CN101141850A - 制造元件嵌入式印刷电路板的方法 - Google Patents

制造元件嵌入式印刷电路板的方法 Download PDF

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CN101141850A
CN101141850A CNA2007101495177A CN200710149517A CN101141850A CN 101141850 A CN101141850 A CN 101141850A CN A2007101495177 A CNA2007101495177 A CN A2007101495177A CN 200710149517 A CN200710149517 A CN 200710149517A CN 101141850 A CN101141850 A CN 101141850A
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insulating barrier
optical element
metal core
core board
chamber
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曹硕铉
柳济光
金昞文
曹汉瑞
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Abstract

本发明公开了一种制造光学元件嵌入式印刷电路板的方法。一种光学元件嵌入式印刷电路板，其包括：金属芯板，其中形成有至少一个腔；光学元件，嵌入于腔中；第一绝缘层，层叠于金属芯板的一侧上；第二绝缘层，层叠于金属芯板的另一侧上；以及电路图案，形成于第一绝缘层上，并且与光学元件电连接，该光学元件嵌入式印刷电路板提供了一种具有出色散热效果的薄印刷电路板。

Description

制造元件嵌入式印刷电路板的方法
相关申请交叉参考
本申请要求于2006年9月5日向韩国知识产权局提交的第10-2006-0085248号韩国专利申请的权益，其全部内容结合于此作为参考。
技术领域
本发明涉及一种印刷电路板，更具体地说，涉及一种光学元件嵌入式印刷电路板。
背景技术
目前正在受到关注的市场是诸如LED和图像传感器等的光学元件的市场。此处，对于LED来说，需要具有高亮度的产品，而对于图像传感器来说，需要具有高分辨率的产品。
在传统的LEF封装技术中，在插入部件之后，所产生的热量主要通过引导框架来释放，所述引导框架被构造成通过焊接的方式在板上电接触。
发明内容
本发明的一个方面在于提供一种用于将光学元件嵌入于印刷电路板中的技术以及一种光学元件嵌入式印刷电路板，该技术和印刷电路板允许尤其当嵌入LED时增加的散热效率。
本发明的一个方面提供了一种光学元件嵌入式印刷电路板，其包括：金属芯板，其中形成有至少一个腔；光学元件，嵌入于腔中；第一绝缘层，层叠于金属芯板的一侧上；第二绝缘层，层叠于金属芯板的另一侧上；以及电路图案，形成于第一绝缘层上，并且与光学元件电连接。
光学元件可以是LED，在这种情况下，第二绝缘层的至少位于LED上方的部分可以具有围绕LED的弯曲表面，或可以具有粗糙部。这可以使从LED发射的光线扩散。
第一绝缘层内可以形成有过孔，该过孔提供金属芯板与电路图案之间的热连接。内部的热量可以通过该过孔散发到外部。
在光学元件是图像传感器的情况下，红外线滤光层可以进一步层叠在第二绝缘层上。
第二绝缘层还可以具有形成于其上的电路图案。
本发明的另一方面提供了一种制造光学元件嵌入式印刷电路板的方法。该方法包括：在金属芯板的一侧上层叠第一绝缘层；将光学元件嵌入于形成在金属芯板中的腔内；在金属芯板的另一侧上层叠透明材料的第二绝缘层；以及在第一绝缘层上形成与光学元件电连接的电路图案。
