CN217378065U

CN217378065U - Jet flow anode device for horizontal electroplating equipment

Info

Publication number: CN217378065U
Application number: CN202221068656.3U
Authority: CN
Inventors: 罗运浪
Original assignee: Dongguan Jiafan Intelligent Technology Co ltd
Current assignee: Dongguan Jiafan Intelligent Technology Co ltd
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2022-09-06
Anticipated expiration: 2032-04-29

Abstract

The utility model belongs to the technical field of the electroplating device technique and specifically relates to indicate a jet flow anode device for horizontal electroplating device, it includes the jet flow frame, connect in the anode plate of jet flow frame, enclose the cavity of establishing, set up on the jet flow frame and with the jet flow entry of cavity intercommunication and run through a plurality of jet flow exports that the anode plate set up respectively, a plurality of jet flow export sets up aslope on the anode plate and communicates with the cavity respectively by the lateral wall of anode plate and the inside wall of jet flow frame. The electroplating solution sprayed out from the plurality of spray outlets can uniformly and comprehensively spray and cover the plated object, so that a natural and uniform electroplating layer is quickly separated out from the surface of the plated object; the electroplating solution flowing at high speed can quickly supplement metal ions to the vicinity of the plated object, thereby improving the ion exchange rate of the anode plate and the plated object and improving the electroplating efficiency and quality.

Description

Jet flow anode device for horizontal electroplating equipment

Technical Field

The utility model relates to the technical field of electroplating equipment, in particular to a jet flow anode device for horizontal electroplating equipment.

Background

In recent years, with the increasing level of industrialization, higher demands have been made on plating equipment. However, the conventional electroplating equipment has a structure with an independent anode and an independent spray pipe, so that the electroplating equipment is complex in assembly and disassembly steps, inconvenient to maintain and high in energy consumption. The prior anode device with jet flow also has the problem that the plating solution sprayed out can not uniformly and completely cover the plated object, thus influencing the plating quality. Therefore, the drawbacks are obvious, and a solution is needed.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problems, an object of the present invention is to provide a jet anode device for a horizontal electroplating apparatus.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a jet flow anode device for horizontal electroplating equipment comprises a jet flow frame, an anode plate connected with the jet flow frame, a cavity surrounded by the side wall of the anode plate and the inner side wall of the jet flow frame, a jet flow inlet arranged on the jet flow frame and communicated with the cavity, and a plurality of jet flow outlets respectively penetrating through the anode plate, wherein the plurality of jet flow outlets are obliquely arranged on the anode plate and respectively communicated with the cavity.

Further, a plurality of the jet flow outlets are arranged on the anode plate at equal intervals.

Further, there is an overlap in the projections of adjacent jet outlets in the length direction.

Further, the surface of the anode plate is coated with an insoluble anodic oxide layer.

Further, the jet flow frame is connected with the anode plate in a screwing or welding mode.

Furthermore, one end of the jet flow frame, which is close to the anode plate, is the bottom end of the jet flow frame, the other end of the jet flow frame is the top end of the jet flow frame, and the width of the jet flow frame is gradually reduced from the top end of the jet flow frame to the bottom end of the jet flow frame.

Further, a guide plate is arranged in the cavity, a guide hole is formed in the guide plate, the guide plate divides the cavity into an upper cavity and a lower cavity, the upper cavity is communicated with the jet flow inlet, the lower cavity is communicated with the jet flow outlet, and the upper cavity is communicated with the lower cavity through the guide hole.

The utility model has the advantages that: the projections of the adjacent jet outlets in the length direction of the utility model are overlapped, the electroplating solution sprayed out from a plurality of jet outlets can uniformly and comprehensively spray and cover on the plated object below, the problem that the electroplating solution sprayed to the plated object by the traditional spraying device is not uniform or partially covers on the plated object due to the spraying of the traditional spraying device is avoided, and the natural and uniform electroplated layer is rapidly separated out from the surface of the plated object; meanwhile, the spraying speed of the electroplating solution is high, the electroplating solution flowing at high speed can rapidly supplement metal ions to the position near the plated object, the ion exchange rate of the anode plate and the plated object is improved, and the electroplating efficiency and quality are improved. The jet flow frame and the anode plate are combined together, and a jet flow device is not required to be arranged between the anode plate and the plated object, so that the distance between the anode plate and the plated object in the electroplating bath is reduced, the work of the electroplating solution which is jetted to the plated object to overcome the fluid resistance is correspondingly reduced, and the time required by electroplating is shortened. The utility model has the advantages of simple and compact structure, low in production cost.

