 2a's Both sides, which are provided with, makes the gap that workpiece to be plated continues through, therefore the liquid medicine in electroplate liquid pilot trench 2a can flow out and flow into from gap Into electroplate liquid female groove 3a, electroplate liquid 5a capacity starts slowly to reduce in electroplate liquid pilot trench 2a so in electroplating process, electricity Electroplate liquid 5a liquid level drops between plating solution pilot trench 2a and electroplate liquid female groove 3a are begun to increase with, while in electroplate liquid pilot trench 2a Electroplate liquid 5a concentration is also reduced accordingly;Therefore set a drawing liquid pump 4a that the electroplate liquid 5a in electroplate liquid female groove 3a is transported into electricity In plating solution pilot trench 2a, control electroplate liquid 5a flows into the speed difference with outflow, you can in control electroplate liquid pilot trench 2a electroplate liquid 5a with Electroplate liquid 5a liquid level drop in electroplate liquid female groove 3a;Electroplate liquid 5a in electroplate liquid female groove 3a is set in addition than electroplate liquid pilot trench Electroplate liquid 5a concentration in 2a is big, and the electroplate liquid 5a concentration in electroplate liquid female groove 3a so newly inputted is higher, can make up electricity The phenomenon of electroplate liquid 5a concentration reductions in plating solution pilot trench 2a;The ring steel belt 1a in addition to the gearing for playing continuous electroplating, Also act as the electric action as negative electrode.
But there can be following technology when existing continuous electroplating apparatus is applied to and come in band cup LED lead frame and ask Topic:Because the rim of a cup 7a with cup LED lead frame 6a is smaller, certain tension force can be formed at rim of a cup 7a, electroplate liquid can be caused Electroplate liquid in groove is difficult to completely into each corner in rim of a cup 7a, as shown in figure 3, can be in some regions in rim of a cup 7a Form bubble and cause electroplating effect bad.
The content of the invention
The technical problem to be solved in the present invention is:It is preferable that offer one kind is not easy formation bubble, electroplating effect in rim of a cup Continuous electroplating apparatus with cup LED lead frames.
The present invention technical solution be:A kind of continuous electroplating apparatus of band cup LED lead frame, including electroplate liquid Groove and for suspension strap cup LED lead frame and the continuous transmission device that makes it into electric bath groove, it is characterised in that: Liquid-jet device, the rim of a cup position of the nozzle alignment band cup LED lead frame of the liquid-jet device are additionally provided with the electric bath groove.
After said structure, the present invention has advantages below:
Continuous electroplating apparatus of the invention with cup LED lead frame at the rim of a cup with cup LED lead frame by setting Liquid-jet device, break the tension force of rim of a cup using the jet power of liquid-jet device, so as to make electroplate liquid well into in rim of a cup Regional, so as to be not easy that bubble is formed in rim of a cup, finally cause electroplating effect it is preferable.
Preferably, the continuous transmission device is ring steel belt.Ring steel belt is simple in construction, occupies little space.
Preferably, also including rectifier, the ring steel belt electrically connects with the negative pole of rectifier, in the electric bath groove A coated metal is respectively equipped with positioned at the both sides of ring steel belt to be electrically connected with the positive pole of rectifier as anode, the coated metal Connect.Ring steel belt is both used as transmission device, is used as negative electrode electric installation again, is respectively provided with coated metal in both sides, can make plating more Uniformly fully.
Preferably, the electric bath groove includes electroplate liquid pilot trench and electroplate liquid female groove, the both sides of the electroplate liquid pilot trench It is described provided with the first gap for making to be hung with the ring steel belt with cup LED lead frame vertically and passing through, in addition to the first drawing liquid pump The liquid inlet of first drawing liquid pump is connected with electroplate liquid female groove, and liquid outlet is connected with electroplate liquid pilot trench.The setting can pass through electricity The electroplate liquid that the recovery of plating solution female groove is flowed out at the first gap of electroplate liquid pilot trench, and electricity is added to by the first drawing liquid pump again In plating solution pilot trench, to control the liquid level difference between electroplate liquid pilot trench and electroplate liquid female groove.
Preferably, also including the second drawing liquid pump, the liquid inlet of second drawing liquid pump is connected with electroplate liquid female groove, gone out Liquid mouth is connected with liquid-jet device.The setting causes the liquid needed for liquid-jet device directly can be obtained out of electroplate liquid female groove, and And it flow back into electroplate liquid female groove and is reused again after injection.
