CN110592653B - Transverse spraying structure and electrolytic etching device applied by same - Google Patents
Transverse spraying structure and electrolytic etching device applied by same Download PDFInfo
- Publication number
- CN110592653B CN110592653B CN201910829035.9A CN201910829035A CN110592653B CN 110592653 B CN110592653 B CN 110592653B CN 201910829035 A CN201910829035 A CN 201910829035A CN 110592653 B CN110592653 B CN 110592653B
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- spray
- pipe
- control unit
- spraying
- spray pipe
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- 238000005507 spraying Methods 0.000 title claims abstract description 48
- 238000000866 electrolytic etching Methods 0.000 title claims abstract description 9
- 239000007921 spray Substances 0.000 claims abstract description 115
- 239000003792 electrolyte Substances 0.000 claims abstract description 54
- 239000007788 liquid Substances 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000005530 etching Methods 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 6
- 238000005868 electrolysis reaction Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention belongs to the field of electrolytic etching, and provides an electrolyte spraying device which comprises a spraying unit, wherein the spraying unit comprises a plurality of spray pipes and spray nozzles, the spray pipes are horizontally arranged and the projections of the spray pipes on the horizontal plane are overlapped, and the spray nozzles are arranged on the spray pipes; and the switch assembly comprises a flow control unit and an on-off control unit which are arranged on the spray pipe. The flow control unit controls the electrolyte spraying flow of the spray pipe, and the on-off control unit controls the on-off of the electrolyte in the spray pipe; the flow control unit and the on-off control unit are arranged on the spray pipe in series or in parallel and are used for adjusting the uniformity of etching in the horizontal direction on the same piece to be etched in the etching process.
Description
Technical Field
The invention relates to the technical field of electrolytic etching, in particular to a transverse spraying structure for a vertical continuous electrolytic etching line.
Background
Electrolytic etching refers to electrolytic PCB board, and the specific practice is as follows: the piece to be etched is taken as an anode, a stainless steel plate or a pure copper plate is taken as a cathode, the anode plate and the cathode plate are both placed in an electrolytic solution, so that metal ions on the anode plate are electrolyzed into the solution, and then are condensed on the cathode plate, such as the dissociation of copper ions, to form a copper shell attached to the cathode plate.
At present, in the common electrolytic structure in industry, a spray pipe is usually arranged in an electrolytic tank, electrolyte in the electrolytic tank is extracted by the spray pipe and then sprayed to a plate to be etched, so that the flow rate of the electrolyte is increased, and the etching speed is improved.
The copper plating tank disclosed in Chinese patent publication No. CN104862767B comprises a tank body and spray pipes arranged in the tank body, wherein the spray pipes are vertically arranged, the bottoms of the spray pipes are provided with pipelines communicated with the spray pipes, electrolyte pumped by a pump is arranged in the pipelines, the electrolyte is sent into the spray pipes, and the electrolyte is sprayed out from the nozzles of the spray pipes towards a piece to be plated.
In this structure, the pressure difference generated by the flow of the electrolyte is the greatest at the top of the spray pipe, that is, the pressure of the electrolyte sprayed from the nozzle with the highest vertical height on the spray pipe is the greatest and the spraying distance is the longest, and the pressure of the electrolyte sprayed from the rest of the nozzles from top to bottom gradually becomes lower. The more intense the state of the gush of electrolyte is at the position of maximum injection pressure. The spray pipe is parallel to the piece to be electrolyzed, so that the etching speed of the piece to be electrolyzed corresponding to the part with larger spraying distance and larger spraying pressure of the electrolyte sprayed on the spray pipe is higher, and the etching effect on the piece to be electrolyzed is uneven.
Even if the valves are installed at the spray pipes, if the valves are installed on each spray pipe, the inflow amount of the electrolyte flowing into the spray pipes through the valves in unit time can be only regulated, and as long as the electrolyte flows in, the liquid pressure difference exists between different spray nozzles. If a valve is arranged at each nozzle, the two are too complicated to adjust, and the nozzle is always immersed in the electrolyte, so that the valve is also immersed in the electrolyte and cannot be effectively adjusted.
Disclosure of Invention
Therefore, the invention aims to solve the technical problem of overcoming the situation that the etching uniformity degree of the piece to be electrolyzed in the vertical direction is influenced by the difference of the pressure of the electrolyte sprayed by different nozzles on a single spray pipe in the prior art, thereby providing the electrolyte spraying device.