在层叠第一绝缘层之前，可以进一步包括如下操作：在金属芯板的一侧上的待嵌入光学元件的位置处形成镀层。镀层可以使得相对于光学元件具有更好的接触能力。
在层叠第一绝缘层之后并在嵌入光学元件之前，可以包括如下操作：去除金属芯板的一部分以形成腔。而且，可以在层叠第一绝缘层之前形成该腔。该腔是光学元件可以嵌入于其中的部分。
形成电路图案的操作可以进一步包括：形成将金属芯板与电路图案热连接的过孔。可以用具有高导热率的材料填充该过孔。
本发明的又一方面提供了一种制造光学元件嵌入式印刷电路板的方法，该方法包括：在覆铜层压板的一侧的一部分上形成镀层；在覆铜层压板的一侧上附着第一感光膜，该第一感光膜具有与光学元件的尺寸相对应的尺寸；镀覆覆铜层压板并去除第一感光膜以形成腔；去除腔内部的铜箔以露出覆铜层压板的第一绝缘层，并去除覆铜层压板另一侧上的铜箔以形成电路图案；以及嵌入光学元件以与镀层电连接，并在覆铜层压板的一侧上层叠透明的第二绝缘层。
在形成镀层与附着第一感光膜之间可以进一步包括如下操作：在覆铜层压板的另一侧内形成孔，从而露出覆铜层压板一侧上的铜箔，在这种情况下，镀覆覆铜层压板以及去除第一感光膜以形成腔的操作可以进一步包括镀覆孔的内部以形成过孔。
本发明的其它方面和优点将在下面的描述中得以部分地阐述，并且将通过该描述而部分地显而易见，或者可以通过本发明的实践而获知。
附图说明
图1是根据本发明第一公开实施例的用于制造光学元件嵌入式印刷电路板的框图。
图2是根据本发明第一公开实施例的用于制造光学元件嵌入式印刷电路板的过程图。
图3是根据本发明第二公开实施例的用于制造光学元件嵌入式印刷电路板的框图。
图4是根据本发明第二公开实施例的用于制造光学元件嵌入式印刷电路板的过程图。
图5是根据本发明第三公开实施例的用于制造光学元件嵌入式印刷电路板的框图。
图6是根据本发明第三公开实施例的用于制造光学元件嵌入式印刷电路板的过程图。
具体实施方式
下面，将参照附图更详细地描述本发明的某些实施例，附图中，不管图号为多少，那些相同或相应的元件被赋以相同的参考标号，并且省略重复性描述。
图1是根据本发明第一公开实施例的用于制造光学元件嵌入式印刷电路板的框图，而图2是根据本发明第一公开实施例的用于制造光学元件嵌入式印刷电路板的过程图。图2中示出了金属芯板21、第一绝缘层22、铜箔23、腔24、光学元件25、线25a、第二绝缘层26、孔27、过孔28a和28b、电路图案29、外部元件251、抗蚀层(resist)252、和粗糙部253。
图1的操作S11可以包括在金属芯板21的一侧上层叠第一绝缘层22，其中图2的图(a)示出了相应的过程。可以使用具有良好散热效果的材料作为金属芯板21。通常使用铝，但是也可以使用其它金属，包括铜。可以在金属芯板21的一侧上层叠第一绝缘层22，并且如图2的(a)所示，可以附加地层叠铜箔23。
图1的操作S12可以包括在通过去除金属芯板21的一些部分而形成的腔24中嵌入光学元件25，其中图2的图(b)和(c)示出了相应的过程。可以在操作S11之前执行在金属芯板21内形成腔24的操作。也就是说，可以在形成腔24之后层叠第一绝缘层22。在这种情况下，可以使用机械方法形成腔24。另一方面，在第一绝缘层22层叠在金属芯板21上之后，可以通过化学蚀刻形成腔24。
可以将光学元件25嵌入腔24中。光学元件25的实例包括LED和图像传感器。可以通过线25a将光学元件25与外部电连接，或者通过倒装芯片类型的安装来连接光学元件25。由于金属芯板21是导电材料的，所以，可以连接线25a，如图2的(c)所示，以便将电信号传输到外部。