Preferably, the liquid-jet device also includes supervisor, with being responsible for a plurality of branch pipe being connected, one end of the supervisor Closing, the other end be connected with the liquid outlet of the second drawing liquid pump, the quantity of the nozzle it is equal with the quantity of branch pipe and with each Pipe is connected, and the multiple nozzle is arranged and is positioned at the rim of a cup of LED lead frame successively along ring steel belt direct of travel.Should Set and make it that liquid-jet device is simple in construction, and the rims of a cup of multiple LED lead frames can be sprayed simultaneously, operating efficiency compared with It is high.
Preferably, also include being arranged on oscilaltion device in electroplate liquid pilot trench, each branch pipe and each nozzle it Between be connected by flexible pipe, each nozzle be arranged on oscilaltion device on, each nozzle include from top to bottom set successively The multiple mouth sprays put are so that each nozzle is remained to when moving up and down at jet electro-plating liquid to the rim of a cup with cup LED lead frame.By Band cup LED lead frame is driven to travel forward in ring steel belt, the nozzle that increase moves along a straight line up and down on this basis, and ensure During the up and down motion at still sprayable electroplate liquid to the rim of a cup with cup LED lead frame, compared to actionless nozzle, more Easily break with the tension force at cup LED lead frame rims of a cup, so that electroplate liquid is easier to enter in rim of a cup.
Preferably, also include being positioned close to the automatic charging device at ring steel belt initiating terminal and close annular The automatic blanking device of steel band end.Automatic loading/unloading can be achieved in the setting, and automaticity is higher.
Preferably, the end of the automatic charging device is provided with positioner, the positioner includes being suspended on platform The rotary flywheel for being used to offset with the top of the side with cup LED lead frame on body and it is arranged on stage body and is located at Two groups of roll assemblies of ring steel belt both sides, two groups of roll assemblies are cased with an endless-belt, two groups of rollers respectively outside Component on the inside of two endless-belts respectively with being affixed and the second gap being provided between two groups of roll assemblies, so as to draw with cup LED The bottom of wire frame is positioned between two groups of roll assemblies and transmitted by endless-belt.The setting can will be with cup LED lead frame Bottom be positioned between two groups of roll assemblies, top is positioned by rotary flywheel, and is accurately sent to ring using endless-belt On the clamping part of shape steel band.
Brief description of the drawings
Fig. 1 is the structural representation of existing continuous electroplating apparatus;
Fig. 2 is another structural representation of existing continuous electroplating apparatus;
Fig. 3 is the water (flow) direction and electroplating effect figure of existing continuous electroplating apparatus;
Fig. 4 is the structural representation of the continuous electroplating apparatus of the invention with cup LED lead frame;
Fig. 5 is another structural representation of the continuous electroplating apparatus of the invention with cup LED lead frame;
Fig. 6 is the water (flow) direction and electroplating effect figure of the continuous electroplating apparatus of the invention with cup LED lead frame;
In prior art diagram:1a- ring steel belts, 2a- electroplate liquid pilot trench, 3a- electroplate liquid female grooves, 4a- drawing liquid pumps, 5a- electricity Plating solution, 6a- band cup LED lead frames, 7a- rims of a cup;
In figure of the present invention:1- rectifiers, 2- electric bath grooves, 3- ring steel belts, 4- electroplate liquid pilot trench, 5- electroplate liquid female grooves, The drawing liquid pumps of 6- first, 7- coated metals, 8- liquid-jet devices, the drawing liquid pumps of 9- second, 10- supervisors, 11- branch pipes, 12- oscilaltions dress Put, 13- flexible pipes, 14- mouth sprays, the automatic charging devices of 15- first, the automatic charging devices of 16- second, 17- positioners, 18- Rotary flywheel, 19- roll assemblies, 20- endless-belts, 21- nozzles, 22- band cup LED lead frames, 23- rims of a cup.
Embodiment
Below in conjunction with the accompanying drawings, and the present invention is described further in conjunction with the embodiments.
Embodiment:
A kind of continuous electroplating apparatus of band cup LED lead frame, including electric bath groove 2 and draw for suspension strap cup LED Wire frame 22 and the continuous transmission device made it into electric bath groove 2, the band cup LED lead frame 22 are sent to plating In liquid bath 2 and it is immersed in electroplate liquid and is electroplated, liquid-jet device 8, the liquid-jet device 8 is additionally provided with the electric bath groove 2 Nozzle 21 be directed at the position of rim of a cup 23 with cup LED lead frame 22.
Continuous electroplating apparatus of the invention with cup LED lead frame passes through at the rim of a cup 23 with cup LED lead frame 22 Liquid-jet device 8 is set, breaks the tension force of rim of a cup 23 using the jet power of liquid-jet device 8, so as to make electroplate liquid well into To the regional in rim of a cup 23, so as to be not easy to be formed bubble in rim of a cup 23, finally make it that electroplating effect is preferable.