Drawings

Fig. 1 is a first cross-sectional view of a first embodiment of the present invention.

Fig. 2 is a second cross-sectional view of the first embodiment of the present invention.

Fig. 3 is a schematic top view of an anode plate according to a first embodiment of the present invention.

Fig. 4 is a sectional view of a jet flow stand according to a second embodiment of the present invention.

Description of reference numerals:

1. a jet flow frame; 2. an anode plate; 3. a cavity; 4. a jet outlet; 5. a jet inlet; 6. a jet pipe; 7. a baffle; 8. a flow guide hole; 9. an upper cavity; 10. and a lower cavity.

Detailed Description

In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention.

The first embodiment.

As shown in fig. 1 to 3, the present invention provides a jet anode device for a horizontal electroplating apparatus, which includes a jet rack 1, an anode plate 2 connected to the jet rack 1, a cavity 3 enclosed by a side wall of the anode plate 2 and an inner side wall of the jet rack 1, a jet inlet 5 disposed on the jet rack 1 and communicated with the cavity 3, and a plurality of jet outlets 4 respectively penetrating through the anode plate 2, wherein the plurality of jet outlets 4 are obliquely disposed on the anode plate 2 and respectively communicated with the cavity 3.

Specifically, a plurality of the jet flow outlets 4 are arranged on the anode plate 2 at equal intervals; the projections of the adjacent jet outlets 4 in the length direction are overlapped; the anode device further comprises a jet flow pipe 6, one end of the jet flow pipe 6 is communicated with the jet flow inlet 5, and the other end of the jet flow pipe 6 is communicated with the pump. In the practical use process, an object to be plated and a jet flow anode device are respectively immersed in a plating bath, the object to be plated is horizontally arranged near a jet flow outlet 4 of an anode plate 2, electroplating solution in the plating bath is pumped by a pump and conveyed into a jet flow pipe 6, the electroplating solution in the jet flow pipe 6 flows into a cavity 3 from a jet flow inlet 5 at a high speed and then is respectively sprayed onto the object to be plated which is horizontally arranged from a plurality of jet flow outlets 4, because the projections of the adjacent jet flow outlets 4 in the length direction are overlapped, the electroplating solution sprayed out from the jet flow outlets 4 can uniformly and comprehensively jet and cover the object to be plated below, the problem that the electroplating solution sprayed onto the object by the traditional jet flow device is not uniform or partially covers the object to be plated is avoided, and a natural and uniform electroplating layer is quickly precipitated on the surface of the object to be plated; meanwhile, the spraying speed of the electroplating solution is high, the electroplating solution flowing at high speed can rapidly supplement metal ions to the position near the plated object, the ion exchange rate of the anode plate 2 and the plated object is improved, and the electroplating efficiency and quality are improved. The jet flow frame 1 and the anode plate 2 are combined together, and a jet flow device is not required to be arranged between the anode plate 2 and the plated object, so that the distance between the anode plate 2 and the plated object in the electroplating bath is reduced, the work of the electroplating solution which is jetted to the plated object to overcome the fluid resistance is correspondingly reduced, and the time required by electroplating is shortened. The utility model has the advantages of simple and compact structure, low in production cost.

Further, the surface of the anode plate 2 is coated with an insoluble anodic oxide layer.

Further, the jet flow frame 1 and the anode plate 2 are connected in a screwing or welding mode. The jet flow and the anode plate 2 have simple connection structure, low production cost and convenient production.

Furthermore, one end of the jet flow frame 1 close to the anode plate 2 is a bottom end of the jet flow frame 1, the other end of the jet flow frame 1 is a top end of the jet flow frame 1, and the width of the jet flow frame 1 gradually decreases from the top end of the jet flow frame 1 to the bottom end of the jet flow frame 1.

