CN101174603A - 半导体装置及半导体装置的制造方法 - Google Patents

半导体装置及半导体装置的制造方法 Download PDF

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Publication number
CN101174603A
CN101174603A CNA2007101653344A CN200710165334A CN101174603A CN 101174603 A CN101174603 A CN 101174603A CN A2007101653344 A CNA2007101653344 A CN A2007101653344A CN 200710165334 A CN200710165334 A CN 200710165334A CN 101174603 A CN101174603 A CN 101174603A
Authority
CN
China
Prior art keywords
chip mounting
lead
mounting portion
chip
sealing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101653344A
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English (en)
Chinese (zh)
Inventor
田中茂树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Publication of CN101174603A publication Critical patent/CN101174603A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Measuring Magnetic Variables (AREA)
CNA2007101653344A 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法 Pending CN101174603A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006298433A JP2008117875A (ja) 2006-11-02 2006-11-02 半導体装置および半導体装置の製造方法
JP2006298433 2006-11-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201010263194.6A Division CN101937856B (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法

Publications (1)

Publication Number Publication Date
CN101174603A true CN101174603A (zh) 2008-05-07

Family

ID=39359027

Family Applications (2)

Application Number Title Priority Date Filing Date
CNA2007101653344A Pending CN101174603A (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法
CN201010263194.6A Expired - Fee Related CN101937856B (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201010263194.6A Expired - Fee Related CN101937856B (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法

Country Status (5)

Country Link
US (1) US8193041B2 (https=)
JP (1) JP2008117875A (https=)
KR (1) KR20080040582A (https=)
CN (2) CN101174603A (https=)
TW (1) TWI446502B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105023905A (zh) * 2015-07-31 2015-11-04 日月光封装测试(上海)有限公司 导线框架和使用该导线框架的功率集成电路封装件
CN109716745A (zh) * 2016-08-01 2019-05-03 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和模塑感光组件和制造方法
CN111279471A (zh) * 2017-11-10 2020-06-12 新电元工业株式会社 电子模块

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5334239B2 (ja) * 2008-06-24 2013-11-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5380244B2 (ja) * 2009-10-22 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP7043225B2 (ja) * 2017-11-08 2022-03-29 株式会社東芝 半導体装置
JP7192688B2 (ja) 2019-07-16 2022-12-20 Tdk株式会社 電子部品パッケージ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2763815Y (zh) * 2002-07-29 2006-03-08 雅马哈株式会社 磁性传感器及其引线框
US7187063B2 (en) * 2002-07-29 2007-03-06 Yamaha Corporation Manufacturing method for magnetic sensor and lead frame therefor
JP2006100348A (ja) 2004-09-28 2006-04-13 Yamaha Corp 物理量センサの製造方法
US7791180B2 (en) * 2004-10-01 2010-09-07 Yamaha Corporation Physical quantity sensor and lead frame used for same
JP4314580B2 (ja) * 2004-10-01 2009-08-19 ヤマハ株式会社 物理量センサ、およびこれに使用するリードフレーム
JP2006269859A (ja) * 2005-03-25 2006-10-05 Yamaha Corp 物理量センサ、およびこれに使用するリードフレーム
TWI280399B (en) * 2004-10-01 2007-05-01 Yamaha Corp Physical amount sensor and lead frame used therein
US7595548B2 (en) * 2004-10-08 2009-09-29 Yamaha Corporation Physical quantity sensor and manufacturing method therefor
JP4345685B2 (ja) * 2005-02-22 2009-10-14 ヤマハ株式会社 物理量センサ、これに使用するリードフレーム、及び、リードフレームの製造方法
US20060185452A1 (en) * 2005-02-22 2006-08-24 Yamaha Corporation Lead frame, sensor including lead frame, resin composition to be used for resin mold in the sensor, and sensor including the resin mold
KR100740358B1 (ko) * 2005-02-25 2007-07-16 야마하 가부시키가이샤 센서 및 센서 형성 방법
JP4652281B2 (ja) * 2006-05-29 2011-03-16 パナソニック株式会社 樹脂封止型半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105023905A (zh) * 2015-07-31 2015-11-04 日月光封装测试(上海)有限公司 导线框架和使用该导线框架的功率集成电路封装件
CN105023905B (zh) * 2015-07-31 2018-01-16 日月光封装测试(上海)有限公司 导线框架和使用该导线框架的功率集成电路封装件
CN109716745A (zh) * 2016-08-01 2019-05-03 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和模塑感光组件和制造方法
CN111279471A (zh) * 2017-11-10 2020-06-12 新电元工业株式会社 电子模块
CN111279471B (zh) * 2017-11-10 2023-09-15 新电元工业株式会社 电子模块

Also Published As

Publication number Publication date
US20080105959A1 (en) 2008-05-08
CN101937856A (zh) 2011-01-05
TWI446502B (zh) 2014-07-21
KR20080040582A (ko) 2008-05-08
JP2008117875A (ja) 2008-05-22
TW200834858A (en) 2008-08-16
CN101937856B (zh) 2014-04-16
US8193041B2 (en) 2012-06-05

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: NEC ELECTRONICS CORPORATION

Free format text: FORMER OWNER: RENESAS TECHNOLOGY CORP.

Effective date: 20100816

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: TOKYO, JAPAN TO: KANAGAWA PREFECTURE, JAPAN

TA01 Transfer of patent application right

Effective date of registration: 20100816

Address after: Kanagawa

Applicant after: NEC electronics KK

Address before: Tokyo, Japan

Applicant before: Renesas Technology Corp.

C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Open date: 20080507