Preferably, the continuous transmission device is ring steel belt 3, the ring steel belt 3 is prior art.Ring steel belt 3 is simple in construction, occupies little space.
Preferably, also including rectifier 1, the ring steel belt 3 electrically connects with the negative pole of rectifier 1, the electroplate liquid Be respectively equipped with a coated metal 7 positioned at the both sides of ring steel belt 3 in groove 2 and be used as anode, the coated metal 7 with rectifier 1 Positive pole electrical connection.Ring steel belt 3 is both used as transmission device, is used as negative electrode electric installation again, coated metal is respectively provided with both sides 7, plating can be made evenly abundant.
Preferably, the electric bath groove 2 includes electroplate liquid pilot trench 4 and electroplate liquid female groove 5, the electroplate liquid pilot trench 4 Both sides, which are provided with, makes to be hung with the first gap that the ring steel belt 3 with cup LED lead frame 22 passes through, in addition to the first drawing liquid vertically Pump 6, the liquid inlet of first drawing liquid pump 6 are connected with electroplate liquid female groove 5, and liquid outlet is connected with electroplate liquid pilot trench 4.This sets The electroplate liquid flowed out at the first gap of electroplate liquid pilot trench 4 can be reclaimed by electroplate liquid female groove 5 by putting, and pass through the first drawing liquid pump 6 add in electroplate liquid pilot trench 4 again, to control the liquid level difference between electroplate liquid pilot trench 4 and electroplate liquid female groove 5.
Preferably, also including the second drawing liquid pump 9, the liquid inlet of second drawing liquid pump 9 is connected with electroplate liquid female groove 5 Logical, liquid outlet is connected with liquid-jet device 8.The setting make it that the liquid needed for liquid-jet device 8 can be directly out of electroplate liquid female groove 5 Obtain, and flow back into electroplate liquid female groove 5 and be reused again after spraying.
Preferably, the liquid-jet device 8 also includes supervisor 10, a plurality of branch pipe 11 being connected with supervisor 10, the master One end closing of pipe 10, the other end are connected with the liquid outlet of the second drawing liquid pump 9, quantity and the branch pipe 11 of the nozzle 21 Quantity is equal and is connected with each branch pipe 11, and the multiple nozzle 21 is arranged and is positioned at successively along the direct of travel of ring steel belt 3 At the rim of a cup 23 of LED lead frames.The setting make it that liquid-jet device 8 is simple in construction, and can be simultaneously to multiple LED lead frames The rim of a cup 23 of frame is sprayed, and operating efficiency is higher.
Preferably, also include the oscilaltion device 12 being arranged in electroplate liquid pilot trench 4, each branch pipe 11 and each spray It is connected between mouth 21 by flexible pipe 13, each nozzle 21 is arranged on oscilaltion device 12, and each nozzle 21 includes The multiple mouth sprays 14 from top to bottom set gradually are so that each nozzle 21 remains to jet electro-plating liquid and drawn to cup LED when moving up and down At the rim of a cup 23 of wire frame 22.Because ring steel belt 3 drives band cup LED lead frame 22 to travel forward, increase on this basis The nozzle 21 to move along a straight line up and down, and ensure that still sprayable electroplate liquid is to cup LED lead frame 22 during up and down motion Rim of a cup 23 at, compared to actionless nozzle 21, it is easier to break with the tension force at the rim of a cup 23 of cup LED lead frame 22, from And electroplate liquid is set to be easier to enter in rim of a cup 23.
Preferably, also include being positioned close to the automatic charging device 15 at the initiating terminal of ring steel belt 3 and close ring The automatic blanking device 16 of the end of shape steel band 3, the automatic charging device 15 and automatic blanking device 16 are using prior art Can.Automatic loading/unloading can be achieved in the setting, and automaticity is higher.
Preferably, the end of the automatic charging device 15 is provided with positioner 17, the positioner 17 includes outstanding Hang over the rotary flywheel 18 for being used to offset with the top of the side with cup LED lead frame 22 on stage body and be arranged on platform An annular skin is cased with respectively on body and outside two groups of roll assemblies 19 of the both sides of ring steel belt 3, two groups of roll assemblies 19 Band 20, two groups of roll assemblies 19 are affixed with the inner side of two endless-belts 20 and are provided between two groups of roll assemblies 19 respectively Second gap, so that the bottom with cup LED lead frame 22 is positioned between two groups of roll assemblies 19 and passed by endless-belt 20 Send.Bottom with cup LED lead frame 22 can be positioned between two groups of roll assemblies 19 by the setting, and top is by rotary flywheel 18 Positioning, and be accurately sent on the clamping part of ring steel belt 3 using endless-belt 20.

