CN101135713A - PCB non-contact type test method and apparatus - Google Patents
PCB non-contact type test method and apparatus Download PDFInfo
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- CN101135713A CN101135713A CNA2006100624231A CN200610062423A CN101135713A CN 101135713 A CN101135713 A CN 101135713A CN A2006100624231 A CNA2006100624231 A CN A2006100624231A CN 200610062423 A CN200610062423 A CN 200610062423A CN 101135713 A CN101135713 A CN 101135713A
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Abstract
The method comprises: detecting the capacitance value generated in the condition of powering the AC supply between the bus end of each circuit in the standard sample board of a PCB under test and their induction piece; saving said capacitance in the tester as a reference value; using the PCB under test to place the standard sample board; powering on, and detecting the capacitance value between the PCB under test and the induction piece; sending the capacitance value signal to the tester through a wire; the tester amplifies and filters the signal to get a interference-removed signal, and compares the processed signal with the standard capacitance signal to the test result.
Description
Technical field
The present invention relates to a kind of printed circuit board (Printed Circuit Board) and be called for short PCB, open circuit/short circuit method of testing and device, particularly a kind of PCB non-contact type test method and device.
Background technology
Printed circuit board (Printed Circuit Board) is called for short PCB, in process of production, must be to its test of carrying out open circuit/short circuit to judge whether it is qualified, classic method is to do a corresponding measurement jig according to pad locations on the PCB and size, boring of the position of corresponding PCB and dress test probe on tool, and be connected on the test machine, because each test point all will be established pin, and test probe contacts with PCB, therefore, probe can not be infinitely small, just is inconvenient to test when the PCB more complicated, and easily has the test probe vestige to stay.
The invention overview
The present invention seeks to develop a kind of solving the problems of the technologies described above, a kind of PCB non-contact type test method and device are provided.
The technology used in the present invention method comprises following steps:
(1) at first tests out the capacitance that under the indirect current situation, produces between the intensive winding displacement end of each circuit of the standard example edition for the treatment of circuit board and the corresponding sensing chip, and be stored in the test machine as standard value.
(2) circuit board under test is positioned on the testing jig, changes standard jig, energising tests out the capacitance between circuit board under test and the sensing chip.
(3) by the power transmission signal line this capacitance signal is transferred in the test machine.
(4) test machine is at first made processing and amplifying by amplifier with signal, by wave filter this signal is carried out filtering again, eliminates undesired signal.
(5) capacitance signal after the data comparator of test machine is handled this and the standard capacitance signal of surveying for the first time compare and draw test result, test test result's statistics and standard value deviation range are in 30%, it all is the specification product value, test machine shows by display screen after this result is handled again, and whether can draw this circuit board under test qualified.
Wherein, the principle of work of sensing chip is to be beneficial to electric capacity to produce principle, and an end of sensing chip and test circuit is adding formation one capacitance under the alternating current situation.
PCB non-contact testing device comprises: test table, sensing chip and test machine, wherein, test table is provided with circuit line end test probe and places the groove structure of sensing chip, the sensing chip linking probe, sensing chip adopts double-sided PCB, the intensive discharge line end correspondence of the conducting strip of the sensitive surface of sensing chip and circuit board under test, but do not contact, different circuit board under test needs different sensing chip correspondences, test machine comprises: amplifier, wave filter and comparer, amplifier amplifies the capacitance signal and amplifies, and wave filter advances filtering to amplifying signal, remove undesired signal, comparer compares signal and the standard signal value after handling.
Via the enforcement of technical scheme of the present invention, utilize sensing chip to adopt non-contact type test method can realize test to the precision circuit plate.
Via the enforcement of technical scheme of the present invention, utilize sensing chip to adopt non-contact type test method, testing circuit board can not leave the test probe vestige.
Via the enforcement of technical scheme of the present invention, utilize amplifier to amplify test signal, the accuracy that can effectively improve test result, the product quality of keeping under strict control.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is test philosophy figure of the present invention.
Fig. 2 is the structural representation of the vertical view of sensing chip embodiment one.
Fig. 3 is the structural representation of the upward view of sensing chip embodiment one.
Fig. 4 is the conducting strip of sensing chip and the structural representation of the corresponding embodiment one of circuit to be measured.
Fig. 5 is the conducting strip of sensing chip and the structural representation of the corresponding embodiment two of circuit to be measured.
In the drawings, 1 sensing chip, 11 conducting strips, 12 through holes, 13 leads, 14 contact points, 2 circuits to be measured, 3A end points, 4B end points, 5 test probes
Embodiment
The technology used in the present invention method comprises following steps:
(1) at first tests out the capacitance that under the indirect current situation, produces between the intensive winding displacement end of each circuit of the standard example edition for the treatment of circuit board and the corresponding sensing chip and measure, and be stored in the test machine as standard value.