Preferably, the bottom end of the jet stand 1 is in the shape of an inverted trapezoid. When the electrolyte is closer to the bottom end of the cavity 3, the smaller the volume of the cavity 3 is, the higher the pressure of the electrolyte in the bottom end of the cavity 3 is, the higher the flow speed of the electrolyte sprayed from the jet flow outlet 4 to the plated object is, and the electroplating efficiency is further improved.

Example two.

As shown in fig. 4, the present embodiment is different from the first embodiment in that: the jet flow type jet flow device is characterized in that a guide plate 7 is arranged in the cavity 3, a guide hole 8 is formed in the guide plate 7, the guide plate 7 divides the cavity 3 into an upper cavity 9 and a lower cavity 10, the upper cavity 9 is communicated with the jet flow inlet 5, the lower cavity 10 is communicated with the jet flow outlet 4, and the upper cavity 9 and the lower cavity 10 are communicated through the guide hole 8.

Specifically, the cross section of the deflector 7 is linear or V-shaped. Preferably, the cross section of the deflector 7 is V-shaped, and the deflector hole 8 is arranged at the bottom end of the deflector 7. In the actual use process, lead to the electrolyte in the cavity 9 through guide plate 7 to make the pressure of the electrolyte that is close to the bottom of last cavity 9 increase gradually, the electrolyte after the pressure increase flows into cavity 10 down through water conservancy diversion hole 8 and from spout outlet 4 blowout to the plated thing on, further improved electroplating efficiency.

The remaining structure of this embodiment is the same as that of the first embodiment, and the same structure may be analyzed according to the first embodiment, which is not described herein again.

All the technical features in the embodiment can be freely combined according to actual needs.

The above-mentioned embodiment is the utility model discloses the implementation scheme of preferred, in addition, the utility model discloses can also realize by other modes, any obvious replacement is all within the protection scope of the utility model under the prerequisite that does not deviate from this technical scheme design.

Claims

1. A jet flow anode device for a horizontal electroplating device is characterized in that: the device comprises a jet flow frame (1), an anode plate (2) connected to the jet flow frame (1), a cavity (3) formed by enclosing the side wall of the anode plate (2) and the inner side wall of the jet flow frame (1), a jet flow inlet (5) arranged on the jet flow frame (1) and communicated with the cavity (3), and a plurality of jet flow outlets (4) respectively arranged through the anode plate (2), wherein the plurality of jet flow outlets (4) are obliquely arranged on the anode plate (2) and are respectively communicated with the cavity (3).

2. A jet anode assembly for a horizontal electroplating apparatus according to claim 1, wherein: a plurality of jet flow outlets (4) are arranged on the anode plate (2) at equal intervals.

3. A jet anode assembly for a horizontal electroplating apparatus according to claim 2, wherein: the projections of the adjacent jet outlets (4) in the length direction are overlapped.

4. A jet anode assembly for a horizontal electroplating apparatus according to claim 1, wherein: the surface of the anode plate (2) is coated with an insoluble anode oxide layer.

5. A jet anode assembly for a horizontal electroplating apparatus according to claim 3, wherein: the jet flow frame (1) is connected with the anode plate (2) in a threaded connection or welding mode.

6. A jet anode assembly for a horizontal electroplating apparatus as claimed in claim 1, wherein: one end of the jet flow frame (1) close to the anode plate (2) is the bottom end of the jet flow frame (1), the other end of the jet flow frame (1) is the top end of the jet flow frame (1), and the width of the jet flow frame (1) is gradually reduced from the top end of the jet flow frame (1) to the bottom end of the jet flow frame (1).

7. A jet anode device for a horizontal electroplating apparatus according to any one of claims 1 to 6, wherein: be provided with guide plate (7) in cavity (3), be provided with water conservancy diversion hole (8) on guide plate (7), guide plate (7) divide into cavity (3) cavity (9) and cavity (10) down, go up cavity (9) and jet inlet (5) intercommunication, cavity (10) and jet outlet (4) intercommunication down, it communicates through water conservancy diversion hole (8) to go up cavity (9) and cavity (10) down.