图1的操作S13可以包括在金属芯板21的另一侧上层叠透明材料的第二绝缘层26，其中图2的图(d)示出了相应的过程。光学元件25可以向外部发射光线，或者可以接收来自于外部的光线。因此，可能有利的是，用作层叠在光学元件25上方的第二绝缘层26的材料为透明材料。此处，“透明材料”不仅是指具有100％光透射率的材料，而且还包括半透明材料。设置于光学元件25上方的第二绝缘层26可以形成为凸状弯曲表面。如果光学元件25为LED，则所述凸状弯曲表面用来扩散光线。为了达到相似效果，可以在第二绝缘层26的表面上形成粗糙部253。相反，如果光学元件25为图像传感器，则第二绝缘层26可以具有平坦形状。在这种情况下，可能有利的是，在第二绝缘层26上方附加地层叠红外线滤光层。
图1的操作S14可以包括形成用于将光学元件25电连接于第一绝缘层22的电路图案29，其中图2的图(e)、(f)、和(g)示出了相应的过程。
为了将电路图案29与光学元件25电连接，可以首先形成过孔28a、28b。在形成孔27之后，如图2的(e)所示，可以通过镀覆形成过孔28a、28b。过孔28a可以与光学元件25电连接。另外，过孔28b还可以与金属芯板21热连接，以便将印刷电路板内的热量释放到外部。此处，“热连接”的意思是，金属芯板21的热量可以通过过孔28b传导到外部而被释放。
图2的图(g)是形成电路图案29之后的示图，其中所述电路图案29可以通过层叠感光膜、进行曝光和显影、然后通过蚀刻而形成。由于这种减成工艺是公知工艺，所以不对其进行进一步详细讨论。虽然图2示出了仅形成于第一绝缘层22的表面上的电路图案29，但是，电路图案29还可以形成于第二绝缘层26上，只要其不阻断传输到光学元件25的光线的路径即可。在形成电路图案29之后，可以涂覆抗蚀层252，并且可以在表面上安装外部元件251。由于外部元件251的这种安装是公知的工艺，所以不对其进行进一步详细讨论。
图3是根据本发明第二公开实施例的用于制造光学元件嵌入式印刷电路板的框图，而图4是根据本发明第二公开实施例的用于制造光学元件嵌入式印刷电路板的过程图。图4中示出了金属芯板31、第一绝缘层32、铜箔33、腔34、光学元件35、第二绝缘层36、过孔38a和38b、镀层301、外部元件351、和抗蚀层352。
图3的操作S31可以包括在与光学元件35电连接的金属芯板31的一侧上层叠镀层301、以及层叠第一绝缘层32，其中图4的图(a)示出了相应的过程。镀层301可以是接下来电连接有光学元件35的部分。因此，可以在考虑将要安装光学元件35的位置的情况下进行镀覆。虽然通常可以使用金来用于镀层301，但是本发明并不局限于此，而是可以使用任何金属，只要该金属是不能通过蚀刻剂被去除的材料即可。第一绝缘层32可以沿镀层301形成的方向而被层叠。可以在第一绝缘层32上附加地层叠铜箔33。
图3的操作S32可以包括在与镀层301电连接的第一绝缘层32上形成电路图案39、以及去除金属芯板31的一些部分以便在将要嵌入光学元件35的部分中形成腔34，其中图4的图(b)和(c)示出了相应的过程。为了使镀层301与随后将要形成的电路图案39电连接，可以形成过孔38a、38b，如图4的(b)所示。形成过孔38a、38b的方法可以包括以下步骤：通过(诸如使用激光的)机械方法形成孔，以及(诸如通过化学镀和电镀等)用导电金属填充内部。
图4的图(c)示出了去除金属芯板31的一些部分以形成其中要嵌入光学元件35的腔34。在金属芯板31上层叠抗蚀层之后，可以仅使得将要形成腔34的部分开孔。在接下来的蚀刻工艺之后，可以形成腔34。此处，如果镀层301是金属，诸如金，则该镀层可以不被蚀刻剂去除，而是保持原样，从而镀层301下方的过孔38a也可以被镀层301保护，并且不会被蚀刻剂去除。相反，可以去除腔34内的金属芯板31，从而可以使第一绝缘层32露出到外部。当去除金属芯板31时，也可以去除铜箔33，以形成电路图案39。
图3的操作S33可以包括：在腔34内嵌入光学元件35以及在光学元件35上方层叠第二绝缘层36。当层叠第二绝缘层36时，如图4的(e)中所示，使用膜层36a可以提供具有更平坦表面的绝缘层36。也就是说，膜层36a在被设置于第二绝缘层36与压力机之间的同时可以被层叠于第二绝缘层36上。该膜层36a可以使得压力机与第二绝缘层36更容易分离。