(2) circuit board under test is positioned on the testing jig, changes standard jig, energising tests out the capacitance between circuit board under test and the sensing chip.
(3) by the power transmission signal line this capacitance signal is transferred in the test machine.
(4) test machine is at first made processing and amplifying by amplifier with signal, by wave filter this signal is carried out filtering again, eliminates undesired signal.
(5) capacitance signal after the data comparator of test machine is handled this and the standard capacitance value signal of surveying for the first time compare and draw test result, test test result's statistics and standard value deviation range are in 30%, it all is the specification product value, test machine shows by display screen after this result is handled again, and whether can draw this circuit board under test qualified.
In Fig. 1, the B end points (4) of the conducting strip (11) of sensing chip (1) and the circuit to be measured (2) of circuit board under test forms electric capacity, when adding an alternating current, produce a capacitance, capacitance with this value and standard compares, and the linkage section that can test out the A end points (3) of circuit to be measured (2) and B end points (4) is UNICOM or disconnect.
In Fig. 2, sensing chip (1) is a double-sided PCB, in the form of sheets, adopt two-sided conductivity type, outer signal order wire better, the conducting strip (11) of sensing chip (1) one side is provided with according to the winding displacement situation of the intensive winding displacement end of circuit board under test is corresponding one by one, the circuit board under test difference, all differences are understood in each conducting strip arrangement on the sensing chip (1), place, (1) four angle of sensing chip is processed with through hole (12), be used for fixing sensing chip (1), the communication conductor spring probe contact point abundant and each conducting strip (11) that is beneficial to sensing chip (1) is connected, and guarantees that communication line is unimpeded.
Fig. 3 is the structural representation of the another side of sensing chip (1), and in the drawings, what conducting strip (11) passed sensing chip (1) draws lead (13), and each lead is not held have point of contact (14), and contact point (14) and communication conductor spring probe are connected.
Fig. 4 is the conducting strip (11) of sensing chip (1) and the synoptic diagram of the corresponding embodiment one of circuit to be measured (2).
Fig. 5 is the conducting strip (11) of sensing chip (1) and the synoptic diagram of the corresponding embodiment two of circuit to be measured (2), and in the drawings, because wherein a circuit to be measured has the branch pin to come out, therefore, conducting strip (11) needs the segmentation setting, reaches the purpose of accurate test.
PCB non-contact testing device comprises: test table, sensing chip and test machine, wherein, test table is provided with circuit line end test probe (5), test exploration pin external circuits, the test table upper surface has a groove structure, groove structure is used for placing and fixing sensing chip (1), and sensing chip (1) connects the communication conductor spring probe, and test machine comprises: amplifier, wave filter and comparer, amplifier amplifies the capacitance signal, and wave filter advances filtering to amplifying signal, removes undesired signal, comparer compares signal and the standard signal value after handling, and draws test result.
The present invention is convenient to be suitable for, and tests the accuracy rate height, is widely used in the field tests of printed circuit board and LCD liquid crystal circuit.
Claims (7)
1. a PCB non-contact type test method may further comprise the steps:
(1) at first tests out the capacitance that under the indirect current situation, produces between the intensive winding displacement end of each circuit of the standard example edition for the treatment of circuit board and the corresponding sensing chip, and be stored in the test machine as standard value.
(2) circuit board under test is positioned on the testing jig, changes standard jig, energising tests out the capacitance between circuit board under test and the sensing chip.
(3) by the power transmission signal line this capacitance signal is transferred in the test machine.
(4) test machine is at first made processing and amplifying by amplifier with the capacitance signal, by wave filter this capacitance signal is carried out filtering again, eliminates undesired signal.
(5) capacitance signal after the data comparator of test machine is handled this and the standard capacitance value signal of surveying for the first time compare and draw test result, test test result's statistics and standard value deviation range are in 30%, it all is the specification product value, test machine shows by display screen after this result is handled again, and whether can draw this circuit board under test qualified.
2. a kind of PCB non-contact type test method according to claim 1, the principle of work that it is characterized in that described sensing chip are to be beneficial to electric capacity to produce principle, and an end of sensing chip and test circuit is adding formation one capacitance under the alternating current situation.
3. a kind of PCB non-contact type test method according to claim 1, after it is characterized in that the described capacitance that tests out between circuit board under test and the sensing chip, by the power transmission signal line this capacitance signal is transferred in the test machine, test machine is made amplification, Filtering Processing to this capacitance signal, eliminate undesired signal, capacitance signal after test machine is handled this and the standard capacitance value signal of surveying for the first time compare and draw test result.
4. a PCB non-contact testing device comprises: test table, sensing chip and test machine.
