CN216039903U

CN216039903U - Spraying flow distribution control device in electroplating bath

Info

Publication number: CN216039903U
Application number: CN202122532892.8U
Authority: CN
Inventors: 黎开明; 田方成
Original assignee: Dongguan Suyuan Automation Equipment Co ltd
Current assignee: Dongguan Suyuan Automation Equipment Co ltd
Priority date: 2021-10-21
Filing date: 2021-10-21
Publication date: 2022-03-15
Anticipated expiration: 2031-10-21

Abstract

The utility model discloses a spraying flow split-flow control device in a plating bath, which comprises the plating bath, wherein a spraying box is arranged in the middle of the bottom of the inner wall of the plating bath, split-flow pipes are arranged on two sides of the bottom of the inner wall of the plating bath, spray pipes are fixedly communicated with the tops of the two split-flow pipes, a plating base plate is arranged between the two spray pipes, two sides of the bottom of the plating bath are fixedly communicated with a water inlet of a spraying pump through a first pipeline, and a water outlet of the spraying pump is fixedly communicated with a water inlet of a filter barrel through a second pipeline; and an electric flow regulating valve is arranged and communicated with the spraying box and the shunt tubes, and the flow of the spraying box and the flow of the shunt tubes are respectively regulated by regulating the electric flow regulating valve to control the spraying pressure of the surface of the electroplating substrate.

Description

Spraying flow distribution control device in electroplating bath

Technical Field

The utility model relates to the technical field of electroplating, in particular to a spraying flow distribution control device in an electroplating bath.

Background

At present electroplating process, spray liquid medicine to electroplating substrate board face through spraying the pump, promote electroplating effect, nevertheless because of the thickness nonconformity of electroplating the face, have different requirements to the pressure of spraying, through the variable frequency control who sprays the pump, can realize electroplating substrate's the adjustment of face injection pressure, nevertheless behind the frequency conversion, liquid medicine circulation flow can change, can not guarantee the unified filtration circulation volume of inslot liquid medicine.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a spraying flow distribution control device in a plating bath, which aims to solve the problems that after frequency conversion is carried out on a spraying pump provided in the background technology, the circulating flow of liquid medicine can change, and the uniform filtering circulating amount of the liquid medicine in the bath can not be ensured.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a spray flow split-flow control device in plating bath, includes the plating bath, the mid-mounting of plating bath inner wall bottom has spouts the box, the shunt tubes is all installed, two in the both sides of plating bath inner wall bottom all fixed intercommunication in shunt tubes top has the spray tube, two be equipped with the electroplating base plate between the spray tube, the both sides of electroplating bath bottom all are through the fixed intercommunication of first pipeline with the water inlet that sprays the pump, the delivery port that sprays the pump passes through the fixed intercommunication of the water inlet of second pipeline with the filter vat, the delivery port of filter vat pass through the third pipeline respectively with the water inlet of electric flow control valve, the delivery port of electric flow control valve passes through the fixed intercommunication of fourth pipeline with the water inlet of three third ball valve, and is three the delivery port of third ball valve pass through the fifth pipeline respectively with spout the fixed intercommunication of box and two shunt tubes.

Preferably, the spray box is located between the two shunt tubes.

Preferably, one side of each of the two spray pipes opposite to each other is provided with a plurality of uniformly distributed nozzles, and the plurality of nozzles are opposite to the electroplating substrate.

Preferably, a first ball valve is mounted on each of the two first pipelines.

Preferably, the second pipeline and the third pipeline are both provided with second ball valves.

Preferably, the spray pump is provided with an electronic frequency controller.

Compared with the prior art, the utility model has the beneficial effects that: the bottom shunt pipe of the electroplating bath is arranged, so that the circulating filtration capacity of the electroplating bath liquid can be effectively ensured while the spraying pressure of the surface of the electroplating substrate is controlled; and an electric flow regulating valve is arranged and communicated with the spraying box and the shunt tubes, and the flow of the spraying box and the flow of the shunt tubes are respectively regulated by regulating the electric flow regulating valve to control the spraying pressure of the surface of the electroplating substrate.

Drawings

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a schematic view of the internal structure of the plating tank of the present invention;

FIG. 3 is a schematic structural view of two nozzles and a plating substrate according to the present invention.