图3的操作S34可以包括在电路图案39上层叠抗蚀层352以及安装外部元件351。这是公知的工艺，因此不对其进一步详细讨论。
图5是根据本发明第三公开实施例的用于制造光学元件嵌入式印刷电路板的框图，而图6是根据本发明第三公开实施例的用于制造光学元件嵌入式印刷电路板的过程图。图6中示出了覆铜层压板61、第一绝缘层61a、铜箔61b和61c、镀层62、孔63、过孔64a和64b、第一感光膜65a、第二感光膜65b、第三感光膜65c、腔67、电路图案68、光学元件69、第二绝缘层601、抗蚀层602、和外部元件651。
图5的操作S51可以包括在覆铜层压板61的一侧的一部分上形成镀层62，其中图6的图(a)示出了相应的过程。在第一绝缘层61a的每一侧上层叠有铜箔61b、61c的覆铜层压板61为通常使用的导电材料。可以在覆铜层压板61的一侧上形成镀层62，所述镀层62将与光学元件69电连接。镀层62可以改善与形成于光学元件69的焊盘上的焊凸(bump)或焊柱(stud)的连接。
图5的操作S52可以包括在对应于镀层62的位置中形成过孔64a、64b，其中图6的图(b)和(c)示出了相应的过程。可以使用激光来形成孔63，并且可以进行镀覆工艺来形成过孔64a、64b。过孔64a、64b可以在铜箔61b、61c之间提供电连接。具体地说，过孔64b的一部分可以形成于对应于镀层62的位置中，以便稍后将光学元件69与电路图案68电连接。而且，与图6的(e)中所形成的金属芯板604相连接的过孔64a用来使散热效果最大化。在镀覆工艺之后，图6的(a)中所示的铜箔61b、61c可以具有增加的厚度，以便形成图6的(c)中所示的形状。
图5的操作S53可以包括对应于光学元件69的尺寸而在覆铜层压板61的一侧上层叠第一干膜65a、以及在另一侧上层叠第二干膜65b，其中图6的图(d)示出了相应的过程。由于接下来的镀覆工艺，所以由第一干膜65a所占据的空间可以变成光学元件69将被安装于其中的腔67。
图5的操作S54可以包括通过镀覆形成金属芯板604、以及去除第一干膜65a以形成腔67，其中图6的图(e)和(f)示出了相应的过程。在去除第一干膜65a之后形成的空间可以变成腔67，光学元件69将被安装在该腔中。因此，第一干膜65a可以形成有与光学元件69的尺寸相对应的尺寸，即，形成有比光学元件69的尺寸稍大的尺寸。
当在图6的(d)之后进行镀覆工艺时，可以形成金属芯板604，诸如图6的(e)所示。另外，沿第一干膜65a已被去除的方向层叠第三干膜65c，并且将层叠于腔67上方的第三干膜65c开孔以便于接下来的蚀刻工艺，这些操作形成了如图6的(f)所示的构造。
在本实施例的情况下，与图2和图4所示的实施例不同，由于腔67不是通过蚀刻形成，所以腔67与金属芯板604之间的边界是竖直的，并且获得了用于嵌入光学元件69的最小的空间。
图5的操作S55可以包括去除腔67内部的铜箔61b以露出第一绝缘层61a、以及去除腔67外部的铜箔61c以形成电路图案68，其中图6的图(g)示出了相应的过程。当去除第一干膜65a时，可以露出腔67内部的铜箔61b，如图6的(f)所示。因此，可以通过蚀刻去除铜箔61b，以便阻断金属芯板604与光学元件69之间的电流。通过蚀刻剂不能去除镀层62。此处，通过将第二干膜65b开孔且在蚀刻腔67内部的铜箔61b的同时蚀刻腔67外部的铜箔61c，可以形成电路图案68。第三干膜65c可以用来保护金属芯板604的在腔67旁边的部分。
图5的操作S56可以包括嵌入光学元件69并在光学元件69上层叠透明的第二绝缘层601，并且接下的工艺包括在电路图案68上层叠抗蚀层602并安装外部元件651。这些操作对应于图6的图(h)、(i)和(j)。操作S56与参照图2和4所描述的工艺相类似，因此不对其进一步详细讨论。