Wherein, test table is provided with circuit line end test probe and groove structure, sensing chip adopts double-sided PCB, the intensive discharge line end correspondence of the conducting strip of the sensitive surface of sensing chip and circuit board under test, and test machine comprises: amplifier, wave filter and comparer.
5. a kind of PCB non-contact testing device according to claim 4, it is characterized in that circuit line end test probe on the described test table has the conducting strip shape loop on extension line and the sensing chip, add alternating current and can produce a capacitance signal, be provided with groove structure simultaneously.
6. a kind of PCB non-contact testing device according to claim 4, it is characterized in that described sensing chip is installed in the groove structure on the test table, sensing chip adopts double-sided PCB, the intensive discharge line end correspondence of the conducting strip of the sensitive surface of sensing chip and circuit board under test, but do not contact, different circuit board under test needs different sensing chip correspondences, and the contact point of sensing chip another side links by power transmission signal line and test machine.
7. a kind of PCB non-contact testing device according to claim 4 is characterized in that described test machine amplifies, promptly draws test result after the filtering, comparison process by its amplifier, wave filter and comparer the capacitance signal that receives.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100624231A CN101135713A (en) | 2006-09-01 | 2006-09-01 | PCB non-contact type test method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100624231A CN101135713A (en) | 2006-09-01 | 2006-09-01 | PCB non-contact type test method and apparatus |
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| Publication Number | Publication Date |
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| CN101135713A true CN101135713A (en) | 2008-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2006100624231A Pending CN101135713A (en) | 2006-09-01 | 2006-09-01 | PCB non-contact type test method and apparatus |
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| CN (1) | CN101135713A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102129004A (en) * | 2011-01-24 | 2011-07-20 | 苏州瀚瑞微电子有限公司 | Method for testing open circuit on PCB |
| CN103308844A (en) * | 2012-03-16 | 2013-09-18 | 展讯通信（上海）有限公司 | Testing template, fault location method and debugging methods of control board and clamping apparatus |
| CN105757107A (en) * | 2016-03-25 | 2016-07-13 | 博艳萍 | Induction gasket for NI test circulator |
| WO2017152480A1 (en) * | 2016-03-09 | 2017-09-14 | 京东方科技集团股份有限公司 | Non-contact probe signal loading device |
| CN108169664A (en) * | 2017-12-29 | 2018-06-15 | 大族激光科技产业集团股份有限公司 | Board failure detection method and device, computer equipment and storage medium |
| CN108693459A (en) * | 2017-10-19 | 2018-10-23 | 曹宁 | Two point VI curved scannings for various circuit boards compare method for diagnosing faults |
| CN110907776A (en) * | 2019-12-05 | 2020-03-24 | 东莞市博展机械科技有限公司 | Contact detection method for voltage withstand test probe of transformer |
| CN114594368A (en) * | 2022-03-07 | 2022-06-07 | 深圳市阳晶电子科技有限公司 | Capacitive detection device and detection method thereof |
-
2006
- 2006-09-01 CN CNA2006100624231A patent/CN101135713A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102129004A (en) * | 2011-01-24 | 2011-07-20 | 苏州瀚瑞微电子有限公司 | Method for testing open circuit on PCB |
| CN103308844A (en) * | 2012-03-16 | 2013-09-18 | 展讯通信（上海）有限公司 | Testing template, fault location method and debugging methods of control board and clamping apparatus |
| CN103308844B (en) * | 2012-03-16 | 2016-03-16 | 展讯通信（上海）有限公司 | The adjustment method of test sample plate, Fault Locating Method, control panel and fixture |
| WO2017152480A1 (en) * | 2016-03-09 | 2017-09-14 | 京东方科技集团股份有限公司 | Non-contact probe signal loading device |
| US10209295B2 (en) | 2016-03-09 | 2019-02-19 | Boe Technology Group Co., Ltd. | Non-contact probe signal loading device |
| CN105757107A (en) * | 2016-03-25 | 2016-07-13 | 博艳萍 | Induction gasket for NI test circulator |
| CN108693459A (en) * | 2017-10-19 | 2018-10-23 | 曹宁 | Two point VI curved scannings for various circuit boards compare method for diagnosing faults |
| CN108169664A (en) * | 2017-12-29 | 2018-06-15 | 大族激光科技产业集团股份有限公司 | Board failure detection method and device, computer equipment and storage medium |
| CN108169664B (en) * | 2017-12-29 | 2021-01-01 | 深圳市大族数控科技有限公司 | Circuit board fault detection method and device, computer equipment and storage medium |
| CN110907776A (en) * | 2019-12-05 | 2020-03-24 | 东莞市博展机械科技有限公司 | Contact detection method for voltage withstand test probe of transformer |
| CN114594368A (en) * | 2022-03-07 | 2022-06-07 | 深圳市阳晶电子科技有限公司 | Capacitive detection device and detection method thereof |
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