Claims (9)

1. a kind of continuous electroplating apparatus of band cup LED lead frame, including electric bath groove (2) and draw for suspension strap cup LED Wire frame (22) and the continuous transmission device made it into electric bath groove (2), it is characterised in that:In the electric bath groove (2) It is additionally provided with liquid-jet device (8), rim of a cup position of nozzle (21) alignment with cup LED lead frame (22) of the liquid-jet device (8).
A kind of 2. continuous electroplating apparatus of band cup LED lead frame according to claim 1, it is characterised in that:The company Continuous transmission device is ring steel belt (3).
A kind of 3. continuous electroplating apparatus of band cup LED lead frame according to claim 2, it is characterised in that:Also include Rectifier (1), the ring steel belt (3) electrically connect with the negative pole of rectifier (1), are located at annular steel in the electric bath groove (2) The both sides of band (3) are respectively equipped with a coated metal (7) and are used as anode, positive pole electricity of the coated metal (7) with rectifier (1) Connection.
A kind of 4. continuous electroplating apparatus of band cup LED lead frame according to claim 2, it is characterised in that:The electricity Bath trough (2) includes electroplate liquid pilot trench (4) and electroplate liquid female groove (5), and the both sides of the electroplate liquid pilot trench (4), which are provided with, makes vertical hang Hang with the first gap that the ring steel belt (3) with cup LED lead frame (22) passes through, in addition to the first drawing liquid pump (6), described The liquid inlet of one drawing liquid pump (6) is connected with electroplate liquid female groove (5), and liquid outlet is connected with electroplate liquid pilot trench (4).
A kind of 5. continuous electroplating apparatus of band cup LED lead frame according to claim 4, it is characterised in that:Also include Second drawing liquid pump (9), the liquid inlet of second drawing liquid pump (9) are connected with electroplate liquid female groove (5), liquid outlet and liquid-jet device (8) it is connected.
A kind of 6. continuous electroplating apparatus of band cup LED lead frame according to claim 5, it is characterised in that:The spray Liquid device (8) also includes supervisor (10), a plurality of branch pipe (11) being connected with supervisor (10), an end seal of the supervisor (10) Close, the other end is connected with the liquid outlet of the second drawing liquid pump (9), the quantity of the nozzle (21) is equal with the quantity of branch pipe (11) And be connected with each branch pipe (11), the multiple nozzle (21) is arranged and is positioned at LED successively along ring steel belt (3) direct of travel At the rim of a cup of lead frame.
A kind of 7. continuous electroplating apparatus of band cup LED lead frame according to claim 6, it is characterised in that:Also include The oscilaltion device (12) being arranged in electroplate liquid pilot trench (4), by soft between each branch pipe (11) and each nozzle (21) Pipe (13) be connected, each nozzle (21) be arranged on oscilaltion device (12) on, each nozzle (21) include by upper and Under multiple mouth sprays (14) for setting gradually so that each nozzle (21) remains to jet electro-plating liquid to band cup LED lead when moving up and down At the rim of a cup of framework (22).
A kind of 8. continuous electroplating apparatus of band cup LED lead frame according to claim 2, it is characterised in that:Also include The automatic charging device (15) that is positioned close at ring steel belt (3) initiating terminal and close to the automatic of ring steel belt (3) end Blanking device (16).
A kind of 9. continuous electroplating apparatus of band cup LED lead frame according to claim 8, it is characterised in that:It is described from The end of dynamic feeding device (15) is provided with positioner (17), the positioner (17) include being suspended on stage body for The rotary flywheel (18) and be arranged on stage body and be located at annular that the top of side with cup LED lead frame (22) offsets Two groups of roll assemblies (19) of steel band (3) both sides, two groups of roll assemblies (19) are cased with an endless-belt (20), institute respectively outside Two groups of roll assemblies (19) are stated respectively with being affixed on the inside of two endless-belts (20) and being provided between two groups of roll assemblies (19) Second gap, so that the bottom with cup LED lead frame (22) is positioned between two groups of roll assemblies (19) and by endless-belt (20) transmit.
CN201711071036.9A 2017-11-03 2017-11-03 A kind of continuous electroplating apparatus of band cup LED lead frame Pending CN107761144A (en)

