CN101169598A - 一种光刻胶清洗剂 - Google Patents

一种光刻胶清洗剂 Download PDF

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Publication number
CN101169598A
CN101169598A CNA200610117668XA CN200610117668A CN101169598A CN 101169598 A CN101169598 A CN 101169598A CN A200610117668X A CNA200610117668X A CN A200610117668XA CN 200610117668 A CN200610117668 A CN 200610117668A CN 101169598 A CN101169598 A CN 101169598A
Authority
CN
China
Prior art keywords
out system
ether
photoresist clean
content
clean
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200610117668XA
Other languages
English (en)
Chinese (zh)
Inventor
彭洪修
史永涛
刘兵
曾浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anji Microelectronics Shanghai Co Ltd
Anji Microelectronics Co Ltd
Original Assignee
Anji Microelectronics Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anji Microelectronics Shanghai Co Ltd filed Critical Anji Microelectronics Shanghai Co Ltd
Priority to CNA200610117668XA priority Critical patent/CN101169598A/zh
Priority to PCT/CN2007/003019 priority patent/WO2008052424A1/fr
Priority to CN200780037460XA priority patent/CN101523298B/zh
Publication of CN101169598A publication Critical patent/CN101169598A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/12—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CNA200610117668XA 2006-10-27 2006-10-27 一种光刻胶清洗剂 Pending CN101169598A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CNA200610117668XA CN101169598A (zh) 2006-10-27 2006-10-27 一种光刻胶清洗剂
PCT/CN2007/003019 WO2008052424A1 (fr) 2006-10-27 2007-10-22 Composé de nettoyage pour éliminer le photorésist
CN200780037460XA CN101523298B (zh) 2006-10-27 2007-10-22 一种光刻胶清洗剂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA200610117668XA CN101169598A (zh) 2006-10-27 2006-10-27 一种光刻胶清洗剂

Publications (1)

Publication Number Publication Date
CN101169598A true CN101169598A (zh) 2008-04-30

Family

ID=39343805

Family Applications (2)

Application Number Title Priority Date Filing Date
CNA200610117668XA Pending CN101169598A (zh) 2006-10-27 2006-10-27 一种光刻胶清洗剂
CN200780037460XA Expired - Fee Related CN101523298B (zh) 2006-10-27 2007-10-22 一种光刻胶清洗剂

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200780037460XA Expired - Fee Related CN101523298B (zh) 2006-10-27 2007-10-22 一种光刻胶清洗剂

Country Status (2)

Country Link
CN (2) CN101169598A (fr)
WO (1) WO2008052424A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009092292A1 (fr) * 2008-01-18 2009-07-30 Anji Microelectronics (Shanghai) Co., Ltd Composition de nettoyage pour un résist à film épais
CN101914775A (zh) * 2010-06-29 2010-12-15 青岛大学 一种水溶性邻氨基苯甲酸聚合物碳钢酸洗缓蚀剂及其应用
CN102200700A (zh) * 2011-06-08 2011-09-28 绵阳艾萨斯电子材料有限公司 剥离液及其制备方法与应用
CN102246096A (zh) * 2008-12-17 2011-11-16 第一毛织株式会社 用于形成蚀刻剂下层膜且具有改善的储存稳定性的硬掩模组合物
WO2012009968A1 (fr) * 2010-07-23 2012-01-26 安集微电子（上海）有限公司 Solution de nettoyage de résine photosensible
CN102346383A (zh) * 2010-08-06 2012-02-08 安集微电子（上海）有限公司 一种光刻胶的清洗液
TWI418624B (fr) * 2011-09-13 2013-12-11
TWI418623B (fr) * 2011-09-13 2013-12-11
CN103543618A (zh) * 2013-09-27 2014-01-29 杨桂望 抗蚀膜剥离剂

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101750912A (zh) * 2008-11-28 2010-06-23 安集微电子（上海）有限公司 一种光刻胶清洗剂组合物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3514782B2 (ja) * 1992-08-31 2004-03-31 旭化成ケミカルズ株式会社 低残渣洗浄剤
US5399285A (en) * 1992-10-30 1995-03-21 Diversey Corporation Non-chlorinated low alkalinity high retention cleaners
US5962197A (en) * 1998-03-27 1999-10-05 Analyze Inc. Alkaline organic photoresist stripper
AU2002338176A1 (en) * 2002-10-11 2004-05-04 Wako Pure Chemical Industries, Ltd. Substrate detergent
US8236485B2 (en) * 2002-12-20 2012-08-07 Advanced Technology Materials, Inc. Photoresist removal
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
US8030263B2 (en) * 2004-07-01 2011-10-04 Air Products And Chemicals, Inc. Composition for stripping and cleaning and use thereof
WO2006110645A2 (fr) * 2005-04-11 2006-10-19 Advanced Technology Materials, Inc. Agents nettoyants liquides au fluorure contenant des melanges de solvants polaires et non polaires destines a nettoyer des dispositifs microelectroniques a faible k

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009092292A1 (fr) * 2008-01-18 2009-07-30 Anji Microelectronics (Shanghai) Co., Ltd Composition de nettoyage pour un résist à film épais
CN102246096B (zh) * 2008-12-17 2015-05-13 第一毛织株式会社 用于形成蚀刻剂下层膜且具有改善的储存稳定性的硬掩模组合物
CN102246096A (zh) * 2008-12-17 2011-11-16 第一毛织株式会社 用于形成蚀刻剂下层膜且具有改善的储存稳定性的硬掩模组合物
CN101914775A (zh) * 2010-06-29 2010-12-15 青岛大学 一种水溶性邻氨基苯甲酸聚合物碳钢酸洗缓蚀剂及其应用
WO2012009968A1 (fr) * 2010-07-23 2012-01-26 安集微电子（上海）有限公司 Solution de nettoyage de résine photosensible
WO2012016425A1 (fr) * 2010-08-06 2012-02-09 安集微电子（上海）有限公司 Fluide de lavage de photorésine
CN102346383A (zh) * 2010-08-06 2012-02-08 安集微电子（上海）有限公司 一种光刻胶的清洗液
CN102346383B (zh) * 2010-08-06 2016-03-16 安集微电子（上海）有限公司 一种光刻胶的清洗液
CN102200700B (zh) * 2011-06-08 2012-08-22 绵阳艾萨斯电子材料有限公司 剥离液及其制备方法与应用
CN102200700A (zh) * 2011-06-08 2011-09-28 绵阳艾萨斯电子材料有限公司 剥离液及其制备方法与应用
TWI418624B (fr) * 2011-09-13 2013-12-11
TWI418623B (fr) * 2011-09-13 2013-12-11
CN103543618A (zh) * 2013-09-27 2014-01-29 杨桂望 抗蚀膜剥离剂

Also Published As

Publication number Publication date
WO2008052424A1 (fr) 2008-05-08
CN101523298A (zh) 2009-09-02
CN101523298B (zh) 2012-04-04

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20080430