An electrolyte spraying device comprising:
the spraying unit comprises a plurality of spraying pipes and nozzles, wherein the spraying pipes are horizontally arranged and the projections of the spraying pipes on the horizontal plane are overlapped, and the nozzles are arranged on the spraying pipes;
the switch assembly comprises a flow control unit and an on-off control unit which are arranged on the spray pipe, wherein the flow control unit controls the electrolyte spraying flow of the spray pipe, and the on-off control unit controls the on-off of the electrolyte in the spray pipe;
the flow control unit and the on-off control unit are arranged on the spray pipe in series or in parallel.
The flow control unit and the on-off control unit are arranged on the spray pipe in parallel, and an auxiliary flow control unit connected with the on-off control unit in series is further arranged on the parallel pipeline of the on-off control unit.
The spraying unit also comprises an input pipe, and the input pipe is communicated with each spraying pipe and inputs electrolyte to the spraying pipes.
The input pipe is vertically arranged, the input pipe is connected to the end part of each spray pipe, and the spray liquid flow settings of the spray pipes with different heights are different.
The input pipe is horizontally arranged, and each spray pipe is connected with the input pipe through a bending pipe.
The input pipe is provided with one, each spray pipe is communicated with one input pipe, or the input pipe is provided with at least two spray pipes, and the spray pipes are respectively communicated with different input pipes.
The preset spray flow of each spray pipe is gradually increased along the height lowering direction.
The nozzle includes:
the spray nozzle comprises a nozzle body, a drainage port and a liquid outlet, wherein the liquid outlet is axially arranged in the nozzle body, the drainage port is radially arranged on the nozzle body, and the drainage port is respectively communicated with the spray pipe and the liquid outlet; the drainage port includes at least one pair of straight edges. .
The nozzle main body comprises a mounting end and an output end, wherein the mounting end is inserted into the spray pipe and in interference fit with the spray pipe, the drainage port is formed in the outer peripheral surface of the mounting end, and the liquid outlet penetrates through the output end.
Another object of the present invention is to provide an electrolytic apparatus for solving the problem of different pressures of the electrolyte sprayed on the plate to be etched.
An electrolytic device comprises an electrolytic tank,
the device also comprises a spraying device according to any one of the above, wherein the spraying pipe is positioned in the electrolytic tank, and the flow control unit and the on-off control unit are positioned outside the electrolytic tank.
The technical scheme of the invention has the following advantages:
1. according to the spraying unit provided by the invention, the spray pipes are horizontally arranged, the end parts of the spray pipes are all positioned on the same vertical line, and thus, the spray nozzles on the spray pipes with different heights are positioned on the same vertical line in the vertical direction after the spray pipes are arranged. Compared with a conventional vertical spray pipe, the pressure of electrolyte sprayed by a nozzle at the top end of the vertical spray pipe is maximum, the pressure sprayed by a nozzle at the bottom of the vertical spray pipe is minimum, and the etching degree is different at different height positions on the same plate to be etched. After being arranged into a horizontal arrangement structure, the spray nozzles in the vertical direction of each group can spray electrolyte with the same or similar pressure; the plate to be etched continuously advances in the electrolytic bath, so that when the plate to be etched passes through different nozzles of the same spray pipe in the advancing process, the same etching effect is generated at any vertical line position on the plate to be etched, and the etching effect on the whole plate surface is more uniform.
2. The switch assembly provided by the invention can finely adjust the flow of the electrolyte passing through each spray pipe through the flow control unit, so that the flow and the pressure of the electrolyte in the spray pipes with different heights can be adjusted.
3. The multiple input pipes are arranged in the invention, so that the spray pipes can be divided into a plurality of groups, and the smaller the number of the spray pipes in each group is, the smaller the pressure difference in the spray pipes is, and the smaller the pressure difference in the spray pipes is.
4. Compared with a conventional circular drainage port, the drainage port of the rectangular groove is provided with right-angle opposite edges, so that a corner is formed, when electrolyte is sucked into the drainage port, negative pressure is formed at the corner, surrounding liquid is more conveniently driven to be sucked into the drainage port, the fluctuation range of the surrounding electrolyte is larger, the amount of electrolyte sprayed in unit time is more, and the surge amount is increased; the etching efficiency is improved on the premise of improving the etching uniformity.