In the figure: 1. a nozzle; 2. an electroplating bath; 3. electroplating the substrate; 4. spraying the box; 5. a shunt tube; 6. a first ball valve; 7. an electric flow regulating valve; 8. a filter vat; 9. a spray pump; 10. a nozzle; 11. a third ball valve; 12. a second ball valve.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to fig. 1-3, the present invention provides a spray flow split-flow control device in a plating bath, including a plating bath 2, a spray box 4 is installed in the middle of the bottom of the inner wall of the plating bath 2, the spray box 4 directly sprays liquid medicine to the bottom of the plating bath 2 from both sides, shunt tubes 5 are installed on both sides of the bottom of the inner wall of the plating bath 2, spray pipes 1 are fixedly communicated with the tops of the two shunt tubes 5, a plating base plate 3 is disposed between the two spray pipes 1, the liquid medicine enters the spray pipes 1 and is sprayed to the plating base plate 3, both sides of the bottom of the plating bath 2 are fixedly communicated with a water inlet of a spray pump 9 through a first pipeline, the liquid medicine is pumped from the plating bath 2 through the spray pump 9, a water outlet of the spray pump 9 is fixedly communicated with a water inlet of a filter barrel 8 through a second pipeline, a water outlet of the filter barrel 8 is respectively communicated with a water inlet of an electric flow control valve 7 through a third pipeline, a water outlet of the electric flow control valve 7 is fixedly communicated with water inlets of three third ball valves 11 through a fourth pipeline, the water outlets of the three third ball valves 11 are respectively fixedly communicated with the spray box 4 and the two shunt pipes 5 through fifth pipelines.

The spray box 4 is positioned between the two shunt pipes 5, and the spray box 4 sprays the liquid medicine directly to the bottom of the plating bath 2 from two sides.

One side that two spray tubes 1 are relative all is equipped with a plurality of evenly distributed's nozzle 10, and a plurality of nozzle 10 all just to electroplating base plate 3, and liquid medicine passes through nozzle 10 direct injection to electroplating base plate 3.

The two first pipelines are respectively provided with a first ball valve 6 for controlling the flow of the liquid medicine of the two first pipelines; and the second pipeline and the third pipeline are respectively provided with a second ball valve 12 for controlling the flow of the liquid medicine in the second pipeline and the third pipeline.

The spraying pump 9 is provided with an electric frequency controller, and the spraying pump 9 is controlled by the electric frequency controller so as to adjust the flow of the liquid medicine.

When the embodiment of the application is used: the method comprises the steps of extracting liquid medicine from an electroplating bath 2 through a spray pump 9, controlling the speed of extracting the liquid medicine through two first ball valves 6, then conveying the liquid medicine to a filter barrel 8 through the spray pump 9, filtering the liquid medicine through the filter barrel 8, then continuously passing through an electric flow regulating valve 7, wherein the electric flow regulating valve 7 is a three-way type electric regulating valve, regulating the flow of the liquid medicine through the adjustment of the electric flow regulating valve 7, controlling the injection pressure of the surface of an electroplating substrate 3, then respectively communicating a spray box 4 and two shunt tubes 5 through three third ball valves 11, controlling the liquid medicine injection through the three third ball valves 11, providing the liquid medicine for the spray box 4 and the two shunt tubes 5, directly spraying the liquid medicine to the bottom of the electroplating bath 2 from two sides by the spray box 4, preventing impurities from precipitating, enabling the liquid medicine to enter a spray pipe 1 through the shunt tubes 5 and be sprayed to the electroplating substrate 3, and controlling and regulating the positions between the shunt tubes 5 and the spray pump 9 through the electric flow regulating valve 7, along with the flow change that electronic flow control valve 7 was adjusted, realize controlling electroplating substrate 3 face jet pressure, simultaneously, can not receive the direct influence of pump 9 that sprays again, can effectively guarantee the liquid medicine circulation filtration volume in the plating bath 2.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides a flow reposition of redundant personnel controlling means sprays in plating bath, includes plating bath (2), its characterized in that: the middle part of the bottom of the inner wall of the electroplating bath (2) is provided with a spray box (4), two sides of the bottom of the inner wall of the electroplating bath (2) are provided with shunt tubes (5), the tops of the two shunt tubes (5) are fixedly communicated with spray pipes (1), an electroplating substrate (3) is arranged between the two spray pipes (1), both sides of the bottom of the electroplating bath (2) are fixedly communicated with a water inlet of the spray pump (9) through a first pipeline, the water outlet of the spray pump (9) is fixedly communicated with the water inlet of the filter barrel (8) through a second pipeline, the water outlet of the filter barrel (8) is respectively connected with the water inlet of the electric flow control valve (7) through a third pipeline, the water outlet of the electric flow control valve (7) is fixedly communicated with the water inlets of the three third ball valves (11) through a fourth pipeline, and the water outlets of the three third ball valves (11) are fixedly communicated with the spray box (4) and the two shunt pipes (5) through fifth pipelines respectively.

2. The device for controlling the flow distribution of the spray in the plating tank according to claim 1, wherein: the spray box (4) is positioned between the two shunt pipes (5).

3. The device for controlling the flow distribution of the spray in the plating tank according to claim 1, wherein: two one side that spray tube (1) is relative all is equipped with a plurality of evenly distributed's nozzle (10), and a plurality of nozzle (10) are all just to electroplating base plate (3).

4. The device for controlling the flow distribution of the spray in the plating tank according to claim 1, wherein: and a first ball valve (6) is arranged on each of the two first pipelines.

5. The device for controlling the flow distribution of the spray in the plating tank according to claim 1, wherein: and the second pipeline and the third pipeline are both provided with a second ball valve (12).

6. The device for controlling the flow distribution of the spray in the plating tank according to claim 1, wherein: the spray pump (9) is provided with an electrical frequency controller.