根据上述的本发明的某些方面，可以将嵌入元件时的有效工艺数量最小化，从而可以减少工艺成本。
而且，当嵌入元件时，电路的一个层可具有埋入的构造。因此，可以减少印刷电路板的整体厚度，并且可以增加硬度。
虽然已参照具体实施例详细描述了本发明的精神，但是，这些实施例仅是为了示例目的，并不限定本发明。可以理解，在不脱离本发明的范围和精神的前提下，本领域技术人员可以改变或修改这些实施例。

Claims (15)

1.一种光学元件嵌入式印刷电路板，其包括：
金属芯板，其中形成有至少一个腔；
光学元件，嵌入于所述腔中；
第一绝缘层，层叠于所述金属芯板的一侧上；
第二绝缘层，层叠于所述金属芯板的另一侧上；以及电路图案，形成于所述第一绝缘层上，并且与所述光学元件电连接。
2.根据权利要求1所述的光学元件嵌入式印刷电路板，其中，所述光学元件是LED，并且
所述第二绝缘层的至少位于所述LED上方的部分具有围绕所述LED的弯曲表面。
3.根据权利要求1所述的光学元件嵌入式印刷电路板，其中，所述光学元件是LED，并且
所述第二绝缘层的至少位于所述LED上方的部分具有粗糙部。
4.根据权利要求1所述的光学元件嵌入式印刷电路板，其中，至少一个过孔形成于所述第一绝缘层内，所述过孔将所述金属芯板与所述电路图案热连接。
5.根据权利要求1所述的光学元件嵌入式印刷电路板，其中，所述光学元件是图像传感器，并且
所述第二绝缘层上进一步层叠有红外线滤光层。
6.根据权利要求1所述的光学元件嵌入式印刷电路板，其中，所述第二绝缘层具有形成于其上的电路图案。
7.一种制造光学元件嵌入式印刷电路板的方法，所述方法包括：
在金属芯板的一侧上层叠第一绝缘层；
将光学元件嵌入于形成在所述金属芯板中的腔内；
在所述金属芯板的另一侧上层叠透明材料的第二绝缘层；以及
在所述第一绝缘层上形成电路图案，所述电路图案与所述光学元件电连接。
8.根据权利要求7所述的方法，在层叠所述第一绝缘层的操作与嵌入所述光学元件的操作之间，进一步包括：
去除所述金属芯板的一部分以形成所述腔。
9.根据权利要求7所述的方法，在层叠所述第一绝缘层的操作之前，进一步包括：
在所述金属芯板的一侧上于待嵌入所述光学元件的位置处形成镀层。
10.根据权利要求9所述的方法，在层叠所述第一绝缘层的操作与嵌入所述光学元件的操作之间，进一步包括：
去除所述金属芯板的一部分以形成所述腔。
11.根据权利要求7所述的方法，在层叠所述第一绝缘层的操作之前，进一步包括：
去除所述金属芯板的一部分以形成所述腔。
12.根据权利要求7所述的方法，其中，形成所述电路图案的操作进一步包括：
形成将所述金属芯板与所述电路图案热连接的过孔。
13.根据权利要求7所述的方法，在形成所述电路图案的操作之后，进一步包括：
在所述第二绝缘层上形成电路图案。
14.一种制造光学元件嵌入式印刷电路板的方法，所述方法包括：
在覆铜层压板的一侧的一部分上形成镀层；
在所述覆铜层压板的一侧上附着第一感光膜，所述第一感光膜具有与光学元件的尺寸相对应的尺寸；
镀覆所述覆铜层压板并去除所述第一感光膜以形成腔；
去除所述腔内部的铜箔以露出所述覆铜层压板的第一绝缘层，并去除所述覆铜层压板另一侧上的铜箔以形成电路图案；以及
嵌入所述光学元件以便与所述镀层电连接，并在所述覆铜层压板的一侧上层叠透明的第二绝缘层。
15.根据权利要求14所述的方法，在形成所述镀层的操作与附着
所述第一感光膜的操作之间，进一步包括：
在所述覆铜层压板的另一侧内形成孔，从而露出所述覆铜层压板一侧上的铜箔，
其中，镀覆所述覆铜层压板并去除所述第一感光膜以形成所述腔的操作进一步包括镀覆所述孔的内部以形成过孔。
CNA2007101495177A 2006-09-05 2007-09-04 制造元件嵌入式印刷电路板的方法 Pending CN101141850A (zh)

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