5. The electrolytic device provided by the invention is provided with the electrolyte spraying device, so that the spraying and etching effects on the workpiece to be etched are more uniform.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view showing the structure of a spraying unit in an electrolytic cell;
FIG. 2 is a front view of the spray unit;
FIG. 3 is a front view of a series arrangement of switch assemblies;
FIG. 4 is a front view of a parallel configuration of switch assemblies;
FIG. 5 is a schematic diagram of the position of the auxiliary flow control unit in the switch assembly;
fig. 6 is a schematic view of a nozzle structure.
Reference numerals illustrate:
1. a spraying unit; 11. a spray pipe; 12. a nozzle; 121. a nozzle body; 122. a drainage port; 123. a liquid outlet; 13. a switch assembly; 131. a flow control unit; 132. an on-off control unit; 133. an auxiliary flow control unit; 2. an input tube; 3. an electrolytic cell.
Detailed Description
The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
Examples
An electrolysis device, as shown in figure 1, comprises an electrolysis tank 3 filled with electrolyte, wherein a spraying device is arranged in the electrolysis tank 3 and is used for extracting the electrolyte in the electrolysis tank 3 and spraying the electrolyte on a piece to be etched in the electrolysis tank 3. The piece to be etched is clamped and connected with the anode through an electroplating clamp, and cathodes are fixed on two sides of the anode. Under the action of electrolyte, cations on the to-be-etched piece at the anode are decomposed into the electrolyte and flow to the cathode to be attached to the surface layer of the cathode.
As shown in fig. 1 and 3, a plurality of spraying units 1 are further arranged in the electrolytic tank 3, each spraying unit 1 comprises a plurality of spraying pipes 11, a plurality of nozzles 12 are linearly arranged on each spraying pipe 11, and the nozzles 12 are vertically directed to the direction of the to-be-etched piece. Each nozzle 12 comprises a columnar nozzle body 121, one end of the nozzle body 121 close to the spray pipe 11 is a mounting end, the outer surface of the mounting end is columnar, and the nozzle body 121 is tightly screwed into an internally threaded hole in the spray pipe 11 in an interference fit manner. One end of the nozzle 12 main body, which is far away from the spray pipe 11, is an output end, a drainage port 122 is arranged on the side wall of the nozzle 12 main body, a liquid outlet 123 is arranged at the output end, and the liquid outlet 123 penetrates through the nozzle 12 main body and is communicated with the drainage port 122 and the inner cavity of the spray pipe 11. In order to increase the surge amount, the drainage port 122 is disposed on the nozzle body 121 by digging a rectangular groove, so as to form at least one pair of straight edges and at least two straight edges.
When the electrolyte is sprayed out of the nozzle 12, the surrounding electrolyte is driven to flow into the drainage opening 122 through the drainage opening 122, negative pressure is formed at the edge angle position of the drainage opening 122 at the moment, more electrolyte is driven to enter the nozzle 12, more electrolyte is sprayed out of the nozzle 12 in unit time, the surge amount formed around is larger, and the etching speed is improved.
The ends of the nozzles 11 of each spray unit 1 fall on the same vertical line, so that the nozzles 12 in the same spray unit 1 can be seen as being arranged in several vertical lines. Because the electrolyte pressures sprayed by the nozzles 12 at different positions on one spray pipe 11 are different, the pressure of the electrolyte sprayed by the plurality of nozzles 12 on each vertical line can be made to be equal after the arrangement. The plate to be etched moves in the electrolytic tank 3 along the direction of the spray pipe 11, so that the electrolytic etching reaction of the plate to be etched in the vertical direction tends to be uniform, and the overall etching effect of the plate to be etched also tends to be uniform after the plate to be etched completely passes through the spraying unit 1.
The end of each lance 11 is provided with a switch assembly 13, the switch assembly 13 comprising a flow control unit 131 and an on-off control unit 132, the lance 11 extending into the cell 3 for ease of adjusting the switch assembly 13, the switch assembly 13 being located outside the cell 3. In this embodiment, the flow control unit 131 is a manual valve, and the on-off control unit 132 is a solenoid valve. The flow control unit 131 and the on-off control unit 132 are connected to the spray pipe 11 in a serial connection manner, that is, the flow control unit 131 and the on-off control unit 132 are sequentially arranged at the part of the spray pipe 11 extending out of the electrolytic bath 3. In use, the opening and closing degree of the flow control unit 131 is adjusted in advance, and the on-off control unit 132 is opened, so that the electrolyte at a desired pressure flows into the nozzle 11.