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CN201711071036.9A CN107761144A (en) 2017-11-03 2017-11-03 A kind of continuous electroplating apparatus of band cup LED lead frame

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Application Number Priority Date Filing Date Title
CN201711071036.9A CN107761144A (en) 2017-11-03 2017-11-03 A kind of continuous electroplating apparatus of band cup LED lead frame

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111139512A (en) * 2020-01-09 2020-05-12 天水迈格智能设备有限公司 Automatic silver plating device for lead frame
CN112875294A (en) * 2021-01-06 2021-06-01 甬矽电子(宁波)股份有限公司 Automatic deplating system
CN114645307A (en) * 2020-12-17 2022-06-21 安徽省东科半导体有限公司 Electroplating device for processing lead frame

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1136096A (en) * 1997-07-18 1999-02-09 Nec Corp Jet plating device
TW401469B (en) * 1995-09-06 2000-08-11 Atotech Deutschland Gmbh Process and device for treating holes or recesses in workpieces with liquid treatment agents
JP2007332435A (en) * 2006-06-16 2007-12-27 Semicon Science:Kk Automatic apparatus for forming metallic film, and method for forming metallic film on wafer
CN103046086A (en) * 2012-12-17 2013-04-17 苏州市安派精密电子有限公司 Continuous electroplating line device
WO2013169015A1 (en) * 2012-05-10 2013-11-14 주식회사 잉크테크 Continuous plating apparatus
CN207845811U (en) * 2017-11-03 2018-09-11 宁波康强电子股份有限公司 A kind of continuous electroplating apparatus of band cup LED lead frame

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW401469B (en) * 1995-09-06 2000-08-11 Atotech Deutschland Gmbh Process and device for treating holes or recesses in workpieces with liquid treatment agents
JPH1136096A (en) * 1997-07-18 1999-02-09 Nec Corp Jet plating device
JP2007332435A (en) * 2006-06-16 2007-12-27 Semicon Science:Kk Automatic apparatus for forming metallic film, and method for forming metallic film on wafer
WO2013169015A1 (en) * 2012-05-10 2013-11-14 주식회사 잉크테크 Continuous plating apparatus
CN103046086A (en) * 2012-12-17 2013-04-17 苏州市安派精密电子有限公司 Continuous electroplating line device
CN207845811U (en) * 2017-11-03 2018-09-11 宁波康强电子股份有限公司 A kind of continuous electroplating apparatus of band cup LED lead frame

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111139512A (en) * 2020-01-09 2020-05-12 天水迈格智能设备有限公司 Automatic silver plating device for lead frame
CN114645307A (en) * 2020-12-17 2022-06-21 安徽省东科半导体有限公司 Electroplating device for processing lead frame
CN114645307B (en) * 2020-12-17 2024-04-12 东科半导体(安徽)股份有限公司 Electroplating device for lead frame processing
CN112875294A (en) * 2021-01-06 2021-06-01 甬矽电子(宁波)股份有限公司 Automatic deplating system

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