As an alternative embodiment, the flow control unit 131 and the on-off control unit 132 can also be connected in parallel. One end of the spray pipe 11 extending out of the electrolytic tank 3 is divided into two branches, and the flow control unit 131 and the on-off control unit 132 are respectively positioned on the two branches, and electrolyte in the two branches is from the same input pipe 2. When in use, one of the flow control unit 131 and the on-off control unit 132 is independently opened, wherein the two purposes of circulation and flow control can be realized when the flow control unit 131 is independently opened; opening the on-off control unit 132 alone can control only the on-off of the electrolyte.
As an optimized implementation manner, at least two auxiliary flow control units 133 are connected in series on the branch where the on-off control unit 132 is located, and the auxiliary flow control units 133 in this embodiment adopt two ball valves, which are respectively located at two ends of the on-off control unit 132.
The ends of all the spray pipes 11 are connected with an input pipe 2, one end of the input pipe 2 is connected with a pump, and the pump pumps electrolyte in the electrolytic tank 3 and conveys the electrolyte into each spray pipe 11 communicated with the input pipe 2. The input pipe 2 is vertically arranged and communicated with the end parts of the spray pipes 11, the electrolyte pressures flowing in the spray pipes 11 with different heights are different, at the moment, the flow control unit 131 is adjusted to enable the allowable flow rate in unit time of the spray pipe 11 at the highest position to be minimum, and the allowable flow rate in unit time of the spray pipe 11 at the lowest position to be maximum, so that the pressure difference of the electrolyte in the spray pipes 11 with different heights is reduced.
As an alternative embodiment, each spraying unit 1 is provided with an inlet pipe 2, reducing the pressure difference between each nozzle 11.
As an alternative embodiment, the input pipe 2 is horizontally arranged, the part of the spray pipe 11 extending out of the electrolytic tank 3 is bent, and the part led to the horizontally arranged input pipe 2 is communicated with the input pipe 2.
As an optimized implementation manner, a pressure gauge or a flow meter is arranged on each spray pipe 11 or any spray pipe 11 in one spraying unit 1, so as to timely and intuitively show the flow in each spray pipe 11 to ensure that the flow in each spray pipe 11 is basically consistent.
The working process is as follows: adjusting the flow control unit 131, the on-off control unit 132 and the auxiliary flow control unit 133 to a desired extent, so that electrolyte with a desired pressure flows into the spray pipe 11 and is sprayed out from the spray nozzle 12; at this time, the workpiece to be etched is driven to move in the electrolytic tank 3 at a uniform speed, electrolytic etching is completed after passing through the plurality of groups of spraying units 1, and the etching degree of any vertical position tends to be equal, so that the overall etching effect of the whole workpiece to be etched tends to be equal.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it intended that all embodiments be exhaustive, but obvious variations or modifications that come within the scope of the invention are possible.
Claims (3)
1. A transverse jet structure, comprising:
the spraying unit (1), the spraying unit (1) comprises a plurality of spray pipes (11) and a spray nozzle (12), wherein the spray pipes (11) are horizontally arranged and the projections on the horizontal plane are overlapped, the spray nozzle (12) is arranged on the spray pipe (11), the spray nozzle (12) comprises a spray nozzle main body (121), a drainage port (122) and a liquid outlet (123), the liquid outlet (123) is axially arranged in the spray nozzle main body (121), the drainage port (122) is radially arranged on the spray nozzle main body (121), and the drainage port (122) is respectively communicated with the spray pipe (11) and the liquid outlet (123); the drainage port (122) comprises at least one pair of straight edges, the drainage port (122) is arranged on the nozzle main body (121) in a rectangular groove digging mode to form at least one pair of straight edges and at least two straight edges, the nozzle main body (121) comprises a mounting end and an output end, the mounting end is inserted into the spray pipe (11) and in interference fit with the spray pipe (11), the drainage port (122) is arranged on the peripheral surface of the mounting end, and the liquid outlet (123) penetrates through the output end;
the switch assembly (13) comprises a flow control unit (131) and an on-off control unit (132) which are arranged on the spray pipe (11), wherein the flow control unit (131) controls the electrolyte spraying flow of the spray pipe (11), and the on-off control unit (132) controls the on-off of the electrolyte in the spray pipe (11);
the flow control unit (131) and the on-off control unit (132) are arranged on the spray pipe (11) in series or in parallel;
the spraying unit (1) further comprises an input pipe (2), and the input pipe (2) is communicated with each spraying pipe (11) and inputs electrolyte to the spraying pipes;
the input pipe (2) is vertically arranged, the input pipe (2) is connected to the end part of each spray pipe (11), the spray liquid flow of the spray pipes (11) with different heights is arranged differently, and the preset spray liquid flow of each spray pipe (11) is gradually increased along the height lowering direction; the flow rate allowed to pass through in unit time at the spray pipe (11) at the highest position is minimum, and the flow rate allowed to pass through in unit time at the spray pipe (11) at the lowest position is maximum;
the input pipe (2) is horizontally arranged, and each spray pipe (11) is connected with the input pipe (2) through a bent pipe; the input pipe (2) is provided with one, each spray pipe (11) is communicated with one input pipe (2), or the input pipe (2) is provided with at least two spray pipes (11) which are respectively communicated with different input pipes (2).
2. The transverse spraying structure according to claim 1, wherein the flow control unit (131) and the on-off control unit (132) are arranged on the spraying pipe (11) in parallel, and an auxiliary flow control unit (133) connected in series with the on-off control unit (132) is further arranged on the parallel pipeline of the on-off control unit (132).
3. An electrolytic etching device comprising an electrolytic cell (3), characterized in that,
the transverse spraying structure as claimed in claim 1 or 2, wherein the spraying pipe (11) is positioned in the electrolytic tank (3), and the flow control unit (131) and the on-off control unit (132) are positioned outside the electrolytic tank (3).
Priority Applications (1)
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CN201910829035.9A CN110592653B (en) | 2019-09-03 | 2019-09-03 | Transverse spraying structure and electrolytic etching device applied by same |
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CN201910829035.9A CN110592653B (en) | 2019-09-03 | 2019-09-03 | Transverse spraying structure and electrolytic etching device applied by same |
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CN110592653B true CN110592653B (en) | 2024-02-02 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008034436A (en) * | 2006-07-26 | 2008-02-14 | Fuji Kiko:Kk | Etching device |
EP2145981A2 (en) * | 2008-07-12 | 2010-01-20 | SMS Siemag Aktiengesellschaft | Device and method for spraying pickling and/or washing liquid onto a metallic band |
TW201143565A (en) * | 2010-05-27 | 2011-12-01 | Foxconn Advanced Tech Inc | Etching device and method for etching printed circuit board |
TWM468007U (en) * | 2013-07-03 | 2013-12-11 | Unimicron Technology Corp | Partial etching apparatus |
CN203754808U (en) * | 2013-12-30 | 2014-08-06 | 天津市德中技术发展有限公司 | Horizontally-arranged nozzle pipe structure for etching device |
CN105714296A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Etching medium flow regulating device and etching medium flow regulating method |
CN210765576U (en) * | 2019-09-03 | 2020-06-16 | 昆山东威科技股份有限公司 | Horizontal spraying structure and electrolytic etching device |
-
2019
- 2019-09-03 CN CN201910829035.9A patent/CN110592653B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008034436A (en) * | 2006-07-26 | 2008-02-14 | Fuji Kiko:Kk | Etching device |
EP2145981A2 (en) * | 2008-07-12 | 2010-01-20 | SMS Siemag Aktiengesellschaft | Device and method for spraying pickling and/or washing liquid onto a metallic band |
TW201143565A (en) * | 2010-05-27 | 2011-12-01 | Foxconn Advanced Tech Inc | Etching device and method for etching printed circuit board |
TWM468007U (en) * | 2013-07-03 | 2013-12-11 | Unimicron Technology Corp | Partial etching apparatus |
CN203754808U (en) * | 2013-12-30 | 2014-08-06 | 天津市德中技术发展有限公司 | Horizontally-arranged nozzle pipe structure for etching device |
CN105714296A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Etching medium flow regulating device and etching medium flow regulating method |
CN210765576U (en) * | 2019-09-03 | 2020-06-16 | 昆山东威科技股份有限公司 | Horizontal spraying structure and electrolytic etching device |
Non-Patent Citations (1)
Title |
---|
许一飞 等.《喷灌机械 原理·设计·应用》.1989,第142-143段. * |
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